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You searched for subject:(warpage). Showing records 1 – 30 of 39 total matches.

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1. Peixoto, Nuno André Rodrigues Diogo. Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados.

Degree: 2014, Instituto Politécnico do Porto

Nos últimos anos a indústria de semicondutores, nomeadamente a produção de memórias, tem sofrido uma grande evolução. A necessidade de baixar custos de produção, assim… (more)

Subjects/Keywords: WLP; Warpage; Mold Compound; Taguchi; debond

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Peixoto, N. A. R. D. (2014). Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados. (Thesis). Instituto Politécnico do Porto. Retrieved from https://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6231

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Peixoto, Nuno André Rodrigues Diogo. “Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados.” 2014. Thesis, Instituto Politécnico do Porto. Accessed March 06, 2021. https://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6231.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Peixoto, Nuno André Rodrigues Diogo. “Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados.” 2014. Web. 06 Mar 2021.

Vancouver:

Peixoto NARD. Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados. [Internet] [Thesis]. Instituto Politécnico do Porto; 2014. [cited 2021 Mar 06]. Available from: https://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6231.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Peixoto NARD. Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados. [Thesis]. Instituto Politécnico do Porto; 2014. Available from: https://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6231

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Virginia Tech

2. Ochinero, Tomoya Thomas. Deformations of Unsymmetric Composite Panels.

Degree: PhD, Engineering Science and Mechanics, 2001, Virginia Tech

 This work discusses the deformations of various unsymmetric composite panels due to thermal and mechanical loads. Chapter 2 focuses on the warpage of large unsymmetric… (more)

Subjects/Keywords: warpage; composite materials; buckling; geometrically nonlinear; warpage; shells; plates

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APA (6th Edition):

Ochinero, T. T. (2001). Deformations of Unsymmetric Composite Panels. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/29375

Chicago Manual of Style (16th Edition):

Ochinero, Tomoya Thomas. “Deformations of Unsymmetric Composite Panels.” 2001. Doctoral Dissertation, Virginia Tech. Accessed March 06, 2021. http://hdl.handle.net/10919/29375.

MLA Handbook (7th Edition):

Ochinero, Tomoya Thomas. “Deformations of Unsymmetric Composite Panels.” 2001. Web. 06 Mar 2021.

Vancouver:

Ochinero TT. Deformations of Unsymmetric Composite Panels. [Internet] [Doctoral dissertation]. Virginia Tech; 2001. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/10919/29375.

Council of Science Editors:

Ochinero TT. Deformations of Unsymmetric Composite Panels. [Doctoral Dissertation]. Virginia Tech; 2001. Available from: http://hdl.handle.net/10919/29375


NSYSU

3. Guo, Yu-Lun. Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2003, NSYSU

 The thesis investigates the thermo-mechanical deformation and stress of a flip-chip package (FCBGA) via both experiment and simulation. First, Shadow Moiré is used to evaluate… (more)

Subjects/Keywords: ANSYS; Flip-Chip; Warpage

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APA (6th Edition):

Guo, Y. (2003). Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701103-144851

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Guo, Yu-Lun. “Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array.” 2003. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701103-144851.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Guo, Yu-Lun. “Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array.” 2003. Web. 06 Mar 2021.

Vancouver:

Guo Y. Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array. [Internet] [Thesis]. NSYSU; 2003. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701103-144851.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Guo Y. Thermo-Mechanical Deformation and Stress Analysis of Flip-Chip Ball Grid Array. [Thesis]. NSYSU; 2003. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701103-144851

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

4. Chen, Wei-Chih. The Study of Precondition Variations on the Warpage of PBGA packages.

Degree: Master, Mechanical Engineering, 2001, NSYSU

 The main objective of this research is to studying the moisture effect on warpage of PBGA via IR-reflow process by utilizing Shadow Moirè method. The… (more)

Subjects/Keywords: Humidity; Warpage; IC package; Temperature

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen, W. (2001). The Study of Precondition Variations on the Warpage of PBGA packages. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0829101-154953

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen, Wei-Chih. “The Study of Precondition Variations on the Warpage of PBGA packages.” 2001. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0829101-154953.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen, Wei-Chih. “The Study of Precondition Variations on the Warpage of PBGA packages.” 2001. Web. 06 Mar 2021.

Vancouver:

Chen W. The Study of Precondition Variations on the Warpage of PBGA packages. [Internet] [Thesis]. NSYSU; 2001. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0829101-154953.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen W. The Study of Precondition Variations on the Warpage of PBGA packages. [Thesis]. NSYSU; 2001. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0829101-154953

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

5. Hung, Jhen-Siou. Reliability of Coreless substrate under thermal loading.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

 The thesis aims to enhance the reliability of the flip-chip ball grid array (FCBGA) package and coreless substrate by changing the material properties of dielectric… (more)

Subjects/Keywords: Reliability; Thermal loading; Coreless substrate; Flip-chip; Warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hung, J. (2015). Reliability of Coreless substrate under thermal loading. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1004115-165049

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hung, Jhen-Siou. “Reliability of Coreless substrate under thermal loading.” 2015. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1004115-165049.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hung, Jhen-Siou. “Reliability of Coreless substrate under thermal loading.” 2015. Web. 06 Mar 2021.

Vancouver:

Hung J. Reliability of Coreless substrate under thermal loading. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1004115-165049.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hung J. Reliability of Coreless substrate under thermal loading. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1004115-165049

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

6. Hong, Yu-Ting. Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2018, NSYSU

 Since the polymer materials in electronic package are humidity sensitive, then their material properties may cause warpage of the package. When the polymer materials absorb… (more)

Subjects/Keywords: Fan-out package; moisture; FEA; 3D-DIC; Youngâs modulus; CME; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hong, Y. (2018). Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619118-125411

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hong, Yu-Ting. “Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package.” 2018. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619118-125411.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hong, Yu-Ting. “Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package.” 2018. Web. 06 Mar 2021.

Vancouver:

Hong Y. Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package. [Internet] [Thesis]. NSYSU; 2018. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619118-125411.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hong Y. Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package. [Thesis]. NSYSU; 2018. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619118-125411

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Delft University of Technology

7. Alkiviades, Charis (author). Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line.

Degree: 2019, Delft University of Technology

 Airborne Composites Automation recently installed an automation product line that creates flat thermoplastic laminates intended for consumer electronics industry. However, due to the composite nature… (more)

Subjects/Keywords: ABAQUS; Python; Warpage; Thermoforming; finite element analysis; Viscoelastic

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Alkiviades, C. (. (2019). Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:c30a2381-5119-49c7-8854-8a21f5cd071e

Chicago Manual of Style (16th Edition):

Alkiviades, Charis (author). “Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line.” 2019. Masters Thesis, Delft University of Technology. Accessed March 06, 2021. http://resolver.tudelft.nl/uuid:c30a2381-5119-49c7-8854-8a21f5cd071e.

MLA Handbook (7th Edition):

Alkiviades, Charis (author). “Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line.” 2019. Web. 06 Mar 2021.

Vancouver:

Alkiviades C(. Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line. [Internet] [Masters thesis]. Delft University of Technology; 2019. [cited 2021 Mar 06]. Available from: http://resolver.tudelft.nl/uuid:c30a2381-5119-49c7-8854-8a21f5cd071e.

Council of Science Editors:

Alkiviades C(. Computational analysis of warpage of composite laminates: Towards digital twins of laminates fabricated from an automation line. [Masters Thesis]. Delft University of Technology; 2019. Available from: http://resolver.tudelft.nl/uuid:c30a2381-5119-49c7-8854-8a21f5cd071e

8. YANG KAI. Wafer warpage detection during bake process in photolithography.

Degree: 2004, National University of Singapore

Subjects/Keywords: Microlithography Warpage Critical Dimension (CD)

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APA (6th Edition):

KAI, Y. (2004). Wafer warpage detection during bake process in photolithography. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/14142

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

KAI, YANG. “Wafer warpage detection during bake process in photolithography.” 2004. Thesis, National University of Singapore. Accessed March 06, 2021. http://scholarbank.nus.edu.sg/handle/10635/14142.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

KAI, YANG. “Wafer warpage detection during bake process in photolithography.” 2004. Web. 06 Mar 2021.

Vancouver:

KAI Y. Wafer warpage detection during bake process in photolithography. [Internet] [Thesis]. National University of Singapore; 2004. [cited 2021 Mar 06]. Available from: http://scholarbank.nus.edu.sg/handle/10635/14142.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

KAI Y. Wafer warpage detection during bake process in photolithography. [Thesis]. National University of Singapore; 2004. Available from: http://scholarbank.nus.edu.sg/handle/10635/14142

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of New Mexico

9. Dou, Jingjing. Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry.

Degree: Mechanical Engineering, 2015, University of New Mexico

 Three-dimensional integration is a solution that vertically stacks multiple layers of silicon chips by Through-Silicon-Vias (TSVs) to enhance the performance of microelectronic devices. The tapered… (more)

Subjects/Keywords: tapered Through-Silicon-Via (TSV); wafer warpage; finite element analysis (FEA)

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Dou, J. (2015). Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry. (Masters Thesis). University of New Mexico. Retrieved from http://hdl.handle.net/1928/25737

Chicago Manual of Style (16th Edition):

Dou, Jingjing. “Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry.” 2015. Masters Thesis, University of New Mexico. Accessed March 06, 2021. http://hdl.handle.net/1928/25737.

MLA Handbook (7th Edition):

Dou, Jingjing. “Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry.” 2015. Web. 06 Mar 2021.

Vancouver:

Dou J. Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry. [Internet] [Masters thesis]. University of New Mexico; 2015. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/1928/25737.

Council of Science Editors:

Dou J. Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry. [Masters Thesis]. University of New Mexico; 2015. Available from: http://hdl.handle.net/1928/25737


University of Maryland

10. Sun, Yong. Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages.

Degree: Mechanical Engineering, 2016, University of Maryland

 Nonlinear thermo-mechanical properties of advanced polymers are crucial to accurate prediction of the process induced warpage and residual stress of electronics packages. The Fiber Bragg… (more)

Subjects/Keywords: Mechanical engineering; Electronic packaging; Polymer; Properties characterization; Residual stress; Warpage

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APA (6th Edition):

Sun, Y. (2016). Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages. (Thesis). University of Maryland. Retrieved from http://hdl.handle.net/1903/18236

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Sun, Yong. “Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages.” 2016. Thesis, University of Maryland. Accessed March 06, 2021. http://hdl.handle.net/1903/18236.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Sun, Yong. “Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages.” 2016. Web. 06 Mar 2021.

Vancouver:

Sun Y. Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages. [Internet] [Thesis]. University of Maryland; 2016. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/1903/18236.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Sun Y. Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages. [Thesis]. University of Maryland; 2016. Available from: http://hdl.handle.net/1903/18236

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Bordeaux I

11. Feng, Wei. Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology.

Degree: Docteur es, Electronique, 2010, Université de Bordeaux I

Les assemblages PoP pour « Package on Package » permettent d’augmenter fortement la densité d’intégration des circuits et systèmes microélectroniques, par superposition de plusieurs éléments… (more)

Subjects/Keywords: PoP (Package-on-Package); Gauchissement thermomécanique; Gauchissement hygromécanique; Cycles thermiques; Électromigration; PoP (Package-on-Package), thermomechanical warpage, hygromechanical warpage, thermal cycling, electromigration

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Feng, W. (2010). Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology. (Doctoral Dissertation). Université de Bordeaux I. Retrieved from http://www.theses.fr/2010BOR14014

Chicago Manual of Style (16th Edition):

Feng, Wei. “Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology.” 2010. Doctoral Dissertation, Université de Bordeaux I. Accessed March 06, 2021. http://www.theses.fr/2010BOR14014.

MLA Handbook (7th Edition):

Feng, Wei. “Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology.” 2010. Web. 06 Mar 2021.

Vancouver:

Feng W. Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology. [Internet] [Doctoral dissertation]. Université de Bordeaux I; 2010. [cited 2021 Mar 06]. Available from: http://www.theses.fr/2010BOR14014.

Council of Science Editors:

Feng W. Caractérisation expérimentale et simulation physique des mécanismes de dégradation des interconnexions sans plomb dans les technologies d’assemblage a trés forte densite d’intégration « boitier sur boitier » : Prediction tool development of an Integrated Circuit behavior under laser impact in CMOS technology. [Doctoral Dissertation]. Université de Bordeaux I; 2010. Available from: http://www.theses.fr/2010BOR14014


NSYSU

12. Hung, Chien-Hsiung. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.

Degree: Master, Mechanical Engineering, 2000, NSYSU

 Abstractï¼ The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC… (more)

Subjects/Keywords: IC package; shadow moire; moisture; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hung, C. (2000). The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hung, Chien-Hsiung. “The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.” 2000. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hung, Chien-Hsiung. “The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.” 2000. Web. 06 Mar 2021.

Vancouver:

Hung C. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. [Internet] [Thesis]. NSYSU; 2000. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hung C. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. [Thesis]. NSYSU; 2000. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

13. Syue, Ming-Jyun. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out.… (more)

Subjects/Keywords: finite element method; cold joint; 2.5D integrated circuits; copper pillar bump; warpage

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APA (6th Edition):

Syue, M. (2014). The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Web. 06 Mar 2021.

Vancouver:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

14. Yen, Jia-Jin. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.

Degree: Master, Mechanical Engineering, 2001, NSYSU

 The main objective of this paper is to utilizing the Shadow Moiré method to study the effect of IR-reflow Condition Variations on the warpage of… (more)

Subjects/Keywords: Peak Temperature; Waiting Time; Warpage; Moisture

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Yen, J. (2001). The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Yen, Jia-Jin. “The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.” 2001. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Yen, Jia-Jin. “The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.” 2001. Web. 06 Mar 2021.

Vancouver:

Yen J. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. [Internet] [Thesis]. NSYSU; 2001. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Yen J. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. [Thesis]. NSYSU; 2001. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

15. Chen, Yung-Chang. The Study of Thermo-mechanical Behavior of PBGA Package's Interface.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2003, NSYSU

 The Plastic Ball Grid Array (PBGA) package and flip-chip technology have been widely used in the microelectronics industry. However, due to the effect of hygroscopic… (more)

Subjects/Keywords: PBGA; moisture; warpage; adhesion; thermal cycling

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APA (6th Edition):

Chen, Y. (2003). The Study of Thermo-mechanical Behavior of PBGA Package's Interface. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1016103-084812

Chicago Manual of Style (16th Edition):

Chen, Yung-Chang. “The Study of Thermo-mechanical Behavior of PBGA Package's Interface.” 2003. Doctoral Dissertation, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1016103-084812.

MLA Handbook (7th Edition):

Chen, Yung-Chang. “The Study of Thermo-mechanical Behavior of PBGA Package's Interface.” 2003. Web. 06 Mar 2021.

Vancouver:

Chen Y. The Study of Thermo-mechanical Behavior of PBGA Package's Interface. [Internet] [Doctoral dissertation]. NSYSU; 2003. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1016103-084812.

Council of Science Editors:

Chen Y. The Study of Thermo-mechanical Behavior of PBGA Package's Interface. [Doctoral Dissertation]. NSYSU; 2003. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1016103-084812


Universidade do Rio Grande do Sul

16. Amaral, Regis Fabiano do. Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução.

Degree: 2016, Universidade do Rio Grande do Sul

A microestrutura de uma peça temperada determina suas características mecânicas. Dessa forma, torna-se fundamental conhecer os parâmetros que influenciam na formação da estrutura do componente… (more)

Subjects/Keywords: Tratamento térmico; Steering gear; Rack; Ensaios mecânicos; Heat treatment; Cremalheira; Warpage; Aço

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APA (6th Edition):

Amaral, R. F. d. (2016). Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução. (Thesis). Universidade do Rio Grande do Sul. Retrieved from http://hdl.handle.net/10183/153324

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Amaral, Regis Fabiano do. “Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução.” 2016. Thesis, Universidade do Rio Grande do Sul. Accessed March 06, 2021. http://hdl.handle.net/10183/153324.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Amaral, Regis Fabiano do. “Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução.” 2016. Web. 06 Mar 2021.

Vancouver:

Amaral RFd. Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução. [Internet] [Thesis]. Universidade do Rio Grande do Sul; 2016. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/10183/153324.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Amaral RFd. Comparativo de empenamento e microestrutural em cremalheiras de aço SAE 1045 temperadas por indução e por condução. [Thesis]. Universidade do Rio Grande do Sul; 2016. Available from: http://hdl.handle.net/10183/153324

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

17. Su, Wei-Hung. Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

 With the advance of the semiconductor industry and in response to the demands of ultra-thin electronic products, packaging technology has been continuously developed. Thermal bonding… (more)

Subjects/Keywords: Embedded copper trace substrate; Flip-chip package; Finite element analysis; Warpage deformation

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APA (6th Edition):

Su, W. (2017). Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0811117-111125

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Su, Wei-Hung. “Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes.” 2017. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0811117-111125.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Su, Wei-Hung. “Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes.” 2017. Web. 06 Mar 2021.

Vancouver:

Su W. Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes. [Internet] [Thesis]. NSYSU; 2017. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0811117-111125.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Su W. Finite Element Analyzes of Warpage Behavior of Embedded Copper Trace Substrate During Flip Chip Package Processes. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0811117-111125

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universitat Politècnica de València

18. Gámez Martínez, Juan Luis. ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA .

Degree: 2014, Universitat Politècnica de València

 La gran parte de productos de consumo contienen partes realizadas a través del proceso de inyección de termoplásticos, esto constata la importancia de este proceso… (more)

Subjects/Keywords: Plastics injection moulded part desing; Neural Network; Warpage; Shrinkage; Shape modification; Response surface

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APA (6th Edition):

Gámez Martínez, J. L. (2014). ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA . (Doctoral Dissertation). Universitat Politècnica de València. Retrieved from http://hdl.handle.net/10251/39350

Chicago Manual of Style (16th Edition):

Gámez Martínez, Juan Luis. “ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA .” 2014. Doctoral Dissertation, Universitat Politècnica de València. Accessed March 06, 2021. http://hdl.handle.net/10251/39350.

MLA Handbook (7th Edition):

Gámez Martínez, Juan Luis. “ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA .” 2014. Web. 06 Mar 2021.

Vancouver:

Gámez Martínez JL. ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA . [Internet] [Doctoral dissertation]. Universitat Politècnica de València; 2014. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/10251/39350.

Council of Science Editors:

Gámez Martínez JL. ANÁLISIS DE LA DEFORMACIÓN EN LA INYECCIÓN DE TERMOPLÁSTICOS BAJO VARIABLES DE FORMA DE LA PIEZA MEDIANTE RED NEURONAL Y SUPERFICIES RESPUESTA . [Doctoral Dissertation]. Universitat Politècnica de València; 2014. Available from: http://hdl.handle.net/10251/39350


Brno University of Technology

19. Hamáček, Richard. Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts.

Degree: 2018, Brno University of Technology

 This project is dealt with optimalization of moulding procedure of plastic housing of headlamp for project DCW 204 Mopf halogen. The aim is reach a… (more)

Subjects/Keywords: těleso světlometu; deformace; světlomet; vstřikování; optimalizace; optická; Moldflow; housing; warpage; headlamp; injection; optimalization; Moldflow

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APA (6th Edition):

Hamáček, R. (2018). Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/6326

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hamáček, Richard. “Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts.” 2018. Thesis, Brno University of Technology. Accessed March 06, 2021. http://hdl.handle.net/11012/6326.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hamáček, Richard. “Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts.” 2018. Web. 06 Mar 2021.

Vancouver:

Hamáček R. Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/11012/6326.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hamáček R. Optimalizace technologických parametrů vstřikování plastového dílce: Optimization of technological parameters of injection plastic parts. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/6326

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Virginia Tech

20. DePolo, Wade Scott. Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers.

Degree: PhD, Chemical Engineering, 2005, Virginia Tech

 This work has been concerned with the dimensional stability and the structure-property relationships of thermoplastics reinforced with particulate and fiber fillers. The first part of… (more)

Subjects/Keywords: Rheology; Stucture-Property Relationships; Warpage; Nanocomposites

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

DePolo, W. S. (2005). Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/29068

Chicago Manual of Style (16th Edition):

DePolo, Wade Scott. “Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers.” 2005. Doctoral Dissertation, Virginia Tech. Accessed March 06, 2021. http://hdl.handle.net/10919/29068.

MLA Handbook (7th Edition):

DePolo, Wade Scott. “Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers.” 2005. Web. 06 Mar 2021.

Vancouver:

DePolo WS. Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers. [Internet] [Doctoral dissertation]. Virginia Tech; 2005. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/10919/29068.

Council of Science Editors:

DePolo WS. Dimensional Stability and Properties of Thermoplastics Reinforced with Particulate and Fiber Fillers. [Doctoral Dissertation]. Virginia Tech; 2005. Available from: http://hdl.handle.net/10919/29068


NSYSU

21. Chang, Chih-Fang. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.

Degree: Master, Mechanical Engineering, 2000, NSYSU

 The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage(more)

Subjects/Keywords: Warpage; Fringe Order; IC Package; Holographic Interferometry

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APA (6th Edition):

Chang, C. (2000). The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chang, Chih-Fang. “The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.” 2000. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chang, Chih-Fang. “The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.” 2000. Web. 06 Mar 2021.

Vancouver:

Chang C. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. [Internet] [Thesis]. NSYSU; 2000. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chang C. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. [Thesis]. NSYSU; 2000. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

22. LI DA. Control of semiconductor manufacturing: CMP & thickness variations.

Degree: 2003, National University of Singapore

Subjects/Keywords: CMP process; Warpage; EWMA; PCC; OAQC; SPCC

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APA (6th Edition):

DA, L. (2003). Control of semiconductor manufacturing: CMP & thickness variations. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/13517

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

DA, LI. “Control of semiconductor manufacturing: CMP & thickness variations.” 2003. Thesis, National University of Singapore. Accessed March 06, 2021. http://scholarbank.nus.edu.sg/handle/10635/13517.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

DA, LI. “Control of semiconductor manufacturing: CMP & thickness variations.” 2003. Web. 06 Mar 2021.

Vancouver:

DA L. Control of semiconductor manufacturing: CMP & thickness variations. [Internet] [Thesis]. National University of Singapore; 2003. [cited 2021 Mar 06]. Available from: http://scholarbank.nus.edu.sg/handle/10635/13517.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

DA L. Control of semiconductor manufacturing: CMP & thickness variations. [Thesis]. National University of Singapore; 2003. Available from: http://scholarbank.nus.edu.sg/handle/10635/13517

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Western Ontario

23. Martin, Eric J. Evaluation of Warpage for Composite Automotive Components.

Degree: 2020, University of Western Ontario

 Thermoplastic composite parts are manufactured using compression molding for the purposes of assembly in a car seat sub-assembly. Concerns about the dimensional accuracy of the… (more)

Subjects/Keywords: Warpage; Composite; Automotive; Laser Line Probe; Reverse Engineering; Compression Molding; Computer-Aided Engineering and Design; Other Materials Science and Engineering

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APA (6th Edition):

Martin, E. J. (2020). Evaluation of Warpage for Composite Automotive Components. (Thesis). University of Western Ontario. Retrieved from https://ir.lib.uwo.ca/etd/7409

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Martin, Eric J. “Evaluation of Warpage for Composite Automotive Components.” 2020. Thesis, University of Western Ontario. Accessed March 06, 2021. https://ir.lib.uwo.ca/etd/7409.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Martin, Eric J. “Evaluation of Warpage for Composite Automotive Components.” 2020. Web. 06 Mar 2021.

Vancouver:

Martin EJ. Evaluation of Warpage for Composite Automotive Components. [Internet] [Thesis]. University of Western Ontario; 2020. [cited 2021 Mar 06]. Available from: https://ir.lib.uwo.ca/etd/7409.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Martin EJ. Evaluation of Warpage for Composite Automotive Components. [Thesis]. University of Western Ontario; 2020. Available from: https://ir.lib.uwo.ca/etd/7409

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Arizona

24. Nakazawa, Takeshi. THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION .

Degree: 2011, University of Arizona

 The subject of this dissertation is the development of three-dimensional (3D) surface profilers for semiconductor back-end inspection. The value of this study is: 1) to… (more)

Subjects/Keywords: IC package inspection; Stereo vision; Substrate warpage; Three dimensional measurement; Optical Sciences; Coplanarity of ball grid array; Fourier transform profilometry

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APA (6th Edition):

Nakazawa, T. (2011). THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION . (Doctoral Dissertation). University of Arizona. Retrieved from http://hdl.handle.net/10150/205472

Chicago Manual of Style (16th Edition):

Nakazawa, Takeshi. “THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION .” 2011. Doctoral Dissertation, University of Arizona. Accessed March 06, 2021. http://hdl.handle.net/10150/205472.

MLA Handbook (7th Edition):

Nakazawa, Takeshi. “THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION .” 2011. Web. 06 Mar 2021.

Vancouver:

Nakazawa T. THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION . [Internet] [Doctoral dissertation]. University of Arizona; 2011. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/10150/205472.

Council of Science Editors:

Nakazawa T. THREE-DIMENSIONAL NON-CONTACT SURFACE PROFILERS FOR SEMICONDUCTOR IC PACKAGE INSPECTION . [Doctoral Dissertation]. University of Arizona; 2011. Available from: http://hdl.handle.net/10150/205472


KTH

25. Čapas, Linas. Development of an off-line silicon wafer warpage measuring tool.

Degree: Industrial Engineering and Management (ITM), 2020, KTH

Warped wafers and all the issues arise with them. are known issue in semiconductor industry. To solve those issues, the shape of the wafer… (more)

Subjects/Keywords: Photolithography; Semiconductor; Silicon; Wafer; Warpage; Mikrolitografi; Halvledare; Kisel; Kiselplatta; Vrängning; Engineering and Technology; Teknik och teknologier

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Čapas, L. (2020). Development of an off-line silicon wafer warpage measuring tool. (Thesis). KTH. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-289186

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Čapas, Linas. “Development of an off-line silicon wafer warpage measuring tool.” 2020. Thesis, KTH. Accessed March 06, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-289186.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Čapas, Linas. “Development of an off-line silicon wafer warpage measuring tool.” 2020. Web. 06 Mar 2021.

Vancouver:

Čapas L. Development of an off-line silicon wafer warpage measuring tool. [Internet] [Thesis]. KTH; 2020. [cited 2021 Mar 06]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-289186.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Čapas L. Development of an off-line silicon wafer warpage measuring tool. [Thesis]. KTH; 2020. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-289186

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Loughborough University

26. Chung, Chee Keong. The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes.

Degree: PhD, 2013, Loughborough University

 The primary reason for incorporating pigments into plastic materials is to impart the desired colour to finished articles. Some pigments however, may interact with the… (more)

Subjects/Keywords: 668.4; Dimensional stability; Shrinkage; Warpage; Crystallisation; Nucleation; Morphology; Crystalline orientation; Polyethylene; High density polyethylene; Pigment; Phthalocyanine; Carboxylic acid salt; Calcium carbonate

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chung, C. K. (2013). The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes. (Doctoral Dissertation). Loughborough University. Retrieved from http://hdl.handle.net/2134/14550

Chicago Manual of Style (16th Edition):

Chung, Chee Keong. “The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes.” 2013. Doctoral Dissertation, Loughborough University. Accessed March 06, 2021. http://hdl.handle.net/2134/14550.

MLA Handbook (7th Edition):

Chung, Chee Keong. “The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes.” 2013. Web. 06 Mar 2021.

Vancouver:

Chung CK. The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes. [Internet] [Doctoral dissertation]. Loughborough University; 2013. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/2134/14550.

Council of Science Editors:

Chung CK. The influence of pigments and additives on the crystallisation and warpage behaviour of polyethylenes. [Doctoral Dissertation]. Loughborough University; 2013. Available from: http://hdl.handle.net/2134/14550


NSYSU

27. Tsai, Ming-Lang. The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry.

Degree: Master, Mechanical Engineering, 2001, NSYSU

 The main aim of this study is to extending the holographic interferometry technique to measure the out-of-plane displacement of an object subjected to both temperature… (more)

Subjects/Keywords: Holographic Interferometry; Warpage; IC Package; Auxiliary Object; Out-of-Plane Displacement

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tsai, M. (2001). The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0517101-172512

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tsai, Ming-Lang. “The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry.” 2001. Thesis, NSYSU. Accessed March 06, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0517101-172512.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tsai, Ming-Lang. “The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry.” 2001. Web. 06 Mar 2021.

Vancouver:

Tsai M. The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry. [Internet] [Thesis]. NSYSU; 2001. [cited 2021 Mar 06]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0517101-172512.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tsai M. The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry. [Thesis]. NSYSU; 2001. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0517101-172512

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Oulu

28. Särkkä, J. (Jussi). A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.

Degree: 2008, University of Oulu

Abstract Electronic devices are subjected to various usage environments, wherein stresses are induced to components and their interconnections. The level of stress affects the interval… (more)

Subjects/Keywords: FIT; component warpage; hazard rate; lead free electronics; reliability estimation; solder joint failure; solder joint fatigue; solder joint reliability; juotosliitosten luotettavuus; juotosliitosten vikaantuminen; komponentin taipuminen; luotettavuusennusteet; lyijytön elektroniikka; vikataajuus

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Särkkä, J. (. (2008). A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9789514288197

Chicago Manual of Style (16th Edition):

Särkkä, J (Jussi). “A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.” 2008. Doctoral Dissertation, University of Oulu. Accessed March 06, 2021. http://urn.fi/urn:isbn:9789514288197.

MLA Handbook (7th Edition):

Särkkä, J (Jussi). “A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.” 2008. Web. 06 Mar 2021.

Vancouver:

Särkkä J(. A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. [Internet] [Doctoral dissertation]. University of Oulu; 2008. [cited 2021 Mar 06]. Available from: http://urn.fi/urn:isbn:9789514288197.

Council of Science Editors:

Särkkä J(. A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. [Doctoral Dissertation]. University of Oulu; 2008. Available from: http://urn.fi/urn:isbn:9789514288197

29. CHEN WEI. Temperature regulation and in-situ fault detection of wafer warpage.

Degree: 2005, National University of Singapore

Subjects/Keywords: Wafer warpage; Fault detection; Feedforward; Temperature control; Lithogrophy; Semiconductor manufacturing

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

WEI, C. (2005). Temperature regulation and in-situ fault detection of wafer warpage. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/14831

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

WEI, CHEN. “Temperature regulation and in-situ fault detection of wafer warpage.” 2005. Thesis, National University of Singapore. Accessed March 06, 2021. http://scholarbank.nus.edu.sg/handle/10635/14831.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

WEI, CHEN. “Temperature regulation and in-situ fault detection of wafer warpage.” 2005. Web. 06 Mar 2021.

Vancouver:

WEI C. Temperature regulation and in-situ fault detection of wafer warpage. [Internet] [Thesis]. National University of Singapore; 2005. [cited 2021 Mar 06]. Available from: http://scholarbank.nus.edu.sg/handle/10635/14831.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

WEI C. Temperature regulation and in-situ fault detection of wafer warpage. [Thesis]. National University of Singapore; 2005. Available from: http://scholarbank.nus.edu.sg/handle/10635/14831

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Maryland

30. Cox, Austin Bradley. Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry.

Degree: Mechanical Engineering, 2006, University of Maryland

 Coefficient of thermal expansion mismatches in microelectronic devices induce deformation when these devices are subjected to thermal loading during manufacturing or everyday operation, creating failures… (more)

Subjects/Keywords: Engineering, Mechanical; Engineering, Mechanical; infrared interferometry; shadow moire; warpage measurement

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Cox, A. B. (2006). Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry. (Thesis). University of Maryland. Retrieved from http://hdl.handle.net/1903/3914

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Cox, Austin Bradley. “Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry.” 2006. Thesis, University of Maryland. Accessed March 06, 2021. http://hdl.handle.net/1903/3914.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Cox, Austin Bradley. “Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry.” 2006. Web. 06 Mar 2021.

Vancouver:

Cox AB. Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry. [Internet] [Thesis]. University of Maryland; 2006. [cited 2021 Mar 06]. Available from: http://hdl.handle.net/1903/3914.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Cox AB. Development of Advanced Warpage Measurement Systems: Shadow Moiré with Nonzero Talbot Distance and Far Infrared Twyman-Green Interferometry. [Thesis]. University of Maryland; 2006. Available from: http://hdl.handle.net/1903/3914

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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