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You searched for subject:(solder joint). Showing records 1 – 30 of 60 total matches.

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University of Oulu

1. Särkkä, J. (Jussi). A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.

Degree: 2008, University of Oulu

Abstract Electronic devices are subjected to various usage environments, wherein stresses are induced to components and their interconnections. The level of stress affects the interval… (more)

Subjects/Keywords: FIT; component warpage; hazard rate; lead free electronics; reliability estimation; solder joint failure; solder joint fatigue; solder joint reliability; juotosliitosten luotettavuus; juotosliitosten vikaantuminen; komponentin taipuminen; luotettavuusennusteet; lyijytön elektroniikka; vikataajuus

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Särkkä, J. (. (2008). A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9789514288197

Chicago Manual of Style (16th Edition):

Särkkä, J (Jussi). “A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.” 2008. Doctoral Dissertation, University of Oulu. Accessed November 23, 2020. http://urn.fi/urn:isbn:9789514288197.

MLA Handbook (7th Edition):

Särkkä, J (Jussi). “A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics.” 2008. Web. 23 Nov 2020.

Vancouver:

Särkkä J(. A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. [Internet] [Doctoral dissertation]. University of Oulu; 2008. [cited 2020 Nov 23]. Available from: http://urn.fi/urn:isbn:9789514288197.

Council of Science Editors:

Särkkä J(. A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics. [Doctoral Dissertation]. University of Oulu; 2008. Available from: http://urn.fi/urn:isbn:9789514288197


University of Wolverhampton

2. Zarmai, Musa Tanko. Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction.

Degree: PhD, 2016, University of Wolverhampton

 Standard crystalline silicon photovoltaic (PV) modules are designed to continuously convert solar energy into electricity for 25 years. However, the continual generation of electricity by… (more)

Subjects/Keywords: Photovoltaic modules; crystalline silicon; solar cells; solder interconnection; intermetallic compound thickness; solder joint thickness; solder joint width; strain energy density; finite element modelling and simulation; fatigue life prediction

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APA (6th Edition):

Zarmai, M. T. (2016). Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction. (Doctoral Dissertation). University of Wolverhampton. Retrieved from http://hdl.handle.net/2436/617782

Chicago Manual of Style (16th Edition):

Zarmai, Musa Tanko. “Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction.” 2016. Doctoral Dissertation, University of Wolverhampton. Accessed November 23, 2020. http://hdl.handle.net/2436/617782.

MLA Handbook (7th Edition):

Zarmai, Musa Tanko. “Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction.” 2016. Web. 23 Nov 2020.

Vancouver:

Zarmai MT. Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction. [Internet] [Doctoral dissertation]. University of Wolverhampton; 2016. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/2436/617782.

Council of Science Editors:

Zarmai MT. Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction. [Doctoral Dissertation]. University of Wolverhampton; 2016. Available from: http://hdl.handle.net/2436/617782


University of Oulu

3. Putaala, J. (Jussi). Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications.

Degree: 2015, University of Oulu

Abstract In the interest of improving reliability, electrical monitoring methods were utilized to observe the degradation of electronics interconnections while simultaneously characterizing accelerated testing-induced changes… (more)

Subjects/Keywords: failure detection; solder joint; juoteliitos; viantunnistus; BGA; LTCC; RF; TCT

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APA (6th Edition):

Putaala, J. (. (2015). Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9789526207605

Chicago Manual of Style (16th Edition):

Putaala, J (Jussi). “Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications.” 2015. Doctoral Dissertation, University of Oulu. Accessed November 23, 2020. http://urn.fi/urn:isbn:9789526207605.

MLA Handbook (7th Edition):

Putaala, J (Jussi). “Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications.” 2015. Web. 23 Nov 2020.

Vancouver:

Putaala J(. Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications. [Internet] [Doctoral dissertation]. University of Oulu; 2015. [cited 2020 Nov 23]. Available from: http://urn.fi/urn:isbn:9789526207605.

Council of Science Editors:

Putaala J(. Reliability and prognostic monitoring methods of electronics interconnections in advanced SMD applications. [Doctoral Dissertation]. University of Oulu; 2015. Available from: http://urn.fi/urn:isbn:9789526207605


Brno University of Technology

4. Novotný, Václav. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.

Degree: 2019, Brno University of Technology

 This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage… (more)

Subjects/Keywords: Únavový model; pájený spoj; únava; spolehlivost; odhad; bezolovnatá pájka; Creep-Fatigue model; Solder joint; Fatigue; Reliability; Estimation; Lead-Free solder

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Novotný, V. (2019). Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/7771

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Novotný, Václav. “Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/7771.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Novotný, Václav. “Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.” 2019. Web. 23 Nov 2020.

Vancouver:

Novotný V. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/7771.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Novotný V. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/7771

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

5. Toufar, Michal. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.

Degree: 2019, Brno University of Technology

 It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the… (more)

Subjects/Keywords: bezolovnatá pájka; pájení přetavením; dusík; kvalita pájeného spoje; povrchová úprava; lead – free solder reflow; nitrogen; quality of solder joint; surface finish

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APA (6th Edition):

Toufar, M. (2019). Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/34465

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Toufar, Michal. “Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/34465.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Toufar, Michal. “Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.” 2019. Web. 23 Nov 2020.

Vancouver:

Toufar M. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/34465.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Toufar M. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/34465

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

6. Novotný, Václav. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.

Degree: 2014, Brno University of Technology

 This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage… (more)

Subjects/Keywords: Únavový model; pájený spoj; únava; spolehlivost; odhad; bezolovnatá pájka; Creep-Fatigue model; Solder joint; Fatigue; Reliability; Estimation; Lead-Free solder

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Novotný, V. (2014). Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17934

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Novotný, Václav. “Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.” 2014. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/17934.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Novotný, Václav. “Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction.” 2014. Web. 23 Nov 2020.

Vancouver:

Novotný V. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. [Internet] [Thesis]. Brno University of Technology; 2014. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/17934.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Novotný V. Únavové modely pro vyhodnocování spolehlivosti pájených spojů: Creep-fatigue models for solder joints reliability prediction. [Thesis]. Brno University of Technology; 2014. Available from: http://hdl.handle.net/11012/17934

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

7. Novotný, Václav. Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic.

Degree: 2019, Brno University of Technology

 The diploma thesis deals with the sphere of solder joints reliability. The narrower focus is use of lead-free solder alloy SAC305 in the production process… (more)

Subjects/Keywords: ANSYS; bezolovnatá pájka; LTCC; pájený spoj; spolehlivost; únavový model; ANSYS; lead-free solder; LTCC; solder joint; reliability; fatigue model

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Novotný, V. (2019). Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32186

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Novotný, Václav. “Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/32186.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Novotný, Václav. “Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic.” 2019. Web. 23 Nov 2020.

Vancouver:

Novotný V. Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/32186.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Novotný V. Termomechanická spolehlivost pájených propojení v elektronice: Termomechanical reliability soldered connections in electronic. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/32186

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

8. Juračka, Martin. Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch.

Degree: 2018, Brno University of Technology

 This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work… (more)

Subjects/Keywords: Pájení; pájený spoj; Fritsch Mikroplacer; bezolovnaté pájky; fázový diagram; teplotní pájecí profil; posuzování poruch; Solder; solder joint; Fritsch Mikroplacer; lead-free solder; phase diagram; heat profil; assessment failure.

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APA (6th Edition):

Juračka, M. (2018). Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32160

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Juračka, Martin. “Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/32160.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Juračka, Martin. “Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch.” 2018. Web. 23 Nov 2020.

Vancouver:

Juračka M. Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/32160.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Juračka M. Možnosti pájení SMD součástek pomocí zařízení Fritsch: The possibilities of SMD components soldering by equipment Fritsch. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/32160

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

9. Dosedla, Milan. Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence.

Degree: 2018, Brno University of Technology

 This thesis deals with novel trends in solder paste technology. It focuses on nanoparticle applications used as a tool for improving a state of the… (more)

Subjects/Keywords: Nanokompozitní pájka; nanočástice; pájený spoj; pájecí pasty; intermetalická vrstva; oxid titaničitý; bizmut.; Nanocomposite solder; nanoparticles; solder joint; solder paste; IMC; titanium dioxide; bismuth.

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APA (6th Edition):

Dosedla, M. (2018). Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/59846

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Dosedla, Milan. “Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/59846.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Dosedla, Milan. “Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence.” 2018. Web. 23 Nov 2020.

Vancouver:

Dosedla M. Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/59846.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Dosedla M. Trendy v oblasti pájecích past a vliv nanočástic: Trends in Solder Paste Area and Nanoparticles Influence. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/59846

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

10. Pelc, Miroslav. Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints.

Degree: 2014, Brno University of Technology

 This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the… (more)

Subjects/Keywords: Spolehlivost pájeného spoje; bezolovnaté pájky; struktura pájeného spoje; dusíková atmosféra; Reliability of the solder joint; leed-free solders; structure of solder joint; nitrogen atmosphere.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Pelc, M. (2014). Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1768

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pelc, Miroslav. “Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints.” 2014. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/1768.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pelc, Miroslav. “Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints.” 2014. Web. 23 Nov 2020.

Vancouver:

Pelc M. Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints. [Internet] [Thesis]. Brno University of Technology; 2014. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/1768.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pelc M. Výzkum spolehlivosti bezolovnatých pájených spojů: Research of the reliability of lead-free solder joints. [Thesis]. Brno University of Technology; 2014. Available from: http://hdl.handle.net/11012/1768

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

11. Salmela, Olli. Reliability Assessment of Telecommunications Equipment.

Degree: 2005, Helsinki University of Technology

This thesis studies the reliability of telecommunications equipment, its components, and the systems made using those components. Special attention is paid to creating stronger links… (more)

Subjects/Keywords: reliability; availability; MTTF; MTBF; hazard rate; derating; solder joint; fatigue; 3rd generation telecommunications network

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Salmela, O. (2005). Reliability Assessment of Telecommunications Equipment. (Thesis). Helsinki University of Technology. Retrieved from http://lib.tkk.fi/Diss/2005/isbn9512274779/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Salmela, Olli. “Reliability Assessment of Telecommunications Equipment.” 2005. Thesis, Helsinki University of Technology. Accessed November 23, 2020. http://lib.tkk.fi/Diss/2005/isbn9512274779/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Salmela, Olli. “Reliability Assessment of Telecommunications Equipment.” 2005. Web. 23 Nov 2020.

Vancouver:

Salmela O. Reliability Assessment of Telecommunications Equipment. [Internet] [Thesis]. Helsinki University of Technology; 2005. [cited 2020 Nov 23]. Available from: http://lib.tkk.fi/Diss/2005/isbn9512274779/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Salmela O. Reliability Assessment of Telecommunications Equipment. [Thesis]. Helsinki University of Technology; 2005. Available from: http://lib.tkk.fi/Diss/2005/isbn9512274779/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

12. Maslák, Marián. Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging.

Degree: 2019, Brno University of Technology

This work deals with issues of descriptions program ANSYS, and simulation thermo-mechanical stress, charakteristic cause of creation fails accelerated aging. Advisors/Committee Members: Vaško, Cyril (advisor), Novotný, Marek (referee).

Subjects/Keywords: modelování; pájený spoj; zrychlené stárnutí; namáhání; ANSYS; modelling; solder joint; thermal aging; shear stress; ANSYS

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APA (6th Edition):

Maslák, M. (2019). Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/15077

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Maslák, Marián. “Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/15077.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Maslák, Marián. “Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging.” 2019. Web. 23 Nov 2020.

Vancouver:

Maslák M. Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/15077.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Maslák M. Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/15077

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

13. Lačný, Radek. Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability.

Degree: 2019, Brno University of Technology

 This work is considered about changes of electric conductivity in lead-free soldered joint's affected by current and thermal stress. The theoretical part describes factors influencing… (more)

Subjects/Keywords: Elektrická vodivost; pájený spoj; bezolovnaté pájení; spolehlivost; Electric Conductivity; Solder Joint; Lead-free Soldering; Reliability

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APA (6th Edition):

Lačný, R. (2019). Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/15850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lačný, Radek. “Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/15850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lačný, Radek. “Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability.” 2019. Web. 23 Nov 2020.

Vancouver:

Lačný R. Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/15850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lačný R. Elektrická vodivost pájeného spoje a vliv na spolehlivost: Solder Joint Electric Conductivity and Solder Joint Reliability. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/15850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

14. Stejskal, Petr. Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction.

Degree: 2018, Brno University of Technology

 The thesis deals issue of the solder joint reliability and diagnostics. The manufacturing technology of electronics currently features a very high level of perfection. A… (more)

Subjects/Keywords: Pájený spoj; intermetalická vrstva; spolehlivost; predikce.; Solder joint; intermetallic layer; reliability; prediction.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Stejskal, P. (2018). Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/36352

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Stejskal, Petr. “Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/36352.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Stejskal, Petr. “Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction.” 2018. Web. 23 Nov 2020.

Vancouver:

Stejskal P. Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/36352.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Stejskal P. Predikce spolehlivosti pájeného spoje: Solder Joint Reliability Prediction. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/36352

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

15. Dvořák, Jaroslav. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders.

Degree: 2019, Brno University of Technology

 This research work is dealing with impact and size of the thermoelectric that may influence DC circuits. Main part of this thesis is to build… (more)

Subjects/Keywords: termonapětí; pájený spoj; olovnaté a bezolovnaté pájení; thermotension; solder joint; lead and lead-free solders

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APA (6th Edition):

Dvořák, J. (2019). Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1753

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Dvořák, Jaroslav. “Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/1753.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Dvořák, Jaroslav. “Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders.” 2019. Web. 23 Nov 2020.

Vancouver:

Dvořák J. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/1753.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Dvořák J. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami: Definition of thermotension by lead and lead-free solders. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1753

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Cal Poly

16. Kimura, Erin A. RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA.

Degree: MS, Industrial and Manufacturing Engineering, 2012, Cal Poly

  The appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. The objective of this study is to… (more)

Subjects/Keywords: solder joint; failure criteria; X-bar and R charts; statistical process control; Industrial Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Kimura, E. A. (2012). RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA. (Masters Thesis). Cal Poly. Retrieved from https://digitalcommons.calpoly.edu/theses/867 ; 10.15368/theses.2012.188

Chicago Manual of Style (16th Edition):

Kimura, Erin A. “RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA.” 2012. Masters Thesis, Cal Poly. Accessed November 23, 2020. https://digitalcommons.calpoly.edu/theses/867 ; 10.15368/theses.2012.188.

MLA Handbook (7th Edition):

Kimura, Erin A. “RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA.” 2012. Web. 23 Nov 2020.

Vancouver:

Kimura EA. RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA. [Internet] [Masters thesis]. Cal Poly; 2012. [cited 2020 Nov 23]. Available from: https://digitalcommons.calpoly.edu/theses/867 ; 10.15368/theses.2012.188.

Council of Science Editors:

Kimura EA. RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA. [Masters Thesis]. Cal Poly; 2012. Available from: https://digitalcommons.calpoly.edu/theses/867 ; 10.15368/theses.2012.188

17. Assif, Safa. Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards.

Degree: Docteur es, Mécanique, 2013, Rouen, INSA; École Mohammadia d'ingénieurs (Rabat, Maroc)

L'objectif principal de cette thèse est l'étude de la fiabilité des cartes électroniques. Ces cartes sont utilisées dans plusieurs domaines, tels que l’industrie automobile, l’aéronautique,… (more)

Subjects/Keywords: Fiabilité; Optimisation; Incertitude; Cartes électroniques; Joint de brasure; Fatigue; Reliability; Optimization; Uncertainties; Electronic board; Solder joint; Fatigue

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APA (6th Edition):

Assif, S. (2013). Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards. (Doctoral Dissertation). Rouen, INSA; École Mohammadia d'ingénieurs (Rabat, Maroc). Retrieved from http://www.theses.fr/2013ISAM0030

Chicago Manual of Style (16th Edition):

Assif, Safa. “Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards.” 2013. Doctoral Dissertation, Rouen, INSA; École Mohammadia d'ingénieurs (Rabat, Maroc). Accessed November 23, 2020. http://www.theses.fr/2013ISAM0030.

MLA Handbook (7th Edition):

Assif, Safa. “Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards.” 2013. Web. 23 Nov 2020.

Vancouver:

Assif S. Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards. [Internet] [Doctoral dissertation]. Rouen, INSA; École Mohammadia d'ingénieurs (Rabat, Maroc); 2013. [cited 2020 Nov 23]. Available from: http://www.theses.fr/2013ISAM0030.

Council of Science Editors:

Assif S. Fiabilité et optimisation des structures mécaniques à paramètres incertains : application aux cartes électroniques : Reliability and optimization of mechanical strucures in uncertain parameters : application to electronic cards. [Doctoral Dissertation]. Rouen, INSA; École Mohammadia d'ingénieurs (Rabat, Maroc); 2013. Available from: http://www.theses.fr/2013ISAM0030


Loughborough University

18. Zha, Xu. Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration.

Degree: PhD, 2016, Loughborough University

 To meet the requirements of miniaturization and multifunction in microelectronics, understanding of their reliability and performance has become an important research subject in order to… (more)

Subjects/Keywords: 671.5; Lead-free solder joint; Micro scale; Finite element; Thermal fatigue; Electro-migration; Void formation; Joint effect

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APA (6th Edition):

Zha, X. (2016). Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration. (Doctoral Dissertation). Loughborough University. Retrieved from http://hdl.handle.net/2134/23446

Chicago Manual of Style (16th Edition):

Zha, Xu. “Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration.” 2016. Doctoral Dissertation, Loughborough University. Accessed November 23, 2020. http://hdl.handle.net/2134/23446.

MLA Handbook (7th Edition):

Zha, Xu. “Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration.” 2016. Web. 23 Nov 2020.

Vancouver:

Zha X. Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration. [Internet] [Doctoral dissertation]. Loughborough University; 2016. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/2134/23446.

Council of Science Editors:

Zha X. Numerical analysis of lead-free solder joints : effects of thermal cycling and electromigration. [Doctoral Dissertation]. Loughborough University; 2016. Available from: http://hdl.handle.net/2134/23446


Brno University of Technology

19. Lipavský, Lubomír. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests.

Degree: 2019, Brno University of Technology

 This thesis deals with issues lead – free soldering in a protective atmosphere with a focus on mechanical tests. The theoretical part is focused on… (more)

Subjects/Keywords: Bezolovnaté pájky; test střihem; pájení přetavením; spolehlivost pájeného spoje; dusíková atmosféra.; Lead – free solder; shear test; reflow soldering; reliability of the solder joint; nitrogen atmosphere.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lipavský, L. (2019). Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12486

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lipavský, Lubomír. “Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/12486.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lipavský, Lubomír. “Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests.” 2019. Web. 23 Nov 2020.

Vancouver:

Lipavský L. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/12486.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lipavský L. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem: The comparison of properties of solder joints on ceramic substrates by shear tests. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/12486

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

20. Jansa, Vojtěch. Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates.

Degree: 2019, Brno University of Technology

 This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on… (more)

Subjects/Keywords: Bezolovnatá pájka; ochranná atmosféra; dusík; pájení přetavením; kvalita pájeného spoje; test střihem; Lead – free solder; protective atmosphere; nitrogen; reflow soldering; quality of solder joint; shear test

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jansa, V. (2019). Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/26947

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jansa, Vojtěch. “Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/26947.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jansa, Vojtěch. “Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates.” 2019. Web. 23 Nov 2020.

Vancouver:

Jansa V. Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/26947.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jansa V. Pevnost pájených spojů na keramických substrátech: The strength of soldered joints on ceramic substrates. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/26947

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

21. Šefara, Petr. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.

Degree: 2018, Brno University of Technology

 This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and… (more)

Subjects/Keywords: Pájení přetavením; dusík; ochranná atmosféra; bezolovnatá pájka; kvalita pájeného spoje; pájecí prol; Solder reow; nitrogen; modied atmosphere; lead – free; quality of solder joint; temperature prole.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Šefara, P. (2018). Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/40248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Šefara, Petr. “Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/40248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Šefara, Petr. “Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.” 2018. Web. 23 Nov 2020.

Vancouver:

Šefara P. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/40248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Šefara P. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/40248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

22. Vala, Martin. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.

Degree: 2018, Brno University of Technology

 This thesis examines the influence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and… (more)

Subjects/Keywords: Pájení přetavením; dusík; ochranná atmosféra; bezolovnatá pájka; kvalita pájeného spoje; pájecí profil.; Solder reflow; nitrogen; modified atmosphere; lead – free; quality of solder joint; temperature profile.

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APA (6th Edition):

Vala, M. (2018). Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/34464

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Vala, Martin. “Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/34464.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Vala, Martin. “Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere.” 2018. Web. 23 Nov 2020.

Vancouver:

Vala M. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/34464.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Vala M. Výzkum spolehlivosti pájených spojů v dusíkové atmosféře: Investigation of Reliability for Solder Joints in Nitrogen Atmosphere. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/34464

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

23. Valíček, Jan. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.

Degree: 2019, Brno University of Technology

 This thesis deals with the design and implementation of a device for measuring pull strength by surface mounted devices (SMD). It analyzes the theory of… (more)

Subjects/Keywords: Měření síly v tahu; tah; tlak; krokový motor; pájený spoj; pájkové kuličky.; Measuring pull strength; pull-up; pressure; stepper motor; solder joint; solder balls.

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APA (6th Edition):

Valíček, J. (2019). Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/25611

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Valíček, Jan. “Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/25611.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Valíček, Jan. “Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.” 2019. Web. 23 Nov 2020.

Vancouver:

Valíček J. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/25611.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Valíček J. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/25611

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Maryland

24. choubey, anupam. MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS.

Degree: Mechanical Engineering, 2007, University of Maryland

 Most electronics companies have transitioned to lead-free processes, both to comply with government legislation and to avoid issues related to mixing of tin-lead and lead-free… (more)

Subjects/Keywords: Engineering, Mechanical; Solder joint; mixed solder; intermetallic compounds; lead-free; SnPb; microstructure

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

choubey, a. (2007). MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS. (Thesis). University of Maryland. Retrieved from http://hdl.handle.net/1903/7712

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

choubey, anupam. “MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS.” 2007. Thesis, University of Maryland. Accessed November 23, 2020. http://hdl.handle.net/1903/7712.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

choubey, anupam. “MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS.” 2007. Web. 23 Nov 2020.

Vancouver:

choubey a. MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS. [Internet] [Thesis]. University of Maryland; 2007. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/1903/7712.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

choubey a. MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING AND THEIR INFLUENCE ON THERMAL FATIGUE RELIABILITY FOR TIN-LEAD AND LEAD-FREE SOLDER JOINTS, INCLUDING MICROSTRUCTURAL CHANGES UNDER ISOTHERMAL AGING IN MIXED SOLDER JOINTS. [Thesis]. University of Maryland; 2007. Available from: http://hdl.handle.net/1903/7712

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Maryland

25. Wang, Weiqiang. Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test.

Degree: Mechanical Engineering, 2009, University of Maryland

Solder dip may be used as a peripheral leaded terminal refinishing process to replace the original pure tin finish with eutectic tin-lead finish to mitigate… (more)

Subjects/Keywords: Engineering, Mechanical; Reliability; SnBi finish; Solder dip refinishing; Solder joint; Temperature cycling

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, W. (2009). Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test. (Thesis). University of Maryland. Retrieved from http://hdl.handle.net/1903/9275

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Weiqiang. “Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test.” 2009. Thesis, University of Maryland. Accessed November 23, 2020. http://hdl.handle.net/1903/9275.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Weiqiang. “Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test.” 2009. Web. 23 Nov 2020.

Vancouver:

Wang W. Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test. [Internet] [Thesis]. University of Maryland; 2009. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/1903/9275.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang W. Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test. [Thesis]. University of Maryland; 2009. Available from: http://hdl.handle.net/1903/9275

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Texas A&M University

26. Giron Palomares, Jose. Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography.

Degree: PhD, Mechanical Engineering, 2012, Texas A&M University

 Characterizing hidden solder joint shapes is essential for electronics reliability. Active thermography is a methodology to identify hidden defects inside an object by means of… (more)

Subjects/Keywords: active thermography; hidden solder joint; FEA; multi PCB assemblies; nondestructive evaluation; parametric analysis; artificial neural networks

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Giron Palomares, J. (2012). Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography. (Doctoral Dissertation). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223

Chicago Manual of Style (16th Edition):

Giron Palomares, Jose. “Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography.” 2012. Doctoral Dissertation, Texas A&M University. Accessed November 23, 2020. http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223.

MLA Handbook (7th Edition):

Giron Palomares, Jose. “Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography.” 2012. Web. 23 Nov 2020.

Vancouver:

Giron Palomares J. Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography. [Internet] [Doctoral dissertation]. Texas A&M University; 2012. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223.

Council of Science Editors:

Giron Palomares J. Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography. [Doctoral Dissertation]. Texas A&M University; 2012. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-11223


Loughborough University

27. Chen, Zhiwen. Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds.

Degree: PhD, 2015, Loughborough University

 Sn-based solder alloys are extensively used in electronic devices to form interconnects between different components to provide mechanical support and electrical path. The formation of… (more)

Subjects/Keywords: 621.381; Growth of IMCs; Micro cantilever bending; Collapse of solder joint; Residual stress; Nanoindentation; Finite element modelling.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen, Z. (2015). Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds. (Doctoral Dissertation). Loughborough University. Retrieved from http://hdl.handle.net/2134/18431

Chicago Manual of Style (16th Edition):

Chen, Zhiwen. “Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds.” 2015. Doctoral Dissertation, Loughborough University. Accessed November 23, 2020. http://hdl.handle.net/2134/18431.

MLA Handbook (7th Edition):

Chen, Zhiwen. “Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds.” 2015. Web. 23 Nov 2020.

Vancouver:

Chen Z. Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds. [Internet] [Doctoral dissertation]. Loughborough University; 2015. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/2134/18431.

Council of Science Editors:

Chen Z. Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds. [Doctoral Dissertation]. Loughborough University; 2015. Available from: http://hdl.handle.net/2134/18431


Brno University of Technology

28. Libich, Jiří. Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint.

Degree: 2018, Brno University of Technology

 This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases… (more)

Subjects/Keywords: Bezolovnatý pájený spoj; spolehlivost; test střihem; povrchová úprava; pevnost.; Lead-free solder joint; reliability; shear test; finishing; strength.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Libich, J. (2018). Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1773

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Libich, Jiří. “Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/1773.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Libich, Jiří. “Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint.” 2018. Web. 23 Nov 2020.

Vancouver:

Libich J. Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/1773.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Libich J. Termomechanické namáhání bezolovnatého pájeného spoje: Thermomechanical Stress of Lead Free Solder Joint. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/1773

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

29. Nestrojil, Michal. Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering.

Degree: 2018, Brno University of Technology

 This master´s thesis dealing with study of influence of inert atmosphere on the wettability of soldered surfaces. The theoretical part is discussed the issue of… (more)

Subjects/Keywords: Bezolovnatý pájený spoj; smáčení; oxidace; ochranná atmosféra; argon; dusík; plazma; Lead-free solder joint; wetting; oxidation; inert atmosphere; argon; nitrogen; plasma

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Nestrojil, M. (2018). Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32578

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nestrojil, Michal. “Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/32578.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nestrojil, Michal. “Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering.” 2018. Web. 23 Nov 2020.

Vancouver:

Nestrojil M. Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/32578.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nestrojil M. Vliv inertní atmosféry na smáčení povrchu u bezolovnatého pájení: Influence of Inert Atmosphere on Surface Wetting in Lead Free Soldering. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/32578

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

30. Janík, Pavel. Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules.

Degree: 2018, Brno University of Technology

 Project is focused on describe modern assembly of microelectronic and electronic modules in electronic devices. Sense of the project is analyse reliability and inadequacies electronic… (more)

Subjects/Keywords: Keramika; Základní deska; Spolehlivost; Pajený spoj; Povrchová montáž; BGA; Ceramics; Main Circuit Board; Reliability; Solder Joint; Surface Mount; BGA

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Janík, P. (2018). Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Janík, Pavel. “Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/17550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Janík, Pavel. “Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules.” 2018. Web. 23 Nov 2020.

Vancouver:

Janík P. Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/17550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Janík P. Termomechanická spolehlivost montáže mikroelektronických a elektronických modulů: Modern Assembly for Microelectronic and Electronic Modules. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/17550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

[1] [2]

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