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You searched for subject:(solder balls ). Showing records 1 – 5 of 5 total matches.

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University of Oulu

1. Nousiainen, O. (Olli). Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.

Degree: 2010, University of Oulu

 Abstract Low-temperature co-fired ceramic (LTCC) based system-in-package (SiP) is an emerging multilayer module technology for wireless communication applications, mainly due to its excellent high-frequency material… (more)

Subjects/Keywords: LTCC; creep; lead-free solders; plastic-core solder balls; thermal fatigue

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Nousiainen, O. (. (2010). Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9789514263538

Chicago Manual of Style (16th Edition):

Nousiainen, O (Olli). “Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.” 2010. Doctoral Dissertation, University of Oulu. Accessed November 23, 2020. http://urn.fi/urn:isbn:9789514263538.

MLA Handbook (7th Edition):

Nousiainen, O (Olli). “Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.” 2010. Web. 23 Nov 2020.

Vancouver:

Nousiainen O(. Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. [Internet] [Doctoral dissertation]. University of Oulu; 2010. [cited 2020 Nov 23]. Available from: http://urn.fi/urn:isbn:9789514263538.

Council of Science Editors:

Nousiainen O(. Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. [Doctoral Dissertation]. University of Oulu; 2010. Available from: http://urn.fi/urn:isbn:9789514263538


Brno University of Technology

2. Bobek, Josef. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.

Degree: 2018, Brno University of Technology

 This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture… (more)

Subjects/Keywords: Pájecí kuličky; inovace; pouzdra BGA; postupy pájení; FRITSCH; Solder balls; innovation; BGA packages; solder processes; FRITSCH

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APA (6th Edition):

Bobek, J. (2018). Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/21766

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bobek, Josef. “Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.” 2018. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/21766.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bobek, Josef. “Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.” 2018. Web. 23 Nov 2020.

Vancouver:

Bobek J. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/21766.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bobek J. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/21766

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

3. Somer, Jakub. Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates.

Degree: 2019, Brno University of Technology

 This project deals with questions related to parameters of solder balls, used on BGA packages, on ceramic substrates. First part of this project contains general… (more)

Subjects/Keywords: pájecí kuličky; výrobní metody; BGA; kompatibilita; zkouška střihem; solder balls; manufacturing methods; compatibility; BGA; ball shear test

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Somer, J. (2019). Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1209

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Somer, Jakub. “Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/1209.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Somer, Jakub. “Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates.” 2019. Web. 23 Nov 2020.

Vancouver:

Somer J. Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/1209.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Somer J. Parametry spojů BGA na keramických Al2O3 substrátech: Parameters of BGA-type interconnection joints ceramic Al2O3 substrates. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1209

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

4. Nicák, Michal. Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions.

Degree: 2019, Brno University of Technology

 The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the… (more)

Subjects/Keywords: Propojení; LTCC; keramika; 3D struktury; pouzdro; pájené spoje; pájecí kuličky; Interconnection; LTCC; ceramic; 3D structures; package; soldered joints; solder balls

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Nicák, M. (2019). Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/63112

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nicák, Michal. “Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/63112.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nicák, Michal. “Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions.” 2019. Web. 23 Nov 2020.

Vancouver:

Nicák M. Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/63112.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nicák M. Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce: Interconnection Technologies for 3D Electronic and Microelectronic Constructions. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/63112

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

5. Valíček, Jan. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.

Degree: 2019, Brno University of Technology

 This thesis deals with the design and implementation of a device for measuring pull strength by surface mounted devices (SMD). It analyzes the theory of… (more)

Subjects/Keywords: Měření síly v tahu; tah; tlak; krokový motor; pájený spoj; pájkové kuličky.; Measuring pull strength; pull-up; pressure; stepper motor; solder joint; solder balls.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Valíček, J. (2019). Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/25611

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Valíček, Jan. “Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.” 2019. Thesis, Brno University of Technology. Accessed November 23, 2020. http://hdl.handle.net/11012/25611.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Valíček, Jan. “Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD.” 2019. Web. 23 Nov 2020.

Vancouver:

Valíček J. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 Nov 23]. Available from: http://hdl.handle.net/11012/25611.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Valíček J. Návrh a realizace zařízení pro měření síly v tahu u SMD: Design and realization of the pull strength measuring device for SMD. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/25611

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.