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NSYSU

1. Chen, Kai. Development of the system for Determining the Thermal Expansion Coefficient of Thin Film.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2018, NSYSU

The coefficient of thermal expansion (CTE) is the important thermal property that affects the performance of thin film components. Therefore, this study establishes a detection system for extracting the CTE which is using the electro-signal as the extracting method. The main advantage of the system is to take a fixed-fixed beam structure as the standard test-key and sequentially using the steady current to heat the test-key to perform thermal deformation and then measuring the pull-in voltage to extracting the CTE. Measuring the capacitance difference during the heating test-key process is also be done for obtaining the critical current (Icr) and the time (tst) required to reach the maximum capacitance difference, it can prevent the damage of the test-key before pull-in voltage measurement. Due to these results, the damage caused by overheating could be prevented before pull-in occurs. Finally, this study also defines the optimized experimental parameters for heating current and the range of heating time. Extracting result of the average value of the CTE of silicon is (2.58±0.04)Ã10-6 K-1 and only 0.77% error compared to the standard value (2.60Ã10-6 K-1)[1]. Therefore, the detection system can be practically applied to the production line in the future. Advisors/Committee Members: Wan-Chun Chuang (committee member), David. T.W. Lin (chair), Ching-Liang Dai (chair), W.C. Lin (chair).

Subjects/Keywords: Test-key; pull-in voltage; empirical formula; coefficient of thermal expansion

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen, K. (2018). Development of the system for Determining the Thermal Expansion Coefficient of Thin Film. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727118-230340

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen, Kai. “Development of the system for Determining the Thermal Expansion Coefficient of Thin Film.” 2018. Thesis, NSYSU. Accessed April 12, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727118-230340.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen, Kai. “Development of the system for Determining the Thermal Expansion Coefficient of Thin Film.” 2018. Web. 12 Apr 2021.

Vancouver:

Chen K. Development of the system for Determining the Thermal Expansion Coefficient of Thin Film. [Internet] [Thesis]. NSYSU; 2018. [cited 2021 Apr 12]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727118-230340.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen K. Development of the system for Determining the Thermal Expansion Coefficient of Thin Film. [Thesis]. NSYSU; 2018. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727118-230340

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Kärkkäinen, Anna-Maija. MEMS Based Voltage References.

Degree: 2006, VTT Technical Research Centre of Finland

Voltage references are fundamental building blocks in many instruments like data logging systems, digital multimeters, and calibrators. State-of-the-art DC voltage references are large and expensive Josephson voltage standards, operated at cryogenic temperatures. On the other hand, small and affordable Zener diodes are noisy and require temperature compensation, so there is a gap to be filled between these devices. The situation regarding AC voltage references is even worse. There are no references fundamentally based on AC, beside the AC Josephson voltage standard. Usually AC references are based on generating an AC voltage from DC, and respectively, an AC voltage is measured by converting it to DC. Hence, a small and affordable MEMS based AC voltage reference would be a very unique device. The excellent mechanical properties of silicon microelectromechanical systems (MEMS) have been demonstrated in many commercial applications. Currently the performance of the components is limited by electrostatic instability phenomena and mechanical stress effects arising from component mounting and packaging. However, when these problems are solved, new application areas open up for micromechanical components, for example, in voltage metrology. The stability of a MEMS based voltage reference is ultimately based on mechanical properties of one of the most stable materials: single crystal silicon. This dissertation reports a DC voltage reference and an AC voltage reference based on the pull-in voltage, a characteristic property of an electrostatic MEMS component. First a brief introduction to voltage metrology and MEMS is given, then methods available for making MEMS based voltage references are discussed, and finally results are presented. The results are divided into three Sections: design and manufacturing of the components, readout electronics, and measurement results of the reference long-term stability. The stability of the reference voltage is of major importance in metrological applications and it is studied both theoretically and experimentally in this work. A detailed analysis of the electromechanical coupling of MEMS components is presented. Due to the lack of an appropriate text book, a majority of the formulas are derived from the basic equations by the author, including also those presented in the Methods Section. Component manufacturing, design and materials choices are also discussed focusing on the stability issue. In the experimental part of this work a DC voltage reference and an AC voltage reference were designed, manufactured and characterized. Also two MEMS moving plate capacitors were designed: one optimised for use as a DC reference and the other optimised for use as an AC reference. The capacitor electrodes required metallizing which could not be manufactured using the existing processes. Hence a new silicon-on-insulator (SOI) manufacturing process utilising low temperature fusion bonding was developed. The stability of the AC voltage reference presented in this dissertation is at ppm-level (10−6).… Advisors/Committee Members: Helsinki University of Technology, Department of Electrical and Communications Engineering.

Subjects/Keywords: MEMS; micro electromechanical systems; DC voltage reference; AC voltage reference; electrostatic charging; pull-in voltage; long-term stability; micromachining

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Kärkkäinen, A. (2006). MEMS Based Voltage References. (Thesis). VTT Technical Research Centre of Finland. Retrieved from http://lib.tkk.fi/Diss/2006/isbn9513868605/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kärkkäinen, Anna-Maija. “MEMS Based Voltage References.” 2006. Thesis, VTT Technical Research Centre of Finland. Accessed April 12, 2021. http://lib.tkk.fi/Diss/2006/isbn9513868605/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kärkkäinen, Anna-Maija. “MEMS Based Voltage References.” 2006. Web. 12 Apr 2021.

Vancouver:

Kärkkäinen A. MEMS Based Voltage References. [Internet] [Thesis]. VTT Technical Research Centre of Finland; 2006. [cited 2021 Apr 12]. Available from: http://lib.tkk.fi/Diss/2006/isbn9513868605/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kärkkäinen A. MEMS Based Voltage References. [Thesis]. VTT Technical Research Centre of Finland; 2006. Available from: http://lib.tkk.fi/Diss/2006/isbn9513868605/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

3. Érick Araujo dos Santos. Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos.

Degree: 2017, University of São Paulo

A concepção deste trabalho está ligada ao desenvolvimento de sistemas microeletromecânicos (MEMS) para RF na faixa de frequências de ondas milimétricas. Dentro deste contexto, o Grupo de Novos Materiais e Dispositivos (GNMD) do Laboratório de Microeletrônica (LME) da Escola Politécnica da Universidade de São Paulo (EPUSP) já fabricou RF MEMS que tiveram resultados bastante promissores. No entanto, para obtenção de melhores resultados, é necessária a otimização eletromecânica destes dispositivos e para isso é necessária a extração de suas propriedades mecânicas. Assim, este trabalho teve como objetivo o desenvolvimento de uma metodologia para extração do módulo de elasticidade e tensão residual em MEMS, através da simulação e fabricação de microestruturas específicas para este fim. As técnicas de nanoindentação, frequência de ressonância, raio de curvatura e M-TEST foram estudadas. As microestruturas fabricadas foram cantileveres e pontes feitas de alumínio e cobre. Foram realizadas simulações no software ANSYS para prever as frequências de ressonância e as tensões de pull-in das estruturas antes de serem fabricadas. O módulo de elasticidade do alumínio extraído através da nanoindentação foi de 75,6 ± 4,1 GPa, e o do cobre extraída através da técnica de frequência de ressonância foi de 123 ± 12 GPa. A tensão residual do cobre foi extraída através da técnica de medição do raio de curvatura e foi de -199±105 MPa. O trabalho está vinculado ao projeto Jovem Pesquisador FAPESP (2011/18167-3).

The approach of this work is linked to the development of microelectromechanical systems (MEMS) for RF in the frequency range of millimeter waves. Within this context, the Group of New Materials and Devices (GNMD) of the Laboratory of Microelectronics (LME) of the Polytechnic School of the University of São Paulo (EPUSP) has already manufactured RF MEMS which have had very promising results. However, to obtain better results, it is necessary the electromechanical optimization of these devices through the extraction of their mechanical properties. Thus, this work has the objective of developing a methodology for the extraction of the Young\'s modulus and residual stress in MEMS, through the simulation and fabrication of specific microstructures for this purpose. The techniques of nanoindentation, resonance frequency, radius of curvature and M-TEST were studied. The fabricated microstructures were cantilevers and bridges in aluminum and copper materials. Simulations were performed in the ANSYS software to predict the resonance frequencies and the pull-in voltages of the structures before they were fabricated. The Young\'s modulus of aluminum extracted through nanoindentation was 75,6 ± 4,1 GPa, the resonance frequency of copper extracted by the technique of the same name was 123 ± 12 GPa and the residual stress of copper was extracted through the technique of measuring the radius of curvature and was -199±105 MPa. The work is linked to the project Jovem Pesquisador from FAPESP (2011/18167-3).

Advisors/Committee Members: Gustavo Pamplona Rehder, André Gusso, Ricardo Cury Ibrahim.

Subjects/Keywords: M-TEST; Modelo de elasticidade; Nanoindentação; Ressonância magnética (Frequência); RF MEMS; Tensão residual; Nanoindentation; Pull-in voltage.,Young's modulus; Residual stress. M-TEST; Ressonance frequency; RF MEMS

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Santos, . A. d. (2017). Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos. (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06042018-104336/

Chicago Manual of Style (16th Edition):

Santos, Érick Araujo dos. “Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos.” 2017. Masters Thesis, University of São Paulo. Accessed April 12, 2021. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06042018-104336/.

MLA Handbook (7th Edition):

Santos, Érick Araujo dos. “Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos.” 2017. Web. 12 Apr 2021.

Vancouver:

Santos Ad. Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos. [Internet] [Masters thesis]. University of São Paulo; 2017. [cited 2021 Apr 12]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06042018-104336/.

Council of Science Editors:

Santos Ad. Simulação, fabricação e caracterização de MEMS para extração de propriedades mecânicas de filmes finos. [Masters Thesis]. University of São Paulo; 2017. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06042018-104336/

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