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You searched for subject:(power module packaging). Showing records 1 – 19 of 19 total matches.

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University of Arkansas

1. Dutta, Atanu. A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module.

Degree: PhD, 2017, University of Arkansas

  The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As… (more)

Subjects/Keywords: Electrical Engineering; Electromagnetic Interference; Electronic Packaging; Power Module; Semiconductor Packaging; Wire Bondless Power Module; Power and Energy

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APA (6th Edition):

Dutta, A. (2017). A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module. (Doctoral Dissertation). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/2515

Chicago Manual of Style (16th Edition):

Dutta, Atanu. “A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module.” 2017. Doctoral Dissertation, University of Arkansas. Accessed January 27, 2021. https://scholarworks.uark.edu/etd/2515.

MLA Handbook (7th Edition):

Dutta, Atanu. “A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module.” 2017. Web. 27 Jan 2021.

Vancouver:

Dutta A. A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module. [Internet] [Doctoral dissertation]. University of Arkansas; 2017. [cited 2021 Jan 27]. Available from: https://scholarworks.uark.edu/etd/2515.

Council of Science Editors:

Dutta A. A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module. [Doctoral Dissertation]. University of Arkansas; 2017. Available from: https://scholarworks.uark.edu/etd/2515


University of Toronto

2. Kim, Namjee. Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs.

Degree: 2018, University of Toronto

Pressureless silver nanopowder sintering of the bonding layer between the insulated gate bipolar transistor (IGBT) and the direct bonded copper (DBC) for the liquid cooled… (more)

Subjects/Keywords: IGBT packaging; nanosilver sintering; Power module packaging; Silver nanopowder; Silver sintering; 0544

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APA (6th Edition):

Kim, N. (2018). Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/89549

Chicago Manual of Style (16th Edition):

Kim, Namjee. “Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs.” 2018. Masters Thesis, University of Toronto. Accessed January 27, 2021. http://hdl.handle.net/1807/89549.

MLA Handbook (7th Edition):

Kim, Namjee. “Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs.” 2018. Web. 27 Jan 2021.

Vancouver:

Kim N. Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs. [Internet] [Masters thesis]. University of Toronto; 2018. [cited 2021 Jan 27]. Available from: http://hdl.handle.net/1807/89549.

Council of Science Editors:

Kim N. Pressureless Silver Nanopowder Sintered Bond for Liquid Cooled IGBT Power Module for EVs and HEVs. [Masters Thesis]. University of Toronto; 2018. Available from: http://hdl.handle.net/1807/89549


University of Arkansas

3. Prabhudeva, Shilpa. Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules.

Degree: MSEE, 2014, University of Arkansas

  This thesis research investigates thermal performance, parasitic extraction and wirebond/encapsulation reliability of power electronic modules. Thermal performance is critical to the power electronic modules.… (more)

Subjects/Keywords: Electronic Packaging; Parasitic Extraction; Power Module Thermal Analysis; Wirebond Reliability Assessment; Power and Energy

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APA (6th Edition):

Prabhudeva, S. (2014). Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules. (Masters Thesis). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/2096

Chicago Manual of Style (16th Edition):

Prabhudeva, Shilpa. “Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules.” 2014. Masters Thesis, University of Arkansas. Accessed January 27, 2021. https://scholarworks.uark.edu/etd/2096.

MLA Handbook (7th Edition):

Prabhudeva, Shilpa. “Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules.” 2014. Web. 27 Jan 2021.

Vancouver:

Prabhudeva S. Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules. [Internet] [Masters thesis]. University of Arkansas; 2014. [cited 2021 Jan 27]. Available from: https://scholarworks.uark.edu/etd/2096.

Council of Science Editors:

Prabhudeva S. Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules. [Masters Thesis]. University of Arkansas; 2014. Available from: https://scholarworks.uark.edu/etd/2096


Virginia Tech

4. Cao, Xiao. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.

Degree: PhD, Electrical and Computer Engineering, 2011, Virginia Tech

 This study focuses on development a planar power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With… (more)

Subjects/Keywords: thermal management; high density integration; power module; thermo-mechanical stress; power electronics packaging; reliability test

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APA (6th Edition):

Cao, X. (2011). Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/77252

Chicago Manual of Style (16th Edition):

Cao, Xiao. “Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.” 2011. Doctoral Dissertation, Virginia Tech. Accessed January 27, 2021. http://hdl.handle.net/10919/77252.

MLA Handbook (7th Edition):

Cao, Xiao. “Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.” 2011. Web. 27 Jan 2021.

Vancouver:

Cao X. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. [Internet] [Doctoral dissertation]. Virginia Tech; 2011. [cited 2021 Jan 27]. Available from: http://hdl.handle.net/10919/77252.

Council of Science Editors:

Cao X. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. [Doctoral Dissertation]. Virginia Tech; 2011. Available from: http://hdl.handle.net/10919/77252


Virginia Tech

5. Watt, Grace R. Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module.

Degree: MS, Electrical Engineering, 2020, Virginia Tech

 This paper describes the design, construction, and testing of advanced power devices for use in electric vehicles. Power devices are necessary to supply electricity to… (more)

Subjects/Keywords: SiC MOSFET; power module packaging; flexible PCB; current sharing; symmetrical direct bonded copper (DBC) layout; diode-less module; multi-chip module; device parametric tolerances; package parasitics; vertical GaN

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APA (6th Edition):

Watt, G. R. (2020). Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/96559

Chicago Manual of Style (16th Edition):

Watt, Grace R. “Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module.” 2020. Masters Thesis, Virginia Tech. Accessed January 27, 2021. http://hdl.handle.net/10919/96559.

MLA Handbook (7th Edition):

Watt, Grace R. “Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module.” 2020. Web. 27 Jan 2021.

Vancouver:

Watt GR. Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module. [Internet] [Masters thesis]. Virginia Tech; 2020. [cited 2021 Jan 27]. Available from: http://hdl.handle.net/10919/96559.

Council of Science Editors:

Watt GR. Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module. [Masters Thesis]. Virginia Tech; 2020. Available from: http://hdl.handle.net/10919/96559


Linköping University

6. Dahl, Emil. MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging.

Degree: Integrated Circuits and Systems, 2020, Linköping University

  This thesis studies the options of using PCB embedding bare die power MOSFET and new packaging of MOSFET to increase the power density in… (more)

Subjects/Keywords: embedded components; embedded MOSFETs; MOSFET packaging; power module; Other Electrical Engineering, Electronic Engineering, Information Engineering; Annan elektroteknik och elektronik

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APA (6th Edition):

Dahl, E. (2020). MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging. (Thesis). Linköping University. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Dahl, Emil. “MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging.” 2020. Thesis, Linköping University. Accessed January 27, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Dahl, Emil. “MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging.” 2020. Web. 27 Jan 2021.

Vancouver:

Dahl E. MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging. [Internet] [Thesis]. Linköping University; 2020. [cited 2021 Jan 27]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Dahl E. MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging. [Thesis]. Linköping University; 2020. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

7. Letowski, Bastien. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.

Degree: Docteur es, Génie électrique, 2016, Université Grenoble Alpes (ComUE)

Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la… (more)

Subjects/Keywords: Electronique de puissance; Packaging 3D; Conception couplé composant/packaging; Collage direct métal-Métal; Fabrication collective; Packaging à l’échelle de la plaque; Power Electronics; 3D packaging; Wire-Bond-Less module; Wafer-Level packaging; Direct copper bonding; Coupled design device/package; 620

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APA (6th Edition):

Letowski, B. (2016). Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2016GREAT114

Chicago Manual of Style (16th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed January 27, 2021. http://www.theses.fr/2016GREAT114.

MLA Handbook (7th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Web. 27 Jan 2021.

Vancouver:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2016. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2016GREAT114.

Council of Science Editors:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2016. Available from: http://www.theses.fr/2016GREAT114


Delft University of Technology

8. Gerber, M.B. The electrical, thermal and spatial integration of a converter in a power electronic module.

Degree: 2005, Delft University of Technology

 This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/DC converter) that is implemented in the automotive environment, specifically… (more)

Subjects/Keywords: power electronics; power density; high temperature; packaging; power module; system integration; ism

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APA (6th Edition):

Gerber, M. B. (2005). The electrical, thermal and spatial integration of a converter in a power electronic module. (Doctoral Dissertation). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993

Chicago Manual of Style (16th Edition):

Gerber, M B. “The electrical, thermal and spatial integration of a converter in a power electronic module.” 2005. Doctoral Dissertation, Delft University of Technology. Accessed January 27, 2021. http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993.

MLA Handbook (7th Edition):

Gerber, M B. “The electrical, thermal and spatial integration of a converter in a power electronic module.” 2005. Web. 27 Jan 2021.

Vancouver:

Gerber MB. The electrical, thermal and spatial integration of a converter in a power electronic module. [Internet] [Doctoral dissertation]. Delft University of Technology; 2005. [cited 2021 Jan 27]. Available from: http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993.

Council of Science Editors:

Gerber MB. The electrical, thermal and spatial integration of a converter in a power electronic module. [Doctoral Dissertation]. Delft University of Technology; 2005. Available from: http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; urn:NBN:nl:ui:24-uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993 ; http://resolver.tudelft.nl/uuid:f28f32fb-f420-44c1-9683-bc2a5e0ec993


Virginia Tech

9. Liu, Xingsheng. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips.

Degree: PhD, Materials Science and Engineering, 2001, Virginia Tech

 Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as… (more)

Subjects/Keywords: Power Electronics Packaging; Power Module; Chip-Scale Power Package; Solder Joint; Reliability

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APA (6th Edition):

Liu, X. (2001). Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/26691

Chicago Manual of Style (16th Edition):

Liu, Xingsheng. “Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips.” 2001. Doctoral Dissertation, Virginia Tech. Accessed January 27, 2021. http://hdl.handle.net/10919/26691.

MLA Handbook (7th Edition):

Liu, Xingsheng. “Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips.” 2001. Web. 27 Jan 2021.

Vancouver:

Liu X. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips. [Internet] [Doctoral dissertation]. Virginia Tech; 2001. [cited 2021 Jan 27]. Available from: http://hdl.handle.net/10919/26691.

Council of Science Editors:

Liu X. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips. [Doctoral Dissertation]. Virginia Tech; 2001. Available from: http://hdl.handle.net/10919/26691

10. Li, Shengnan. Packaging Design of IGBT Power Module Using Novel Switching Cells.

Degree: 2011, University of Tennessee – Knoxville

 Parasitic inductance in power modules generates voltage spikes and current ringing during switching which cause extra stress in power electronic devices, increase electromagnetic interference (EMI),… (more)

Subjects/Keywords: Power Module; Stray Inductance; Module Packaging; Commutation Loop; Switching Cells; Power and Energy

…integration technology. As decades went by, power device and module packaging technology has evolved… …85 6.2 Switching Characteristic of Multichip Power Module… …98 7.1.2 Power Module Design Considerations and Influence of Parasitics… …2 Figure 1.3. Fully integrated intelligent power module in single-in-line and dual-in-line… …3 Figure 2.1. Structure of an IGBT power module… 

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APA (6th Edition):

Li, S. (2011). Packaging Design of IGBT Power Module Using Novel Switching Cells. (Doctoral Dissertation). University of Tennessee – Knoxville. Retrieved from https://trace.tennessee.edu/utk_graddiss/1205

Chicago Manual of Style (16th Edition):

Li, Shengnan. “Packaging Design of IGBT Power Module Using Novel Switching Cells.” 2011. Doctoral Dissertation, University of Tennessee – Knoxville. Accessed January 27, 2021. https://trace.tennessee.edu/utk_graddiss/1205.

MLA Handbook (7th Edition):

Li, Shengnan. “Packaging Design of IGBT Power Module Using Novel Switching Cells.” 2011. Web. 27 Jan 2021.

Vancouver:

Li S. Packaging Design of IGBT Power Module Using Novel Switching Cells. [Internet] [Doctoral dissertation]. University of Tennessee – Knoxville; 2011. [cited 2021 Jan 27]. Available from: https://trace.tennessee.edu/utk_graddiss/1205.

Council of Science Editors:

Li S. Packaging Design of IGBT Power Module Using Novel Switching Cells. [Doctoral Dissertation]. University of Tennessee – Knoxville; 2011. Available from: https://trace.tennessee.edu/utk_graddiss/1205


INP Toulouse

11. Dou, Zhifeng. Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant.

Degree: Docteur es, Génie Electrique, 2011, INP Toulouse

Au sein d'un convertisseur la défaillance d'un composant de puissance est un événement critique tant par le risque d'explosion du boitier et sa propagation au… (more)

Subjects/Keywords: Rupteur-fusible; Matériaux énergétiques; Mode défaillant; Onduleur à tolérance de pannes; Short-circuit failure; Switch fuse; Packaging; Power Module; Fault-tolerant capability; Interleaved converter

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APA (6th Edition):

Dou, Z. (2011). Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2011INPT0096

Chicago Manual of Style (16th Edition):

Dou, Zhifeng. “Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant.” 2011. Doctoral Dissertation, INP Toulouse. Accessed January 27, 2021. http://www.theses.fr/2011INPT0096.

MLA Handbook (7th Edition):

Dou, Zhifeng. “Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant.” 2011. Web. 27 Jan 2021.

Vancouver:

Dou Z. Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant. [Internet] [Doctoral dissertation]. INP Toulouse; 2011. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2011INPT0096.

Council of Science Editors:

Dou Z. Sûreté de fonctionnement des convertisseurs - Nouvelles structures de redondances pour onduleurs sécurisés à tolérance de pannes : Dependability of the converters : New structures for inverters redundancy secure fault-tolerant. [Doctoral Dissertation]. INP Toulouse; 2011. Available from: http://www.theses.fr/2011INPT0096

12. Reynes, Hugo. Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application.

Degree: Docteur es, Génie électrique, 2018, Lyon

Satisfaire les besoins en énergie de manière responsable est possible grâce aux énergies renouvelables, notamment éoliennes et solaires. Cependant ces centres de captation d’énergie sont… (more)

Subjects/Keywords: Electronique de puissance; Module de puissance; Packaging; High voltage Direct Current - HVDC; Medium Voltage Direct Current - MVDC; Insulated Gate Bipolar Transistor - IGBT; Mosfet; Décharges partielles; Power Electronics; Power Module; Packaging; High voltage Direct Current - HVDC; Medium Voltage Direct Current - MVDC; Insulated Gate Bipolar Transistor - IGBT; Mosfet; Insulation; Partial discharges; 621.317 072

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APA (6th Edition):

Reynes, H. (2018). Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application. (Doctoral Dissertation). Lyon. Retrieved from http://www.theses.fr/2018LYSEI035

Chicago Manual of Style (16th Edition):

Reynes, Hugo. “Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application.” 2018. Doctoral Dissertation, Lyon. Accessed January 27, 2021. http://www.theses.fr/2018LYSEI035.

MLA Handbook (7th Edition):

Reynes, Hugo. “Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application.” 2018. Web. 27 Jan 2021.

Vancouver:

Reynes H. Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application. [Internet] [Doctoral dissertation]. Lyon; 2018. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2018LYSEI035.

Council of Science Editors:

Reynes H. Conception d'un module électronique de puissance pour application haute tension : Design of a power electronic module for high voltage application. [Doctoral Dissertation]. Lyon; 2018. Available from: http://www.theses.fr/2018LYSEI035


Virginia Tech

13. yin, jian. High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure.

Degree: PhD, Electrical and Computer Engineering, 2005, Virginia Tech

 The work reported in this dissertation is intended to propose, analyze and demonstrate a technology for a high temperature integrated power electronics module, for high… (more)

Subjects/Keywords: High temperature; 3-D; thermal analysis; integrated power electronics module; electronic packaging; thermo-mechanical analysis; embedded chip module

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APA (6th Edition):

yin, j. (2005). High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/30076

Chicago Manual of Style (16th Edition):

yin, jian. “High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure.” 2005. Doctoral Dissertation, Virginia Tech. Accessed January 27, 2021. http://hdl.handle.net/10919/30076.

MLA Handbook (7th Edition):

yin, jian. “High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure.” 2005. Web. 27 Jan 2021.

Vancouver:

yin j. High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure. [Internet] [Doctoral dissertation]. Virginia Tech; 2005. [cited 2021 Jan 27]. Available from: http://hdl.handle.net/10919/30076.

Council of Science Editors:

yin j. High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure. [Doctoral Dissertation]. Virginia Tech; 2005. Available from: http://hdl.handle.net/10919/30076

14. Arabi, Faical. Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics.

Degree: Docteur es, Electronique, 2017, Bordeaux

Ces travaux s’inscrivent dans le cadre du projet GENOME (GEstioN OptiMisée de l’Energie). Ce projet s’intéresse aux solutions de packaging haute-température pour des modules de… (more)

Subjects/Keywords: Assemblages de puissance; Fiabilité; Packaging; AuSn; Film d’Ag fritté; Techniques d’assemblages sans plomb; RoHS; Modélisations par éléments finis; Power module; Reliability; Packaging; Silver paste sintering technology; Lead-free die-attach technology; RoHS; FEM analysis

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APA (6th Edition):

Arabi, F. (2017). Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics. (Doctoral Dissertation). Bordeaux. Retrieved from http://www.theses.fr/2017BORD0603

Chicago Manual of Style (16th Edition):

Arabi, Faical. “Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics.” 2017. Doctoral Dissertation, Bordeaux. Accessed January 27, 2021. http://www.theses.fr/2017BORD0603.

MLA Handbook (7th Edition):

Arabi, Faical. “Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics.” 2017. Web. 27 Jan 2021.

Vancouver:

Arabi F. Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics. [Internet] [Doctoral dissertation]. Bordeaux; 2017. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2017BORD0603.

Council of Science Editors:

Arabi F. Étude de vieillissement et caractérisation d’assemblage de module de puissance 40 kW pour l’aéronautique : Ageing test and reliability characterization of power electronic assemblies 40 kW for aeronautics. [Doctoral Dissertation]. Bordeaux; 2017. Available from: http://www.theses.fr/2017BORD0603

15. Le Henaff, François. Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature.

Degree: Docteur es, Électronique, 2014, Bordeaux

Ces travaux s’intègrent dans la recherche de solutions alternatives aux alliages de brasure pour les assemblages de puissance. De par les propriétés intrinsèques de l’argent… (more)

Subjects/Keywords: Assemblages de puissanc; Fiabilité; Packaging; Frittage de pâte d’argent; Techniques d’assemblages sans plomb; RoHS; Modélisations par éléments finis; Évaluation de la durée de vie; Power module; Reliability; Packaging; Silver paste sintering technology; Lead - free die - attach technology; RoHS; FEM analysis; Lifetime evaluation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Le Henaff, F. (2014). Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature. (Doctoral Dissertation). Bordeaux. Retrieved from http://www.theses.fr/2014BORD0098

Chicago Manual of Style (16th Edition):

Le Henaff, François. “Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature.” 2014. Doctoral Dissertation, Bordeaux. Accessed January 27, 2021. http://www.theses.fr/2014BORD0098.

MLA Handbook (7th Edition):

Le Henaff, François. “Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature.” 2014. Web. 27 Jan 2021.

Vancouver:

Le Henaff F. Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature. [Internet] [Doctoral dissertation]. Bordeaux; 2014. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2014BORD0098.

Council of Science Editors:

Le Henaff F. Contribution à l'étude, la mise en oeuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température : Contribution to the study, the processing and the evaluation of a power semiconductor device attachment solution : silver sintering technology at high pressure and low temperature. [Doctoral Dissertation]. Bordeaux; 2014. Available from: http://www.theses.fr/2014BORD0098


University of Arkansas

16. Curbow, William Austin. Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module.

Degree: MSEE, 2019, University of Arkansas

  The main objective of this effort is to determine points of weakness in the gate network of a high-performance SiC power module and to… (more)

Subjects/Keywords: gate signal modeling; die-to-die interactions; miller clamp; parameter variance; parasitic inductance; power packaging; SiC power module; Electronic Devices and Semiconductor Manufacturing; OS and Networks; Power and Energy; VLSI and Circuits, Embedded and Hardware Systems

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APA (6th Edition):

Curbow, W. A. (2019). Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module. (Masters Thesis). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/3189

Chicago Manual of Style (16th Edition):

Curbow, William Austin. “Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module.” 2019. Masters Thesis, University of Arkansas. Accessed January 27, 2021. https://scholarworks.uark.edu/etd/3189.

MLA Handbook (7th Edition):

Curbow, William Austin. “Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module.” 2019. Web. 27 Jan 2021.

Vancouver:

Curbow WA. Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module. [Internet] [Masters thesis]. University of Arkansas; 2019. [cited 2021 Jan 27]. Available from: https://scholarworks.uark.edu/etd/3189.

Council of Science Editors:

Curbow WA. Model Development and Assessment of the Gate Network in a High-Performance SiC Power Module. [Masters Thesis]. University of Arkansas; 2019. Available from: https://scholarworks.uark.edu/etd/3189

17. Masson, Amandine. Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application.

Degree: Docteur es, Génie électrique, 2012, INSA Lyon

L'objectif d'un avion plus électrique conduit à l'utilisation croissante de systèmes d'électronique y compris dans des zones de haute température. Les modules de puissance classiques… (more)

Subjects/Keywords: Électronique de puissance; Module de puissance; Haute température; Conditionnement; Report de puce; Fixation de la puce; Assemblage puce-substrat; Frittage de nanopoudre d'argent; Brasure en phase liquide transitoire; Aéronautique; Power Electronics; High temperature; Packaging; Transient Liquid Phase Bonding; Aeronautics; 621.317 072

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Masson, A. (2012). Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application. (Doctoral Dissertation). INSA Lyon. Retrieved from http://www.theses.fr/2012ISAL0005

Chicago Manual of Style (16th Edition):

Masson, Amandine. “Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application.” 2012. Doctoral Dissertation, INSA Lyon. Accessed January 27, 2021. http://www.theses.fr/2012ISAL0005.

MLA Handbook (7th Edition):

Masson, Amandine. “Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application.” 2012. Web. 27 Jan 2021.

Vancouver:

Masson A. Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application. [Internet] [Doctoral dissertation]. INSA Lyon; 2012. [cited 2021 Jan 27]. Available from: http://www.theses.fr/2012ISAL0005.

Council of Science Editors:

Masson A. Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures pour des applications haute température : Processing of alternative die attaches techniques for high temperature application. [Doctoral Dissertation]. INSA Lyon; 2012. Available from: http://www.theses.fr/2012ISAL0005


University of Central Florida

18. Grummel, Brian. High Temperature Packaging For Wide Bandgap Semiconductor Devices.

Degree: 2008, University of Central Florida

 Currently, wide bandgap semiconductor devices feature increased efficiency, higher current handling capabilities, and higher reverse blocking voltages than silicon devices while recent fabrication advances have… (more)

Subjects/Keywords: Electronics Packaging; Power Module; High Temperature Electronics; Hybrid Electric Vehicle; Motor Control; Electrical and Computer Engineering; Electrical and Electronics; Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Grummel, B. (2008). High Temperature Packaging For Wide Bandgap Semiconductor Devices. (Masters Thesis). University of Central Florida. Retrieved from https://stars.library.ucf.edu/etd/3583

Chicago Manual of Style (16th Edition):

Grummel, Brian. “High Temperature Packaging For Wide Bandgap Semiconductor Devices.” 2008. Masters Thesis, University of Central Florida. Accessed January 27, 2021. https://stars.library.ucf.edu/etd/3583.

MLA Handbook (7th Edition):

Grummel, Brian. “High Temperature Packaging For Wide Bandgap Semiconductor Devices.” 2008. Web. 27 Jan 2021.

Vancouver:

Grummel B. High Temperature Packaging For Wide Bandgap Semiconductor Devices. [Internet] [Masters thesis]. University of Central Florida; 2008. [cited 2021 Jan 27]. Available from: https://stars.library.ucf.edu/etd/3583.

Council of Science Editors:

Grummel B. High Temperature Packaging For Wide Bandgap Semiconductor Devices. [Masters Thesis]. University of Central Florida; 2008. Available from: https://stars.library.ucf.edu/etd/3583


University of Central Florida

19. Grummel, Brian. Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices.

Degree: 2012, University of Central Florida

 Advances in wide-bandgap semiconductor devices have increased the allowable operating temperature of power electronic systems. High-temperature devices can benefit applications such as renewable energy, electric… (more)

Subjects/Keywords: Au in; die attach; diffusion; high temperature; packaging; power module; power semiconductor; silicon carbide (sic); shear strength; solid liquid interdiffusion (slid); reliability; resistivity; transient liquid phase (tlp) die attach; thermal cycling; wide bandgap; Electrical and Computer Engineering; Electrical and Electronics; Engineering; Dissertations, Academic  – Engineering and Computer Science, Engineering and Computer Science  – Dissertations, Academic

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Grummel, B. (2012). Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices. (Doctoral Dissertation). University of Central Florida. Retrieved from https://stars.library.ucf.edu/etd/2495

Chicago Manual of Style (16th Edition):

Grummel, Brian. “Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices.” 2012. Doctoral Dissertation, University of Central Florida. Accessed January 27, 2021. https://stars.library.ucf.edu/etd/2495.

MLA Handbook (7th Edition):

Grummel, Brian. “Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices.” 2012. Web. 27 Jan 2021.

Vancouver:

Grummel B. Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices. [Internet] [Doctoral dissertation]. University of Central Florida; 2012. [cited 2021 Jan 27]. Available from: https://stars.library.ucf.edu/etd/2495.

Council of Science Editors:

Grummel B. Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices. [Doctoral Dissertation]. University of Central Florida; 2012. Available from: https://stars.library.ucf.edu/etd/2495

.