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You searched for subject:(packaging materials). Showing records 1 – 30 of 187 total matches.

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Stellenbosch University

1. Venter, Martin Philip. Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods.

Degree: Mechanical and Mechatronic Engineering, 2011, Stellenbosch University

Thesis (MScEng (Mechanical and Mechatronic Engineering)) – University of Stellenbosch, 2011.

Please refer to full text to view abstract.

Imported from http://etd.sun.ac.za.

np2011

Advisors/Committee Members: Venter, G., University of Stellenbosch. Faculty of Engineering. Dept. of Mechanical and Mechatronic Engineering..

Subjects/Keywords: Mechanical engineering; Transportation  – Packaging; Packaging materials

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Venter, M. P. (2011). Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods. (Thesis). Stellenbosch University. Retrieved from http://hdl.handle.net/10019.1/6827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Venter, Martin Philip. “Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods.” 2011. Thesis, Stellenbosch University. Accessed April 18, 2021. http://hdl.handle.net/10019.1/6827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Venter, Martin Philip. “Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods.” 2011. Web. 18 Apr 2021.

Vancouver:

Venter MP. Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods. [Internet] [Thesis]. Stellenbosch University; 2011. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10019.1/6827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Venter MP. Development and validation of a numerical model for an inflatable paper dunnage bag using finite element methods. [Thesis]. Stellenbosch University; 2011. Available from: http://hdl.handle.net/10019.1/6827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of California – Irvine

2. Wu, Yuan-Yun. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology.

Degree: Engineering, 2015, University of California – Irvine

 In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion… (more)

Subjects/Keywords: Engineering; Materials Science; Packaging

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APA (6th Edition):

Wu, Y. (2015). Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology. (Thesis). University of California – Irvine. Retrieved from http://www.escholarship.org/uc/item/8rz0003f

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wu, Yuan-Yun. “Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology.” 2015. Thesis, University of California – Irvine. Accessed April 18, 2021. http://www.escholarship.org/uc/item/8rz0003f.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wu, Yuan-Yun. “Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology.” 2015. Web. 18 Apr 2021.

Vancouver:

Wu Y. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology. [Internet] [Thesis]. University of California – Irvine; 2015. [cited 2021 Apr 18]. Available from: http://www.escholarship.org/uc/item/8rz0003f.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wu Y. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology. [Thesis]. University of California – Irvine; 2015. Available from: http://www.escholarship.org/uc/item/8rz0003f

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

3. He, Peng. Thiol material selection for better adhesion and reliability for copper/epoxy interface.

Degree: 2011, Hong Kong University of Science and Technology

 With the shrinking size and increasing density of electronic packages, reliability becomes one of the most critical issues. Especially delamination, such as the weak adhesion… (more)

Subjects/Keywords: Electronic packaging  – Materials ; Thiols ; Adhesion

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APA (6th Edition):

He, P. (2011). Thiol material selection for better adhesion and reliability for copper/epoxy interface. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

He, Peng. “Thiol material selection for better adhesion and reliability for copper/epoxy interface.” 2011. Thesis, Hong Kong University of Science and Technology. Accessed April 18, 2021. http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

He, Peng. “Thiol material selection for better adhesion and reliability for copper/epoxy interface.” 2011. Web. 18 Apr 2021.

Vancouver:

He P. Thiol material selection for better adhesion and reliability for copper/epoxy interface. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2011. [cited 2021 Apr 18]. Available from: http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

He P. Thiol material selection for better adhesion and reliability for copper/epoxy interface. [Thesis]. Hong Kong University of Science and Technology; 2011. Available from: http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

4. Lim, Jun Zhang. Glass frit hermetic encapsulation for harsh environment multi-chip module application .

Degree: 2013, Nanyang Technological University

 This research project aims to investigate the suitability of glass frit bonding for multi-chip module (MCM) package encapsulation that needs to operate at a high… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Lim, J. Z. (2013). Glass frit hermetic encapsulation for harsh environment multi-chip module application . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/59379

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lim, Jun Zhang. “Glass frit hermetic encapsulation for harsh environment multi-chip module application .” 2013. Thesis, Nanyang Technological University. Accessed April 18, 2021. http://hdl.handle.net/10356/59379.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lim, Jun Zhang. “Glass frit hermetic encapsulation for harsh environment multi-chip module application .” 2013. Web. 18 Apr 2021.

Vancouver:

Lim JZ. Glass frit hermetic encapsulation for harsh environment multi-chip module application . [Internet] [Thesis]. Nanyang Technological University; 2013. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10356/59379.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lim JZ. Glass frit hermetic encapsulation for harsh environment multi-chip module application . [Thesis]. Nanyang Technological University; 2013. Available from: http://hdl.handle.net/10356/59379

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

5. Lau, Fu Long. Electrical properties of AU-GE solder under high temperature .

Degree: 2014, Nanyang Technological University

 Ruggedized electronics are defined as electronics that can withstand harsh operating environment. A key requirement for ruggedized electronics is reliability. One of the areas for… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Lau, F. L. (2014). Electrical properties of AU-GE solder under high temperature . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/61875

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lau, Fu Long. “Electrical properties of AU-GE solder under high temperature .” 2014. Thesis, Nanyang Technological University. Accessed April 18, 2021. http://hdl.handle.net/10356/61875.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lau, Fu Long. “Electrical properties of AU-GE solder under high temperature .” 2014. Web. 18 Apr 2021.

Vancouver:

Lau FL. Electrical properties of AU-GE solder under high temperature . [Internet] [Thesis]. Nanyang Technological University; 2014. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10356/61875.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lau FL. Electrical properties of AU-GE solder under high temperature . [Thesis]. Nanyang Technological University; 2014. Available from: http://hdl.handle.net/10356/61875

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

6. I Made Riko. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .

Degree: 2011, Nanyang Technological University

 Vertically stacking and bonding individual processed wafers with through-Si vias (TSV) to form three dimensional integrated circuits (3DIC) introduces the possibility of reducing signal propagation… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Riko, I. M. (2011). Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/43639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Riko, I Made. “Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .” 2011. Thesis, Nanyang Technological University. Accessed April 18, 2021. http://hdl.handle.net/10356/43639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Riko, I Made. “Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .” 2011. Web. 18 Apr 2021.

Vancouver:

Riko IM. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . [Internet] [Thesis]. Nanyang Technological University; 2011. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10356/43639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Riko IM. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . [Thesis]. Nanyang Technological University; 2011. Available from: http://hdl.handle.net/10356/43639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

7. Luo, Kaiming. Investigation of nano-copper for electronic packaging application : solder metallization and die attach .

Degree: 2016, Nanyang Technological University

 Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Luo, K. (2016). Investigation of nano-copper for electronic packaging application : solder metallization and die attach . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/66939

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Luo, Kaiming. “Investigation of nano-copper for electronic packaging application : solder metallization and die attach .” 2016. Thesis, Nanyang Technological University. Accessed April 18, 2021. http://hdl.handle.net/10356/66939.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Luo, Kaiming. “Investigation of nano-copper for electronic packaging application : solder metallization and die attach .” 2016. Web. 18 Apr 2021.

Vancouver:

Luo K. Investigation of nano-copper for electronic packaging application : solder metallization and die attach . [Internet] [Thesis]. Nanyang Technological University; 2016. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10356/66939.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Luo K. Investigation of nano-copper for electronic packaging application : solder metallization and die attach . [Thesis]. Nanyang Technological University; 2016. Available from: http://hdl.handle.net/10356/66939

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of California – Irvine

8. Fu, Shao-Wei. Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics.

Degree: Engineering, 2018, University of California – Irvine

 A major challenge in today’s high-temperature power electronics is the lack of reliable packaging materials with good performance. Silver (Ag) has the advantages of high electric and thermal… (more)

Subjects/Keywords: Materials Science; Packaging; Ag-Al direct bonding; intermetallic; packaging

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APA (6th Edition):

Fu, S. (2018). Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics. (Thesis). University of California – Irvine. Retrieved from http://www.escholarship.org/uc/item/1d23m0d4

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Fu, Shao-Wei. “Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics.” 2018. Thesis, University of California – Irvine. Accessed April 18, 2021. http://www.escholarship.org/uc/item/1d23m0d4.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Fu, Shao-Wei. “Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics.” 2018. Web. 18 Apr 2021.

Vancouver:

Fu S. Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics. [Internet] [Thesis]. University of California – Irvine; 2018. [cited 2021 Apr 18]. Available from: http://www.escholarship.org/uc/item/1d23m0d4.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Fu S. Silver Aluminum Solid-State and Eutectic Bonding Processes and Study of Intermetallic Properties and Corrosion for Advanced Electronics and Photonics. [Thesis]. University of California – Irvine; 2018. Available from: http://www.escholarship.org/uc/item/1d23m0d4

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Cape Peninsula University of Technology

9. Skillington, Pauline. Migration of chemicals through coated paperboard for food contact packaging .

Degree: 2014, Cape Peninsula University of Technology

 Paperboard made from recycled fibres is being used more frequently in direct food packaging applications, in addition to its use as secondary and tertiary packaging.… (more)

Subjects/Keywords: Food  – Packaging; Packaging  – Materials; Paper containers; Food contamination; Paperboard; Paper coatings

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APA (6th Edition):

Skillington, P. (2014). Migration of chemicals through coated paperboard for food contact packaging . (Thesis). Cape Peninsula University of Technology. Retrieved from http://etd.cput.ac.za/handle/20.500.11838/752

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Skillington, Pauline. “Migration of chemicals through coated paperboard for food contact packaging .” 2014. Thesis, Cape Peninsula University of Technology. Accessed April 18, 2021. http://etd.cput.ac.za/handle/20.500.11838/752.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Skillington, Pauline. “Migration of chemicals through coated paperboard for food contact packaging .” 2014. Web. 18 Apr 2021.

Vancouver:

Skillington P. Migration of chemicals through coated paperboard for food contact packaging . [Internet] [Thesis]. Cape Peninsula University of Technology; 2014. [cited 2021 Apr 18]. Available from: http://etd.cput.ac.za/handle/20.500.11838/752.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Skillington P. Migration of chemicals through coated paperboard for food contact packaging . [Thesis]. Cape Peninsula University of Technology; 2014. Available from: http://etd.cput.ac.za/handle/20.500.11838/752

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

10. Galligan, Patrick Ryan. Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films.

Degree: 2020, Hong Kong University of Science and Technology

 Anisotropic conductive films (ACF) are important component used in LCD and LED screen packaging, utilized for many different electronic devices. To be effective, these films… (more)

Subjects/Keywords: Thin films ; Packaging ; Materials ; Electronic packaging ; Electroless plating

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APA (6th Edition):

Galligan, P. R. (2020). Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-108952 ; https://doi.org/10.14711/thesis-991012880167703412 ; http://repository.ust.hk/ir/bitstream/1783.1-108952/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Galligan, Patrick Ryan. “Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films.” 2020. Thesis, Hong Kong University of Science and Technology. Accessed April 18, 2021. http://repository.ust.hk/ir/Record/1783.1-108952 ; https://doi.org/10.14711/thesis-991012880167703412 ; http://repository.ust.hk/ir/bitstream/1783.1-108952/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Galligan, Patrick Ryan. “Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films.” 2020. Web. 18 Apr 2021.

Vancouver:

Galligan PR. Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2020. [cited 2021 Apr 18]. Available from: http://repository.ust.hk/ir/Record/1783.1-108952 ; https://doi.org/10.14711/thesis-991012880167703412 ; http://repository.ust.hk/ir/bitstream/1783.1-108952/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Galligan PR. Engineering graphene/metal-coated polystyrene beads for anisotropic conductive films. [Thesis]. Hong Kong University of Science and Technology; 2020. Available from: http://repository.ust.hk/ir/Record/1783.1-108952 ; https://doi.org/10.14711/thesis-991012880167703412 ; http://repository.ust.hk/ir/bitstream/1783.1-108952/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Michigan State University

11. Xia, Yining. Release of nanoclay and surfactant from polymer-clay nanocomposite systems.

Degree: 2014, Michigan State University

Thesis Ph. D. Michigan State University. Packaging 2014.

In the past decade, applications of nanocomposites consisting of polymers and engineered nanoparticles have been significantly expanded,… (more)

Subjects/Keywords: Packaging – Research; Package goods industry; Nanocomposites (Materials) – Environmental aspects; Packaging

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Xia, Y. (2014). Release of nanoclay and surfactant from polymer-clay nanocomposite systems. (Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:2783

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Xia, Yining. “Release of nanoclay and surfactant from polymer-clay nanocomposite systems.” 2014. Thesis, Michigan State University. Accessed April 18, 2021. http://etd.lib.msu.edu/islandora/object/etd:2783.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Xia, Yining. “Release of nanoclay and surfactant from polymer-clay nanocomposite systems.” 2014. Web. 18 Apr 2021.

Vancouver:

Xia Y. Release of nanoclay and surfactant from polymer-clay nanocomposite systems. [Internet] [Thesis]. Michigan State University; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.msu.edu/islandora/object/etd:2783.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Xia Y. Release of nanoclay and surfactant from polymer-clay nanocomposite systems. [Thesis]. Michigan State University; 2014. Available from: http://etd.lib.msu.edu/islandora/object/etd:2783

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


RMIT University

12. Patuto, J. Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures.

Degree: 2008, RMIT University

 Polyethylene Terephthalate (PET) has become the preferred material of choice for many packaging applications. A preference over glass due to its low weight, similar transparency… (more)

Subjects/Keywords: Fields of Research; Packaging  – Materials; Polyethylene terephthalate

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APA (6th Edition):

Patuto, J. (2008). Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures. (Thesis). RMIT University. Retrieved from http://researchbank.rmit.edu.au/view/rmit:6770

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Patuto, J. “Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures.” 2008. Thesis, RMIT University. Accessed April 18, 2021. http://researchbank.rmit.edu.au/view/rmit:6770.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Patuto, J. “Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures.” 2008. Web. 18 Apr 2021.

Vancouver:

Patuto J. Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures. [Internet] [Thesis]. RMIT University; 2008. [cited 2021 Apr 18]. Available from: http://researchbank.rmit.edu.au/view/rmit:6770.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Patuto J. Investigation of recycled PET and its application for blow moulded containers requiring thermal stability at elevated temperatures. [Thesis]. RMIT University; 2008. Available from: http://researchbank.rmit.edu.au/view/rmit:6770

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

13. Spurney, Robert Grant. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.

Degree: PhD, Materials Science and Engineering, 2019, Georgia Tech

 Capacitors are key components for power conversion, delivery, and management. Along with inductors, they dictate the size and performance of voltage regulators in power distribution… (more)

Subjects/Keywords: Power components; Electronic packaging; Capacitors; Energy materials

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APA (6th Edition):

Spurney, R. G. (2019). Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62279

Chicago Manual of Style (16th Edition):

Spurney, Robert Grant. “Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.” 2019. Doctoral Dissertation, Georgia Tech. Accessed April 18, 2021. http://hdl.handle.net/1853/62279.

MLA Handbook (7th Edition):

Spurney, Robert Grant. “Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.” 2019. Web. 18 Apr 2021.

Vancouver:

Spurney RG. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/1853/62279.

Council of Science Editors:

Spurney RG. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62279


Michigan State University

14. Charnnarong, Nopporn. A comparison between various package cushioning materials based on performance and environmental concerns.

Degree: MS, School of Packaging, 1991, Michigan State University

Subjects/Keywords: Cushioning materials; Packaging

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APA (6th Edition):

Charnnarong, N. (1991). A comparison between various package cushioning materials based on performance and environmental concerns. (Masters Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:28964

Chicago Manual of Style (16th Edition):

Charnnarong, Nopporn. “A comparison between various package cushioning materials based on performance and environmental concerns.” 1991. Masters Thesis, Michigan State University. Accessed April 18, 2021. http://etd.lib.msu.edu/islandora/object/etd:28964.

MLA Handbook (7th Edition):

Charnnarong, Nopporn. “A comparison between various package cushioning materials based on performance and environmental concerns.” 1991. Web. 18 Apr 2021.

Vancouver:

Charnnarong N. A comparison between various package cushioning materials based on performance and environmental concerns. [Internet] [Masters thesis]. Michigan State University; 1991. [cited 2021 Apr 18]. Available from: http://etd.lib.msu.edu/islandora/object/etd:28964.

Council of Science Editors:

Charnnarong N. A comparison between various package cushioning materials based on performance and environmental concerns. [Masters Thesis]. Michigan State University; 1991. Available from: http://etd.lib.msu.edu/islandora/object/etd:28964


Michigan State University

15. Al-Ghamdi, Saleh. Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds.

Degree: 2014, Michigan State University

Thesis M.S. Michigan State University. Packaging 2014.

Cyclodextrin metal organic frameworks (CDMOFs) with different types of cyclodextrins (CDs) (i.e., Alpha, Beta and Gamma-CD) and coordination… (more)

Subjects/Keywords: Nanostructured materials; Cyclodextrins – Synthesis; Organometallic polymers – Industrial applications; Porous materials; Packaging – Technological innovations; Materials Science; Packaging; Nanotechnology

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APA (6th Edition):

Al-Ghamdi, S. (2014). Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds. (Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:2721

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Al-Ghamdi, Saleh. “Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds.” 2014. Thesis, Michigan State University. Accessed April 18, 2021. http://etd.lib.msu.edu/islandora/object/etd:2721.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Al-Ghamdi, Saleh. “Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds.” 2014. Web. 18 Apr 2021.

Vancouver:

Al-Ghamdi S. Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds. [Internet] [Thesis]. Michigan State University; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.msu.edu/islandora/object/etd:2721.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Al-Ghamdi S. Synthesis of nanoporous carbohydrate metal-organic framework and encapsulation of selected organic compounds. [Thesis]. Michigan State University; 2014. Available from: http://etd.lib.msu.edu/islandora/object/etd:2721

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Rochester Institute of Technology

16. Thangsupanich, Grit. Food research and product development and packaging practices, issues and strategies in Thailand.

Degree: Packaging Science (CAST), 1995, Rochester Institute of Technology

 This thesis examines some of the institutions and organizations that play an important role in food research and product development. Packaging practices, issues and strategies… (more)

Subjects/Keywords: Food research; Packaging development; Packaging materials; Packaging methods; Thailand

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APA (6th Edition):

Thangsupanich, G. (1995). Food research and product development and packaging practices, issues and strategies in Thailand. (Thesis). Rochester Institute of Technology. Retrieved from https://scholarworks.rit.edu/theses/298

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Thangsupanich, Grit. “Food research and product development and packaging practices, issues and strategies in Thailand.” 1995. Thesis, Rochester Institute of Technology. Accessed April 18, 2021. https://scholarworks.rit.edu/theses/298.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Thangsupanich, Grit. “Food research and product development and packaging practices, issues and strategies in Thailand.” 1995. Web. 18 Apr 2021.

Vancouver:

Thangsupanich G. Food research and product development and packaging practices, issues and strategies in Thailand. [Internet] [Thesis]. Rochester Institute of Technology; 1995. [cited 2021 Apr 18]. Available from: https://scholarworks.rit.edu/theses/298.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Thangsupanich G. Food research and product development and packaging practices, issues and strategies in Thailand. [Thesis]. Rochester Institute of Technology; 1995. Available from: https://scholarworks.rit.edu/theses/298

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universitat Politècnica de València

17. CHALCO SANDOVAL, WILSON. Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain .

Degree: 2016, Universitat Politècnica de València

 [EN] The use of latent heat storage materials containing phase change materials (PCM's) is an effective way of buffering thermal fluctuations and has the advantages… (more)

Subjects/Keywords: Phase change materials; Electro-hydrodynamic processing; Electrospinning; Food; Cold chain; Fiber; Food packaging; Electrospun; Polymer; Smart packaging; Active packaging; Temperature buffering.

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APA (6th Edition):

CHALCO SANDOVAL, W. (2016). Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain . (Doctoral Dissertation). Universitat Politècnica de València. Retrieved from http://hdl.handle.net/10251/53349

Chicago Manual of Style (16th Edition):

CHALCO SANDOVAL, WILSON. “Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain .” 2016. Doctoral Dissertation, Universitat Politècnica de València. Accessed April 18, 2021. http://hdl.handle.net/10251/53349.

MLA Handbook (7th Edition):

CHALCO SANDOVAL, WILSON. “Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain .” 2016. Web. 18 Apr 2021.

Vancouver:

CHALCO SANDOVAL W. Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain . [Internet] [Doctoral dissertation]. Universitat Politècnica de València; 2016. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10251/53349.

Council of Science Editors:

CHALCO SANDOVAL W. Development of Temperature Buffering Material Concepts Based on Electro-Hydrodynamic Processing of Interest in the Food Cold Chain . [Doctoral Dissertation]. Universitat Politècnica de València; 2016. Available from: http://hdl.handle.net/10251/53349


Michigan State University

18. Fehlberg, Jack Alan. The use of waste from orange juicing for food packaging applications.

Degree: 2019, Michigan State University

Thesis M.S. Michigan State University. Packaging 2019.

Utilization of orange juicing waste (OP) as a filler material within a polymer matrix can add value to… (more)

Subjects/Keywords: Oranges – Industrial applications; Agricultural wastes – Recycling; Food – Packaging; Plastic films; Plastics in packaging; Polyethylene; Packaging; Materials Science; Food science

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APA (6th Edition):

Fehlberg, J. A. (2019). The use of waste from orange juicing for food packaging applications. (Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:48193

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Fehlberg, Jack Alan. “The use of waste from orange juicing for food packaging applications.” 2019. Thesis, Michigan State University. Accessed April 18, 2021. http://etd.lib.msu.edu/islandora/object/etd:48193.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Fehlberg, Jack Alan. “The use of waste from orange juicing for food packaging applications.” 2019. Web. 18 Apr 2021.

Vancouver:

Fehlberg JA. The use of waste from orange juicing for food packaging applications. [Internet] [Thesis]. Michigan State University; 2019. [cited 2021 Apr 18]. Available from: http://etd.lib.msu.edu/islandora/object/etd:48193.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Fehlberg JA. The use of waste from orange juicing for food packaging applications. [Thesis]. Michigan State University; 2019. Available from: http://etd.lib.msu.edu/islandora/object/etd:48193

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

19. Aiken, Gregg W. The use of a char pile reactor to study char bed processes.

Degree: PhD, Institute of Paper Science and Technology, 1988, Georgia Tech

Subjects/Keywords: Paper Packaging; Packaging Research; Wrapping materials

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APA (6th Edition):

Aiken, G. W. (1988). The use of a char pile reactor to study char bed processes. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5734

Chicago Manual of Style (16th Edition):

Aiken, Gregg W. “The use of a char pile reactor to study char bed processes.” 1988. Doctoral Dissertation, Georgia Tech. Accessed April 18, 2021. http://hdl.handle.net/1853/5734.

MLA Handbook (7th Edition):

Aiken, Gregg W. “The use of a char pile reactor to study char bed processes.” 1988. Web. 18 Apr 2021.

Vancouver:

Aiken GW. The use of a char pile reactor to study char bed processes. [Internet] [Doctoral dissertation]. Georgia Tech; 1988. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/1853/5734.

Council of Science Editors:

Aiken GW. The use of a char pile reactor to study char bed processes. [Doctoral Dissertation]. Georgia Tech; 1988. Available from: http://hdl.handle.net/1853/5734


Portland State University

20. Cope, Alexander Randon. Solid State Pre-Formed Electronics Adhesive (SPEA).

Degree: MS(M.S.) in Mechanical Engineering, Mechanical and Materials Engineering, 2013, Portland State University

  In mobile and handheld consumer electronic markets, product use conditions drive the requirement for mechanical strength and device durability. The majority of relatively large… (more)

Subjects/Keywords: Surface mount technology; Electronic packaging  – Design and construction; Electronic packaging  – Testing; Materials Science and Engineering

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APA (6th Edition):

Cope, A. R. (2013). Solid State Pre-Formed Electronics Adhesive (SPEA). (Masters Thesis). Portland State University. Retrieved from https://pdxscholar.library.pdx.edu/open_access_etds/1842

Chicago Manual of Style (16th Edition):

Cope, Alexander Randon. “Solid State Pre-Formed Electronics Adhesive (SPEA).” 2013. Masters Thesis, Portland State University. Accessed April 18, 2021. https://pdxscholar.library.pdx.edu/open_access_etds/1842.

MLA Handbook (7th Edition):

Cope, Alexander Randon. “Solid State Pre-Formed Electronics Adhesive (SPEA).” 2013. Web. 18 Apr 2021.

Vancouver:

Cope AR. Solid State Pre-Formed Electronics Adhesive (SPEA). [Internet] [Masters thesis]. Portland State University; 2013. [cited 2021 Apr 18]. Available from: https://pdxscholar.library.pdx.edu/open_access_etds/1842.

Council of Science Editors:

Cope AR. Solid State Pre-Formed Electronics Adhesive (SPEA). [Masters Thesis]. Portland State University; 2013. Available from: https://pdxscholar.library.pdx.edu/open_access_etds/1842


Arizona State University

21. Ganesan, Kousik. Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing.

Degree: Materials Science and Engineering, 2018, Arizona State University

 This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line… (more)

Subjects/Keywords: Materials Science; Chemical engineering; Chemistry; Copper Plating; Electrodeposition; Packaging; Plating; Reverse Pulse plating; Substrate Packaging

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APA (6th Edition):

Ganesan, K. (2018). Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing. (Doctoral Dissertation). Arizona State University. Retrieved from http://repository.asu.edu/items/49012

Chicago Manual of Style (16th Edition):

Ganesan, Kousik. “Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing.” 2018. Doctoral Dissertation, Arizona State University. Accessed April 18, 2021. http://repository.asu.edu/items/49012.

MLA Handbook (7th Edition):

Ganesan, Kousik. “Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing.” 2018. Web. 18 Apr 2021.

Vancouver:

Ganesan K. Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing. [Internet] [Doctoral dissertation]. Arizona State University; 2018. [cited 2021 Apr 18]. Available from: http://repository.asu.edu/items/49012.

Council of Science Editors:

Ganesan K. Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing. [Doctoral Dissertation]. Arizona State University; 2018. Available from: http://repository.asu.edu/items/49012


Michigan State University

22. Sheu, In-Laang Karl. Influence of various factors on cushion loading rate.

Degree: MS, 1975, Michigan State University

Subjects/Keywords: Packaging – Testing; Cushioning materials; Packaging – Research; Materials – Dynamic testing

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APA (6th Edition):

Sheu, I. K. (1975). Influence of various factors on cushion loading rate. (Masters Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:45560

Chicago Manual of Style (16th Edition):

Sheu, In-Laang Karl. “Influence of various factors on cushion loading rate.” 1975. Masters Thesis, Michigan State University. Accessed April 18, 2021. http://etd.lib.msu.edu/islandora/object/etd:45560.

MLA Handbook (7th Edition):

Sheu, In-Laang Karl. “Influence of various factors on cushion loading rate.” 1975. Web. 18 Apr 2021.

Vancouver:

Sheu IK. Influence of various factors on cushion loading rate. [Internet] [Masters thesis]. Michigan State University; 1975. [cited 2021 Apr 18]. Available from: http://etd.lib.msu.edu/islandora/object/etd:45560.

Council of Science Editors:

Sheu IK. Influence of various factors on cushion loading rate. [Masters Thesis]. Michigan State University; 1975. Available from: http://etd.lib.msu.edu/islandora/object/etd:45560

23. Tsigonias, Marios. Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας.

Degree: 2016, Hellenic Open University; Ελληνικό Ανοικτό Πανεπιστήμιο (ΕΑΠ)

This thesis deals with the holistic and environmental packaging development and belongs in the field of Graphic Arts and packaging technology.A comprehensive analysis of holistic… (more)

Subjects/Keywords: Ολιστικός σχεδιασμός συσκευασίας; Πολυκριτηριακή ανάπτυξη συσκευασίας; Πράσινη συσκευασία; Αειφόρος ανάπτυξη; Ενεργεική αποδοτικότητα; Αποικοδομήσιμα υλικά συσκευασίας; Holistic packaging development; Multicriteria packaging development; Green packaging; Sustainable development; Energy efficiency; Degradable packaging materials

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APA (6th Edition):

Tsigonias, M. (2016). Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας. (Thesis). Hellenic Open University; Ελληνικό Ανοικτό Πανεπιστήμιο (ΕΑΠ). Retrieved from http://hdl.handle.net/10442/hedi/37735

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tsigonias, Marios. “Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας.” 2016. Thesis, Hellenic Open University; Ελληνικό Ανοικτό Πανεπιστήμιο (ΕΑΠ). Accessed April 18, 2021. http://hdl.handle.net/10442/hedi/37735.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tsigonias, Marios. “Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας.” 2016. Web. 18 Apr 2021.

Vancouver:

Tsigonias M. Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας. [Internet] [Thesis]. Hellenic Open University; Ελληνικό Ανοικτό Πανεπιστήμιο (ΕΑΠ); 2016. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/10442/hedi/37735.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tsigonias M. Ολιστικός και περιβαλλοντικός σχεδιασμός συσκευασίας: ανάπτυξη και μελέτη υλικών και τεχνολογιών για την κάλυψη των περιβαλλοντικών απαιτήσεων της εκτυπωτικής βιομηχανίας της συσκευασίας. [Thesis]. Hellenic Open University; Ελληνικό Ανοικτό Πανεπιστήμιο (ΕΑΠ); 2016. Available from: http://hdl.handle.net/10442/hedi/37735

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Rochester Institute of Technology

24. Soch, Manpreet. A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC.

Degree: Packaging Science (CAST), 1999, Rochester Institute of Technology

 Environmental concerns in European countries caused a US cosmetics company to evaluate plastic materials to replace PVC bottles for fragrances. PVC bottles and PETG bottles… (more)

Subjects/Keywords: Packaging science; Plastic materials

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APA (6th Edition):

Soch, M. (1999). A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC. (Thesis). Rochester Institute of Technology. Retrieved from https://scholarworks.rit.edu/theses/802

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Soch, Manpreet. “A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC.” 1999. Thesis, Rochester Institute of Technology. Accessed April 18, 2021. https://scholarworks.rit.edu/theses/802.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Soch, Manpreet. “A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC.” 1999. Web. 18 Apr 2021.

Vancouver:

Soch M. A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC. [Internet] [Thesis]. Rochester Institute of Technology; 1999. [cited 2021 Apr 18]. Available from: https://scholarworks.rit.edu/theses/802.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Soch M. A Study of replacing PVC with PEGT plastic bottles due to recycling concers for PVC. [Thesis]. Rochester Institute of Technology; 1999. Available from: https://scholarworks.rit.edu/theses/802

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Rochester Institute of Technology

25. O'Leary-Swinson, Cindy. Investigation and evaluation of foodservice industry packaging formats.

Degree: Manufacturing and Mechanical Engineering Technology (CAST), 2003, Rochester Institute of Technology

 The purpose of this study was to determine the packaging usage of the foodservice industry in today's marketplace. It summarized the foodservice packaging formats in… (more)

Subjects/Keywords: Foodservice; Marketplace; Materials; Packaging

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APA (6th Edition):

O'Leary-Swinson, C. (2003). Investigation and evaluation of foodservice industry packaging formats. (Thesis). Rochester Institute of Technology. Retrieved from https://scholarworks.rit.edu/theses/311

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

O'Leary-Swinson, Cindy. “Investigation and evaluation of foodservice industry packaging formats.” 2003. Thesis, Rochester Institute of Technology. Accessed April 18, 2021. https://scholarworks.rit.edu/theses/311.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

O'Leary-Swinson, Cindy. “Investigation and evaluation of foodservice industry packaging formats.” 2003. Web. 18 Apr 2021.

Vancouver:

O'Leary-Swinson C. Investigation and evaluation of foodservice industry packaging formats. [Internet] [Thesis]. Rochester Institute of Technology; 2003. [cited 2021 Apr 18]. Available from: https://scholarworks.rit.edu/theses/311.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

O'Leary-Swinson C. Investigation and evaluation of foodservice industry packaging formats. [Thesis]. Rochester Institute of Technology; 2003. Available from: https://scholarworks.rit.edu/theses/311

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

26. Hah, Jinho. Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications.

Degree: MS, Materials Science and Engineering, 2019, Georgia Tech

 There have been many attempts to improve the stability of the environmentally-sensitive perovskite solar cells (PSCs) from adverse environments. The next generation encapsulation method should… (more)

Subjects/Keywords: Perovskite solar cell; Encapsulation; Packaging materials; Stability; Interfacial adhesion

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APA (6th Edition):

Hah, J. (2019). Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62699

Chicago Manual of Style (16th Edition):

Hah, Jinho. “Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications.” 2019. Masters Thesis, Georgia Tech. Accessed April 18, 2021. http://hdl.handle.net/1853/62699.

MLA Handbook (7th Edition):

Hah, Jinho. “Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications.” 2019. Web. 18 Apr 2021.

Vancouver:

Hah J. Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications. [Internet] [Masters thesis]. Georgia Tech; 2019. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/1853/62699.

Council of Science Editors:

Hah J. Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications. [Masters Thesis]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62699


Boston University

27. Lake, Anneliese Elizabeth. A comparison of packaging materials for wet biological evidence.

Degree: MS, Biomedical Forensic Sciences, 2015, Boston University

 When considering what packaging material is optimal for a piece of biological evidence there are two vital things to consider: degradation and contamination (1). Biological… (more)

Subjects/Keywords: Biology; Biological evidence; Evidence degradation; Forensic evidence; Forensic packaging materials

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APA (6th Edition):

Lake, A. E. (2015). A comparison of packaging materials for wet biological evidence. (Masters Thesis). Boston University. Retrieved from http://hdl.handle.net/2144/16136

Chicago Manual of Style (16th Edition):

Lake, Anneliese Elizabeth. “A comparison of packaging materials for wet biological evidence.” 2015. Masters Thesis, Boston University. Accessed April 18, 2021. http://hdl.handle.net/2144/16136.

MLA Handbook (7th Edition):

Lake, Anneliese Elizabeth. “A comparison of packaging materials for wet biological evidence.” 2015. Web. 18 Apr 2021.

Vancouver:

Lake AE. A comparison of packaging materials for wet biological evidence. [Internet] [Masters thesis]. Boston University; 2015. [cited 2021 Apr 18]. Available from: http://hdl.handle.net/2144/16136.

Council of Science Editors:

Lake AE. A comparison of packaging materials for wet biological evidence. [Masters Thesis]. Boston University; 2015. Available from: http://hdl.handle.net/2144/16136


Hong Kong University of Science and Technology

28. Liu, Lilin. Materials science in pre-plated leadframes for electronic packages.

Degree: 2006, Hong Kong University of Science and Technology

 Au/Pd/Ni pre-plated leadframes (PPF) are high performance frames for accommodating high-end electronic packages. Cost and reliability are major concerns in their wide application. The present… (more)

Subjects/Keywords: Electronic packaging  – Materials ; Thin films

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Liu, L. (2006). Materials science in pre-plated leadframes for electronic packages. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Lilin. “Materials science in pre-plated leadframes for electronic packages.” 2006. Thesis, Hong Kong University of Science and Technology. Accessed April 18, 2021. http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Lilin. “Materials science in pre-plated leadframes for electronic packages.” 2006. Web. 18 Apr 2021.

Vancouver:

Liu L. Materials science in pre-plated leadframes for electronic packages. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2006. [cited 2021 Apr 18]. Available from: http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu L. Materials science in pre-plated leadframes for electronic packages. [Thesis]. Hong Kong University of Science and Technology; 2006. Available from: http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

29. Kwok, Stephen Chin To. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.

Degree: 2015, Hong Kong University of Science and Technology

 The advanced consumer electronic gadgets are tending to be miniaturized in size and incorporated with multi-function purposes. The mechanical and electrical reliability of such products… (more)

Subjects/Keywords: Electronic packaging ; Materials ; Epoxy compounds ; Self-assembly (Chemistry) ; Thiols ; Adhesion

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Kwok, S. C. T. (2015). Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kwok, Stephen Chin To. “Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.” 2015. Thesis, Hong Kong University of Science and Technology. Accessed April 18, 2021. http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kwok, Stephen Chin To. “Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.” 2015. Web. 18 Apr 2021.

Vancouver:

Kwok SCT. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2015. [cited 2021 Apr 18]. Available from: http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kwok SCT. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. [Thesis]. Hong Kong University of Science and Technology; 2015. Available from: http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

30. Wen, Haoran. Synthesis and applications of graphene based composites as thermal interface materials.

Degree: 2018, Hong Kong University of Science and Technology

 As the amount of transistors double every two years as described by Moore’s law and the energy density increases correspondingly, the huge amount of heat… (more)

Subjects/Keywords: Thermal interface materials ; Graphene ; Thermal properties ; Electronic packaging

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wen, H. (2018). Synthesis and applications of graphene based composites as thermal interface materials. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-92242 ; https://doi.org/10.14711/thesis-991012588664903412 ; http://repository.ust.hk/ir/bitstream/1783.1-92242/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wen, Haoran. “Synthesis and applications of graphene based composites as thermal interface materials.” 2018. Thesis, Hong Kong University of Science and Technology. Accessed April 18, 2021. http://repository.ust.hk/ir/Record/1783.1-92242 ; https://doi.org/10.14711/thesis-991012588664903412 ; http://repository.ust.hk/ir/bitstream/1783.1-92242/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wen, Haoran. “Synthesis and applications of graphene based composites as thermal interface materials.” 2018. Web. 18 Apr 2021.

Vancouver:

Wen H. Synthesis and applications of graphene based composites as thermal interface materials. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2018. [cited 2021 Apr 18]. Available from: http://repository.ust.hk/ir/Record/1783.1-92242 ; https://doi.org/10.14711/thesis-991012588664903412 ; http://repository.ust.hk/ir/bitstream/1783.1-92242/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wen H. Synthesis and applications of graphene based composites as thermal interface materials. [Thesis]. Hong Kong University of Science and Technology; 2018. Available from: http://repository.ust.hk/ir/Record/1783.1-92242 ; https://doi.org/10.14711/thesis-991012588664903412 ; http://repository.ust.hk/ir/bitstream/1783.1-92242/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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