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You searched for subject:(hygroscopic swelling). Showing records 1 – 2 of 2 total matches.

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1. CHIN CHIAM CHUANG. SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES.

Degree: 2003, National University of Singapore

Subjects/Keywords: moisture diffusivity; saturated moisture concentration; coefficient of moisture expansion; hygroscopic swelling; thermal expansion; vapor pressure; interface delamination

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

CHUANG, C. C. (2003). SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. (Thesis). National University of Singapore. Retrieved from https://scholarbank.nus.edu.sg/handle/10635/154028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

CHUANG, CHIN CHIAM. “SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES.” 2003. Thesis, National University of Singapore. Accessed December 08, 2019. https://scholarbank.nus.edu.sg/handle/10635/154028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

CHUANG, CHIN CHIAM. “SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES.” 2003. Web. 08 Dec 2019.

Vancouver:

CHUANG CC. SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. [Internet] [Thesis]. National University of Singapore; 2003. [cited 2019 Dec 08]. Available from: https://scholarbank.nus.edu.sg/handle/10635/154028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

CHUANG CC. SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. [Thesis]. National University of Singapore; 2003. Available from: https://scholarbank.nus.edu.sg/handle/10635/154028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Cesaretti, Juan Manuel. Mechanical stress and stress compensation in Hall sensors.

Degree: MS, Electrical and Computer Engineering, 2008, Georgia Tech

Silicon magnetic sensors based on the Hall effect have proven to be an excellent sensor choice for many applications, such as position sensing, gear-tooth sensing, contact-less switching and linear sensing. Although a sensor can be trimmed over temperature before it is shipped to the customer, little can be done about the sensitivity's stability once the sensor has been installed in its final application. The goal of this project is to propose and implement mechanisms to stabilize the Hall sensor's sensitivity through the use of mechanical stress feedback and magnetic feedback. Advisors/Committee Members: Brand, Oliver (Committee Chair), Hasler, Paul (Committee Member), Taylor, William (Committee Member).

Subjects/Keywords: Magnetic field; Open loop compensation; Piezoresistance; Piezo-Hall; Piezoresistive; Magnetism; Hygroscopic swelling; Closed loop compensation; Humidity absorption; Detectors; Hall effect devices; Magnetic devices

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Cesaretti, J. M. (2008). Mechanical stress and stress compensation in Hall sensors. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/28202

Chicago Manual of Style (16th Edition):

Cesaretti, Juan Manuel. “Mechanical stress and stress compensation in Hall sensors.” 2008. Masters Thesis, Georgia Tech. Accessed December 08, 2019. http://hdl.handle.net/1853/28202.

MLA Handbook (7th Edition):

Cesaretti, Juan Manuel. “Mechanical stress and stress compensation in Hall sensors.” 2008. Web. 08 Dec 2019.

Vancouver:

Cesaretti JM. Mechanical stress and stress compensation in Hall sensors. [Internet] [Masters thesis]. Georgia Tech; 2008. [cited 2019 Dec 08]. Available from: http://hdl.handle.net/1853/28202.

Council of Science Editors:

Cesaretti JM. Mechanical stress and stress compensation in Hall sensors. [Masters Thesis]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/28202

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