Advanced search options

Advanced Search Options 🞨

Browse by author name (“Author name starts with…”).

Find ETDs with:

in
/  
in
/  
in
/  
in

Written in Published in Earliest date Latest date

Sorted by

Results per page:

Sorted by: relevance · author · university · dateNew search

You searched for subject:(copper bonding process). Showing records 1 – 4 of 4 total matches.

Search Limiters

Last 2 Years | English Only

No search limiters apply to these results.

▼ Search Limiters


NSYSU

1. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

 Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous… (more)

Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed February 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 24 Feb 2021.

Vancouver:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2021 Feb 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

2. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

 Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction… (more)

Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed February 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 24 Feb 2021.

Vancouver:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Feb 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

3. Hook, Michael. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.

Degree: 2018, University of Waterloo

 Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package sizes… (more)

Subjects/Keywords: Wire Bonding; Reliability; Copper Wire; Process Development; Accelerated Failure Time Model; High-Temperature Storage; Humidity Testing

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hook, M. (2018). Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Thesis, University of Waterloo. Accessed February 24, 2021. http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Web. 24 Feb 2021.

Vancouver:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Internet] [Thesis]. University of Waterloo; 2018. [cited 2021 Feb 24]. Available from: http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Thesis]. University of Waterloo; 2018. Available from: http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

4. Pequegnat, Andrew. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.

Degree: 2010, University of Waterloo

 Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold… (more)

Subjects/Keywords: Thermosonic wire bonding; Electrical flame off process; Copper wire bonding; Gold wire bonding; Free air ball; Ball bonding

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Pequegnat, A. (2010). A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Thesis, University of Waterloo. Accessed February 24, 2021. http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Web. 24 Feb 2021.

Vancouver:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2021 Feb 24]. Available from: http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.