subject:(Wafer stage)

Delft University of Technology

1. Boots, E. (author). Actuation of a 450 mm through Wall Wafer Stage.

Degree: 2012, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:145a3691-6c89-4d52-b3e8-e92f952b9cdc

Precision and Microsystems Engineering

Mechanical, Maritime and Materials Engineering

Advisors/Committee Members: Ostayen, R.A.J. (mentor).

Subjects/Keywords: Wall Wafer Stage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Boots, E. (. (2012). Actuation of a 450 mm through Wall Wafer Stage. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:145a3691-6c89-4d52-b3e8-e92f952b9cdc

Chicago Manual of Style (16^th Edition):

Boots, E (author). “Actuation of a 450 mm through Wall Wafer Stage.” 2012. Masters Thesis, Delft University of Technology. Accessed January 26, 2021. http://resolver.tudelft.nl/uuid:145a3691-6c89-4d52-b3e8-e92f952b9cdc.

MLA Handbook (7^th Edition):

Boots, E (author). “Actuation of a 450 mm through Wall Wafer Stage.” 2012. Web. 26 Jan 2021.

Vancouver:

Boots E(. Actuation of a 450 mm through Wall Wafer Stage. [Internet] [Masters thesis]. Delft University of Technology; 2012. [cited 2021 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:145a3691-6c89-4d52-b3e8-e92f952b9cdc.

Council of Science Editors:

Boots E(. Actuation of a 450 mm through Wall Wafer Stage. [Masters Thesis]. Delft University of Technology; 2012. Available from: http://resolver.tudelft.nl/uuid:145a3691-6c89-4d52-b3e8-e92f952b9cdc

Delft University of Technology

2. Zoutendijk, Mike (author). Applying Deflation Methods in a Topology Optimization Procedure.

Degree: 2019, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:c5b85fd2-4745-465b-8988-6d9d59664343

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Structure Optimization has been an important subject with many applications for centuries. In the last sixty years, numerical optimization has facilitated large advancements in this… (more)

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Structure Optimization has been an important subject with many applications for centuries. In the last sixty years, numerical optimization has facilitated large advancements in this field. One of the areas in Structure Optimization is Topology Optimization, which is used for Additive Manufacturing purposes. In this thesis we explore Static and Dynamic Topology Optimization. In the optimization problems matrix equations of the type Ax = b, with A sparse and badly conditioned, are accelerated using deflation techniques in addition to preconditioning. We have applied several iterative methods, preconditioners, and deflation types to the topology optimization problems. The static problem concerns compliance optimization of a two-dimensional MBB-beam. The deflation type that reduced the number of iterations the most without introducing large overhead costs was rigid body modes deflation, divided over element squares. It was found that dividing the rigid body modes vectors over density based regions did not reduce the number of iterations. The dynamic problem concerns eigenvalue optimization of a three-dimensional moving wafer stage that is used for laser-printing computer chips. The optimization formulation contains a shifted eigenvalue problem that is solved using model order reduction. In the computations of bases for the reduction matrix equations appear, to which deflation techniques were applied. All deflation types reduced the number of iterations and needed time to solve the matrix equations. The best deflation type was using rigid body modes (RBM) divided over element cubes combined with eigenvectors from the previous iteration. The next best was the same combination without the division over cubes. Using eigenvectors or RBM separately were the least effective deflation types. There is an optimal amount of element cubes to use when dividing the RBM. The tests on a few grid sizes suggested a quadrupling of the amount when the grid size doubles, but more research is needed to really identify a relation between the grid size and optimal amount. When increasing the grid size to a level where parallel computing on a cluster was required, the deflation type using element cubes could not be used due to complications with parallel implementation. Using the deflation type RBM and eigenvectors, reductions by a factor of 1.60 and 1.75 in the total needed time for 150 optimization iterations were achieved for grid sizes 120x120x20 and 180x180x30, respectively. In the first case the objective function of the optimized design converged further in the same amount of iterations when using deflation. future research could include using the promising deflation type RBM in cubes + eigenvectors in parallel computing to obtain an even larger time reduction in the optimization of the wafer stage with large grid sizes.

Applied Mathematics

Advisors/Committee Members: van Gijzen, Martin (mentor), Astudillo Rengifo, Reinaldo (mentor), Langelaar, Matthijs (graduation committee), van Horssen, Wim (graduation committee), Delft University of Technology (degree granting institution).

Subjects/Keywords: Deflation; Topology Optimization; Model Order Reduction; Iterative methods; Wafer stage; PETSc

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Zoutendijk, M. (. (2019). Applying Deflation Methods in a Topology Optimization Procedure. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:c5b85fd2-4745-465b-8988-6d9d59664343

Chicago Manual of Style (16^th Edition):

Zoutendijk, Mike (author). “Applying Deflation Methods in a Topology Optimization Procedure.” 2019. Masters Thesis, Delft University of Technology. Accessed January 26, 2021. http://resolver.tudelft.nl/uuid:c5b85fd2-4745-465b-8988-6d9d59664343.

MLA Handbook (7^th Edition):

Zoutendijk, Mike (author). “Applying Deflation Methods in a Topology Optimization Procedure.” 2019. Web. 26 Jan 2021.

Vancouver:

Zoutendijk M(. Applying Deflation Methods in a Topology Optimization Procedure. [Internet] [Masters thesis]. Delft University of Technology; 2019. [cited 2021 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:c5b85fd2-4745-465b-8988-6d9d59664343.

Council of Science Editors:

Zoutendijk M(. Applying Deflation Methods in a Topology Optimization Procedure. [Masters Thesis]. Delft University of Technology; 2019. Available from: http://resolver.tudelft.nl/uuid:c5b85fd2-4745-465b-8988-6d9d59664343

Delft University of Technology

3. Dijkstra, B.G. Iterative learning control, with applications to a wafer-stage.

Degree: 2004, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba

► In the past Iterative Learning Control has been shown to be a method that can easily achieve extremely high performance with very limited effort from… (more)

Subjects/Keywords: ilc; wafer-stage; input-shaping

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Dijkstra, B. G. (2004). Iterative learning control, with applications to a wafer-stage. (Doctoral Dissertation). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba

Chicago Manual of Style (16^th Edition):

Dijkstra, B G. “Iterative learning control, with applications to a wafer-stage.” 2004. Doctoral Dissertation, Delft University of Technology. Accessed January 26, 2021. http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba.

MLA Handbook (7^th Edition):

Dijkstra, B G. “Iterative learning control, with applications to a wafer-stage.” 2004. Web. 26 Jan 2021.

Vancouver:

Dijkstra BG. Iterative learning control, with applications to a wafer-stage. [Internet] [Doctoral dissertation]. Delft University of Technology; 2004. [cited 2021 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba.

Council of Science Editors:

Dijkstra BG. Iterative learning control, with applications to a wafer-stage. [Doctoral Dissertation]. Delft University of Technology; 2004. Available from: http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; urn:NBN:nl:ui:24-uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba ; http://resolver.tudelft.nl/uuid:b29a7fa2-6bee-4b59-8aaf-b7b016e1eeba

Delft University of Technology

4. Huang, X. (author). Actuation System Design for a 3 DoF Contactless Wafer Stage.

Degree: 2016, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:d654771f-bcc8-453b-89f7-d79be5369815

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Silicon wafers are getting bigger and bigger in the production line, aiming for faster manufacturing, lower cost and higher yield. The handling/transportation technique is becoming… (more)

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Silicon wafers are getting bigger and bigger in the production line, aiming for faster manufacturing, lower cost and higher yield. The handling/transportation technique is becoming more and more critical during the production. As the wafer is being handled with physical contact there is always risk of damage and contemination coming from the contact surface. Contactless wafer stage utilizes a thin film of pressurized air to support the wafer, provides wafer handling without physical contact, hence reducing the risk of damage and contamination. A special contactless 3DoF wafer stage called "the Flowerbed" is developed by H.P.Vuong during his PhD research. This flowerbed has a creative mechanical design to combine the wafer support and driving function, so that the wafer can be supported and driven by pressurized air with 3 degrees of freedom (x-y-theta). The goal of this MSc research is to design an actuation system for the Flowerbed, and design a special pneumatic actuator specific for this application. Two actuation configurations are discussed and the concept of 3-RPR parallel manipulator is chosen. Pneumatic actuator is chosen to be the type of actuator in this research. This pneumatic actuator has to be specially made, because the requirement of the actuators is, that it should have a stroke of 80 micro meters, with a maximum force of higher than 140N, and the required bandwidth is 150Hz. Such pneumatic actuator is rarely seen and is not available. A model is developed for this special pneumatic actuator, and is validated by test setups. Further development is made by a design with piezo buzzer. This piezo buzzer is implemented as a low cost valve with high performance, and the use of piezo buzzer makes it possible to integrate the valve into the actuator housing, hence further reduce the cost and improve the performance. A prototype is made to demonstrate the feasibility of such kind of pneumatic actuator. This prototype meets the requirement of the actuator and has very good performance for small range of stroke. However due to the weakness of the pneumatic actuator, the performance of large stroke must be improved. The knowledge developed in this research is summarised as a design method, and a GUI toolbox is made using MATLAB. This toolbox can be used to assist the design of such actuator, reducing the difficulty and provides assist for further research.

Mechatronic System Design

Precision and Microsystems Engineering

Mechanical, Maritime and Materials Engineering

Advisors/Committee Members: Van Ostayen, R.A.J. (mentor), Vuong, H.P. (mentor).

Subjects/Keywords: pneumatic; actuator; contactless; wafer; stage; piezo; low cost; RPR; valve; orifice; compressed air

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Huang, X. (. (2016). Actuation System Design for a 3 DoF Contactless Wafer Stage. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:d654771f-bcc8-453b-89f7-d79be5369815

Chicago Manual of Style (16^th Edition):

Huang, X (author). “Actuation System Design for a 3 DoF Contactless Wafer Stage.” 2016. Masters Thesis, Delft University of Technology. Accessed January 26, 2021. http://resolver.tudelft.nl/uuid:d654771f-bcc8-453b-89f7-d79be5369815.

MLA Handbook (7^th Edition):

Huang, X (author). “Actuation System Design for a 3 DoF Contactless Wafer Stage.” 2016. Web. 26 Jan 2021.

Vancouver:

Huang X(. Actuation System Design for a 3 DoF Contactless Wafer Stage. [Internet] [Masters thesis]. Delft University of Technology; 2016. [cited 2021 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:d654771f-bcc8-453b-89f7-d79be5369815.

Council of Science Editors:

Huang X(. Actuation System Design for a 3 DoF Contactless Wafer Stage. [Masters Thesis]. Delft University of Technology; 2016. Available from: http://resolver.tudelft.nl/uuid:d654771f-bcc8-453b-89f7-d79be5369815

Indian Institute of Science

5. Vimala Rani, M. Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing.

Degree: PhD, Faculty of Engineering, 2018, Indian Institute of Science

URL: http://etd.iisc.ac.in/handle/2005/3555

► The manufacturing industries play a significant role in contributing to the economy of a country. Among various manufacturing industries, the semiconductor manufacturing (SM) industries is… (more)

▼ The manufacturing industries play a significant role in contributing to the economy of a country. Among various manufacturing industries, the semiconductor manufacturing (SM) industries is one of the fastest growing industries in the world having worldwide sales of $31 billion in the month of December 2016. Semiconductors are required by large number of industries, including Telecommunications, Medical Electronics, Automobile, Defence and Aerospace, Consumer Electronics, etc.,. Today, without semiconductors, the technology that we count on every day would not be possible. Because of these, the demand for SM industry is increased rapidly. In addition, most of the semiconductor based products‘ life is very short. Due to these, SM industry is highly competitive industry. Thus, to utilize the resources effectively, to handle the huge demand, and to deliver the product on-time, efficient scheduling is important in SM industry. SM process can be broadly classified into Wafer Fabrication (called as wafer fab), Wafer Probing, Assembly, and Final Testing. Scheduling is more important in wafer fab due to complex operations involving with multiple types of machines and re-entrant, expensive machines, and time-consuming process involved. Thus, this study concerns about scheduling in wafer fab, particularly diffusion operation. The diffusion operation, carried out on batch processing machine, heavily impacts the production rate of wafer fab and in turn the SM industry. This is due to the fact that, diffusion operation requires relatively longest processing time among all the operations in the wafer fab. Due to these, diffusion operation is the bottleneck operations in the wafer fab. Based on the detailed literature review, this study addresses a new research problem on dynamic scheduling (DS) of diffusion furnace(s) by considering together the various real-life problem characteristics: Non-identical parallel diffusion furnaces, Machine eligibility restriction, Incompatible-job families, Job and/or resource related real time events, and Non-agreeable release time and due-date. In addition, due to the importance of on-time delivery this study deals with five due-date based scheduling objectives: Total weighted tardiness (TWT), Number of tardy jobs (NT), On time delivery (OTD) rate, Total earliness and lateness (TE/L) and Maximum lateness (Lmax) as a single objective as well as multi objectives. Here, the multi objectives are developed, considering all the five due-date based scheduling objectives in a linear form by randomly assigning equal and unequal weights to each of the due-date based single objectives considered in this study. With these, the main objective of this thesis is to study the impact of job and/or resource related real time events (JR-RTE) on the relative efficiency of the proposed dynamic scheduling algorithms for diffusion furnace(s) while optimizing each of the due-date based scheduling objectives considered in this study. The research problem considered in this study is decomposed into five phases. From the… Advisors/Committee Members: Mathirajan, M (advisor).

Subjects/Keywords: Semiconductor Manufacturing; Manufacturing Industry; Wafer Fabrication Stage; Diffusion Furnace; Dynamic Scheduling Algorithms; Dynamic Real Time Scheduling; Scheduling Diffusion Furnace; Real Time Events; Management

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Vimala Rani, M. (2018). Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing. (Doctoral Dissertation). Indian Institute of Science. Retrieved from http://etd.iisc.ac.in/handle/2005/3555

Chicago Manual of Style (16^th Edition):

Vimala Rani, M. “Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing.” 2018. Doctoral Dissertation, Indian Institute of Science. Accessed January 26, 2021. http://etd.iisc.ac.in/handle/2005/3555.

MLA Handbook (7^th Edition):

Vimala Rani, M. “Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing.” 2018. Web. 26 Jan 2021.

Vancouver:

Vimala Rani M. Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing. [Internet] [Doctoral dissertation]. Indian Institute of Science; 2018. [cited 2021 Jan 26]. Available from: http://etd.iisc.ac.in/handle/2005/3555.

Council of Science Editors:

Vimala Rani M. Impact of Real Time Events on the Relative Efficiency of the Proposed Dynamic Scheduling Algorithms for Diffusion Furnace(s) in the Semiconductor Manufacturing. [Doctoral Dissertation]. Indian Institute of Science; 2018. Available from: http://etd.iisc.ac.in/handle/2005/3555

Delft University of Technology

6. Broxterman, Stefan (author). Using Topology Optimization for Actuator Placement within Motion Systems.

Degree: 2017, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:dabadd38-19f4-413e-b597-e8777a9bbb88

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Topology optimization is a strong approach for generating optimal designs which cannot be obtained using conventional optimization methods. Improving structural characteristics by changing the internal… (more)

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Topology optimization is a strong approach for generating optimal designs which cannot be obtained using conventional optimization methods. Improving structural characteristics by changing the internal topology of a design domain has been fascinating scientists and engineers for years. Topology optimization can be described as a distribution of a given amount of material in a specified design domain, which is subjected to certain loading and boundary conditions. This domain can then be optimized to minimize specified objectives, for example compliance. For static problems, topology optimization is extensively used. The distribution of material, void and solid regions, can be used to solve several problems within the mechanical domain. However, this method of optimization is also used to optimize structures with respect to their resonant dynamics. Design of actuator placement is used to determine the most optimal actuator layout for a given objective, for example reducing responses. Combined with topology optimization, both design variables can influence each other, and be optimized towards the wanted behavior. This is done in a static domain. When material is removed, the force layout is updated, which influences the material distribution again. It is shown that the combination of these design variables in the optimization process, contributes to a better result; weight reduction can be achieved, while large deformations are preserved. Design of actuator placement, combined with topology optimization is also implemented in a dynamic domain. Since topology changes result in frequency response changes, the force placement is more sensitive. On the other hand, forces can be placed in a smart way, to ensure some mode shapes are not excited, whereas others are. By enabling positive and negative forces these forces can even be used to counteract or minimize certain modal responses. When implementing for example a harmonic excitation, the weight and total force can be linked together, to ensure accelerations are feasible. A weight reduction can thus lead to force reduction, which on its turn leads to less deformations. Especially in the high-precision industry, smart placement of actuators, including weight reduction can be very helpful. The combination of these phenomena could provide a new insight in creating accurate wafer stages.

Precision and Microsystems Engineering | Engineering Mechanics

Advisors/Committee Members: Langelaar, Matthijs (mentor), Delft University of Technology (degree granting institution).

Subjects/Keywords: topology; optimization; actuator; placement; motion; systems; design; supports; load; load placement; eigenmodes; eigenfrequency; stefan; broxterman; tudelft; msc; pme; precision; mechanisms; compliant; case; wafer; stage; harmonic; excitation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Broxterman, S. (. (2017). Using Topology Optimization for Actuator Placement within Motion Systems. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:dabadd38-19f4-413e-b597-e8777a9bbb88

Chicago Manual of Style (16^th Edition):

Broxterman, Stefan (author). “Using Topology Optimization for Actuator Placement within Motion Systems.” 2017. Masters Thesis, Delft University of Technology. Accessed January 26, 2021. http://resolver.tudelft.nl/uuid:dabadd38-19f4-413e-b597-e8777a9bbb88.

MLA Handbook (7^th Edition):

Broxterman, Stefan (author). “Using Topology Optimization for Actuator Placement within Motion Systems.” 2017. Web. 26 Jan 2021.

Vancouver:

Broxterman S(. Using Topology Optimization for Actuator Placement within Motion Systems. [Internet] [Masters thesis]. Delft University of Technology; 2017. [cited 2021 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:dabadd38-19f4-413e-b597-e8777a9bbb88.

Council of Science Editors:

Broxterman S(. Using Topology Optimization for Actuator Placement within Motion Systems. [Masters Thesis]. Delft University of Technology; 2017. Available from: http://resolver.tudelft.nl/uuid:dabadd38-19f4-413e-b597-e8777a9bbb88

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