Advanced search options

Advanced Search Options 🞨

Browse by author name (“Author name starts with…”).

Find ETDs with:

in
/  
in
/  
in
/  
in

Written in Published in Earliest date Latest date

Sorted by

Results per page:

Sorted by: relevance · author · university · dateNew search

You searched for subject:(Underfill). Showing records 1 – 10 of 10 total matches.

Search Limiters

Last 2 Years | English Only

No search limiters apply to these results.

▼ Search Limiters


Université de Grenoble

1. Taluy, Alisée. Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking.

Degree: Docteur es, Génie civil, 2013, Université de Grenoble

Depuis l'invention du transistor dans les années 50, les performances des composants microélectroniques n'ont cessé de progresser, en passant notamment par l'augmentation de leur densité.… (more)

Subjects/Keywords: Underfill; Empilement de composants; Wafer-level underfill; Écoulement de polymère; Contraintes thermomécaniques; Underfill; Die stacking; Wafer-level underfill; Polymer flow; Thermomechanical constrains,

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Taluy, A. (2013). Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2013GRENI047

Chicago Manual of Style (16th Edition):

Taluy, Alisée. “Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking.” 2013. Doctoral Dissertation, Université de Grenoble. Accessed August 19, 2019. http://www.theses.fr/2013GRENI047.

MLA Handbook (7th Edition):

Taluy, Alisée. “Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking.” 2013. Web. 19 Aug 2019.

Vancouver:

Taluy A. Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking. [Internet] [Doctoral dissertation]. Université de Grenoble; 2013. [cited 2019 Aug 19]. Available from: http://www.theses.fr/2013GRENI047.

Council of Science Editors:

Taluy A. Polymères underfills innovants pour l'empilement de puces éléctroniques. : Innovative underfills polymers for chips stacking. [Doctoral Dissertation]. Université de Grenoble; 2013. Available from: http://www.theses.fr/2013GRENI047


NSYSU

2. Wang, Tai-sheng. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU

 Solder bump is used to connect organic substrate with chip to form Flip Chip package. Comparing to wire bond package, the path is reduced so… (more)

Subjects/Keywords: Underfill; Lead Free Bump; 40nm Wafer Technology; Reliability Test

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, T. (2010). Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Tai-sheng. “Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.” 2010. Thesis, NSYSU. Accessed August 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Tai-sheng. “Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.” 2010. Web. 19 Aug 2019.

Vancouver:

Wang T. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. [Internet] [Thesis]. NSYSU; 2010. [cited 2019 Aug 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang T. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Grenoble

3. Dubois, Christelle. Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2011, Université de Grenoble

L'objectif de ce travail de thèse a été d'évaluer, à partir d'outils de caractérisation électrique (spectroscopie d'impédance basse fréquence et courants thermo-stimulés), l'impact des étapes… (more)

Subjects/Keywords: SiOCH poreux; Polissage mécano chimique (CMP),; Traitement thermique; Spectroscopie diélectrique; Résine époxy; Wafer level underfill; Porous SIOCH; Chemical mechanical polishing; Thermal treatment; Dielectric spectroscopy; Epoxy resin; Wafer level underfill

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Dubois, C. (2011). Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2011GRENI022

Chicago Manual of Style (16th Edition):

Dubois, Christelle. “Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies.” 2011. Doctoral Dissertation, Université de Grenoble. Accessed August 19, 2019. http://www.theses.fr/2011GRENI022.

MLA Handbook (7th Edition):

Dubois, Christelle. “Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies.” 2011. Web. 19 Aug 2019.

Vancouver:

Dubois C. Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies. [Internet] [Doctoral dissertation]. Université de Grenoble; 2011. [cited 2019 Aug 19]. Available from: http://www.theses.fr/2011GRENI022.

Council of Science Editors:

Dubois C. Evaluation des performances isolantes de couches de SIOCH poreuses et de polymères destinés aux technologies d'intégration innovantes : Dielectric characterization of porous SiOCH and polymer films used in state-of-the-art integration technologies. [Doctoral Dissertation]. Université de Grenoble; 2011. Available from: http://www.theses.fr/2011GRENI022


Université de Sherbrooke

4. Cloutier, Antoine. Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant .

Degree: 2018, Université de Sherbrooke

 La tendance actuelle vers l’encapsulation d’un assemblage comportant plusieurs puces favorise l’incorporation d’un procédé de réusinage compatible avec l’enlèvement et le remplacement d’une puce défectueuse.… (more)

Subjects/Keywords: Sans underfill; Sans capot; Sans plomb; Test électrique; MCM; Réusinage; Déformation; Fluage

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Cloutier, A. (2018). Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant . (Masters Thesis). Université de Sherbrooke. Retrieved from http://hdl.handle.net/11143/11812

Chicago Manual of Style (16th Edition):

Cloutier, Antoine. “Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant .” 2018. Masters Thesis, Université de Sherbrooke. Accessed August 19, 2019. http://hdl.handle.net/11143/11812.

MLA Handbook (7th Edition):

Cloutier, Antoine. “Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant .” 2018. Web. 19 Aug 2019.

Vancouver:

Cloutier A. Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant . [Internet] [Masters thesis]. Université de Sherbrooke; 2018. [cited 2019 Aug 19]. Available from: http://hdl.handle.net/11143/11812.

Council of Science Editors:

Cloutier A. Impact des charges de compression sur l'intégrité des puces renversées sur un substrat organique sans capot et sans encapsulant . [Masters Thesis]. Université de Sherbrooke; 2018. Available from: http://hdl.handle.net/11143/11812


Lehigh University

5. Davies, Daniel Wesley. Fracture Behavior of Epoxy-Based Hybrid Composites.

Degree: MS, Materials Science and Engineering, 2013, Lehigh University

 Crosslinked epoxy resins have become popular materials in advanced engineering applications such as the aerospace, packaging, coatings, electrical, and adhesive industries. These resins offer a… (more)

Subjects/Keywords: Composites; Epoxy Resin; Fracture Behavior; Hybrids; Microelectronics; Underfill; Engineering; Materials Science and Engineering

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Davies, D. W. (2013). Fracture Behavior of Epoxy-Based Hybrid Composites. (Thesis). Lehigh University. Retrieved from https://preserve.lehigh.edu/etd/1468

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Davies, Daniel Wesley. “Fracture Behavior of Epoxy-Based Hybrid Composites.” 2013. Thesis, Lehigh University. Accessed August 19, 2019. https://preserve.lehigh.edu/etd/1468.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Davies, Daniel Wesley. “Fracture Behavior of Epoxy-Based Hybrid Composites.” 2013. Web. 19 Aug 2019.

Vancouver:

Davies DW. Fracture Behavior of Epoxy-Based Hybrid Composites. [Internet] [Thesis]. Lehigh University; 2013. [cited 2019 Aug 19]. Available from: https://preserve.lehigh.edu/etd/1468.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Davies DW. Fracture Behavior of Epoxy-Based Hybrid Composites. [Thesis]. Lehigh University; 2013. Available from: https://preserve.lehigh.edu/etd/1468

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

6. Colella, Michael. Evaluation, Optimization,and Reliability of No-flow Underfill Process.

Degree: MS, Mechanical Engineering, 2004, Georgia Tech

 This research details the development of a novel process for four commercially available no-flow fluxing underfills for use with flip chip on FR4 substrates. The… (more)

Subjects/Keywords: Underfll; Design of experiments; Underfill voiding; Reflow; Process characterization

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Colella, M. (2004). Evaluation, Optimization,and Reliability of No-flow Underfill Process. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5132

Chicago Manual of Style (16th Edition):

Colella, Michael. “Evaluation, Optimization,and Reliability of No-flow Underfill Process.” 2004. Masters Thesis, Georgia Tech. Accessed August 19, 2019. http://hdl.handle.net/1853/5132.

MLA Handbook (7th Edition):

Colella, Michael. “Evaluation, Optimization,and Reliability of No-flow Underfill Process.” 2004. Web. 19 Aug 2019.

Vancouver:

Colella M. Evaluation, Optimization,and Reliability of No-flow Underfill Process. [Internet] [Masters thesis]. Georgia Tech; 2004. [cited 2019 Aug 19]. Available from: http://hdl.handle.net/1853/5132.

Council of Science Editors:

Colella M. Evaluation, Optimization,and Reliability of No-flow Underfill Process. [Masters Thesis]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/5132


University of New Orleans

7. Chilakamarthi, Geetha. Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life.

Degree: MS, Mechanical Engineering, 2004, University of New Orleans

  The influence of underfill material properties on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated… (more)

Subjects/Keywords: Mode I cyclic stress; underfill; BGA package

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chilakamarthi, G. (2004). Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life. (Thesis). University of New Orleans. Retrieved from https://scholarworks.uno.edu/td/85

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chilakamarthi, Geetha. “Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life.” 2004. Thesis, University of New Orleans. Accessed August 19, 2019. https://scholarworks.uno.edu/td/85.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chilakamarthi, Geetha. “Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life.” 2004. Web. 19 Aug 2019.

Vancouver:

Chilakamarthi G. Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life. [Internet] [Thesis]. University of New Orleans; 2004. [cited 2019 Aug 19]. Available from: https://scholarworks.uno.edu/td/85.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chilakamarthi G. Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life. [Thesis]. University of New Orleans; 2004. Available from: https://scholarworks.uno.edu/td/85

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

8. Mahalingam, Sakethraman. Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials.

Degree: PhD, Mechanical Engineering, 2005, Georgia Tech

 No-flow underfill materials that cure during the solder reflow process is a relatively new technology. Although there are several advantages in terms of cost, time… (more)

Subjects/Keywords: No-flow underfill; Nano-filled underfill; Flip chip; Delamination; Fatigue crack propagation; Interface fracture toughness; Thermo-mechanical; Reliability

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Mahalingam, S. (2005). Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/7215

Chicago Manual of Style (16th Edition):

Mahalingam, Sakethraman. “Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials.” 2005. Doctoral Dissertation, Georgia Tech. Accessed August 19, 2019. http://hdl.handle.net/1853/7215.

MLA Handbook (7th Edition):

Mahalingam, Sakethraman. “Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials.” 2005. Web. 19 Aug 2019.

Vancouver:

Mahalingam S. Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials. [Internet] [Doctoral dissertation]. Georgia Tech; 2005. [cited 2019 Aug 19]. Available from: http://hdl.handle.net/1853/7215.

Council of Science Editors:

Mahalingam S. Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials. [Doctoral Dissertation]. Georgia Tech; 2005. Available from: http://hdl.handle.net/1853/7215


University of Saskatchewan

9. Wan, Jianwu. Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging.

Degree: 2005, University of Saskatchewan

 Flip-chip underfilling is a technology by which silica-filled epoxy resin is used to fill the micro-cavity between a silicon chip and a substrate, by dispensing… (more)

Subjects/Keywords: Solder Bump Resistance; Flip-chip Package; Capillary Action; Underfill Flow; Critical Clearance

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wan, J. (2005). Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging. (Thesis). University of Saskatchewan. Retrieved from http://hdl.handle.net/10388/etd-01272005-213038

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wan, Jianwu. “Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging.” 2005. Thesis, University of Saskatchewan. Accessed August 19, 2019. http://hdl.handle.net/10388/etd-01272005-213038.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wan, Jianwu. “Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging.” 2005. Web. 19 Aug 2019.

Vancouver:

Wan J. Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging. [Internet] [Thesis]. University of Saskatchewan; 2005. [cited 2019 Aug 19]. Available from: http://hdl.handle.net/10388/etd-01272005-213038.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wan J. Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging. [Thesis]. University of Saskatchewan; 2005. Available from: http://hdl.handle.net/10388/etd-01272005-213038

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Bordeaux I

10. Barnat, Samed. Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package".

Degree: Docteur es, Electronique, 2011, Université de Bordeaux I

Ce projet de thèse se situe dans le cadre de l'étude de la fiabilité prédictive de nouveaux concepts d'assemblages microélectroniques de type « system in… (more)

Subjects/Keywords: Test bille sur anneau; Test trois points; Prototypage virtuel; Simulation thermomécanique; Microassemblages; Méthodologie de fiabilité prédictive; Résistance mécanique du silicium; Boitier électronique; Plans d’expérience; Ball-on-ring test; Three point bend test; Silicon strength; Die crack; Virtual prototyping; Thermo mechanical simulation; Design for reliability; Predictive reliability methodology; System in package; Underfill; Design of experiments

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Barnat, S. (2011). Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package". (Doctoral Dissertation). Université de Bordeaux I. Retrieved from http://www.theses.fr/2011BOR14243

Chicago Manual of Style (16th Edition):

Barnat, Samed. “Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package".” 2011. Doctoral Dissertation, Université de Bordeaux I. Accessed August 19, 2019. http://www.theses.fr/2011BOR14243.

MLA Handbook (7th Edition):

Barnat, Samed. “Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package".” 2011. Web. 19 Aug 2019.

Vancouver:

Barnat S. Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package". [Internet] [Doctoral dissertation]. Université de Bordeaux I; 2011. [cited 2019 Aug 19]. Available from: http://www.theses.fr/2011BOR14243.

Council of Science Editors:

Barnat S. Etude prédictive de fiabilité de nouveaux concepts d’assemblage pour des « system-in-package » hétérogènes : Predictive reliability study of new assembly concepts for heterogeneous "system-in-package". [Doctoral Dissertation]. Université de Bordeaux I; 2011. Available from: http://www.theses.fr/2011BOR14243

.