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You searched for subject:(Thermal resistance). Showing records 1 – 30 of 261 total matches.

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Texas Tech University

1. -0595-3877. Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study.

Degree: PhD, Physics, 2018, Texas Tech University

 Oxide layers are very common in semiconductor Si technology, but their impact on the flow of heat has only been calculated by three groups using… (more)

Subjects/Keywords: Silicon Dioxide; Kapitza Resistance; Heat Flow; Thermal Transport; Thermal Interface Resistance; Thermal Boundary Resistance; Thermal Interface Conductance; Thermal Boundary Conductance.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

-0595-3877. (2018). Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study. (Doctoral Dissertation). Texas Tech University. Retrieved from http://hdl.handle.net/2346/73843

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Chicago Manual of Style (16th Edition):

-0595-3877. “Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study.” 2018. Doctoral Dissertation, Texas Tech University. Accessed June 17, 2019. http://hdl.handle.net/2346/73843.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-0595-3877. “Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study.” 2018. Web. 17 Jun 2019.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-0595-3877. Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study. [Internet] [Doctoral dissertation]. Texas Tech University; 2018. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/2346/73843.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-0595-3877. Heat flow and Kapitza resistance across a Si|SiO2 interface: A first principles study. [Doctoral Dissertation]. Texas Tech University; 2018. Available from: http://hdl.handle.net/2346/73843

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete


Penn State University

2. Stavely, Rebecca Lee. Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures.

Degree: MS, Aerospace Engineering, 2013, Penn State University

Thermal switches are systems that are capable of switching between high and low effective conductivity. Contact-aided Cellular Compliant Mechanisms (C3M) are cellular structures that employ… (more)

Subjects/Keywords: passive thermal switch; thermal contact resistance; compliant mechanism; thermal conductivity

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APA (6th Edition):

Stavely, R. L. (2013). Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures. (Masters Thesis). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/19261

Chicago Manual of Style (16th Edition):

Stavely, Rebecca Lee. “Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures.” 2013. Masters Thesis, Penn State University. Accessed June 17, 2019. https://etda.libraries.psu.edu/catalog/19261.

MLA Handbook (7th Edition):

Stavely, Rebecca Lee. “Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures.” 2013. Web. 17 Jun 2019.

Vancouver:

Stavely RL. Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures. [Internet] [Masters thesis]. Penn State University; 2013. [cited 2019 Jun 17]. Available from: https://etda.libraries.psu.edu/catalog/19261.

Council of Science Editors:

Stavely RL. Design of Contact-aided Compliant Cellular Mechanisms for Use as Passive Variable Thermal Conductivity Structures. [Masters Thesis]. Penn State University; 2013. Available from: https://etda.libraries.psu.edu/catalog/19261


Utah State University

3. Spackman, Jesse. Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide.

Degree: MS, Mechanical and Aerospace Engineering, 2017, Utah State University

  Many materials are made up of small crystals, or grains. Grain boundaries are the interfaces between two grains and affect the flow of heat… (more)

Subjects/Keywords: Thermal Boundary Resistance; Kapitza Resistance; Interface Resistance; Aerospace Engineering; Mechanical Engineering

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APA (6th Edition):

Spackman, J. (2017). Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide. (Masters Thesis). Utah State University. Retrieved from https://digitalcommons.usu.edu/etd/6427

Chicago Manual of Style (16th Edition):

Spackman, Jesse. “Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide.” 2017. Masters Thesis, Utah State University. Accessed June 17, 2019. https://digitalcommons.usu.edu/etd/6427.

MLA Handbook (7th Edition):

Spackman, Jesse. “Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide.” 2017. Web. 17 Jun 2019.

Vancouver:

Spackman J. Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide. [Internet] [Masters thesis]. Utah State University; 2017. [cited 2019 Jun 17]. Available from: https://digitalcommons.usu.edu/etd/6427.

Council of Science Editors:

Spackman J. Characterization of the Thermal Resistance of Grain Boundaries of Cerium Oxide. [Masters Thesis]. Utah State University; 2017. Available from: https://digitalcommons.usu.edu/etd/6427


University of Arizona

4. Mustapha, Lateef Abimbola. Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches .

Degree: 2017, University of Arizona

 Effective application of thermal interface materials (TIM) sandwiched between silicon and a heat spreader in a microelectronic package for improved heat dissipation is studied through… (more)

Subjects/Keywords: Integrated Circuits; Microelectronic Packaging; Thermal Conductivity; Thermal Design power; Thermal Interface Material; Thermal Interface resistance

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APA (6th Edition):

Mustapha, L. A. (2017). Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches . (Doctoral Dissertation). University of Arizona. Retrieved from http://hdl.handle.net/10150/625379

Chicago Manual of Style (16th Edition):

Mustapha, Lateef Abimbola. “Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches .” 2017. Doctoral Dissertation, University of Arizona. Accessed June 17, 2019. http://hdl.handle.net/10150/625379.

MLA Handbook (7th Edition):

Mustapha, Lateef Abimbola. “Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches .” 2017. Web. 17 Jun 2019.

Vancouver:

Mustapha LA. Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches . [Internet] [Doctoral dissertation]. University of Arizona; 2017. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/10150/625379.

Council of Science Editors:

Mustapha LA. Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches . [Doctoral Dissertation]. University of Arizona; 2017. Available from: http://hdl.handle.net/10150/625379


RMIT University

5. Clarke, R. High-conductance measurement with the heat flow meter apparatus.

Degree: 2017, RMIT University

 Measurement laboratories must be mindful of equipment limitations and increasing uncertainty as the extremes of operational range are approached. For thermal insulation measurement, the prominent… (more)

Subjects/Keywords: Fields of Research; Thermal resistance; Thermal contact resistance; Thermal interface resistance; Thermal insulation measurement; Heat flow meter apparatus; Thermal test method; Thermal modelling

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APA (6th Edition):

Clarke, R. (2017). High-conductance measurement with the heat flow meter apparatus. (Thesis). RMIT University. Retrieved from http://researchbank.rmit.edu.au/view/rmit:162042

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Clarke, R. “High-conductance measurement with the heat flow meter apparatus.” 2017. Thesis, RMIT University. Accessed June 17, 2019. http://researchbank.rmit.edu.au/view/rmit:162042.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Clarke, R. “High-conductance measurement with the heat flow meter apparatus.” 2017. Web. 17 Jun 2019.

Vancouver:

Clarke R. High-conductance measurement with the heat flow meter apparatus. [Internet] [Thesis]. RMIT University; 2017. [cited 2019 Jun 17]. Available from: http://researchbank.rmit.edu.au/view/rmit:162042.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Clarke R. High-conductance measurement with the heat flow meter apparatus. [Thesis]. RMIT University; 2017. Available from: http://researchbank.rmit.edu.au/view/rmit:162042

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

6. Hu, Shih-Jie. Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory.

Degree: Master, Materials and Optoelectronic Science, 2015, NSYSU

 In this study, three kinds of resistive switching mechanism: FormingãResetãSet process in Resistance Random Access Memory(RRAM) will be discussion. And measure by Agilent B1530 fast… (more)

Subjects/Keywords: RRAM; Resistance Switching; Thermal Effect; Charge Quantity

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APA (6th Edition):

Hu, S. (2015). Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0710115-103817

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hu, Shih-Jie. “Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory.” 2015. Thesis, NSYSU. Accessed June 17, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0710115-103817.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hu, Shih-Jie. “Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory.” 2015. Web. 17 Jun 2019.

Vancouver:

Hu S. Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory. [Internet] [Thesis]. NSYSU; 2015. [cited 2019 Jun 17]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0710115-103817.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hu S. Study on the Influence of Charge Quantity and Thermal Effect in Resistance Random Access Memory. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0710115-103817

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

7. Martínez, Oscar. Controlling a mechanical piston and a thermal resistance with Arduino.

Degree: Electronics, 2017, University of Gävle

  The project consists of controlling a mechanical piston and thermal resistance using an Arduino’s microcontroller. The piston and the thermal resistance take part of… (more)

Subjects/Keywords: Arduino; Piston; Sensor; PT100; RTD; Resistance; Thermal

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APA (6th Edition):

Martínez, O. (2017). Controlling a mechanical piston and a thermal resistance with Arduino. (Thesis). University of Gävle. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-23342

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Martínez, Oscar. “Controlling a mechanical piston and a thermal resistance with Arduino.” 2017. Thesis, University of Gävle. Accessed June 17, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-23342.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Martínez, Oscar. “Controlling a mechanical piston and a thermal resistance with Arduino.” 2017. Web. 17 Jun 2019.

Vancouver:

Martínez O. Controlling a mechanical piston and a thermal resistance with Arduino. [Internet] [Thesis]. University of Gävle; 2017. [cited 2019 Jun 17]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-23342.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Martínez O. Controlling a mechanical piston and a thermal resistance with Arduino. [Thesis]. University of Gävle; 2017. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-23342

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

8. Anderssson, Björn. Lumped Parameter Thermal Modelling of Electric Machines.

Degree: 2013, Chalmers University of Technology

 Two thermal resistance network models have been developed for the steady state radial heat ow an experimental IPMSM. The models have been based on published… (more)

Subjects/Keywords: Thermal Modelling; PMSM; Electric Machines; Thermal Resistance Network; FEM

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APA (6th Edition):

Anderssson, B. (2013). Lumped Parameter Thermal Modelling of Electric Machines. (Thesis). Chalmers University of Technology. Retrieved from http://studentarbeten.chalmers.se/publication/185192-lumped-parameter-thermal-modelling-of-electric-machines

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Anderssson, Björn. “Lumped Parameter Thermal Modelling of Electric Machines.” 2013. Thesis, Chalmers University of Technology. Accessed June 17, 2019. http://studentarbeten.chalmers.se/publication/185192-lumped-parameter-thermal-modelling-of-electric-machines.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Anderssson, Björn. “Lumped Parameter Thermal Modelling of Electric Machines.” 2013. Web. 17 Jun 2019.

Vancouver:

Anderssson B. Lumped Parameter Thermal Modelling of Electric Machines. [Internet] [Thesis]. Chalmers University of Technology; 2013. [cited 2019 Jun 17]. Available from: http://studentarbeten.chalmers.se/publication/185192-lumped-parameter-thermal-modelling-of-electric-machines.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Anderssson B. Lumped Parameter Thermal Modelling of Electric Machines. [Thesis]. Chalmers University of Technology; 2013. Available from: http://studentarbeten.chalmers.se/publication/185192-lumped-parameter-thermal-modelling-of-electric-machines

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Pretoria

9. Adewumi, Olayinka Omowunmi. Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling.

Degree: PhD, Mechanical and Aeronautical Engineering, 2017, University of Pretoria

 Microchannels and micro pin fins have been employed for almost four decades in the cooling of microelectronic devices and research is still being done in… (more)

Subjects/Keywords: UCTD; Microchannels; Thermal conductance; Thermal resistance; Temperature variation

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APA (6th Edition):

Adewumi, O. (2017). Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling. (Doctoral Dissertation). University of Pretoria. Retrieved from http://hdl.handle.net/2263/61305

Chicago Manual of Style (16th Edition):

Adewumi, Olayinka. “Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling.” 2017. Doctoral Dissertation, University of Pretoria. Accessed June 17, 2019. http://hdl.handle.net/2263/61305.

MLA Handbook (7th Edition):

Adewumi, Olayinka. “Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling.” 2017. Web. 17 Jun 2019.

Vancouver:

Adewumi O. Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling. [Internet] [Doctoral dissertation]. University of Pretoria; 2017. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/2263/61305.

Council of Science Editors:

Adewumi O. Constructal design and optimisation of combined microchannels and micro pin fins for microelectronic cooling. [Doctoral Dissertation]. University of Pretoria; 2017. Available from: http://hdl.handle.net/2263/61305


Virginia Tech

10. Al-Khwaji, Abdusalam. Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds.

Degree: PhD, Mechanical Engineering, 2013, Virginia Tech

 A new mathematical model has been developed along with a new parameter estimation routine using surface temperature and heat flux measurements to estimate blood perfusion… (more)

Subjects/Keywords: burn severity; blood perfusion; thermal resistance; thermal measurement; parameter estimation; inflammation

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APA (6th Edition):

Al-Khwaji, A. (2013). Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/19368

Chicago Manual of Style (16th Edition):

Al-Khwaji, Abdusalam. “Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds.” 2013. Doctoral Dissertation, Virginia Tech. Accessed June 17, 2019. http://hdl.handle.net/10919/19368.

MLA Handbook (7th Edition):

Al-Khwaji, Abdusalam. “Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds.” 2013. Web. 17 Jun 2019.

Vancouver:

Al-Khwaji A. Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds. [Internet] [Doctoral dissertation]. Virginia Tech; 2013. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/10919/19368.

Council of Science Editors:

Al-Khwaji A. Computational and Experimental Modeling of the Bioheat Transfer Process of Perfusion in Tissue Applied to Burn Wounds. [Doctoral Dissertation]. Virginia Tech; 2013. Available from: http://hdl.handle.net/10919/19368


University of New South Wales

11. Moridi Farimani, Alireza. High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method.

Degree: Mechanical & Manufacturing Engineering, 2016, University of New South Wales

 Temperature rise in electronic devices due to self-heating is a major barrier to increasing the capacity of devices because higher temperatures greatly deteriorate performance reliability.… (more)

Subjects/Keywords: interface thermal resistance; thin-film; thermal conductivity; 3-omega method

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APA (6th Edition):

Moridi Farimani, A. (2016). High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/55862 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:39557/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Moridi Farimani, Alireza. “High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method.” 2016. Doctoral Dissertation, University of New South Wales. Accessed June 17, 2019. http://handle.unsw.edu.au/1959.4/55862 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:39557/SOURCE02?view=true.

MLA Handbook (7th Edition):

Moridi Farimani, Alireza. “High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method.” 2016. Web. 17 Jun 2019.

Vancouver:

Moridi Farimani A. High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method. [Internet] [Doctoral dissertation]. University of New South Wales; 2016. [cited 2019 Jun 17]. Available from: http://handle.unsw.edu.au/1959.4/55862 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:39557/SOURCE02?view=true.

Council of Science Editors:

Moridi Farimani A. High-accuracy Thermal-conductivity Characterisation of Thin-film/Substrate Systems and Interfaces by Modified 3-Omega Method. [Doctoral Dissertation]. University of New South Wales; 2016. Available from: http://handle.unsw.edu.au/1959.4/55862 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:39557/SOURCE02?view=true


Texas A&M University

12. Singh, Navdeep. Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin.

Degree: 2011, Texas A&M University

 Miniaturization of electronic devices for enhancing their performance is associated with higher heat fluxes and cooling requirements. Surface modifi cation by texturing or coating is… (more)

Subjects/Keywords: Carbon Nanotube; Nanofin; Interfacial Thermal Resistance; Kapitza Resistance; Polymer Chains

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APA (6th Edition):

Singh, N. (2011). Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin. (Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/ETD-TAMU-2010-12-8707

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Singh, Navdeep. “Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin.” 2011. Thesis, Texas A&M University. Accessed June 17, 2019. http://hdl.handle.net/1969.1/ETD-TAMU-2010-12-8707.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Singh, Navdeep. “Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin.” 2011. Web. 17 Jun 2019.

Vancouver:

Singh N. Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin. [Internet] [Thesis]. Texas A&M University; 2011. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2010-12-8707.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Singh N. Computational Analysis of Thermo-Fluidic Characteristics of a Carbon Nano-Fin. [Thesis]. Texas A&M University; 2011. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2010-12-8707

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Clemson University

13. Dharmasena, Muthu. Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>.

Degree: PhD, Food Science and Human Nutrition, 2018, Clemson University

  The number of Clostridium difficile infection (CDI) cases associated with healthcare and community is increasing. Increased isolation of this pathogen from environmental samples of… (more)

Subjects/Keywords: Antimcrobial resistance; Clostridium difficile; Isolation; Manure-based compost; Survival; Thermal resistance

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APA (6th Edition):

Dharmasena, M. (2018). Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>. (Doctoral Dissertation). Clemson University. Retrieved from https://tigerprints.clemson.edu/all_dissertations/2157

Chicago Manual of Style (16th Edition):

Dharmasena, Muthu. “Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>.” 2018. Doctoral Dissertation, Clemson University. Accessed June 17, 2019. https://tigerprints.clemson.edu/all_dissertations/2157.

MLA Handbook (7th Edition):

Dharmasena, Muthu. “Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>.” 2018. Web. 17 Jun 2019.

Vancouver:

Dharmasena M. Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>. [Internet] [Doctoral dissertation]. Clemson University; 2018. [cited 2019 Jun 17]. Available from: https://tigerprints.clemson.edu/all_dissertations/2157.

Council of Science Editors:

Dharmasena M. Evaluation of Animal Manure-based Compost as an Environmental Source of <i>Clostridium difficile</i>. [Doctoral Dissertation]. Clemson University; 2018. Available from: https://tigerprints.clemson.edu/all_dissertations/2157


Texas A&M University

14. Yegin, Cengiz. Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications.

Degree: PhD, Materials Science and Engineering, 2016, Texas A&M University

 The inefficient dissipation of heat is a crucial problem that limits the reliability and performance of all electronic systems. As electronic devices get smaller and… (more)

Subjects/Keywords: Thermal Interface Materials; Ultra Low Thermal Resistance; Enhanced Thermal Conductivity; Mechanically Compliant

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APA (6th Edition):

Yegin, C. (2016). Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications. (Doctoral Dissertation). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/159049

Chicago Manual of Style (16th Edition):

Yegin, Cengiz. “Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications.” 2016. Doctoral Dissertation, Texas A&M University. Accessed June 17, 2019. http://hdl.handle.net/1969.1/159049.

MLA Handbook (7th Edition):

Yegin, Cengiz. “Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications.” 2016. Web. 17 Jun 2019.

Vancouver:

Yegin C. Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications. [Internet] [Doctoral dissertation]. Texas A&M University; 2016. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1969.1/159049.

Council of Science Editors:

Yegin C. Synthesis, Production and Characterization of Next Generation Thermal Interface Materials for Electronic Applications. [Doctoral Dissertation]. Texas A&M University; 2016. Available from: http://hdl.handle.net/1969.1/159049


Georgia Tech

15. Vasquez, Cristal Jeanette. Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials.

Degree: MS, Mechanical Engineering, 2014, Georgia Tech

 Carbon nanotube (CNT) forests have outstanding thermal, electrical, and mechanical properties, which have generated significant interest as thermal interface materials (TIMs). Some drawbacks to using… (more)

Subjects/Keywords: Vertically aligned carbon nanotubes; Carbon nanotubes; Oxide coating; Conformal coating; Thermal interface material; Thermal conductivity; Thermal resistance; Electrical resistance; Chemical composition; Thermal stability

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APA (6th Edition):

Vasquez, C. J. (2014). Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52237

Chicago Manual of Style (16th Edition):

Vasquez, Cristal Jeanette. “Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials.” 2014. Masters Thesis, Georgia Tech. Accessed June 17, 2019. http://hdl.handle.net/1853/52237.

MLA Handbook (7th Edition):

Vasquez, Cristal Jeanette. “Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials.” 2014. Web. 17 Jun 2019.

Vancouver:

Vasquez CJ. Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials. [Internet] [Masters thesis]. Georgia Tech; 2014. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1853/52237.

Council of Science Editors:

Vasquez CJ. Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials. [Masters Thesis]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/52237

16. Jayasankar, M. Sol-Gel Alumina Nano Composites for Functional Applications.

Degree: 2009, Cochin University of Science and Technology

 The thesis entitled "Sol-Gel Alumina Nano Composites for Functional Applications" investigate sol-gel methods of synthesis of alumina nanocomposites special reference to alumina-aluminium titanate and alumina-lanthanum… (more)

Subjects/Keywords: Ceramics; Alumina-aluminium titanate; Alumina-lanthanum phosphate composite; Thermal shock resistance; Thermal expansion coefficient

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APA (6th Edition):

Jayasankar, M. (2009). Sol-Gel Alumina Nano Composites for Functional Applications. (Thesis). Cochin University of Science and Technology. Retrieved from http://dyuthi.cusat.ac.in/purl/2661

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jayasankar, M. “Sol-Gel Alumina Nano Composites for Functional Applications.” 2009. Thesis, Cochin University of Science and Technology. Accessed June 17, 2019. http://dyuthi.cusat.ac.in/purl/2661.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jayasankar, M. “Sol-Gel Alumina Nano Composites for Functional Applications.” 2009. Web. 17 Jun 2019.

Vancouver:

Jayasankar M. Sol-Gel Alumina Nano Composites for Functional Applications. [Internet] [Thesis]. Cochin University of Science and Technology; 2009. [cited 2019 Jun 17]. Available from: http://dyuthi.cusat.ac.in/purl/2661.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jayasankar M. Sol-Gel Alumina Nano Composites for Functional Applications. [Thesis]. Cochin University of Science and Technology; 2009. Available from: http://dyuthi.cusat.ac.in/purl/2661

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Texas A&M University

17. Jung, Seunghwan. Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications.

Degree: 2012, Texas A&M University

 The objective of this study is to synthesize nanomaterials by mixing molten salt (alkali nitrate salt eutectics) with inorganic nanoparticles. The thermo-physical properties of the… (more)

Subjects/Keywords: nanomaterial; specific heat capacity; interfacial thermal resistance; viscosity; molten salt; thermal energy storage

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APA (6th Edition):

Jung, S. (2012). Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications. (Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-10739

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jung, Seunghwan. “Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications.” 2012. Thesis, Texas A&M University. Accessed June 17, 2019. http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-10739.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jung, Seunghwan. “Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications.” 2012. Web. 17 Jun 2019.

Vancouver:

Jung S. Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications. [Internet] [Thesis]. Texas A&M University; 2012. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-10739.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jung S. Numerical and Experimental Investigation of Inorganic Nanomaterials for Thermal Energy Storage (TES) and Concentrated Solar Power (CSP) Applications. [Thesis]. Texas A&M University; 2012. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2012-05-10739

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universidade do Rio Grande do Sul

18. Polozine, Alexandre. Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento.

Degree: 2009, Universidade do Rio Grande do Sul

A Resistência Térmica de Contato entre a ferramenta de forjamento e a peça é um parâmetro importante para a otimização, por simulação computacional, do comportamento… (more)

Subjects/Keywords: Forjamento; Forging; Condutividade térmica; Thermal contact conductance; Thermal contact resistance; Resistência térmica

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APA (6th Edition):

Polozine, A. (2009). Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento. (Thesis). Universidade do Rio Grande do Sul. Retrieved from http://hdl.handle.net/10183/15577

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Polozine, Alexandre. “Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento.” 2009. Thesis, Universidade do Rio Grande do Sul. Accessed June 17, 2019. http://hdl.handle.net/10183/15577.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Polozine, Alexandre. “Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento.” 2009. Web. 17 Jun 2019.

Vancouver:

Polozine A. Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento. [Internet] [Thesis]. Universidade do Rio Grande do Sul; 2009. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/10183/15577.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Polozine A. Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamento. [Thesis]. Universidade do Rio Grande do Sul; 2009. Available from: http://hdl.handle.net/10183/15577

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Texas – Austin

19. -7285-7148. Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures.

Degree: Mechanical Engineering, 2015, University of Texas – Austin

Thermal management in electronic devices has become a significant challenge because of the high power density in nanoelectronic devices. This challenge calls for a better… (more)

Subjects/Keywords: Contact thermal resistance; Thermal conductivity; Bismuth antimony telluride; Silicon nanowire; Boron arsenide

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APA (6th Edition):

-7285-7148. (2015). Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures. (Thesis). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/46986

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

-7285-7148. “Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures.” 2015. Thesis, University of Texas – Austin. Accessed June 17, 2019. http://hdl.handle.net/2152/46986.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

-7285-7148. “Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures.” 2015. Web. 17 Jun 2019.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-7285-7148. Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures. [Internet] [Thesis]. University of Texas – Austin; 2015. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/2152/46986.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

-7285-7148. Four-probe thermal and thermoelectric transport measurements of bismuth antimony telluride, silicon, and boron arsenide nanostructures. [Thesis]. University of Texas – Austin; 2015. Available from: http://hdl.handle.net/2152/46986

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete
Not specified: Masters Thesis or Doctoral Dissertation


University of Alberta

20. Ding, Dan. Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model.

Degree: MS, Department of Mechanical Engineering, 2010, University of Alberta

 A mathematical model is developed to study the coupled heat and moisture transfer through a fabric system that consists of a single layer of fabric… (more)

Subjects/Keywords: thermal resistance; heat and mass transfer model; evaporative resistance; single-layer fabric system

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APA (6th Edition):

Ding, D. (2010). Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model. (Masters Thesis). University of Alberta. Retrieved from https://era.library.ualberta.ca/files/jm214q650

Chicago Manual of Style (16th Edition):

Ding, Dan. “Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model.” 2010. Masters Thesis, University of Alberta. Accessed June 17, 2019. https://era.library.ualberta.ca/files/jm214q650.

MLA Handbook (7th Edition):

Ding, Dan. “Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model.” 2010. Web. 17 Jun 2019.

Vancouver:

Ding D. Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model. [Internet] [Masters thesis]. University of Alberta; 2010. [cited 2019 Jun 17]. Available from: https://era.library.ualberta.ca/files/jm214q650.

Council of Science Editors:

Ding D. Characterizing the Performance of a Single-layer Fabric System through a Heat and Mass Transfer Model. [Masters Thesis]. University of Alberta; 2010. Available from: https://era.library.ualberta.ca/files/jm214q650


Universidade do Rio Grande do Sul

21. Malheiros, Patricia da Silva. Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares.

Degree: 2007, Universidade do Rio Grande do Sul

No período de 1999 a 2002, uma linhagem de Salmonella Enteritidis esteve envolvida em mais de 90% das salmoneloses ocorridas no RS. Este trabalho teve… (more)

Subjects/Keywords: Salmonella; Salmonella; Resistência ácida; Growth kinetics; Resistência térmica; Acid resistance; Thermal resistance; Surtos alimentares

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APA (6th Edition):

Malheiros, P. d. S. (2007). Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares. (Thesis). Universidade do Rio Grande do Sul. Retrieved from http://hdl.handle.net/10183/11142

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Malheiros, Patricia da Silva. “Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares.” 2007. Thesis, Universidade do Rio Grande do Sul. Accessed June 17, 2019. http://hdl.handle.net/10183/11142.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Malheiros, Patricia da Silva. “Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares.” 2007. Web. 17 Jun 2019.

Vancouver:

Malheiros PdS. Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares. [Internet] [Thesis]. Universidade do Rio Grande do Sul; 2007. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/10183/11142.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Malheiros PdS. Avaliação da cinética de crescimento, resistência ácida e resistência térmica de Salmonella enteritidis envolvida em surtos alimentares ocorridos no Rio Grande do Sul e comparação com outros sorovares. [Thesis]. Universidade do Rio Grande do Sul; 2007. Available from: http://hdl.handle.net/10183/11142

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Kentucky

22. Russell, Carissa Don. INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES.

Degree: 2010, University of Kentucky

 Shrinking volume, coupled with higher performance, microprocessors and integrated circuits have led to serious heat dissipation issues. In an effort to mitigate the excessive amounts… (more)

Subjects/Keywords: Carbon Nanotubes; Thermal Interface Materials; Carbon Nanotube Arrays; Thermal Contact Resistance; Composite Thermal Interface Materials; Mechanical Engineering

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APA (6th Edition):

Russell, C. D. (2010). INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/gradschool_theses/30

Chicago Manual of Style (16th Edition):

Russell, Carissa Don. “INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES.” 2010. Masters Thesis, University of Kentucky. Accessed June 17, 2019. http://uknowledge.uky.edu/gradschool_theses/30.

MLA Handbook (7th Edition):

Russell, Carissa Don. “INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES.” 2010. Web. 17 Jun 2019.

Vancouver:

Russell CD. INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES. [Internet] [Masters thesis]. University of Kentucky; 2010. [cited 2019 Jun 17]. Available from: http://uknowledge.uky.edu/gradschool_theses/30.

Council of Science Editors:

Russell CD. INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES. [Masters Thesis]. University of Kentucky; 2010. Available from: http://uknowledge.uky.edu/gradschool_theses/30


University of Kentucky

23. Etheredge, Darrell Keith. MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT.

Degree: 2012, University of Kentucky

 High performance/small package electronics create difficult thermal issues for integrated circuits. Challenges exist at material interfaces due to interfacial contact resistances. Multiwall carbon nanotube (MWCNT)… (more)

Subjects/Keywords: Carbon Nanotubes; Thermal Interface Materials; Carbon Nanotube Arrays; Thermal Contact Resistance; Composite Thermal Interface Materials; Engineering; Mechanical Engineering

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APA (6th Edition):

Etheredge, D. K. (2012). MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/me_etds/3

Chicago Manual of Style (16th Edition):

Etheredge, Darrell Keith. “MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT.” 2012. Masters Thesis, University of Kentucky. Accessed June 17, 2019. http://uknowledge.uky.edu/me_etds/3.

MLA Handbook (7th Edition):

Etheredge, Darrell Keith. “MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT.” 2012. Web. 17 Jun 2019.

Vancouver:

Etheredge DK. MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT. [Internet] [Masters thesis]. University of Kentucky; 2012. [cited 2019 Jun 17]. Available from: http://uknowledge.uky.edu/me_etds/3.

Council of Science Editors:

Etheredge DK. MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENT. [Masters Thesis]. University of Kentucky; 2012. Available from: http://uknowledge.uky.edu/me_etds/3


University of Waterloo

24. Athia, Depayne. Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling.

Degree: 2017, University of Waterloo

 Thermo-compression bonding (TCB) relies on uniform thermal distribution during microelectronic packaging processes to ensure reliable interconnects are formed. During any TCB processes, the thermal application… (more)

Subjects/Keywords: thermo-compression bonding; finite element analysis; flip chip; CMOS; RTD; microsensor; thermal contact resistance; thermal; thermal gradient; numerical analysis; Gold bumps

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APA (6th Edition):

Athia, D. (2017). Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/12523

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Athia, Depayne. “Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling.” 2017. Thesis, University of Waterloo. Accessed June 17, 2019. http://hdl.handle.net/10012/12523.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Athia, Depayne. “Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling.” 2017. Web. 17 Jun 2019.

Vancouver:

Athia D. Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling. [Internet] [Thesis]. University of Waterloo; 2017. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/10012/12523.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Athia D. Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling. [Thesis]. University of Waterloo; 2017. Available from: http://hdl.handle.net/10012/12523

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

25. Nakos, Helena. Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool.

Degree: 2011, Chalmers University of Technology

 Ground source heat pump, GSHP, systems are an interesting alternative in the energy sector compared to other heating and cooling systems due to the fact… (more)

Subjects/Keywords: Borehole heat exchanger; Borehole thermal resistance; Ground source heat

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APA (6th Edition):

Nakos, H. (2011). Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool. (Thesis). Chalmers University of Technology. Retrieved from http://studentarbeten.chalmers.se/publication/147851-response-testing-and-evaluation-of-groundwater-filled-boreholes-development-and-validation-of-a-new

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nakos, Helena. “Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool.” 2011. Thesis, Chalmers University of Technology. Accessed June 17, 2019. http://studentarbeten.chalmers.se/publication/147851-response-testing-and-evaluation-of-groundwater-filled-boreholes-development-and-validation-of-a-new.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nakos, Helena. “Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool.” 2011. Web. 17 Jun 2019.

Vancouver:

Nakos H. Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool. [Internet] [Thesis]. Chalmers University of Technology; 2011. [cited 2019 Jun 17]. Available from: http://studentarbeten.chalmers.se/publication/147851-response-testing-and-evaluation-of-groundwater-filled-boreholes-development-and-validation-of-a-new.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nakos H. Response testing and evaluation of groundwater-filled boreholes. Development and validation of a new caculation tool. [Thesis]. Chalmers University of Technology; 2011. Available from: http://studentarbeten.chalmers.se/publication/147851-response-testing-and-evaluation-of-groundwater-filled-boreholes-development-and-validation-of-a-new

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Texas A&M University

26. Hu, Yuzhu. Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance.

Degree: 2014, Texas A&M University

 Concentrated Solar Power (CSP) systems are used widely as a stable and reliable renewable source of energy. However, intermittency of this power source and the… (more)

Subjects/Keywords: Interfacial Thermal Resistance; Carbon Nanotube; MD simulation; Chirality

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hu, Y. (2014). Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance. (Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/153304

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hu, Yuzhu. “Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance.” 2014. Thesis, Texas A&M University. Accessed June 17, 2019. http://hdl.handle.net/1969.1/153304.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hu, Yuzhu. “Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance.” 2014. Web. 17 Jun 2019.

Vancouver:

Hu Y. Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance. [Internet] [Thesis]. Texas A&M University; 2014. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1969.1/153304.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hu Y. Numerical Investigation of the Effect of Chirality of Carbon Nanotube on the Interfacial Thermal Resistance. [Thesis]. Texas A&M University; 2014. Available from: http://hdl.handle.net/1969.1/153304

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Queens University

27. Martin, Eric John. Laboratory study evaluating electrical resistance heating of pooled trichloroethylene .

Degree: Civil Engineering, 2009, Queens University

 A laboratory scale study was conducted to evaluate the thermal remediation of trichloroethylene (TCE) in a saturated groundwater system using electrical resistance heating (ERH). Two… (more)

Subjects/Keywords: TCE; Remediation; ERH; DNAPL; Electrical Resistance Heating; Thermal; Pooled

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APA (6th Edition):

Martin, E. J. (2009). Laboratory study evaluating electrical resistance heating of pooled trichloroethylene . (Thesis). Queens University. Retrieved from http://hdl.handle.net/1974/1723

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Martin, Eric John. “Laboratory study evaluating electrical resistance heating of pooled trichloroethylene .” 2009. Thesis, Queens University. Accessed June 17, 2019. http://hdl.handle.net/1974/1723.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Martin, Eric John. “Laboratory study evaluating electrical resistance heating of pooled trichloroethylene .” 2009. Web. 17 Jun 2019.

Vancouver:

Martin EJ. Laboratory study evaluating electrical resistance heating of pooled trichloroethylene . [Internet] [Thesis]. Queens University; 2009. [cited 2019 Jun 17]. Available from: http://hdl.handle.net/1974/1723.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Martin EJ. Laboratory study evaluating electrical resistance heating of pooled trichloroethylene . [Thesis]. Queens University; 2009. Available from: http://hdl.handle.net/1974/1723

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Dayton

28. Memon, Muhammad Omar. Carbon Nanostructures As Thermal Interface Materials: Processing And Properties.

Degree: MS(M.S.), Aerospace Engineering, 2011, University of Dayton

 The power density of electronic packages has substantially increased. The thermal interface resistance involves more than 50% of the total thermal resistance in current high-power… (more)

Subjects/Keywords: Aerospace Materials; Carbon Nanofibers; Thermal Resistance; Power Spike

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APA (6th Edition):

Memon, M. O. (2011). Carbon Nanostructures As Thermal Interface Materials: Processing And Properties. (Masters Thesis). University of Dayton. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=dayton1304020760

Chicago Manual of Style (16th Edition):

Memon, Muhammad Omar. “Carbon Nanostructures As Thermal Interface Materials: Processing And Properties.” 2011. Masters Thesis, University of Dayton. Accessed June 17, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1304020760.

MLA Handbook (7th Edition):

Memon, Muhammad Omar. “Carbon Nanostructures As Thermal Interface Materials: Processing And Properties.” 2011. Web. 17 Jun 2019.

Vancouver:

Memon MO. Carbon Nanostructures As Thermal Interface Materials: Processing And Properties. [Internet] [Masters thesis]. University of Dayton; 2011. [cited 2019 Jun 17]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=dayton1304020760.

Council of Science Editors:

Memon MO. Carbon Nanostructures As Thermal Interface Materials: Processing And Properties. [Masters Thesis]. University of Dayton; 2011. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=dayton1304020760


NSYSU

29. Tsai, Cheng-Yu. Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

 The purpose of this study is to investigate the heat transfer ability of high-performance flip-chip ball grid array (HFCBGA) package. In this work, the value… (more)

Subjects/Keywords: multi-point measurement; thermal resistance; HFCBGA; Taguchi; HTST

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tsai, C. (2017). Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0617117-153343

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tsai, Cheng-Yu. “Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency.” 2017. Thesis, NSYSU. Accessed June 17, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0617117-153343.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tsai, Cheng-Yu. “Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency.” 2017. Web. 17 Jun 2019.

Vancouver:

Tsai C. Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency. [Internet] [Thesis]. NSYSU; 2017. [cited 2019 Jun 17]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0617117-153343.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tsai C. Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0617117-153343

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Arizona State University

30. Tummala, Abhishiktha. Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates.

Degree: Mechanical Engineering, 2016, Arizona State University

 Solar photovoltaic (PV) industry is tipped to be one of the front-runners in the renewable industry. Typically, PV module manufacturers provide a linear or step… (more)

Subjects/Keywords: Mechanical engineering; corrosion; fill factor; series resistance; Solder bond; thermal fatigue

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tummala, A. (2016). Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates. (Masters Thesis). Arizona State University. Retrieved from http://repository.asu.edu/items/40306

Chicago Manual of Style (16th Edition):

Tummala, Abhishiktha. “Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates.” 2016. Masters Thesis, Arizona State University. Accessed June 17, 2019. http://repository.asu.edu/items/40306.

MLA Handbook (7th Edition):

Tummala, Abhishiktha. “Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates.” 2016. Web. 17 Jun 2019.

Vancouver:

Tummala A. Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates. [Internet] [Masters thesis]. Arizona State University; 2016. [cited 2019 Jun 17]. Available from: http://repository.asu.edu/items/40306.

Council of Science Editors:

Tummala A. Effect of Series Resistance Increase on Fill Factor of PV Cells Extracted from Field Aged Modules of Different Climates. [Masters Thesis]. Arizona State University; 2016. Available from: http://repository.asu.edu/items/40306

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