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You searched for subject:(Substrate noise coupling). Showing records 1 – 8 of 8 total matches.

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University of Rochester

1. Salman, Emre (1981 - ). Switching noise and timing characteristics in nanoscale integrated circuits.

Degree: PhD, 2011, University of Rochester

 Continuous progress in the design and manufacturing of integrated circuits (ICs) has enabled the integration of more than two billion transistors on the same die… (more)

Subjects/Keywords: Integrated circuits; System-on-chips; Timing analysis; Noise estimation; Noise coupling; Substrate coupling

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APA (6th Edition):

Salman, E. (. -. ). (2011). Switching noise and timing characteristics in nanoscale integrated circuits. (Doctoral Dissertation). University of Rochester. Retrieved from http://hdl.handle.net/1802/14423

Chicago Manual of Style (16th Edition):

Salman, Emre (1981 - ). “Switching noise and timing characteristics in nanoscale integrated circuits.” 2011. Doctoral Dissertation, University of Rochester. Accessed December 07, 2019. http://hdl.handle.net/1802/14423.

MLA Handbook (7th Edition):

Salman, Emre (1981 - ). “Switching noise and timing characteristics in nanoscale integrated circuits.” 2011. Web. 07 Dec 2019.

Vancouver:

Salman E(-). Switching noise and timing characteristics in nanoscale integrated circuits. [Internet] [Doctoral dissertation]. University of Rochester; 2011. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/1802/14423.

Council of Science Editors:

Salman E(-). Switching noise and timing characteristics in nanoscale integrated circuits. [Doctoral Dissertation]. University of Rochester; 2011. Available from: http://hdl.handle.net/1802/14423


Oregon State University

2. Webb, Kyle M. A test fixture and deembedding procedure for high-frequency substrate characterization.

Degree: MS, Electrical and Computer Engineering, 2005, Oregon State University

 At frequencies exceeding 1-2 GHz, the substrate network models used in substrate coupling simulation must account for the reactive nature of the substrate. Unlike at… (more)

Subjects/Keywords: Substrate coupling; Mixed signal circuits  – Noise

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APA (6th Edition):

Webb, K. M. (2005). A test fixture and deembedding procedure for high-frequency substrate characterization. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/425

Chicago Manual of Style (16th Edition):

Webb, Kyle M. “A test fixture and deembedding procedure for high-frequency substrate characterization.” 2005. Masters Thesis, Oregon State University. Accessed December 07, 2019. http://hdl.handle.net/1957/425.

MLA Handbook (7th Edition):

Webb, Kyle M. “A test fixture and deembedding procedure for high-frequency substrate characterization.” 2005. Web. 07 Dec 2019.

Vancouver:

Webb KM. A test fixture and deembedding procedure for high-frequency substrate characterization. [Internet] [Masters thesis]. Oregon State University; 2005. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/1957/425.

Council of Science Editors:

Webb KM. A test fixture and deembedding procedure for high-frequency substrate characterization. [Masters Thesis]. Oregon State University; 2005. Available from: http://hdl.handle.net/1957/425


Oregon State University

3. Arunachalam, Sasi Kumar S. An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates.

Degree: MS, Electrical and Computer Engineering, 2005, Oregon State University

 This thesis presents a Z-parameter based model to predict the substrate noise coupling between two contacts in a heavily doped substrate for frequencies less than… (more)

Subjects/Keywords: Substrate noise coupling; Electronic noise  – Mathematical models

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APA (6th Edition):

Arunachalam, S. K. S. (2005). An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/541

Chicago Manual of Style (16th Edition):

Arunachalam, Sasi Kumar S. “An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates.” 2005. Masters Thesis, Oregon State University. Accessed December 07, 2019. http://hdl.handle.net/1957/541.

MLA Handbook (7th Edition):

Arunachalam, Sasi Kumar S. “An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates.” 2005. Web. 07 Dec 2019.

Vancouver:

Arunachalam SKS. An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates. [Internet] [Masters thesis]. Oregon State University; 2005. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/1957/541.

Council of Science Editors:

Arunachalam SKS. An efficient and accurate method of estimating substrate noise coupling in heavily doped substrates. [Masters Thesis]. Oregon State University; 2005. Available from: http://hdl.handle.net/1957/541


The Ohio State University

4. Helmy, Ahmed. Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs.

Degree: PhD, Electrical Engineering, 2006, The Ohio State University

Substrate noise coupling in integrated circuits is the process by which interference signals generated by high speed digital blocks cause parasitic currents to flow in… (more)

Subjects/Keywords: Substrate noise coupling; RFIC; Isolation Techniques; Isolation Design Guides

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APA (6th Edition):

Helmy, A. (2006). Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs. (Doctoral Dissertation). The Ohio State University. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=osu1160150387

Chicago Manual of Style (16th Edition):

Helmy, Ahmed. “Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs.” 2006. Doctoral Dissertation, The Ohio State University. Accessed December 07, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=osu1160150387.

MLA Handbook (7th Edition):

Helmy, Ahmed. “Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs.” 2006. Web. 07 Dec 2019.

Vancouver:

Helmy A. Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs. [Internet] [Doctoral dissertation]. The Ohio State University; 2006. [cited 2019 Dec 07]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=osu1160150387.

Council of Science Editors:

Helmy A. Characterization of substrate noise coupling, its impacts and remedies in RF and mixed-signal ICs. [Doctoral Dissertation]. The Ohio State University; 2006. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=osu1160150387


North Carolina State University

5. Vijayaraghavan, Ravi C. Substrate Noise Analysis in RF Integrated Circuits.

Degree: MS, Electrical Engineering, 2004, North Carolina State University

Substrate coupling in integrated circuits is the process whereby, parasitic current flow in the substrate, electrically couples devices in different parts of the circuit. Higher… (more)

Subjects/Keywords: Isolation Analysis; SUbstrate Noise; Analytical Model of Coupling

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APA (6th Edition):

Vijayaraghavan, R. C. (2004). Substrate Noise Analysis in RF Integrated Circuits. (Thesis). North Carolina State University. Retrieved from http://www.lib.ncsu.edu/resolver/1840.16/1278

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Vijayaraghavan, Ravi C. “Substrate Noise Analysis in RF Integrated Circuits.” 2004. Thesis, North Carolina State University. Accessed December 07, 2019. http://www.lib.ncsu.edu/resolver/1840.16/1278.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Vijayaraghavan, Ravi C. “Substrate Noise Analysis in RF Integrated Circuits.” 2004. Web. 07 Dec 2019.

Vancouver:

Vijayaraghavan RC. Substrate Noise Analysis in RF Integrated Circuits. [Internet] [Thesis]. North Carolina State University; 2004. [cited 2019 Dec 07]. Available from: http://www.lib.ncsu.edu/resolver/1840.16/1278.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Vijayaraghavan RC. Substrate Noise Analysis in RF Integrated Circuits. [Thesis]. North Carolina State University; 2004. Available from: http://www.lib.ncsu.edu/resolver/1840.16/1278

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universitat Politècnica de Catalunya

6. Aragonès Cervera, Xavier. Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes.

Degree: Departament d'Enginyeria Electrònica, 1997, Universitat Politècnica de Catalunya

Noise coupling through common silicon substrate in mixed-signal circuits is an important problem that often limits the performance of the analog circuitry. The characteristics of… (more)

Subjects/Keywords: integrated circuits; mixed-signal circuits; substrate coupling; substrate noise; 621.3

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APA (6th Edition):

Aragonès Cervera, X. (1997). Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes. (Thesis). Universitat Politècnica de Catalunya. Retrieved from http://hdl.handle.net/10803/6348

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Aragonès Cervera, Xavier. “Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes.” 1997. Thesis, Universitat Politècnica de Catalunya. Accessed December 07, 2019. http://hdl.handle.net/10803/6348.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Aragonès Cervera, Xavier. “Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes.” 1997. Web. 07 Dec 2019.

Vancouver:

Aragonès Cervera X. Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes. [Internet] [Thesis]. Universitat Politècnica de Catalunya; 1997. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/10803/6348.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Aragonès Cervera X. Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes. [Thesis]. Universitat Politècnica de Catalunya; 1997. Available from: http://hdl.handle.net/10803/6348

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

7. Oakley, Michael Alan. Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers.

Degree: PhD, Electrical and Computer Engineering, 2016, Georgia Tech

 This work focuses on the electrothermal impact of large voltage swings on silicon-germanium heterojunction bipolar transistors used in radio frequency amplifiers. Measurement data and simulation… (more)

Subjects/Keywords: Silicon-germanium; Heterojunction bipolar transistor; Radio frequency; Reliability; Power amplifier; Low-noise amplifier; Large-signal; Technology computer-aided design; Thermal simulation; Electrothermal interaction; Breakdown; Design guidelines; High-resistivity substrate; Measurement techniques; Mutual thermal coupling; Mutual heating

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APA (6th Edition):

Oakley, M. A. (2016). Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58609

Chicago Manual of Style (16th Edition):

Oakley, Michael Alan. “Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers.” 2016. Doctoral Dissertation, Georgia Tech. Accessed December 07, 2019. http://hdl.handle.net/1853/58609.

MLA Handbook (7th Edition):

Oakley, Michael Alan. “Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers.” 2016. Web. 07 Dec 2019.

Vancouver:

Oakley MA. Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers. [Internet] [Doctoral dissertation]. Georgia Tech; 2016. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/1853/58609.

Council of Science Editors:

Oakley MA. Large-signal reliability of silicon-germanium heterojunction bipolar transistor amplifiers. [Doctoral Dissertation]. Georgia Tech; 2016. Available from: http://hdl.handle.net/1853/58609

8. Kripanidhi, Arjun. Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling.

Degree: MS, 1200, 2011, University of Illinois – Urbana-Champaign

Substrate current injection is the origin of external latchup and substrate noise coupling. The trigger current for external latchup depends on the duration of the… (more)

Subjects/Keywords: Latchup; Complementary metal–oxide–semiconductor (CMOS); Positive-Negative-Positive-Negative (PNPN); transient external latchup; substrate noise coupling

…well junction gets forward biased, injecting minority carriers into the substrate which… …I-tests, minority (majority) carriers are injected into the substrate… …collecting a portion of the electrons (holes) injected into the substrate before they… …significantly smaller when compared to ovictim 180. In this technology (1-2 Ω-cm substrate… …minority carriers into the substrate. The dependence of Itrig on TPW is plotted in Figure 2.14… 

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APA (6th Edition):

Kripanidhi, A. (2011). Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling. (Thesis). University of Illinois – Urbana-Champaign. Retrieved from http://hdl.handle.net/2142/26209

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kripanidhi, Arjun. “Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling.” 2011. Thesis, University of Illinois – Urbana-Champaign. Accessed December 07, 2019. http://hdl.handle.net/2142/26209.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kripanidhi, Arjun. “Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling.” 2011. Web. 07 Dec 2019.

Vancouver:

Kripanidhi A. Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling. [Internet] [Thesis]. University of Illinois – Urbana-Champaign; 2011. [cited 2019 Dec 07]. Available from: http://hdl.handle.net/2142/26209.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kripanidhi A. Investigation of the hazards of substrate current injection: transient external latchup and substrate noise coupling. [Thesis]. University of Illinois – Urbana-Champaign; 2011. Available from: http://hdl.handle.net/2142/26209

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.