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You searched for subject:(Silicon etching). Showing records 1 – 30 of 142 total matches.

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Louisiana State University

1. Narayanan, Purnima. Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100).

Degree: MSChE, Chemical Engineering, 2011, Louisiana State University

 Three-dimensional integration techniques have become increasingly popular to meet the ever rising demand of high capacity and reduced package size in microelectronics devices. Through Silicon(more)

Subjects/Keywords: PHOTOELECTROCHEMICAL ETCHING; MICROSTRUCTURES; SILICON

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APA (6th Edition):

Narayanan, P. (2011). Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100). (Masters Thesis). Louisiana State University. Retrieved from etd-06112011-104922 ; https://digitalcommons.lsu.edu/gradschool_theses/4273

Chicago Manual of Style (16th Edition):

Narayanan, Purnima. “Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100).” 2011. Masters Thesis, Louisiana State University. Accessed November 14, 2019. etd-06112011-104922 ; https://digitalcommons.lsu.edu/gradschool_theses/4273.

MLA Handbook (7th Edition):

Narayanan, Purnima. “Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100).” 2011. Web. 14 Nov 2019.

Vancouver:

Narayanan P. Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100). [Internet] [Masters thesis]. Louisiana State University; 2011. [cited 2019 Nov 14]. Available from: etd-06112011-104922 ; https://digitalcommons.lsu.edu/gradschool_theses/4273.

Council of Science Editors:

Narayanan P. Photoelectrochemical etching of isolated, high aspect ratio micorstructures in n-type silicon (100). [Masters Thesis]. Louisiana State University; 2011. Available from: etd-06112011-104922 ; https://digitalcommons.lsu.edu/gradschool_theses/4273


University of Minnesota

2. Liptak, Richard William. In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices.

Degree: PhD, Electrical Engineering, 2009, University of Minnesota

Silicon nanocrystals (SiNCs) have become a heavily researched material over the past several years. Researchers envision that this material can be used in many diverse… (more)

Subjects/Keywords: Devices; Etching; Nanocrystals; Passivation; Silicon

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APA (6th Edition):

Liptak, R. W. (2009). In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices. (Doctoral Dissertation). University of Minnesota. Retrieved from http://purl.umn.edu/57226

Chicago Manual of Style (16th Edition):

Liptak, Richard William. “In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices.” 2009. Doctoral Dissertation, University of Minnesota. Accessed November 14, 2019. http://purl.umn.edu/57226.

MLA Handbook (7th Edition):

Liptak, Richard William. “In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices.” 2009. Web. 14 Nov 2019.

Vancouver:

Liptak RW. In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices. [Internet] [Doctoral dissertation]. University of Minnesota; 2009. [cited 2019 Nov 14]. Available from: http://purl.umn.edu/57226.

Council of Science Editors:

Liptak RW. In-flight gas phase passivation of silicon nanocrystals for novel inorganic-silicon nanocrystal based electroluminescent devices. [Doctoral Dissertation]. University of Minnesota; 2009. Available from: http://purl.umn.edu/57226


University of Illinois – Urbana-Champaign

3. Peck, Jason A. Laser-enhanced plasma etching of semiconductor materials.

Degree: PhD, Nuclear, Plasma, Radiolgc Engr, 2017, University of Illinois – Urbana-Champaign

 In this work, laser exposure was coupled with plasma etch processes for local etch rate enhancement, and under some conditions, etch activation. Materials were tested… (more)

Subjects/Keywords: Plasma; Etching; Silicon; Laser; Processing

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APA (6th Edition):

Peck, J. A. (2017). Laser-enhanced plasma etching of semiconductor materials. (Doctoral Dissertation). University of Illinois – Urbana-Champaign. Retrieved from http://hdl.handle.net/2142/104723

Chicago Manual of Style (16th Edition):

Peck, Jason A. “Laser-enhanced plasma etching of semiconductor materials.” 2017. Doctoral Dissertation, University of Illinois – Urbana-Champaign. Accessed November 14, 2019. http://hdl.handle.net/2142/104723.

MLA Handbook (7th Edition):

Peck, Jason A. “Laser-enhanced plasma etching of semiconductor materials.” 2017. Web. 14 Nov 2019.

Vancouver:

Peck JA. Laser-enhanced plasma etching of semiconductor materials. [Internet] [Doctoral dissertation]. University of Illinois – Urbana-Champaign; 2017. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/2142/104723.

Council of Science Editors:

Peck JA. Laser-enhanced plasma etching of semiconductor materials. [Doctoral Dissertation]. University of Illinois – Urbana-Champaign; 2017. Available from: http://hdl.handle.net/2142/104723


Georgia Tech

4. Li, Liyi. Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications.

Degree: PhD, Materials Science and Engineering, 2016, Georgia Tech

 This dissertation is focused on a novel wet etching method, named metal-assisted chemical etching (MaCE), for fabrication of uniform high-aspect-ratio (HAR) structures on silicon (Si)… (more)

Subjects/Keywords: Silicon etching; High aspect ratio; Nanomanufacturing

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APA (6th Edition):

Li, L. (2016). Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58582

Chicago Manual of Style (16th Edition):

Li, Liyi. “Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications.” 2016. Doctoral Dissertation, Georgia Tech. Accessed November 14, 2019. http://hdl.handle.net/1853/58582.

MLA Handbook (7th Edition):

Li, Liyi. “Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications.” 2016. Web. 14 Nov 2019.

Vancouver:

Li L. Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2016. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/1853/58582.

Council of Science Editors:

Li L. Uniform high-aspect-ratio 3D micro-and nanomanufacturing on silicon by (electro)-metal-assisted chemical etching: fundamentals and applications. [Doctoral Dissertation]. Georgia Tech; 2016. Available from: http://hdl.handle.net/1853/58582


Oregon State University

5. Watts, Paul E. Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide.

Degree: MS, Materials Science, 2002, Oregon State University

 A study of potentiostatic and galvanostatic electrochemical etching of silicon in tetramethylammonium hydroxide (TMAH) has been carried out. In TMAH baths,, we find that biased… (more)

Subjects/Keywords: Silicon  – Surfaces  – Etching

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APA (6th Edition):

Watts, P. E. (2002). Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/30888

Chicago Manual of Style (16th Edition):

Watts, Paul E. “Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide.” 2002. Masters Thesis, Oregon State University. Accessed November 14, 2019. http://hdl.handle.net/1957/30888.

MLA Handbook (7th Edition):

Watts, Paul E. “Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide.” 2002. Web. 14 Nov 2019.

Vancouver:

Watts PE. Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide. [Internet] [Masters thesis]. Oregon State University; 2002. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/1957/30888.

Council of Science Editors:

Watts PE. Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide. [Masters Thesis]. Oregon State University; 2002. Available from: http://hdl.handle.net/1957/30888


King Abdullah University of Science and Technology

6. Mughal, Asad Jahangir. Synthesis and Characterization of Chemically Etched Nanostructured Silicon.

Degree: 2012, King Abdullah University of Science and Technology

Silicon is an essential element in today’s modern world. Nanostructured Si is a more recently studied variant, which has currently garnered much attention. When its… (more)

Subjects/Keywords: Silicon; nanostructures; porous; amorphous; photoluminescence; etching

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APA (6th Edition):

Mughal, A. J. (2012). Synthesis and Characterization of Chemically Etched Nanostructured Silicon. (Thesis). King Abdullah University of Science and Technology. Retrieved from http://hdl.handle.net/10754/222131

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Mughal, Asad Jahangir. “Synthesis and Characterization of Chemically Etched Nanostructured Silicon.” 2012. Thesis, King Abdullah University of Science and Technology. Accessed November 14, 2019. http://hdl.handle.net/10754/222131.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Mughal, Asad Jahangir. “Synthesis and Characterization of Chemically Etched Nanostructured Silicon.” 2012. Web. 14 Nov 2019.

Vancouver:

Mughal AJ. Synthesis and Characterization of Chemically Etched Nanostructured Silicon. [Internet] [Thesis]. King Abdullah University of Science and Technology; 2012. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/10754/222131.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Mughal AJ. Synthesis and Characterization of Chemically Etched Nanostructured Silicon. [Thesis]. King Abdullah University of Science and Technology; 2012. Available from: http://hdl.handle.net/10754/222131

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Houston

7. Kaler, Sanbir S. Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas.

Degree: Chemical and Biomolecular Engineering, Department of, 2014, University of Houston

 In advanced microelectronic device fabrications, novel gate electrode designs for field effect transistors (FinFETs) require highly anisotropic and selective silicon nitride (SiNx) etching over Si… (more)

Subjects/Keywords: Silicon-nitride etching; Hydro-fluorocarbon plasmas

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APA (6th Edition):

Kaler, S. S. (2014). Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas. (Thesis). University of Houston. Retrieved from http://hdl.handle.net/10657/1451

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kaler, Sanbir S. “Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas.” 2014. Thesis, University of Houston. Accessed November 14, 2019. http://hdl.handle.net/10657/1451.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kaler, Sanbir S. “Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas.” 2014. Web. 14 Nov 2019.

Vancouver:

Kaler SS. Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas. [Internet] [Thesis]. University of Houston; 2014. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/10657/1451.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kaler SS. Etching of Si and SiNx by Beams Emanating from Inductively Coupled CH3F/O2 and CH3F/CO2 Plasmas. [Thesis]. University of Houston; 2014. Available from: http://hdl.handle.net/10657/1451

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Kansas State University

8. Cooper, Brian. Microstructured silicon carbide neutron detectors.

Degree: MS, Department of Mechanical and Nuclear Engineering, 2019, Kansas State University

Silicon carbide is a material of interest in many ventures as an intriguing semiconducting material for use as high voltage, high temperature, high power, or… (more)

Subjects/Keywords: Silicon carbide; Neutron; Neutron detector; Plasma etching

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APA (6th Edition):

Cooper, B. (2019). Microstructured silicon carbide neutron detectors. (Masters Thesis). Kansas State University. Retrieved from http://hdl.handle.net/2097/40097

Chicago Manual of Style (16th Edition):

Cooper, Brian. “Microstructured silicon carbide neutron detectors.” 2019. Masters Thesis, Kansas State University. Accessed November 14, 2019. http://hdl.handle.net/2097/40097.

MLA Handbook (7th Edition):

Cooper, Brian. “Microstructured silicon carbide neutron detectors.” 2019. Web. 14 Nov 2019.

Vancouver:

Cooper B. Microstructured silicon carbide neutron detectors. [Internet] [Masters thesis]. Kansas State University; 2019. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/2097/40097.

Council of Science Editors:

Cooper B. Microstructured silicon carbide neutron detectors. [Masters Thesis]. Kansas State University; 2019. Available from: http://hdl.handle.net/2097/40097


University of North Texas

9. Barclay, Joshua David. High Temperature Water as an Etch and Clean for SiO2 and Si3N4.

Degree: 2018, University of North Texas

 An environmentally friendly, and contamination free process for etching and cleaning semiconductors is critical to future of the IC industry. Under the right conditions, water… (more)

Subjects/Keywords: Etching; Semiconductor; Silicon Dioxide; Silicon Nitride; Water, High Temperature water; Deuterium Oxide; wet etching; Etch

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APA (6th Edition):

Barclay, J. D. (2018). High Temperature Water as an Etch and Clean for SiO2 and Si3N4. (Thesis). University of North Texas. Retrieved from https://digital.library.unt.edu/ark:/67531/metadc1404614/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Barclay, Joshua David. “High Temperature Water as an Etch and Clean for SiO2 and Si3N4.” 2018. Thesis, University of North Texas. Accessed November 14, 2019. https://digital.library.unt.edu/ark:/67531/metadc1404614/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Barclay, Joshua David. “High Temperature Water as an Etch and Clean for SiO2 and Si3N4.” 2018. Web. 14 Nov 2019.

Vancouver:

Barclay JD. High Temperature Water as an Etch and Clean for SiO2 and Si3N4. [Internet] [Thesis]. University of North Texas; 2018. [cited 2019 Nov 14]. Available from: https://digital.library.unt.edu/ark:/67531/metadc1404614/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Barclay JD. High Temperature Water as an Etch and Clean for SiO2 and Si3N4. [Thesis]. University of North Texas; 2018. Available from: https://digital.library.unt.edu/ark:/67531/metadc1404614/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

10. Balajka, Jan. Výroba membrán pomocí anizotropního leptání křemíku .

Degree: 2011, Brno University of Technology

 Bakalářská práce se zabývá přípravou membrán z oxidu křemičitého (SiO2) na křemíkovém (Si) substrátu pomocí anizotropního leptání křemíku. Masky pro anizotropní leptání křemíku byly vytvořeny… (more)

Subjects/Keywords: KŘEMÍK; ANIZOTROPNÍ LEPTÁNÍ KŘEMÍKU; MEMBRÁNA; ELEKTRONOVÁ LITOGRAFIE; SILICON; ANISOTROPIC SILICON ETCHING; MEMBRANE; ELECTRON BEAM LITHOGRAPHY

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APA (6th Edition):

Balajka, J. (2011). Výroba membrán pomocí anizotropního leptání křemíku . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/3525

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Balajka, Jan. “Výroba membrán pomocí anizotropního leptání křemíku .” 2011. Thesis, Brno University of Technology. Accessed November 14, 2019. http://hdl.handle.net/11012/3525.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Balajka, Jan. “Výroba membrán pomocí anizotropního leptání křemíku .” 2011. Web. 14 Nov 2019.

Vancouver:

Balajka J. Výroba membrán pomocí anizotropního leptání křemíku . [Internet] [Thesis]. Brno University of Technology; 2011. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/11012/3525.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Balajka J. Výroba membrán pomocí anizotropního leptání křemíku . [Thesis]. Brno University of Technology; 2011. Available from: http://hdl.handle.net/11012/3525

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Univerzitet u Beogradu

11. Smiljanić, Milče, 1978-. Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora.

Degree: Elektrotehnički fakultet, 2016, Univerzitet u Beogradu

Mikroelektronske tehnologije i MEMS, senzori i aktuatori - Mikromašinstvo – vlažno anizotropno hemijsko nagrizanje silicijuma / Microelectronic technologies and MEMS, sensors and actuators - Micromachining… (more)

Subjects/Keywords: Silicon; TMAH; wet chemical etching; crystallographic planes; MEMS; sensor

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APA (6th Edition):

Smiljanić, Milče, 1. (2016). Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora. (Thesis). Univerzitet u Beogradu. Retrieved from https://fedorabg.bg.ac.rs/fedora/get/o:11701/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Smiljanić, Milče, 1978-. “Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora.” 2016. Thesis, Univerzitet u Beogradu. Accessed November 14, 2019. https://fedorabg.bg.ac.rs/fedora/get/o:11701/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Smiljanić, Milče, 1978-. “Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora.” 2016. Web. 14 Nov 2019.

Vancouver:

Smiljanić, Milče 1. Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora. [Internet] [Thesis]. Univerzitet u Beogradu; 2016. [cited 2019 Nov 14]. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:11701/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Smiljanić, Milče 1. Nove primene procesa nagrizanja silicijuma u vodenom rastvoru TMAH u izradi MEMS senzora. [Thesis]. Univerzitet u Beogradu; 2016. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:11701/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Western Australia

12. Lai, Meifang. Porous silicon and its application for micromachining technologies.

Degree: PhD, 2012, University of Western Australia

[Truncated abstract] Porous silicon (PS), which exhibits valuable characteristics including photoluminescence, easily tunable refractive index, and large surface area, has gained enormous attention worldwide for… (more)

Subjects/Keywords: Porous silicon; Passivation; Photolithography; Alkaline developer; Reactive ion etching; Micromachining

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APA (6th Edition):

Lai, M. (2012). Porous silicon and its application for micromachining technologies. (Doctoral Dissertation). University of Western Australia. Retrieved from http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=33374&local_base=GEN01-INS01

Chicago Manual of Style (16th Edition):

Lai, Meifang. “Porous silicon and its application for micromachining technologies.” 2012. Doctoral Dissertation, University of Western Australia. Accessed November 14, 2019. http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=33374&local_base=GEN01-INS01.

MLA Handbook (7th Edition):

Lai, Meifang. “Porous silicon and its application for micromachining technologies.” 2012. Web. 14 Nov 2019.

Vancouver:

Lai M. Porous silicon and its application for micromachining technologies. [Internet] [Doctoral dissertation]. University of Western Australia; 2012. [cited 2019 Nov 14]. Available from: http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=33374&local_base=GEN01-INS01.

Council of Science Editors:

Lai M. Porous silicon and its application for micromachining technologies. [Doctoral Dissertation]. University of Western Australia; 2012. Available from: http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=33374&local_base=GEN01-INS01


Dublin City University

13. Tan, Liang. Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide.

Degree: School of Electronic Engineering, 1994, Dublin City University

 Plasma etching has been used extensively in the microelectronics industry for integrated circuit fabrication. However, the optimisation of this process is quite challenging because the… (more)

Subjects/Keywords: Electronic engineering; Plasma etching; Silicon

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APA (6th Edition):

Tan, L. (1994). Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide. (Thesis). Dublin City University. Retrieved from http://doras.dcu.ie/19597/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tan, Liang. “Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide.” 1994. Thesis, Dublin City University. Accessed November 14, 2019. http://doras.dcu.ie/19597/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tan, Liang. “Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide.” 1994. Web. 14 Nov 2019.

Vancouver:

Tan L. Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide. [Internet] [Thesis]. Dublin City University; 1994. [cited 2019 Nov 14]. Available from: http://doras.dcu.ie/19597/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tan L. Modelling, simulation and multivariable control of plasma etching of silicon and silicon dioxide. [Thesis]. Dublin City University; 1994. Available from: http://doras.dcu.ie/19597/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Louisiana State University

14. Bugayong, Joel Nino. Electrochemical etching of isolated structures in p-type silicon.

Degree: MSChE, Chemical Engineering, 2010, Louisiana State University

 The role of the space charge region (SCR) was demonstrated in isolated structures for the first time. Electrochemical etching was conducted in differently pitched structures… (more)

Subjects/Keywords: space charge region; pore formation; electrochemical etching; p-type silicon

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APA (6th Edition):

Bugayong, J. N. (2010). Electrochemical etching of isolated structures in p-type silicon. (Masters Thesis). Louisiana State University. Retrieved from etd-03032011-163036 ; https://digitalcommons.lsu.edu/gradschool_theses/4084

Chicago Manual of Style (16th Edition):

Bugayong, Joel Nino. “Electrochemical etching of isolated structures in p-type silicon.” 2010. Masters Thesis, Louisiana State University. Accessed November 14, 2019. etd-03032011-163036 ; https://digitalcommons.lsu.edu/gradschool_theses/4084.

MLA Handbook (7th Edition):

Bugayong, Joel Nino. “Electrochemical etching of isolated structures in p-type silicon.” 2010. Web. 14 Nov 2019.

Vancouver:

Bugayong JN. Electrochemical etching of isolated structures in p-type silicon. [Internet] [Masters thesis]. Louisiana State University; 2010. [cited 2019 Nov 14]. Available from: etd-03032011-163036 ; https://digitalcommons.lsu.edu/gradschool_theses/4084.

Council of Science Editors:

Bugayong JN. Electrochemical etching of isolated structures in p-type silicon. [Masters Thesis]. Louisiana State University; 2010. Available from: etd-03032011-163036 ; https://digitalcommons.lsu.edu/gradschool_theses/4084


University of British Columbia

15. Walker, Zane Harry. Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine .

Degree: 1990, University of British Columbia

 The etching of silicon by atomic and molecular chlorine and bromine was studied as a function of etchant pressure and reaction temperature. Various types of… (more)

Subjects/Keywords: Chemical kinetics; Silicon crystals  – Etching

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APA (6th Edition):

Walker, Z. H. (1990). Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine . (Thesis). University of British Columbia. Retrieved from http://hdl.handle.net/2429/32378

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Walker, Zane Harry. “Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine .” 1990. Thesis, University of British Columbia. Accessed November 14, 2019. http://hdl.handle.net/2429/32378.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Walker, Zane Harry. “Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine .” 1990. Web. 14 Nov 2019.

Vancouver:

Walker ZH. Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine . [Internet] [Thesis]. University of British Columbia; 1990. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/2429/32378.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Walker ZH. Kinetics of the reaction of intrinsic and N-type silicon with atomic and molecular bromine and chlorine . [Thesis]. University of British Columbia; 1990. Available from: http://hdl.handle.net/2429/32378

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Uppsala University

16. Catalan, Ernesto Vargas. Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon.

Degree: Ångström Space Technology Centre (ÅSTC), 2012, Uppsala University

  In this master thesis, the goal was to devise design patterns and a fabrication processfor manufacturing a 3-D rotationally symmetric converging-diverging cold gasmicronozzle in… (more)

Subjects/Keywords: Etching; Micronozzle; Microloading; RIE lag; Silicon; Rotationally symmetric

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APA (6th Edition):

Catalan, E. V. (2012). Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon. (Thesis). Uppsala University. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-182199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Catalan, Ernesto Vargas. “Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon.” 2012. Thesis, Uppsala University. Accessed November 14, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-182199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Catalan, Ernesto Vargas. “Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon.” 2012. Web. 14 Nov 2019.

Vancouver:

Catalan EV. Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon. [Internet] [Thesis]. Uppsala University; 2012. [cited 2019 Nov 14]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-182199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Catalan EV. Design and Manufacturing of a Rotationally Symmetric Cold Gas Nozzle in Silicon. [Thesis]. Uppsala University; 2012. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-182199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


New Jersey Institute of Technology

17. Wang, Ying. Koh etching of silicon.

Degree: MSin Materials Science and Engineering - (M.S.), Committee for the Interdisciplinary Program in Materials Science and Engineering, 2016, New Jersey Institute of Technology

  In this research, a series of comparative etching experiments on silicon wafers have been carried out using potassium hydroxide (KOH) for different experimental etching(more)

Subjects/Keywords: Silicon wafers; Potassium hydroxide etching; Materials Science and Engineering

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APA (6th Edition):

Wang, Y. (2016). Koh etching of silicon. (Thesis). New Jersey Institute of Technology. Retrieved from https://digitalcommons.njit.edu/theses/282

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Ying. “Koh etching of silicon.” 2016. Thesis, New Jersey Institute of Technology. Accessed November 14, 2019. https://digitalcommons.njit.edu/theses/282.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Ying. “Koh etching of silicon.” 2016. Web. 14 Nov 2019.

Vancouver:

Wang Y. Koh etching of silicon. [Internet] [Thesis]. New Jersey Institute of Technology; 2016. [cited 2019 Nov 14]. Available from: https://digitalcommons.njit.edu/theses/282.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang Y. Koh etching of silicon. [Thesis]. New Jersey Institute of Technology; 2016. Available from: https://digitalcommons.njit.edu/theses/282

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Rochester Institute of Technology

18. Wilhelm, Thomas S. Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts.

Degree: PhD, Microsystems Engineering, 2019, Rochester Institute of Technology

  The increasing demand for complex devices that utilize three-dimensional nanostructures has incentivized the development of adaptable and versatile semiconductor nanofabrication strategies. Without the introduction… (more)

Subjects/Keywords: III-V; MACE; MacEtch; Metal-assisted chemical etching; Semiconductor nanofabrication; Silicon

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APA (6th Edition):

Wilhelm, T. S. (2019). Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts. (Doctoral Dissertation). Rochester Institute of Technology. Retrieved from https://scholarworks.rit.edu/theses/10233

Chicago Manual of Style (16th Edition):

Wilhelm, Thomas S. “Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts.” 2019. Doctoral Dissertation, Rochester Institute of Technology. Accessed November 14, 2019. https://scholarworks.rit.edu/theses/10233.

MLA Handbook (7th Edition):

Wilhelm, Thomas S. “Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts.” 2019. Web. 14 Nov 2019.

Vancouver:

Wilhelm TS. Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts. [Internet] [Doctoral dissertation]. Rochester Institute of Technology; 2019. [cited 2019 Nov 14]. Available from: https://scholarworks.rit.edu/theses/10233.

Council of Science Editors:

Wilhelm TS. Semiconductor Nanofabrication via Metal-Assisted Chemical Etching: Ternary III-V Alloys and Alternative Catalysts. [Doctoral Dissertation]. Rochester Institute of Technology; 2019. Available from: https://scholarworks.rit.edu/theses/10233


Michigan State University

19. Hopwood, Jeffrey Alan. Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching.

Degree: PhD, Department of Electrical Engineering, 1990, Michigan State University

Subjects/Keywords: Plasma etching; Silicon; Cyclotron resonance

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APA (6th Edition):

Hopwood, J. A. (1990). Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching. (Doctoral Dissertation). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:20896

Chicago Manual of Style (16th Edition):

Hopwood, Jeffrey Alan. “Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching.” 1990. Doctoral Dissertation, Michigan State University. Accessed November 14, 2019. http://etd.lib.msu.edu/islandora/object/etd:20896.

MLA Handbook (7th Edition):

Hopwood, Jeffrey Alan. “Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching.” 1990. Web. 14 Nov 2019.

Vancouver:

Hopwood JA. Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching. [Internet] [Doctoral dissertation]. Michigan State University; 1990. [cited 2019 Nov 14]. Available from: http://etd.lib.msu.edu/islandora/object/etd:20896.

Council of Science Editors:

Hopwood JA. Macroscopic properties of a multipolar electron cyclotron resonance microwave-cavity plasma source for anisotropic silicon etching. [Doctoral Dissertation]. Michigan State University; 1990. Available from: http://etd.lib.msu.edu/islandora/object/etd:20896


Michigan State University

20. Gopinath, Venkatesh P. An investigation of methods of evaluating plasma etch damage on silicon.

Degree: MS, Department of Electrical Engineering, 1991, Michigan State University

Subjects/Keywords: Plasma etching – Evaluation; Silicon

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APA (6th Edition):

Gopinath, V. P. (1991). An investigation of methods of evaluating plasma etch damage on silicon. (Masters Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:23155

Chicago Manual of Style (16th Edition):

Gopinath, Venkatesh P. “An investigation of methods of evaluating plasma etch damage on silicon.” 1991. Masters Thesis, Michigan State University. Accessed November 14, 2019. http://etd.lib.msu.edu/islandora/object/etd:23155.

MLA Handbook (7th Edition):

Gopinath, Venkatesh P. “An investigation of methods of evaluating plasma etch damage on silicon.” 1991. Web. 14 Nov 2019.

Vancouver:

Gopinath VP. An investigation of methods of evaluating plasma etch damage on silicon. [Internet] [Masters thesis]. Michigan State University; 1991. [cited 2019 Nov 14]. Available from: http://etd.lib.msu.edu/islandora/object/etd:23155.

Council of Science Editors:

Gopinath VP. An investigation of methods of evaluating plasma etch damage on silicon. [Masters Thesis]. Michigan State University; 1991. Available from: http://etd.lib.msu.edu/islandora/object/etd:23155


Delft University of Technology

21. Li, Y.X. Plasma Etching for Integrated Silicon Sensor Applications.

Degree: 1995, Delft University of Technology

Subjects/Keywords: Plasma etching; silicon sensor; micromachining

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APA (6th Edition):

Li, Y. X. (1995). Plasma Etching for Integrated Silicon Sensor Applications. (Doctoral Dissertation). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0

Chicago Manual of Style (16th Edition):

Li, Y X. “Plasma Etching for Integrated Silicon Sensor Applications.” 1995. Doctoral Dissertation, Delft University of Technology. Accessed November 14, 2019. http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0.

MLA Handbook (7th Edition):

Li, Y X. “Plasma Etching for Integrated Silicon Sensor Applications.” 1995. Web. 14 Nov 2019.

Vancouver:

Li YX. Plasma Etching for Integrated Silicon Sensor Applications. [Internet] [Doctoral dissertation]. Delft University of Technology; 1995. [cited 2019 Nov 14]. Available from: http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0.

Council of Science Editors:

Li YX. Plasma Etching for Integrated Silicon Sensor Applications. [Doctoral Dissertation]. Delft University of Technology; 1995. Available from: http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; urn:NBN:nl:ui:24-uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0 ; http://resolver.tudelft.nl/uuid:5030552c-3bbe-4659-b4b4-aac93b7bb8b0


Case Western Reserve University

22. CHEN, LI. A BIOINSPIRED MICRO-COMPOSITE STRUCTURE.

Degree: PhD, Civil Engineering, 2005, Case Western Reserve University

 This thesis involves the design, fabrication and mechanical testing of a bioinspired composite structure with characteristic dimensions of the order of tens of microns. The… (more)

Subjects/Keywords: Photoresist; silicon; Sputtered silicon; Etching; silicon film

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APA (6th Edition):

CHEN, L. (2005). A BIOINSPIRED MICRO-COMPOSITE STRUCTURE. (Doctoral Dissertation). Case Western Reserve University. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=case1118471877

Chicago Manual of Style (16th Edition):

CHEN, LI. “A BIOINSPIRED MICRO-COMPOSITE STRUCTURE.” 2005. Doctoral Dissertation, Case Western Reserve University. Accessed November 14, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=case1118471877.

MLA Handbook (7th Edition):

CHEN, LI. “A BIOINSPIRED MICRO-COMPOSITE STRUCTURE.” 2005. Web. 14 Nov 2019.

Vancouver:

CHEN L. A BIOINSPIRED MICRO-COMPOSITE STRUCTURE. [Internet] [Doctoral dissertation]. Case Western Reserve University; 2005. [cited 2019 Nov 14]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=case1118471877.

Council of Science Editors:

CHEN L. A BIOINSPIRED MICRO-COMPOSITE STRUCTURE. [Doctoral Dissertation]. Case Western Reserve University; 2005. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=case1118471877


Louisiana State University

23. Upadhyaya, Kailash. Wafer level chip scale packaging using wafer bonder.

Degree: MSEE, Electrical and Computer Engineering, 2005, Louisiana State University

 An in-house processing capability is developed in this research for silicon-glass bonding for microfabrication and wafer level chip scale packaging (WLCSP) using a wafer bonder.… (more)

Subjects/Keywords: glass etching; anodic bonding; wafer bonder; silicon etching; WLCSP

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APA (6th Edition):

Upadhyaya, K. (2005). Wafer level chip scale packaging using wafer bonder. (Masters Thesis). Louisiana State University. Retrieved from etd-07152005-092326 ; https://digitalcommons.lsu.edu/gradschool_theses/3798

Chicago Manual of Style (16th Edition):

Upadhyaya, Kailash. “Wafer level chip scale packaging using wafer bonder.” 2005. Masters Thesis, Louisiana State University. Accessed November 14, 2019. etd-07152005-092326 ; https://digitalcommons.lsu.edu/gradschool_theses/3798.

MLA Handbook (7th Edition):

Upadhyaya, Kailash. “Wafer level chip scale packaging using wafer bonder.” 2005. Web. 14 Nov 2019.

Vancouver:

Upadhyaya K. Wafer level chip scale packaging using wafer bonder. [Internet] [Masters thesis]. Louisiana State University; 2005. [cited 2019 Nov 14]. Available from: etd-07152005-092326 ; https://digitalcommons.lsu.edu/gradschool_theses/3798.

Council of Science Editors:

Upadhyaya K. Wafer level chip scale packaging using wafer bonder. [Masters Thesis]. Louisiana State University; 2005. Available from: etd-07152005-092326 ; https://digitalcommons.lsu.edu/gradschool_theses/3798


University of Cincinnati

24. PARIMI, SRINIVAS. PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS.

Degree: MS, Engineering : Electrical Engineering, 2003, University of Cincinnati

 The present work deals with the development of a very novel and prototypical Micro Loop Heat Pipe (LHP) using the Coherent Porous Silicon (CPS) technology… (more)

Subjects/Keywords: COHERENT POROUS SILICON ETCHING; MACRO POROUS SILICON ETCHING; AUTOMATION; MEMS FABRICATION; ANODIC BONDING

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APA (6th Edition):

PARIMI, S. (2003). PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS. (Masters Thesis). University of Cincinnati. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=ucin1047067699

Chicago Manual of Style (16th Edition):

PARIMI, SRINIVAS. “PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS.” 2003. Masters Thesis, University of Cincinnati. Accessed November 14, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1047067699.

MLA Handbook (7th Edition):

PARIMI, SRINIVAS. “PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS.” 2003. Web. 14 Nov 2019.

Vancouver:

PARIMI S. PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS. [Internet] [Masters thesis]. University of Cincinnati; 2003. [cited 2019 Nov 14]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1047067699.

Council of Science Editors:

PARIMI S. PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODIC BONDING OF CPS FOR LHP APPLICATIONS. [Masters Thesis]. University of Cincinnati; 2003. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1047067699

25. Kiihamäki, Jyrki. Fabrication of SOI Micromechanical Devices.

Degree: 2005, VTT Technical Research Centre of Finland

This work reports on studies and the fabrication process development of micromechanical silicon-on-insulator (SOI) devices. SOI is a promising starting material for fabrication of single… (more)

Subjects/Keywords: silicon-on-insulator; SOI; micromechanics; MEMS; microfabrication; HARMST; DRIE; etching; vacuum cavities; resonators; monolithic integration

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APA (6th Edition):

Kiihamäki, J. (2005). Fabrication of SOI Micromechanical Devices. (Thesis). VTT Technical Research Centre of Finland. Retrieved from http://lib.tkk.fi/Diss/2005/isbn9513864367/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kiihamäki, Jyrki. “Fabrication of SOI Micromechanical Devices.” 2005. Thesis, VTT Technical Research Centre of Finland. Accessed November 14, 2019. http://lib.tkk.fi/Diss/2005/isbn9513864367/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kiihamäki, Jyrki. “Fabrication of SOI Micromechanical Devices.” 2005. Web. 14 Nov 2019.

Vancouver:

Kiihamäki J. Fabrication of SOI Micromechanical Devices. [Internet] [Thesis]. VTT Technical Research Centre of Finland; 2005. [cited 2019 Nov 14]. Available from: http://lib.tkk.fi/Diss/2005/isbn9513864367/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kiihamäki J. Fabrication of SOI Micromechanical Devices. [Thesis]. VTT Technical Research Centre of Finland; 2005. Available from: http://lib.tkk.fi/Diss/2005/isbn9513864367/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

26. Artoni, Pietro. Silicon Nanowires by Metal Assisted Etching.

Degree: 2013, Università degli Studi di Catania

 Group-IV semiconductor nanowires (NWs) are attracting interest among the scientific community as building blocks for future nanoscaled devices. Different techniques are currently used for Si… (more)

Subjects/Keywords: Area 02 - Scienze fisiche; nanowires, optoelectronics, electroluminescence, optical tweezers, silicon, etching, quantum confinement

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APA (6th Edition):

Artoni, P. (2013). Silicon Nanowires by Metal Assisted Etching. (Thesis). Università degli Studi di Catania. Retrieved from http://hdl.handle.net/10761/1431

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Artoni, Pietro. “Silicon Nanowires by Metal Assisted Etching.” 2013. Thesis, Università degli Studi di Catania. Accessed November 14, 2019. http://hdl.handle.net/10761/1431.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Artoni, Pietro. “Silicon Nanowires by Metal Assisted Etching.” 2013. Web. 14 Nov 2019.

Vancouver:

Artoni P. Silicon Nanowires by Metal Assisted Etching. [Internet] [Thesis]. Università degli Studi di Catania; 2013. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/10761/1431.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Artoni P. Silicon Nanowires by Metal Assisted Etching. [Thesis]. Università degli Studi di Catania; 2013. Available from: http://hdl.handle.net/10761/1431

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

27. Oliveira Júnior, José Pinto de. Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular.

Degree: Mestrado, Microeletrônica, 2008, University of São Paulo

Nesse trabalho foi desenvolvido um software para simular a corrosão anisotrópica do silício, tendo como base o comportamento desta corrosão em soluções alcalinas (KOH). Esse… (more)

Subjects/Keywords: Autômatos celulares; Cellular automata; Etching silicon; MEMS; MEMS; Simulação da corrosão do silício; Simulation

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APA (6th Edition):

Oliveira Júnior, J. P. d. (2008). Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular. (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06112008-204522/ ;

Chicago Manual of Style (16th Edition):

Oliveira Júnior, José Pinto de. “Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular.” 2008. Masters Thesis, University of São Paulo. Accessed November 14, 2019. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06112008-204522/ ;.

MLA Handbook (7th Edition):

Oliveira Júnior, José Pinto de. “Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular.” 2008. Web. 14 Nov 2019.

Vancouver:

Oliveira Júnior JPd. Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular. [Internet] [Masters thesis]. University of São Paulo; 2008. [cited 2019 Nov 14]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06112008-204522/ ;.

Council of Science Editors:

Oliveira Júnior JPd. Desenvolvimento de software para simulação atomística da corrosão anisotrópica do silício por autômato celular. [Masters Thesis]. University of São Paulo; 2008. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-06112008-204522/ ;


University of Pretoria

28. Skolo, Kholiswa Patricia. Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles.

Degree: Chemical Engineering, 2013, University of Pretoria

 High-temperature reactors make use of tri-structural coated fuel particles as basic fuel components. These TRISO particles consist of fissionable uranium dioxide fuel kernels, about 0.5… (more)

Subjects/Keywords: Microwave digestion; Chemical etching; Pyrolytic carbon; Silicon carbide; Triso coated fuel particles; UCTD

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Skolo, K. (2013). Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles. (Masters Thesis). University of Pretoria. Retrieved from http://hdl.handle.net/2263/29908

Chicago Manual of Style (16th Edition):

Skolo, Kholiswa. “Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles.” 2013. Masters Thesis, University of Pretoria. Accessed November 14, 2019. http://hdl.handle.net/2263/29908.

MLA Handbook (7th Edition):

Skolo, Kholiswa. “Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles.” 2013. Web. 14 Nov 2019.

Vancouver:

Skolo K. Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles. [Internet] [Masters thesis]. University of Pretoria; 2013. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/2263/29908.

Council of Science Editors:

Skolo K. Controlled wet-chemical dissolution of simulated high-temperature reactor coated fuel particles. [Masters Thesis]. University of Pretoria; 2013. Available from: http://hdl.handle.net/2263/29908


NSYSU

29. Tu, Hwai-Fu. Characterizations of Electrochemically Synthesized Zinc Oxide.

Degree: PhD, Electrical Engineering, 2008, NSYSU

 Zinc oxide (ZnO) has higher exiton binding energy (60 meV) and high band gap (~3.4 eV) that can provide efficient ultraviolet (UV) light at room… (more)

Subjects/Keywords: ZnO; Porous Silicon; Pt; Au; Nano; Zn-ZnO; Electrodeposition; Etching; Electroluminescence; Photocatalysis

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tu, H. (2008). Characterizations of Electrochemically Synthesized Zinc Oxide. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0626108-020008

Chicago Manual of Style (16th Edition):

Tu, Hwai-Fu. “Characterizations of Electrochemically Synthesized Zinc Oxide.” 2008. Doctoral Dissertation, NSYSU. Accessed November 14, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0626108-020008.

MLA Handbook (7th Edition):

Tu, Hwai-Fu. “Characterizations of Electrochemically Synthesized Zinc Oxide.” 2008. Web. 14 Nov 2019.

Vancouver:

Tu H. Characterizations of Electrochemically Synthesized Zinc Oxide. [Internet] [Doctoral dissertation]. NSYSU; 2008. [cited 2019 Nov 14]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0626108-020008.

Council of Science Editors:

Tu H. Characterizations of Electrochemically Synthesized Zinc Oxide. [Doctoral Dissertation]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0626108-020008


Université de Montréal

30. Saussac, Jérôme. Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux .

Degree: 2010, Université de Montréal

 La réalisation de dispositifs à des dimensions sous-micrométriques et nanométriques demande une maîtrise parfaite des procédés de fabrication, notamment ceux de gravure. La réalisation des… (more)

Subjects/Keywords: Plasma; Gravure; Simulation; Silicium; Platine; Micro-tranchées; Redépôt; Etching; Silicon; Platinum; Microtrenching; Redeposition

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Saussac, J. (2010). Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux . (Thesis). Université de Montréal. Retrieved from http://hdl.handle.net/1866/3498

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Saussac, Jérôme. “Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux .” 2010. Thesis, Université de Montréal. Accessed November 14, 2019. http://hdl.handle.net/1866/3498.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Saussac, Jérôme. “Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux .” 2010. Web. 14 Nov 2019.

Vancouver:

Saussac J. Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux . [Internet] [Thesis]. Université de Montréal; 2010. [cited 2019 Nov 14]. Available from: http://hdl.handle.net/1866/3498.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Saussac J. Élaboration d’un simulateur de gravure par plasma de haute densité basé sur une approche cellulaire pour l’étude de profils dans divers matériaux . [Thesis]. Université de Montréal; 2010. Available from: http://hdl.handle.net/1866/3498

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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