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You searched for subject:(Silicon electrical steel). Showing records 1 – 2 of 2 total matches.

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University of California – Berkeley

1. Chan, Matthew. Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding.

Degree: Mechanical Engineering, 2013, University of California – Berkeley

Complex engineering systems ranging from automobile engines to geothermal wells require specialized sensors to monitor conditions such as pressure, acceleration and temperature in order to improve efficiency and monitor component lifetime in what may be high temperature, corrosive, harsh environments. Microelectromechanical systems (MEMS) have demonstrated their ability to precisely and accurately take measurements under such conditions. The systems being monitored are typically made from metals, such as steel, while the MEMS sensors used for monitoring are commonly fabricated from silicon, silicon carbide and aluminum nitride, and so there is a sizable thermal expansion mismatch between the two. For these engineering applications the direct bonding of MEMS sensors to the components being monitored is often required. This introduces several challenges, namely the development of a bond that is capable of surviving high temperature harsh environments while mitigating the thermally induced strains produced during bonding.This project investigates the development of a robust packaging and bonding process, using the gold-tin metal system and the solid-liquid interdiffusion (SLID) bonding process, to join silicon carbide substrates directly to type-316 stainless steel. The SLID process enables bonding at lower temperatures while producing a bond capable of surviving higher temperatures. Finite element analysis was performed to model the thermally induced strains generated in the bond and to understand the optimal way to design the bond. The cross-sectional composition of the bonds has been analyzed and the bond strength has been investigated using die shear testing. The effects of high temperature aging on the bond's strength and the metallurgy of the bond were studied. Additionally, loading of the bond was performed at temperatures over 415 °C, more than 100 °C, above the temperature used for bonding, with full survival of the bond, thus demonstrating the benefit of SLID bonding for high temperature applications.Lastly, this dissertation provides recommendations for improving the strength and durability of the bond at temperatures of 400 °C and provides the framework for future work in the area of high temperature harsh environment MEMS packaging that would take directly bonded MEMS to temperatures of 600 °C and beyond.

Subjects/Keywords: Mechanical engineering; Electrical engineering; Materials Science; Bonding; MEMS; Packaging; Sensors; Silicon Carbide; Steel

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chan, M. (2013). Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding. (Thesis). University of California – Berkeley. Retrieved from http://www.escholarship.org/uc/item/0r09f7ns

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chan, Matthew. “Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding.” 2013. Thesis, University of California – Berkeley. Accessed February 22, 2020. http://www.escholarship.org/uc/item/0r09f7ns.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chan, Matthew. “Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding.” 2013. Web. 22 Feb 2020.

Vancouver:

Chan M. Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding. [Internet] [Thesis]. University of California – Berkeley; 2013. [cited 2020 Feb 22]. Available from: http://www.escholarship.org/uc/item/0r09f7ns.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chan M. Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding. [Thesis]. University of California – Berkeley; 2013. Available from: http://www.escholarship.org/uc/item/0r09f7ns

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Marcelo Niehues Schlickmann. Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso.

Degree: 2010, Universidade do Estado de Santa Catarina

O processo de soldagem TIG (Tungsten Inert Gas), também conhecido como GTAW (Gas Tungsten Arc Welding), é o processo mais utilizado para a soldagem de chapas finas onde um excelente controle do aporte térmico à peça é necessário. Nesta dissertação é presentado um estudo realizado em parceria entre o Departamento de Pós-Graduação em Ciência e engenharia dos Materiais e os Departamentos de Engenharia Industrial e Estamparia da WEG Equipamentos Elétricos S.A. - Motores. Esse estudo envolveu a utilização da metodologia de delineamento experimental DOE para investigar a influência dos parâmetros do processo de soldagem TIG, corrente elétrica, velocidade de deslocamento da tocha e vazão do gás de proteção, na qualidade de uma peça fabricada com aço elétrico silicioso ABNT 50F 466M, mais conhecido pela classificação 50A 400 da norma JIS. Inicialmente foi elaborado o planejamento do experimento a fim de obter peças soldadas com diferentes combinações dos parâmetros acima mencionados e possibilitar a avaliação da resistência mecânica, dimensão dos cordões de solda, dureza e análise metalográfica dos corpos de prova. Os resultados obtidos, com o auxílio da técnica de análise de variância (ANOVA), mostraram que mudanças nos níveis de corrente e na velocidade de soldagem promoveram alterações significativas nos resultados. Por outro lado, as diferentes taxas de vazão de gás testadas não provocaram diferenças nas variáveis de resposta do estudo. Também foi possível determinar as combinações desses parâmetros que garantem a qualidade requerida e proporcionam aumento de produtividade, economia de energia elétrica e redução no consumo de gás de proteção.

The TIG welding process (Tungsten Inert Gas), also known as GTAW (Gas Tungsten ArcWelding), is the most commonly used process for welding of thin plates where there is a need for an excellent control of the temperature applied on the piece. This paper presents a study carried out in partnership between the Department of Graduate Studies in Scienceand Materials Engineering and the Department of Industrial Engineering and Stamping of WEG Equipamentos Elétricos S.A Motors Division. It elaborates on the use of the experimental methodology DOE to investigate the influence of TIG welding process parameters, electrical current, welding speed and flow of the shielding gas on the quality of a piece fabricated with silicon electrical steel - ABNT 50F 466M, best known for its 50A 400 specification on the JIS standard. The first step of the study was the designing of the experiment to obtain welded pieces with different combinations of the parameters above mentioned and enable the evaluation of mechanical strength, fillet weld size, hardness and metallographic analysis of the test specimens. The information obtained with analysis of variance techniques (ANOVA) showed that the change in the levels of electrical current and welding speed promotes significant changes in final results. Furthermore, the different rates of gas flow tested caused no differences in response variables of the study.…

Advisors/Committee Members: Guilherme Ourique Verran.

Subjects/Keywords: Aço Elétrico Silicioso; Soldagem TIG; Otimização dos Parâmetros deSoldagem; Optimization of welding Parameters; DOE methodology; Metais; Metodologia DOE; ENGENHARIA DE MATERIAIS E METALURGICA; Silicon electrical steel; TIG welding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Schlickmann, M. N. (2010). Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso. (Thesis). Universidade do Estado de Santa Catarina. Retrieved from http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2079 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2080 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2081 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2082 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2083 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2084 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2085 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2086

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Schlickmann, Marcelo Niehues. “Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso.” 2010. Thesis, Universidade do Estado de Santa Catarina. Accessed February 22, 2020. http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2079 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2080 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2081 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2082 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2083 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2084 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2085 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2086.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Schlickmann, Marcelo Niehues. “Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso.” 2010. Web. 22 Feb 2020.

Vancouver:

Schlickmann MN. Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso. [Internet] [Thesis]. Universidade do Estado de Santa Catarina; 2010. [cited 2020 Feb 22]. Available from: http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2079 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2080 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2081 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2082 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2083 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2084 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2085 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2086.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Schlickmann MN. Avaliação da influência dos parâmetros do processo de soldagem TIG sobre a qualidade de uma peça fabricada em aço elétrico silicioso. [Thesis]. Universidade do Estado de Santa Catarina; 2010. Available from: http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2079 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2080 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2081 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2082 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2083 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2084 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2085 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2086

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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