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You searched for subject:(Semiconductor fault detection). Showing records 1 – 4 of 4 total matches.

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University of Cincinnati

1. Tian, Runfeng. An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process.

Degree: MS, Engineering and Applied Science: Mechanical Engineering, 2019, University of Cincinnati

 The semiconductor etching process is an essential and complex manufacturing process, in which the degradation is unobservable. Due to issues related to data quality and… (more)

Subjects/Keywords: Mechanical Engineering; Semiconductor fault detection; Time series segmentation; Feature extraction

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tian, R. (2019). An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process. (Masters Thesis). University of Cincinnati. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=ucin1562923441016763

Chicago Manual of Style (16th Edition):

Tian, Runfeng. “An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process.” 2019. Masters Thesis, University of Cincinnati. Accessed November 17, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1562923441016763.

MLA Handbook (7th Edition):

Tian, Runfeng. “An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process.” 2019. Web. 17 Nov 2019.

Vancouver:

Tian R. An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process. [Internet] [Masters thesis]. University of Cincinnati; 2019. [cited 2019 Nov 17]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1562923441016763.

Council of Science Editors:

Tian R. An Enhanced Approach using Time Series Segmentation for Fault Detection of Semiconductor Manufacturing Process. [Masters Thesis]. University of Cincinnati; 2019. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1562923441016763

2. Thieullen, Alexis. Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes.

Degree: Docteur es, Automatique, 2014, Aix Marseille Université

L'objectif de cette thèse est le développement d'une méthodologie pour la détection de défauts appliquée aux équipements de production de semi-conducteurs. L'approche proposée repose sur… (more)

Subjects/Keywords: Semi-Conducteurs; Détection de défauts; ACP multiway; ACP récursive; EWMA; DTW; Semiconductor; Fault detection; Multiway PCA; Recursive PCA; EWMA; DTW

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Thieullen, A. (2014). Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes. (Doctoral Dissertation). Aix Marseille Université. Retrieved from http://www.theses.fr/2014AIXM4329

Chicago Manual of Style (16th Edition):

Thieullen, Alexis. “Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes.” 2014. Doctoral Dissertation, Aix Marseille Université. Accessed November 17, 2019. http://www.theses.fr/2014AIXM4329.

MLA Handbook (7th Edition):

Thieullen, Alexis. “Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes.” 2014. Web. 17 Nov 2019.

Vancouver:

Thieullen A. Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes. [Internet] [Doctoral dissertation]. Aix Marseille Université 2014. [cited 2019 Nov 17]. Available from: http://www.theses.fr/2014AIXM4329.

Council of Science Editors:

Thieullen A. Méthodologie pour la détection de défaillance des procédés de fabrication par ACP : application à la production de dispositifs semi-conducteurs : PCA Methodology for Production Process Fault Detection : Application to Semiconductor Manufacturing Processes. [Doctoral Dissertation]. Aix Marseille Université 2014. Available from: http://www.theses.fr/2014AIXM4329

3. CHEN WEI. Temperature regulation and in-situ fault detection of wafer warpage.

Degree: 2005, National University of Singapore

Subjects/Keywords: Wafer warpage; Fault detection; Feedforward; Temperature control; Lithogrophy; Semiconductor manufacturing

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

WEI, C. (2005). Temperature regulation and in-situ fault detection of wafer warpage. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/14831

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

WEI, CHEN. “Temperature regulation and in-situ fault detection of wafer warpage.” 2005. Thesis, National University of Singapore. Accessed November 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/14831.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

WEI, CHEN. “Temperature regulation and in-situ fault detection of wafer warpage.” 2005. Web. 17 Nov 2019.

Vancouver:

WEI C. Temperature regulation and in-situ fault detection of wafer warpage. [Internet] [Thesis]. National University of Singapore; 2005. [cited 2019 Nov 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/14831.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

WEI C. Temperature regulation and in-situ fault detection of wafer warpage. [Thesis]. National University of Singapore; 2005. Available from: http://scholarbank.nus.edu.sg/handle/10635/14831

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

4. -5100-5600. Improving process monitoring and modeling of batch-type plasma etching tools.

Degree: PhD, Chemical Engineering, 2015, University of Texas – Austin

 Manufacturing equipments in semiconductor factories (fabs) provide abundant data and opportunities for data-driven process monitoring and modeling. In particular, virtual metrology (VM) is an active… (more)

Subjects/Keywords: PLS; Fault detection; Soft sensor; Inferential sensor; Virtual metrology; Variable selection; Time warping; Multiple model systems; PCA; Partial least squares; Etching; Semiconductor; Control; Data-driven; Multivariate; Machine learning

…overcome several challenges in mixture model systems. In addition, fault detection sensitivities… …132 Fault detection speed for the Tennessee Eastman Process (lower is faster, blank… …Modern semiconductor fab tools are equipped with fault diagnostic sensors that generate large… …22]. The batch level regression (PLS) or fault detection model (PCA… …process capability of a semiconductor manufacturing process, figure adapted from [1]… 

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

-5100-5600. (2015). Improving process monitoring and modeling of batch-type plasma etching tools. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/30486

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Chicago Manual of Style (16th Edition):

-5100-5600. “Improving process monitoring and modeling of batch-type plasma etching tools.” 2015. Doctoral Dissertation, University of Texas – Austin. Accessed November 17, 2019. http://hdl.handle.net/2152/30486.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-5100-5600. “Improving process monitoring and modeling of batch-type plasma etching tools.” 2015. Web. 17 Nov 2019.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-5100-5600. Improving process monitoring and modeling of batch-type plasma etching tools. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2015. [cited 2019 Nov 17]. Available from: http://hdl.handle.net/2152/30486.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-5100-5600. Improving process monitoring and modeling of batch-type plasma etching tools. [Doctoral Dissertation]. University of Texas – Austin; 2015. Available from: http://hdl.handle.net/2152/30486

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

.