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You searched for subject:(Printed circuit boards). Showing records 1 – 30 of 34 total matches.

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Anna University

1. Sakri M I. Experimental investigations on Board level electronic packaging Subjected to dynamic loads;.

Degree: Experimental investigations on Board level electronic packaging Subjected to dynamic loads, 2014, Anna University

Electronic equipment are more often subjected to severe vibration newlineenvironments such as sinusoidal random and mechanical shock during newlinehandling transportation Because of severe vibration environments… (more)

Subjects/Keywords: Electronic equipment; Printed circuit boards

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APA (6th Edition):

I, S. M. (2014). Experimental investigations on Board level electronic packaging Subjected to dynamic loads;. (Thesis). Anna University. Retrieved from http://shodhganga.inflibnet.ac.in/handle/10603/31730

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

I, Sakri M. “Experimental investigations on Board level electronic packaging Subjected to dynamic loads;.” 2014. Thesis, Anna University. Accessed October 15, 2019. http://shodhganga.inflibnet.ac.in/handle/10603/31730.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

I, Sakri M. “Experimental investigations on Board level electronic packaging Subjected to dynamic loads;.” 2014. Web. 15 Oct 2019.

Vancouver:

I SM. Experimental investigations on Board level electronic packaging Subjected to dynamic loads;. [Internet] [Thesis]. Anna University; 2014. [cited 2019 Oct 15]. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/31730.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

I SM. Experimental investigations on Board level electronic packaging Subjected to dynamic loads;. [Thesis]. Anna University; 2014. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/31730

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Anna University

2. Kavitha N. Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;.

Degree: Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation, 2015, Anna University

E waste the waste arising from discarded electronic components is newlineone of the fastest growing waste streams containing hazardous materials newlinePrinted circuit boards PCBs are… (more)

Subjects/Keywords: hydrometallurgical; Printed circuit boards

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APA (6th Edition):

N, K. (2015). Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;. (Thesis). Anna University. Retrieved from http://shodhganga.inflibnet.ac.in/handle/10603/35502

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

N, Kavitha. “Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;.” 2015. Thesis, Anna University. Accessed October 15, 2019. http://shodhganga.inflibnet.ac.in/handle/10603/35502.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

N, Kavitha. “Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;.” 2015. Web. 15 Oct 2019.

Vancouver:

N K. Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;. [Internet] [Thesis]. Anna University; 2015. [cited 2019 Oct 15]. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/35502.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

N K. Recovery of heavy metals from E waste by polymer inclusion Membrane coupled with cementation;. [Thesis]. Anna University; 2015. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/35502

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Manitoba

3. Zeynali, Ehsan. Assessment of thermally-aged conformally-coated printed circuit boards.

Degree: Electrical and Computer Engineering, 2019, University of Manitoba

Printed circuit boards (PCBs) are key components of electrical and electronic systems. The electrical performance of PCBs under harsh operating conditions is a decisive factor… (more)

Subjects/Keywords: Printed circuit boards; Conformal coating; PCB

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APA (6th Edition):

Zeynali, E. (2019). Assessment of thermally-aged conformally-coated printed circuit boards. (Masters Thesis). University of Manitoba. Retrieved from http://hdl.handle.net/1993/34296

Chicago Manual of Style (16th Edition):

Zeynali, Ehsan. “Assessment of thermally-aged conformally-coated printed circuit boards.” 2019. Masters Thesis, University of Manitoba. Accessed October 15, 2019. http://hdl.handle.net/1993/34296.

MLA Handbook (7th Edition):

Zeynali, Ehsan. “Assessment of thermally-aged conformally-coated printed circuit boards.” 2019. Web. 15 Oct 2019.

Vancouver:

Zeynali E. Assessment of thermally-aged conformally-coated printed circuit boards. [Internet] [Masters thesis]. University of Manitoba; 2019. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/1993/34296.

Council of Science Editors:

Zeynali E. Assessment of thermally-aged conformally-coated printed circuit boards. [Masters Thesis]. University of Manitoba; 2019. Available from: http://hdl.handle.net/1993/34296


Univerzitet u Beogradu

4. Dervišević, Irma, 1964-. Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама.

Degree: Tehnološko-metalurški fakultet, 2016, Univerzitet u Beogradu

Tехничко-технолошке науке - Инжењерство заштите животне средине / Applied sciences - Environmental Engineering

Широк спектар застарелих електричних и електронских уређаја чини отпад од електричне и… (more)

Subjects/Keywords: waste electrical and electronic equipment; waste printed circuit boards; characterization printed circuit boards; recycling; ternary alloys

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APA (6th Edition):

Dervišević, Irma, 1. (2016). Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама. (Thesis). Univerzitet u Beogradu. Retrieved from https://fedorabg.bg.ac.rs/fedora/get/o:12526/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Dervišević, Irma, 1964-. “Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама.” 2016. Thesis, Univerzitet u Beogradu. Accessed October 15, 2019. https://fedorabg.bg.ac.rs/fedora/get/o:12526/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Dervišević, Irma, 1964-. “Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама.” 2016. Web. 15 Oct 2019.

Vancouver:

Dervišević, Irma 1. Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама. [Internet] [Thesis]. Univerzitet u Beogradu; 2016. [cited 2019 Oct 15]. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:12526/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Dervišević, Irma 1. Издвајање метала из електронског отпада и замена злата, арсена и олова у електронској опреми трокомпонентним легурама. [Thesis]. Univerzitet u Beogradu; 2016. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:12526/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

5. Murcia Santanilla, Adriana Johanny. Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares.

Degree: Mestrado, Engenharia Metalúrgica e de Materiais, 2011, University of São Paulo

Os resíduos de equipamentos elétricos e eletrônicos é um dos fluxos de resíduos que mais cresce no mundo. O aumento na produção destes equipamentos como… (more)

Subjects/Keywords: Hidrometalurgia; Hydrometallurgy; Nickel; Níquel; Placas de circuito impresso; Printed circuit boards

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APA (6th Edition):

Murcia Santanilla, A. J. (2011). Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares. (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3133/tde-20032012-155039/ ;

Chicago Manual of Style (16th Edition):

Murcia Santanilla, Adriana Johanny. “Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares.” 2011. Masters Thesis, University of São Paulo. Accessed October 15, 2019. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-20032012-155039/ ;.

MLA Handbook (7th Edition):

Murcia Santanilla, Adriana Johanny. “Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares.” 2011. Web. 15 Oct 2019.

Vancouver:

Murcia Santanilla AJ. Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares. [Internet] [Masters thesis]. University of São Paulo; 2011. [cited 2019 Oct 15]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3133/tde-20032012-155039/ ;.

Council of Science Editors:

Murcia Santanilla AJ. Recuperação de níquel a partir do licor de lixiviação de placas de circuito impresso de telefones celulares. [Masters Thesis]. University of São Paulo; 2011. Available from: http://www.teses.usp.br/teses/disponiveis/3/3133/tde-20032012-155039/ ;


University of Waterloo

6. Chan, Lok Si. Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates.

Degree: 2012, University of Waterloo

 Increasing demands for more reliability and functionalities in electronic devices have pushed the electronics industry to adopt newly developed materials and reduce interconnect sizes and… (more)

Subjects/Keywords: laminates; printed circuit boards; curing agents; drilling methods

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APA (6th Edition):

Chan, L. S. (2012). Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/6470

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chan, Lok Si. “Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates.” 2012. Thesis, University of Waterloo. Accessed October 15, 2019. http://hdl.handle.net/10012/6470.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chan, Lok Si. “Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates.” 2012. Web. 15 Oct 2019.

Vancouver:

Chan LS. Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates. [Internet] [Thesis]. University of Waterloo; 2012. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/10012/6470.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chan LS. Effects of Curing Agents and Drilling Methods on CAF Formation in Halogen-Free Laminates. [Thesis]. University of Waterloo; 2012. Available from: http://hdl.handle.net/10012/6470

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Illinois – Urbana-Champaign

7. Maciel Yo, Fernanda Paola. Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes.

Degree: MS, Civil Engineering, 2015, University of Illinois – Urbana-Champaign

 This thesis presents a GIS-based tool Arc-BEST (Bioaccumulation Evaluation Screening Tool) to perform spatially distributed bioaccumulation risk analyses. Estimating bioaccumulation risk is important to help… (more)

Subjects/Keywords: bioaccumulation; Printed Circuit Boards (PCBs); Great Lakes; risk assessment

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APA (6th Edition):

Maciel Yo, F. P. (2015). Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes. (Thesis). University of Illinois – Urbana-Champaign. Retrieved from http://hdl.handle.net/2142/88306

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Maciel Yo, Fernanda Paola. “Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes.” 2015. Thesis, University of Illinois – Urbana-Champaign. Accessed October 15, 2019. http://hdl.handle.net/2142/88306.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Maciel Yo, Fernanda Paola. “Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes.” 2015. Web. 15 Oct 2019.

Vancouver:

Maciel Yo FP. Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes. [Internet] [Thesis]. University of Illinois – Urbana-Champaign; 2015. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/2142/88306.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Maciel Yo FP. Spatially distributed bioaccumulation risk analysis: a GIS-based tool and a case study of polychlorinated biphenyls in the Great Lakes. [Thesis]. University of Illinois – Urbana-Champaign; 2015. Available from: http://hdl.handle.net/2142/88306

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Indian Institute of Science

8. Bhat, Shriram N. Studies In Micro Interconnections In Printed Wiring Board.

Degree: 2008, Indian Institute of Science

 Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components… (more)

Subjects/Keywords: Printed Circuit Boards; Build-up Multilayer Technology; Multilayer Printed Wiring Boards; Solid Micro-Interconnects; Interfaces - Adhesion; Solid Micro Pillars - Printing; Printed Wiring Board (PWB); Build-up Multilayer (BuM); Electronic Engineering

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APA (6th Edition):

Bhat, S. N. (2008). Studies In Micro Interconnections In Printed Wiring Board. (Thesis). Indian Institute of Science. Retrieved from http://hdl.handle.net/2005/846

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bhat, Shriram N. “Studies In Micro Interconnections In Printed Wiring Board.” 2008. Thesis, Indian Institute of Science. Accessed October 15, 2019. http://hdl.handle.net/2005/846.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bhat, Shriram N. “Studies In Micro Interconnections In Printed Wiring Board.” 2008. Web. 15 Oct 2019.

Vancouver:

Bhat SN. Studies In Micro Interconnections In Printed Wiring Board. [Internet] [Thesis]. Indian Institute of Science; 2008. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/2005/846.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bhat SN. Studies In Micro Interconnections In Printed Wiring Board. [Thesis]. Indian Institute of Science; 2008. Available from: http://hdl.handle.net/2005/846

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universidade do Rio Grande do Sul

9. Ocampo, Edwin José Figueroa. Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso.

Degree: 2017, Universidade do Rio Grande do Sul

As placas de circuito impresso (PCI) estão presentes em quase todos os equipamentos eletroeletrônicos (EEE) e são componentes fundamentais dos computadores. Estes dispositivos são compostos… (more)

Subjects/Keywords: E-waste recycling; Placa de circuito impresso; Reciclagem; Printed circuit boards; Cobre; Copper

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APA (6th Edition):

Ocampo, E. J. F. (2017). Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso. (Thesis). Universidade do Rio Grande do Sul. Retrieved from http://hdl.handle.net/10183/170949

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Ocampo, Edwin José Figueroa. “Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso.” 2017. Thesis, Universidade do Rio Grande do Sul. Accessed October 15, 2019. http://hdl.handle.net/10183/170949.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Ocampo, Edwin José Figueroa. “Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso.” 2017. Web. 15 Oct 2019.

Vancouver:

Ocampo EJF. Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso. [Internet] [Thesis]. Universidade do Rio Grande do Sul; 2017. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/10183/170949.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Ocampo EJF. Produção de pó de cobre eletrolítico a partir de resíduos de placas de circuito impresso. [Thesis]. Universidade do Rio Grande do Sul; 2017. Available from: http://hdl.handle.net/10183/170949

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Stellenbosch University

10. De Waal, Alicia. Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses.

Degree: MEng, Process Engineering, 2019, Stellenbosch University

 ENGLISH ABSTRACT: Various recycling technologies for metal production from electronic waste (e- waste) have been proposed in literature. Traditionally, pyrometallurgical processes are employed to recover… (more)

Subjects/Keywords: Exergy  – Analysis; UCTD; Electronic waste; Printed circuit  – Boards; Recycling (Waste); Hydrometallurgy; Product life cycle

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

De Waal, A. (2019). Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses. (Thesis). Stellenbosch University. Retrieved from http://hdl.handle.net/10019.1/106003

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

De Waal, Alicia. “Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses.” 2019. Thesis, Stellenbosch University. Accessed October 15, 2019. http://hdl.handle.net/10019.1/106003.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

De Waal, Alicia. “Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses.” 2019. Web. 15 Oct 2019.

Vancouver:

De Waal A. Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses. [Internet] [Thesis]. Stellenbosch University; 2019. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/10019.1/106003.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

De Waal A. Evaluating the efficiency of a metal recycling process by means of life cycle assessment and exergy analyses. [Thesis]. Stellenbosch University; 2019. Available from: http://hdl.handle.net/10019.1/106003

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

11. Lima, Ricardo Barbosa de. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).

Degree: Mestrado, Microeletrônica, 2011, University of São Paulo

Neste trabalho foram estudadas as etapas de processo envolvidas na tecnologia Pin-in-Paste (PIP) de soldagem por refusão de componentes convencionais (THCs - Through Hole Components… (more)

Subjects/Keywords: Circuito impresso; Electronic assembly; Lead-free; Lead-free; Montagem eletrônica; Pin-in-Paste; Pin-in-Paste; Printed circuit boards

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lima, R. B. d. (2011). Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;

Chicago Manual of Style (16th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Masters Thesis, University of São Paulo. Accessed October 15, 2019. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

MLA Handbook (7th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Web. 15 Oct 2019.

Vancouver:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Internet] [Masters thesis]. University of São Paulo; 2011. [cited 2019 Oct 15]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

Council of Science Editors:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Masters Thesis]. University of São Paulo; 2011. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;

12. Yamane, Luciana Harue. Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico.

Degree: PhD, Engenharia Metalúrgica e de Materiais, 2012, University of São Paulo

O consumo de produtos eletroeletrônicos, em especial de computadores pessoais, aliado ao avanço tecnológico, diminui a vida útil dos equipamentos a cada geração e o… (more)

Subjects/Keywords: A. ferrooxidans-LR.; A. ferrooxidans-LR.; Bioleaching; Biolixiviação; Metais; Metals; Placas de circuito impresso; Printed circuit boards; Reciclagem; Recycling

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APA (6th Edition):

Yamane, L. H. (2012). Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico. (Doctoral Dissertation). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3133/tde-07062013-154359/ ;

Chicago Manual of Style (16th Edition):

Yamane, Luciana Harue. “Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico.” 2012. Doctoral Dissertation, University of São Paulo. Accessed October 15, 2019. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-07062013-154359/ ;.

MLA Handbook (7th Edition):

Yamane, Luciana Harue. “Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico.” 2012. Web. 15 Oct 2019.

Vancouver:

Yamane LH. Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico. [Internet] [Doctoral dissertation]. University of São Paulo; 2012. [cited 2019 Oct 15]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3133/tde-07062013-154359/ ;.

Council of Science Editors:

Yamane LH. Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico. [Doctoral Dissertation]. University of São Paulo; 2012. Available from: http://www.teses.usp.br/teses/disponiveis/3/3133/tde-07062013-154359/ ;

13. Fernanda do Nascimento Stafford. Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas.

Degree: 2012, Universidade do Estado de Santa Catarina

The aim of this work is evaluate the effect of incorporation of waste printed circuit boards (WPCB) in physical and mechanical properties of triaxial ceramics… (more)

Subjects/Keywords: Placas de circuito impresso; Misturas cerâmicas; Experimentos com misturas; Propriedades cerâmicas; CERAMICA; Printed circuit boards; Ceramics mixtures; DOE; Ceramics properties

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APA (6th Edition):

Stafford, F. d. N. (2012). Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas. (Thesis). Universidade do Estado de Santa Catarina. Retrieved from http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2771 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2772 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2773 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2774 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2775

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Stafford, Fernanda do Nascimento. “Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas.” 2012. Thesis, Universidade do Estado de Santa Catarina. Accessed October 15, 2019. http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2771 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2772 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2773 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2774 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2775.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Stafford, Fernanda do Nascimento. “Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas.” 2012. Web. 15 Oct 2019.

Vancouver:

Stafford FdN. Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas. [Internet] [Thesis]. Universidade do Estado de Santa Catarina; 2012. [cited 2019 Oct 15]. Available from: http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2771 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2772 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2773 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2774 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2775.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Stafford FdN. Incorporação de resíduos de placas de circuitos impressos (RPCI) em massas cerâmicas triaxiais utilizando experimentos com misturas. [Thesis]. Universidade do Estado de Santa Catarina; 2012. Available from: http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2771 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2772 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2773 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2774 ; http://www.tede.udesc.br/tde_busca/arquivo.php?codArquivo=2775

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Missouri University of Science and Technology

14. Luyima, Alex. Recycling of electronic waste: printed wiring boards.

Degree: PhD, Materials Science and Engineering, Missouri University of Science and Technology

 "Pyrolysis and leaching are the dominant techniques applied in the recycling of waste printed wiring boards (PWBs). Waste PWB pyrolysis is a highly polluting technology… (more)

Subjects/Keywords: Printed Circuit Boards; Materials Science and Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Luyima, A. (n.d.). Recycling of electronic waste: printed wiring boards. (Doctoral Dissertation). Missouri University of Science and Technology. Retrieved from http://scholarsmine.mst.edu/doctoral_dissertations/2250

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Chicago Manual of Style (16th Edition):

Luyima, Alex. “Recycling of electronic waste: printed wiring boards.” Doctoral Dissertation, Missouri University of Science and Technology. Accessed October 15, 2019. http://scholarsmine.mst.edu/doctoral_dissertations/2250.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

MLA Handbook (7th Edition):

Luyima, Alex. “Recycling of electronic waste: printed wiring boards.” Web. 15 Oct 2019.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Vancouver:

Luyima A. Recycling of electronic waste: printed wiring boards. [Internet] [Doctoral dissertation]. Missouri University of Science and Technology; [cited 2019 Oct 15]. Available from: http://scholarsmine.mst.edu/doctoral_dissertations/2250.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Council of Science Editors:

Luyima A. Recycling of electronic waste: printed wiring boards. [Doctoral Dissertation]. Missouri University of Science and Technology; Available from: http://scholarsmine.mst.edu/doctoral_dissertations/2250

Note: this citation may be lacking information needed for this citation format:
No year of publication.


University of South Carolina

15. Jones, Christine Madden. Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards.

Degree: MS, Electrical Engineering, 2010, University of South Carolina

  Though the printed circuit board (PCB) industry advances much more slowly compared to silicon density, the signaling rates of PCBs must continue to scale… (more)

Subjects/Keywords: Electrical and Computer Engineering; Electrical and Electronics; Engineering; Absorption; Dielectric; High Frequency; Printed Circuit Boards; Resonance

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jones, C. M. (2010). Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards. (Masters Thesis). University of South Carolina. Retrieved from https://scholarcommons.sc.edu/etd/197

Chicago Manual of Style (16th Edition):

Jones, Christine Madden. “Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards.” 2010. Masters Thesis, University of South Carolina. Accessed October 15, 2019. https://scholarcommons.sc.edu/etd/197.

MLA Handbook (7th Edition):

Jones, Christine Madden. “Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards.” 2010. Web. 15 Oct 2019.

Vancouver:

Jones CM. Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards. [Internet] [Masters thesis]. University of South Carolina; 2010. [cited 2019 Oct 15]. Available from: https://scholarcommons.sc.edu/etd/197.

Council of Science Editors:

Jones CM. Measurement and Analysis of High Frequency Resonances In Printed Circuit Boards. [Masters Thesis]. University of South Carolina; 2010. Available from: https://scholarcommons.sc.edu/etd/197

16. Guo, Mengxi. Design of aromatic thermosetting polyester composites for thermally stable devices.

Degree: MS, 0130, 2015, University of Illinois – Urbana-Champaign

 Aromatic thermosetting copolyester (ATSP) has been under development since 1995 in Professor James Economy’s research group at the University of Illinois, Urbana-Champaign. It can be… (more)

Subjects/Keywords: aromatic thermosetting polyester; composites; printed circuit boards

…33 viii CHAPTER 1 INTRODUCTION 1.1 Printed Circuit Boards Printed circuit boards (… …x29; can be employed as the matrix for printed circuit boards. Study of ATSP/carbon fiber… …circuit boards is FR-4 which is made of epoxy/glass fiber. The typical engineering values are… …environment. Many other polymers have been tested as the resin for printed circuit board laminate… …carbon fiber or glass fiber composites for re-entry spaceship coating, circuit boards, aircraft… 

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APA (6th Edition):

Guo, M. (2015). Design of aromatic thermosetting polyester composites for thermally stable devices. (Thesis). University of Illinois – Urbana-Champaign. Retrieved from http://hdl.handle.net/2142/72863

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Guo, Mengxi. “Design of aromatic thermosetting polyester composites for thermally stable devices.” 2015. Thesis, University of Illinois – Urbana-Champaign. Accessed October 15, 2019. http://hdl.handle.net/2142/72863.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Guo, Mengxi. “Design of aromatic thermosetting polyester composites for thermally stable devices.” 2015. Web. 15 Oct 2019.

Vancouver:

Guo M. Design of aromatic thermosetting polyester composites for thermally stable devices. [Internet] [Thesis]. University of Illinois – Urbana-Champaign; 2015. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/2142/72863.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Guo M. Design of aromatic thermosetting polyester composites for thermally stable devices. [Thesis]. University of Illinois – Urbana-Champaign; 2015. Available from: http://hdl.handle.net/2142/72863

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

17. Hort, Marek. Konstrukce GPS přístroje .

Degree: 2010, Brno University of Technology

 Cílem předkládané diplomové práce bylo vytvořit zařízení schopné přijímat navigační data ze systému GPS. Tyto data následně ukládat do vlastní paměti a po připojení k… (more)

Subjects/Keywords: GPS modul; FPGA; PICOBLAZE; VHDL; aplikace pro PC; desky plošných spojů.; GPS modul; FPGA; PICOBLAZE; VHDL; PC application; printed circuit boards.

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APA (6th Edition):

Hort, M. (2010). Konstrukce GPS přístroje . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17126

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hort, Marek. “Konstrukce GPS přístroje .” 2010. Thesis, Brno University of Technology. Accessed October 15, 2019. http://hdl.handle.net/11012/17126.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hort, Marek. “Konstrukce GPS přístroje .” 2010. Web. 15 Oct 2019.

Vancouver:

Hort M. Konstrukce GPS přístroje . [Internet] [Thesis]. Brno University of Technology; 2010. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/11012/17126.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hort M. Konstrukce GPS přístroje . [Thesis]. Brno University of Technology; 2010. Available from: http://hdl.handle.net/11012/17126

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

18. Kollár, Pavel. Možnosti elektrického propojení součástek v automobilových zámcích .

Degree: 2011, Brno University of Technology

 V této práci jsou popsány možnosti elektrického propojení součástek v automobilových zámcích a v praktické části projektu je provedena aplikace elektricky vodivých plastů na zadaném… (more)

Subjects/Keywords: Elektricky vodivé plasty; 3D-MID; elektrické kabely; plošné spoje; STG vodiče; vstřikování plastů; vstřikovací forma; Electroconductive plastics materials; 3D-MID; electric cables; printed circuit boards; flexible circuit boards; lead frames; injection molding; injection mold

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APA (6th Edition):

Kollár, P. (2011). Možnosti elektrického propojení součástek v automobilových zámcích . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/18417

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kollár, Pavel. “Možnosti elektrického propojení součástek v automobilových zámcích .” 2011. Thesis, Brno University of Technology. Accessed October 15, 2019. http://hdl.handle.net/11012/18417.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kollár, Pavel. “Možnosti elektrického propojení součástek v automobilových zámcích .” 2011. Web. 15 Oct 2019.

Vancouver:

Kollár P. Možnosti elektrického propojení součástek v automobilových zámcích . [Internet] [Thesis]. Brno University of Technology; 2011. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/11012/18417.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kollár P. Možnosti elektrického propojení součástek v automobilových zámcích . [Thesis]. Brno University of Technology; 2011. Available from: http://hdl.handle.net/11012/18417

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Kentucky

19. Mantena, Keerthi Varma. ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's.

Degree: 2009, University of Kentucky

 Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface Mount Devices (SMD) in electronic assemblies. ECAs are mixtures of a polymer… (more)

Subjects/Keywords: Carbon nanotubes(CNTs); Electrically conductive adhesives(ECAs); Multi walled carbon nanotubes (MWCNTs); Printed Circuit Boards (PCB); epoxy; heloxy; Electrical and Computer Engineering

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APA (6th Edition):

Mantena, K. V. (2009). ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/gradschool_theses/613

Chicago Manual of Style (16th Edition):

Mantena, Keerthi Varma. “ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's.” 2009. Masters Thesis, University of Kentucky. Accessed October 15, 2019. http://uknowledge.uky.edu/gradschool_theses/613.

MLA Handbook (7th Edition):

Mantena, Keerthi Varma. “ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's.” 2009. Web. 15 Oct 2019.

Vancouver:

Mantena KV. ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's. [Internet] [Masters thesis]. University of Kentucky; 2009. [cited 2019 Oct 15]. Available from: http://uknowledge.uky.edu/gradschool_theses/613.

Council of Science Editors:

Mantena KV. ELECTRICAL AND MECHANICAL PROPERTIES OF MWCNT FILLED CONDUCTIVE ADHESIVES ON LEAD FREE SURFACE FINISHED PCB's. [Masters Thesis]. University of Kentucky; 2009. Available from: http://uknowledge.uky.edu/gradschool_theses/613


Stellenbosch University

20. Broeksma, Cara Philipa. Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste.

Degree: MEng, Process Engineering, 2018, Stellenbosch University

 ENGLISH SUMMARY: The recovery of metals from waste printed circuit boards (PCBs), a key component in electronic equipment, is beneficial from both an environmental and… (more)

Subjects/Keywords: Precious metals  – Leaching; Recycling (Waste, etc); Metals wastes  – Recycling; Printed circuit boards  – Recycling; Amino acids leaching process; Glycine; Leaching  – Environmental aspects; UCTD

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APA (6th Edition):

Broeksma, C. P. (2018). Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste. (Thesis). Stellenbosch University. Retrieved from http://hdl.handle.net/10019.1/103502

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Broeksma, Cara Philipa. “Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste.” 2018. Thesis, Stellenbosch University. Accessed October 15, 2019. http://hdl.handle.net/10019.1/103502.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Broeksma, Cara Philipa. “Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste.” 2018. Web. 15 Oct 2019.

Vancouver:

Broeksma CP. Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste. [Internet] [Thesis]. Stellenbosch University; 2018. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/10019.1/103502.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Broeksma CP. Evaluating the applicability of an alkaline amino acid leaching process for base and precious metal leaching from printed circuit board waste. [Thesis]. Stellenbosch University; 2018. Available from: http://hdl.handle.net/10019.1/103502

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

21. Kakos, Spyridon. Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών.

Degree: 2014, National Technical University of Athens (NTUA); Εθνικό Μετσόβιο Πολυτεχνείο (ΕΜΠ)

In the context of this thesis I investigated the use of conductive polymers of pyrrole in high-technology applications and more specifically in surface modification. We… (more)

Subjects/Keywords: Πολυπυρρόλη; Αγώγιμα πολυμερή; Πυρρόλη; Τυπωμένα κυκλώματα; Επιμετάλλωση; Επιχάλκωση οπών; Τροποποίηση επιφανειών; Πολυμερή; PPy; Polymers; Polypyrroles; Pyrrole; Printed Circuit Boards; Insulators metallization; Through-hole plating; Surface modification

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APA (6th Edition):

Kakos, S. (2014). Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών. (Thesis). National Technical University of Athens (NTUA); Εθνικό Μετσόβιο Πολυτεχνείο (ΕΜΠ). Retrieved from http://hdl.handle.net/10442/hedi/42234

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kakos, Spyridon. “Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών.” 2014. Thesis, National Technical University of Athens (NTUA); Εθνικό Μετσόβιο Πολυτεχνείο (ΕΜΠ). Accessed October 15, 2019. http://hdl.handle.net/10442/hedi/42234.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kakos, Spyridon. “Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών.” 2014. Web. 15 Oct 2019.

Vancouver:

Kakos S. Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών. [Internet] [Thesis]. National Technical University of Athens (NTUA); Εθνικό Μετσόβιο Πολυτεχνείο (ΕΜΠ); 2014. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/10442/hedi/42234.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kakos S. Αγώγιμα πολυμερή της πυρρόλης: εφαρμογές στην τροποποίηση επιφανειών. [Thesis]. National Technical University of Athens (NTUA); Εθνικό Μετσόβιο Πολυτεχνείο (ΕΜΠ); 2014. Available from: http://hdl.handle.net/10442/hedi/42234

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Lorraine

22. Girard, Gautier. Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications.

Degree: Docteur es, Sciences des matériaux, 2018, Université de Lorraine

La thèse s’intéresse au comportement thermomécanique des circuits imprimés pour des applications spatiales hyperfréquences. Dans cette étude, les circuits imprimés sont des assemblages multi-matériaux faisant… (more)

Subjects/Keywords: Circuits-imprimés; Modélisation thermomécanique; Éléments finis; Homogénéisation numérique; Composites; Cuivre; Printed circuit boards; Thermomechanical modeling; Finite elements; Numerical homogenization; Composites; Copper; 621.381 53; 620.112 6

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APA (6th Edition):

Girard, G. (2018). Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications. (Doctoral Dissertation). Université de Lorraine. Retrieved from http://www.theses.fr/2018LORR0170

Chicago Manual of Style (16th Edition):

Girard, Gautier. “Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications.” 2018. Doctoral Dissertation, Université de Lorraine. Accessed October 15, 2019. http://www.theses.fr/2018LORR0170.

MLA Handbook (7th Edition):

Girard, Gautier. “Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications.” 2018. Web. 15 Oct 2019.

Vancouver:

Girard G. Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications. [Internet] [Doctoral dissertation]. Université de Lorraine; 2018. [cited 2019 Oct 15]. Available from: http://www.theses.fr/2018LORR0170.

Council of Science Editors:

Girard G. Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes : Thermo-mechanical characterization and modelling of printed circuit boards with high frequency space applications. [Doctoral Dissertation]. Université de Lorraine; 2018. Available from: http://www.theses.fr/2018LORR0170


University of Central Florida

23. Maamoun, Adam Y. A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards.

Degree: 2008, University of Central Florida

  The objective of this research is to determine and develop a model that is capable of accurately measuring customer satisfaction for different industries and… (more)

Subjects/Keywords: Printed Wiring Boards; PWB; PCB; Quality; ISO; Customer Satisfaction; Printed Circuit Board; Engineering; Industrial Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Maamoun, A. Y. (2008). A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards. (Doctoral Dissertation). University of Central Florida. Retrieved from https://stars.library.ucf.edu/etd/3647

Chicago Manual of Style (16th Edition):

Maamoun, Adam Y. “A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards.” 2008. Doctoral Dissertation, University of Central Florida. Accessed October 15, 2019. https://stars.library.ucf.edu/etd/3647.

MLA Handbook (7th Edition):

Maamoun, Adam Y. “A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards.” 2008. Web. 15 Oct 2019.

Vancouver:

Maamoun AY. A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards. [Internet] [Doctoral dissertation]. University of Central Florida; 2008. [cited 2019 Oct 15]. Available from: https://stars.library.ucf.edu/etd/3647.

Council of Science Editors:

Maamoun AY. A Surrogate Measure Of Customer Satisfaction In The Manufacture Of Printed Wiring Boards. [Doctoral Dissertation]. University of Central Florida; 2008. Available from: https://stars.library.ucf.edu/etd/3647


Missouri University of Science and Technology

24. Shringarpure, Ketan. Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links.

Degree: PhD, Electrical Engineering, Missouri University of Science and Technology

  "High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale of integration goes smaller. With the smaller bit… (more)

Subjects/Keywords: High speed digital sysytems; Lumped circuit model for printed circuit boards; Power distribution networks; Statistical crosstalk analysis; Electrical and Computer Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Shringarpure, K. (n.d.). Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links. (Doctoral Dissertation). Missouri University of Science and Technology. Retrieved from http://scholarsmine.mst.edu/doctoral_dissertations/2394

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Chicago Manual of Style (16th Edition):

Shringarpure, Ketan. “Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links.” Doctoral Dissertation, Missouri University of Science and Technology. Accessed October 15, 2019. http://scholarsmine.mst.edu/doctoral_dissertations/2394.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

MLA Handbook (7th Edition):

Shringarpure, Ketan. “Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links.” Web. 15 Oct 2019.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Vancouver:

Shringarpure K. Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links. [Internet] [Doctoral dissertation]. Missouri University of Science and Technology; [cited 2019 Oct 15]. Available from: http://scholarsmine.mst.edu/doctoral_dissertations/2394.

Note: this citation may be lacking information needed for this citation format:
No year of publication.

Council of Science Editors:

Shringarpure K. Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links. [Doctoral Dissertation]. Missouri University of Science and Technology; Available from: http://scholarsmine.mst.edu/doctoral_dissertations/2394

Note: this citation may be lacking information needed for this citation format:
No year of publication.

25. Wang, Fengtao. Optical interconnects on printed circuit boards.

Degree: PhD, Electrical and Computer Engineering, 2010, Georgia Tech

 The ever-increasing need for higher bandwidth and density is one of the motivations for extensive research on planar optoelectronic structures on printed circuit board (PCB)… (more)

Subjects/Keywords: Polymer optical waveguides; Printed circuit boards; Optical interconnects; Micro-mirrors; Printed circuits; Photolithography; Optoelectronic devices; Integrated optics

…Numerical Aperture PCB Printed Circuit Board PLC Planar Lightwave Circuits PRC Packaging… …extensive research on planar optoelectronic structures on printed circuit board (PCB)… …efficient out-of-plane couplers for optical interconnects on printed circuit board substrates, as… …photolithography is commonly used in printed circuit and semiconductor fabrication, micro-electro… …third spatial dimension for beam propagation. The space between two circuit boards that need… 

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, F. (2010). Optical interconnects on printed circuit boards. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/37133

Chicago Manual of Style (16th Edition):

Wang, Fengtao. “Optical interconnects on printed circuit boards.” 2010. Doctoral Dissertation, Georgia Tech. Accessed October 15, 2019. http://hdl.handle.net/1853/37133.

MLA Handbook (7th Edition):

Wang, Fengtao. “Optical interconnects on printed circuit boards.” 2010. Web. 15 Oct 2019.

Vancouver:

Wang F. Optical interconnects on printed circuit boards. [Internet] [Doctoral dissertation]. Georgia Tech; 2010. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/1853/37133.

Council of Science Editors:

Wang F. Optical interconnects on printed circuit boards. [Doctoral Dissertation]. Georgia Tech; 2010. Available from: http://hdl.handle.net/1853/37133


Brunel University

26. Dick, Jochen Helmut. Cost modelling and concurrent engineering for testable design.

Degree: 1993, Brunel University

 As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices.… (more)

Subjects/Keywords: 658.2; Integrated circuits; Printed circuit boards; Complex electronic systems; Automatic test systems; Production test strategy

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APA (6th Edition):

Dick, J. H. (1993). Cost modelling and concurrent engineering for testable design. (Doctoral Dissertation). Brunel University. Retrieved from http://bura.brunel.ac.uk/handle/2438/5284 ; http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.333389

Chicago Manual of Style (16th Edition):

Dick, Jochen Helmut. “Cost modelling and concurrent engineering for testable design.” 1993. Doctoral Dissertation, Brunel University. Accessed October 15, 2019. http://bura.brunel.ac.uk/handle/2438/5284 ; http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.333389.

MLA Handbook (7th Edition):

Dick, Jochen Helmut. “Cost modelling and concurrent engineering for testable design.” 1993. Web. 15 Oct 2019.

Vancouver:

Dick JH. Cost modelling and concurrent engineering for testable design. [Internet] [Doctoral dissertation]. Brunel University; 1993. [cited 2019 Oct 15]. Available from: http://bura.brunel.ac.uk/handle/2438/5284 ; http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.333389.

Council of Science Editors:

Dick JH. Cost modelling and concurrent engineering for testable design. [Doctoral Dissertation]. Brunel University; 1993. Available from: http://bura.brunel.ac.uk/handle/2438/5284 ; http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.333389


Brno University of Technology

27. Susko, Petr. Výrobní logistika výroby desek plošných spojů .

Degree: 2013, Brno University of Technology

 Diplomová práce se zabývá návrhem nového provozu na výrobu desek plošných spojů s kapacitou 40 000 m2 ročně. Popisuje základní principy návrhu nové výroby, principy… (more)

Subjects/Keywords: Výrobní logistika; S.L.P.; rozmisťování výroby; desky plošných spojů; kapacitní propočty; 3D vizualizace; výroba; materiálový tok; náklady; EMS; odpady; ekonomické zhodnocení; Production logistics; SLP; deployment of production; printed circuit boards; capacity calculations; 3D visualization; production; material flow; cost; EMS; waste management; economic evaluation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Susko, P. (2013). Výrobní logistika výroby desek plošných spojů . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/25166

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Susko, Petr. “Výrobní logistika výroby desek plošných spojů .” 2013. Thesis, Brno University of Technology. Accessed October 15, 2019. http://hdl.handle.net/11012/25166.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Susko, Petr. “Výrobní logistika výroby desek plošných spojů .” 2013. Web. 15 Oct 2019.

Vancouver:

Susko P. Výrobní logistika výroby desek plošných spojů . [Internet] [Thesis]. Brno University of Technology; 2013. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/11012/25166.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Susko P. Výrobní logistika výroby desek plošných spojů . [Thesis]. Brno University of Technology; 2013. Available from: http://hdl.handle.net/11012/25166

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

28. Schenk, David. Optimalizace desky plošného spoje pro výkonovou LED .

Degree: 2013, Brno University of Technology

 Tato diplomová práce se zabývá problematikou přenosu tepla na deskách plošných spojů. První část práce se skládá z teoretického rozboru všech principů vedení tepla v… (more)

Subjects/Keywords: Teplotní simulace; tepelný odpor; pokovené otvory; LED; tepelný management; tepelná vodivost; desky plošných spojů; FR4; ANSYS® Workbench™; Thermal simulation; thermal resistance; vias; LED; thermal management; thermal conductivity; printed circuit boards; FR4; ANSYS® Workbench™

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Schenk, D. (2013). Optimalizace desky plošného spoje pro výkonovou LED . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/26987

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Schenk, David. “Optimalizace desky plošného spoje pro výkonovou LED .” 2013. Thesis, Brno University of Technology. Accessed October 15, 2019. http://hdl.handle.net/11012/26987.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Schenk, David. “Optimalizace desky plošného spoje pro výkonovou LED .” 2013. Web. 15 Oct 2019.

Vancouver:

Schenk D. Optimalizace desky plošného spoje pro výkonovou LED . [Internet] [Thesis]. Brno University of Technology; 2013. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/11012/26987.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Schenk D. Optimalizace desky plošného spoje pro výkonovou LED . [Thesis]. Brno University of Technology; 2013. Available from: http://hdl.handle.net/11012/26987

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


ETH Zürich

29. Fassini, Mario G. Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce.

Degree: 1965, ETH Zürich

Subjects/Keywords: LEITERPLATTEN + PLATINEN (MIKROELEKTRONIK); IMPULSVERFAHREN (ELEKTRISCHE SCHWINGUNGSTECHNIK); PRINTED WIRING BOARDS, PWB + PRINTED CIRCUIT BOARDS, PCB (MICROELECTRONICS); PULSE PROCESSES (ELECTRICAL OSCILLATION TECHNOLOGY); info:eu-repo/classification/ddc/621.3; info:eu-repo/classification/ddc/621.3; Electric engineering; Electric engineering

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APA (6th Edition):

Fassini, M. G. (1965). Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce. (Doctoral Dissertation). ETH Zürich. Retrieved from http://hdl.handle.net/20.500.11850/136806

Chicago Manual of Style (16th Edition):

Fassini, Mario G. “Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce.” 1965. Doctoral Dissertation, ETH Zürich. Accessed October 15, 2019. http://hdl.handle.net/20.500.11850/136806.

MLA Handbook (7th Edition):

Fassini, Mario G. “Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce.” 1965. Web. 15 Oct 2019.

Vancouver:

Fassini MG. Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce. [Internet] [Doctoral dissertation]. ETH Zürich; 1965. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/20.500.11850/136806.

Council of Science Editors:

Fassini MG. Impiego di circuiti e componenti stampati nella tecnica impulsiva veloce. [Doctoral Dissertation]. ETH Zürich; 1965. Available from: http://hdl.handle.net/20.500.11850/136806


Brno University of Technology

30. Uhlář, Vít. Tavidlové zbytky po pájení přetavením .

Degree: 2012, Brno University of Technology

 Cílem této bakalářské práce je seznámit se s problematikou tavidlových zbytků vzniklých po pájení přetavením ve vztahu k deskám plošných spojů. První část se zabývá… (more)

Subjects/Keywords: Deska plošných spojů; tavidlové zbytky; pájení přetavením; elektromigrace; teplotní profil; pájecí pasta; tavidlo; povrchový izolační odpor; ionizovatelné nečistoty; odpor výluhu roztoku; roztékavost; ztrátový činitel.; Printed circuit boards; flux residues; reflow soldering; electromigration; temperature profile; solder paste; flux; surface insulation resistance; ionic contamination; Resistivity Of Solvent Extract; wetting; loss factor.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Uhlář, V. (2012). Tavidlové zbytky po pájení přetavením . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12133

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Uhlář, Vít. “Tavidlové zbytky po pájení přetavením .” 2012. Thesis, Brno University of Technology. Accessed October 15, 2019. http://hdl.handle.net/11012/12133.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Uhlář, Vít. “Tavidlové zbytky po pájení přetavením .” 2012. Web. 15 Oct 2019.

Vancouver:

Uhlář V. Tavidlové zbytky po pájení přetavením . [Internet] [Thesis]. Brno University of Technology; 2012. [cited 2019 Oct 15]. Available from: http://hdl.handle.net/11012/12133.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Uhlář V. Tavidlové zbytky po pájení přetavením . [Thesis]. Brno University of Technology; 2012. Available from: http://hdl.handle.net/11012/12133

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

[1] [2]

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