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You searched for subject:(Metallization). Showing records 1 – 30 of 105 total matches.

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University of Alberta

1. Dalili, Neda. Design of Amorphous Diffusion Barriers for Cu Metallization.

Degree: PhD, Department of Chemical and Materials Engineering, 2013, University of Alberta

 The incorporation of Cu interconnects into the manufacturing of integrated circuits has accompanied several modifications to the fabrication process and the associated material systems. The… (more)

Subjects/Keywords: Diffusion Barrier; Tantalum; Copper Metallization; Rhodium

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APA (6th Edition):

Dalili, N. (2013). Design of Amorphous Diffusion Barriers for Cu Metallization. (Doctoral Dissertation). University of Alberta. Retrieved from https://era.library.ualberta.ca/files/0k225c07q

Chicago Manual of Style (16th Edition):

Dalili, Neda. “Design of Amorphous Diffusion Barriers for Cu Metallization.” 2013. Doctoral Dissertation, University of Alberta. Accessed April 04, 2020. https://era.library.ualberta.ca/files/0k225c07q.

MLA Handbook (7th Edition):

Dalili, Neda. “Design of Amorphous Diffusion Barriers for Cu Metallization.” 2013. Web. 04 Apr 2020.

Vancouver:

Dalili N. Design of Amorphous Diffusion Barriers for Cu Metallization. [Internet] [Doctoral dissertation]. University of Alberta; 2013. [cited 2020 Apr 04]. Available from: https://era.library.ualberta.ca/files/0k225c07q.

Council of Science Editors:

Dalili N. Design of Amorphous Diffusion Barriers for Cu Metallization. [Doctoral Dissertation]. University of Alberta; 2013. Available from: https://era.library.ualberta.ca/files/0k225c07q


University of Toronto

2. Yaremko, Adam Allan. Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures.

Degree: 2018, University of Toronto

Nanocrystalline nickel can be electrodeposited on a structurally efficient polymer core to create lightweight load bearing structures. The polymer core is made by jetted photopolymer,… (more)

Subjects/Keywords: electrodeposition; hybrid materials; jetted photopolymer; metallization; 0794

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APA (6th Edition):

Yaremko, A. A. (2018). Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/89631

Chicago Manual of Style (16th Edition):

Yaremko, Adam Allan. “Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures.” 2018. Masters Thesis, University of Toronto. Accessed April 04, 2020. http://hdl.handle.net/1807/89631.

MLA Handbook (7th Edition):

Yaremko, Adam Allan. “Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures.” 2018. Web. 04 Apr 2020.

Vancouver:

Yaremko AA. Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures. [Internet] [Masters thesis]. University of Toronto; 2018. [cited 2020 Apr 04]. Available from: http://hdl.handle.net/1807/89631.

Council of Science Editors:

Yaremko AA. Metallization and Characterization of Nanocrystalline Nickel Coated Jetted Photopolymer Structures. [Masters Thesis]. University of Toronto; 2018. Available from: http://hdl.handle.net/1807/89631


University of New Mexico

3. Leger, Jon-Claude. Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization.

Degree: Mechanical Engineering, 2015, University of New Mexico

 This thesis presents reliability analysis of indium interconnects and Under Bump Metallization (UBM) in flip chip devices. Flip chip assemblies with the use of bump… (more)

Subjects/Keywords: Reliability; Microelectronics; Indium; Under Bump Metallization

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APA (6th Edition):

Leger, J. (2015). Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization. (Masters Thesis). University of New Mexico. Retrieved from http://hdl.handle.net/1928/30347

Chicago Manual of Style (16th Edition):

Leger, Jon-Claude. “Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization.” 2015. Masters Thesis, University of New Mexico. Accessed April 04, 2020. http://hdl.handle.net/1928/30347.

MLA Handbook (7th Edition):

Leger, Jon-Claude. “Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization.” 2015. Web. 04 Apr 2020.

Vancouver:

Leger J. Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization. [Internet] [Masters thesis]. University of New Mexico; 2015. [cited 2020 Apr 04]. Available from: http://hdl.handle.net/1928/30347.

Council of Science Editors:

Leger J. Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization. [Masters Thesis]. University of New Mexico; 2015. Available from: http://hdl.handle.net/1928/30347


University of New South Wales

4. Lin, Dong. Advanced metallization for screen-printed solar cells.

Degree: Photovoltaics & Renewable Energy Engineering, 2014, University of New South Wales

 Solar cells with screen printed metallization have been dominating the PV market for decades due to thewell understood and robust fabrication process and the readily… (more)

Subjects/Keywords: PERL; Silicon solar cell; PERC; Metallization; Laser doping

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APA (6th Edition):

Lin, D. (2014). Advanced metallization for screen-printed solar cells. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/54853 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:36057/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Lin, Dong. “Advanced metallization for screen-printed solar cells.” 2014. Doctoral Dissertation, University of New South Wales. Accessed April 04, 2020. http://handle.unsw.edu.au/1959.4/54853 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:36057/SOURCE02?view=true.

MLA Handbook (7th Edition):

Lin, Dong. “Advanced metallization for screen-printed solar cells.” 2014. Web. 04 Apr 2020.

Vancouver:

Lin D. Advanced metallization for screen-printed solar cells. [Internet] [Doctoral dissertation]. University of New South Wales; 2014. [cited 2020 Apr 04]. Available from: http://handle.unsw.edu.au/1959.4/54853 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:36057/SOURCE02?view=true.

Council of Science Editors:

Lin D. Advanced metallization for screen-printed solar cells. [Doctoral Dissertation]. University of New South Wales; 2014. Available from: http://handle.unsw.edu.au/1959.4/54853 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:36057/SOURCE02?view=true


Arizona State University

5. Chen, Wenhao. Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications.

Degree: Electrical Engineering, 2017, Arizona State University

 The Programmable Metallization Cell (PMC) is a novel solid-state resistive switching technology. It has a simple metal-insulator-metal “MIM” structure with one metal being electrochemically active… (more)

Subjects/Keywords: Electrical engineering; CBRAM; Cu; Programmable Metallization Cell; resistive switching; RRAM; Silica

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APA (6th Edition):

Chen, W. (2017). Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications. (Doctoral Dissertation). Arizona State University. Retrieved from http://repository.asu.edu/items/44992

Chicago Manual of Style (16th Edition):

Chen, Wenhao. “Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications.” 2017. Doctoral Dissertation, Arizona State University. Accessed April 04, 2020. http://repository.asu.edu/items/44992.

MLA Handbook (7th Edition):

Chen, Wenhao. “Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications.” 2017. Web. 04 Apr 2020.

Vancouver:

Chen W. Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications. [Internet] [Doctoral dissertation]. Arizona State University; 2017. [cited 2020 Apr 04]. Available from: http://repository.asu.edu/items/44992.

Council of Science Editors:

Chen W. Cu-Silica Based Programmable Metallization Cell: Fabrication, Characterization and Applications. [Doctoral Dissertation]. Arizona State University; 2017. Available from: http://repository.asu.edu/items/44992


Arizona State University

6. Venkatesh, Srilakshmi Hosadurga. Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization.

Degree: MS, Materials Science and Engineering, 2010, Arizona State University

 Miedema's plot is used to select the Cu/metal barrier for Cu metallization.The Cu/metal barrier system selected should have positive heat of formation (Hf) so that… (more)

Subjects/Keywords: Materials Science; Adhesion; Copper Metallization; Copper Ruthenium; Diffusion Barrier; Miedema

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APA (6th Edition):

Venkatesh, S. H. (2010). Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization. (Masters Thesis). Arizona State University. Retrieved from http://repository.asu.edu/items/8754

Chicago Manual of Style (16th Edition):

Venkatesh, Srilakshmi Hosadurga. “Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization.” 2010. Masters Thesis, Arizona State University. Accessed April 04, 2020. http://repository.asu.edu/items/8754.

MLA Handbook (7th Edition):

Venkatesh, Srilakshmi Hosadurga. “Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization.” 2010. Web. 04 Apr 2020.

Vancouver:

Venkatesh SH. Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization. [Internet] [Masters thesis]. Arizona State University; 2010. [cited 2020 Apr 04]. Available from: http://repository.asu.edu/items/8754.

Council of Science Editors:

Venkatesh SH. Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization. [Masters Thesis]. Arizona State University; 2010. Available from: http://repository.asu.edu/items/8754


INP Toulouse

7. Addou, Fouzi. Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process.

Degree: Docteur es, Science et Génie des Matériaux, 2017, INP Toulouse

 La fabrication de guides d’ondes à partir d’un matériau composite CFRP isolant, nécessite de rendre la surface interne conductrice électriquement. Cela peut s’effectuer par métallisation,… (more)

Subjects/Keywords: Métallisation; Composite; Matériaux; Revêtement; Metallization; Composite; Materials; Coating

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APA (6th Edition):

Addou, F. (2017). Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2017INPT0081

Chicago Manual of Style (16th Edition):

Addou, Fouzi. “Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process.” 2017. Doctoral Dissertation, INP Toulouse. Accessed April 04, 2020. http://www.theses.fr/2017INPT0081.

MLA Handbook (7th Edition):

Addou, Fouzi. “Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process.” 2017. Web. 04 Apr 2020.

Vancouver:

Addou F. Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process. [Internet] [Doctoral dissertation]. INP Toulouse; 2017. [cited 2020 Apr 04]. Available from: http://www.theses.fr/2017INPT0081.

Council of Science Editors:

Addou F. Métallisation de guide d'onde en matériau composite à matrice époxy par un procédé DLI-MOCVD : Metallization of epoxy matrix composite waveguides by a DLI-MOCVD process. [Doctoral Dissertation]. INP Toulouse; 2017. Available from: http://www.theses.fr/2017INPT0081

8. Dupenne, David. Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose.

Degree: Docteur es, Sciences et génie des matériaux, 2017, Université Toulouse III – Paul Sabatier

Ces travaux décrivent la réalisation et l'étude d'un procédé original permettant la métallisation de surface de substrats à matrice polymère chargés fibres de carbone (CFRP)… (more)

Subjects/Keywords: Métallisation; Polymère; Surface; Blindage électromagnétique; Metallization; Polymer; Surface; Electromagnetic shielding

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APA (6th Edition):

Dupenne, D. (2017). Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose. (Doctoral Dissertation). Université Toulouse III – Paul Sabatier. Retrieved from http://www.theses.fr/2017TOU30336

Chicago Manual of Style (16th Edition):

Dupenne, David. “Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose.” 2017. Doctoral Dissertation, Université Toulouse III – Paul Sabatier. Accessed April 04, 2020. http://www.theses.fr/2017TOU30336.

MLA Handbook (7th Edition):

Dupenne, David. “Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose.” 2017. Web. 04 Apr 2020.

Vancouver:

Dupenne D. Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose. [Internet] [Doctoral dissertation]. Université Toulouse III – Paul Sabatier; 2017. [cited 2020 Apr 04]. Available from: http://www.theses.fr/2017TOU30336.

Council of Science Editors:

Dupenne D. Conception d'un revêtement conducteur extrinsèque polymère/fils submicroniques d'argent : application à la métallisation de substrat thermodurcissable chargé fibres de carbone à finalité spatiale : Design of a polymer extrinsic conductive coating - silver nanowires : application to the metallization of thermosetting substrate filled with carbon fibers for spatial purpose. [Doctoral Dissertation]. Université Toulouse III – Paul Sabatier; 2017. Available from: http://www.theses.fr/2017TOU30336

9. Cotte, Stéphane. Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices.

Degree: Docteur es, Chimie-analytique, 2010, Université Claude Bernard – Lyon I

Le travail de thèse a consisté à développer des voies originales de microfabrication pour laconception d’électrodes qui pourront être utilisées dans un biocapteur basé sur… (more)

Subjects/Keywords: Microfabrication; Transduction électrochimique; Biocapteur; Métallisation; Micro fabrication; Electrochemical transduction; Biosensor; Metallization; 543

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APA (6th Edition):

Cotte, S. (2010). Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices. (Doctoral Dissertation). Université Claude Bernard – Lyon I. Retrieved from http://www.theses.fr/2010LYO10205

Chicago Manual of Style (16th Edition):

Cotte, Stéphane. “Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices.” 2010. Doctoral Dissertation, Université Claude Bernard – Lyon I. Accessed April 04, 2020. http://www.theses.fr/2010LYO10205.

MLA Handbook (7th Edition):

Cotte, Stéphane. “Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices.” 2010. Web. 04 Apr 2020.

Vancouver:

Cotte S. Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices. [Internet] [Doctoral dissertation]. Université Claude Bernard – Lyon I; 2010. [cited 2020 Apr 04]. Available from: http://www.theses.fr/2010LYO10205.

Council of Science Editors:

Cotte S. Développement de technologies de fabrication de microélectrodes sur support microfluidique par des méthodes de lithographie douce : Development of microelectrodes using soft lithographic methods for the integration of biosensors in microfluidic devices. [Doctoral Dissertation]. Université Claude Bernard – Lyon I; 2010. Available from: http://www.theses.fr/2010LYO10205


Universidade do Rio Grande do Norte

10. Silva, João Moreno Vilas Boas de Souza. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .

Degree: 2011, Universidade do Rio Grande do Norte

 Metal/ceramic interfaces using zirconia have dominated the industrial applications in the last decade, due to the high mechanical strength and fracture toughness of zirconia, especially… (more)

Subjects/Keywords: Brasagem; Zircônia; Metalização mecânica; União metal; Cerâmica; Brazing; Zirconia; Mechanical metallization; Metal; Ceramic joining

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APA (6th Edition):

Silva, J. M. V. B. d. S. (2011). Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . (Doctoral Dissertation). Universidade do Rio Grande do Norte. Retrieved from http://repositorio.ufrn.br/handle/123456789/15581

Chicago Manual of Style (16th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .” 2011. Doctoral Dissertation, Universidade do Rio Grande do Norte. Accessed April 04, 2020. http://repositorio.ufrn.br/handle/123456789/15581.

MLA Handbook (7th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .” 2011. Web. 04 Apr 2020.

Vancouver:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . [Internet] [Doctoral dissertation]. Universidade do Rio Grande do Norte; 2011. [cited 2020 Apr 04]. Available from: http://repositorio.ufrn.br/handle/123456789/15581.

Council of Science Editors:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . [Doctoral Dissertation]. Universidade do Rio Grande do Norte; 2011. Available from: http://repositorio.ufrn.br/handle/123456789/15581


Universidade do Rio Grande do Norte

11. Silva, João Moreno Vilas Boas de Souza. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .

Degree: 2011, Universidade do Rio Grande do Norte

 Metal/ceramic interfaces using zirconia have dominated the industrial applications in the last decade, due to the high mechanical strength and fracture toughness of zirconia, especially… (more)

Subjects/Keywords: Brasagem; Zircônia; Metalização mecânica; União metal; Cerâmica; Brazing; Zirconia; Mechanical metallization; Metal; Ceramic joining

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APA (6th Edition):

Silva, J. M. V. B. d. S. (2011). Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . (Thesis). Universidade do Rio Grande do Norte. Retrieved from http://repositorio.ufrn.br/handle/123456789/15581

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .” 2011. Thesis, Universidade do Rio Grande do Norte. Accessed April 04, 2020. http://repositorio.ufrn.br/handle/123456789/15581.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo .” 2011. Web. 04 Apr 2020.

Vancouver:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . [Internet] [Thesis]. Universidade do Rio Grande do Norte; 2011. [cited 2020 Apr 04]. Available from: http://repositorio.ufrn.br/handle/123456789/15581.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo . [Thesis]. Universidade do Rio Grande do Norte; 2011. Available from: http://repositorio.ufrn.br/handle/123456789/15581

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

12. Tung, Huan-Chien. The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors.

Degree: PhD, Materials and Optoelectronic Science, 2014, NSYSU

 The present paper discusses the application of the silicon-aluminum and its chemical compound thin film applied on non conductive vacuum metallization (NCVM) and passivation layer… (more)

Subjects/Keywords: Si-Al target; passivation; a-IGZO TFTs; non conductive vacuum metallization; nano particle

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APA (6th Edition):

Tung, H. (2014). The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627114-154256

Chicago Manual of Style (16th Edition):

Tung, Huan-Chien. “The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors.” 2014. Doctoral Dissertation, NSYSU. Accessed April 04, 2020. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627114-154256.

MLA Handbook (7th Edition):

Tung, Huan-Chien. “The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors.” 2014. Web. 04 Apr 2020.

Vancouver:

Tung H. The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors. [Internet] [Doctoral dissertation]. NSYSU; 2014. [cited 2020 Apr 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627114-154256.

Council of Science Editors:

Tung H. The preparation and optical properties of Si-Al thin films and their applications on the passivation of thin film transistors. [Doctoral Dissertation]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627114-154256


Osaka University

13. Nguyen, Huyen Thi Le. Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ.

Degree: 博士(理学), 2012, Osaka University

博士(理学)

2012-03-22

大阪大学

14401甲第15519号

25255

Subjects/Keywords: hydride; pressure-induced resistance; metallization; superconductivity

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APA (6th Edition):

Nguyen, H. T. L. (2012). Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ. (Thesis). Osaka University. Retrieved from http://hdl.handle.net/11094/26848

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nguyen, Huyen Thi Le. “Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ.” 2012. Thesis, Osaka University. Accessed April 04, 2020. http://hdl.handle.net/11094/26848.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nguyen, Huyen Thi Le. “Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ.” 2012. Web. 04 Apr 2020.

Vancouver:

Nguyen HTL. Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ. [Internet] [Thesis]. Osaka University; 2012. [cited 2020 Apr 04]. Available from: http://hdl.handle.net/11094/26848.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nguyen HTL. Pressure-induced metallic phase of hydrogen-rich systems : 高密度水素化物質における圧力誘起金属状態; コウミツド スイソカ ブッシツ ニ オケル アツリョク ユウキ キンゾク ジョウタイ. [Thesis]. Osaka University; 2012. Available from: http://hdl.handle.net/11094/26848

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Arkansas

14. Wei, Xingfei. Tin Sensitization For Electroless Plating.

Degree: MSChE, 2013, University of Arkansas

  The tin sensitization process has been used in electroless plating since 1940s Brenner and Riddell developed the electroless plating for surface metallization method. It… (more)

Subjects/Keywords: Applied sciences; Electroless plating; Metallization; Tin; Organic Chemistry; Process Control and Systems

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APA (6th Edition):

Wei, X. (2013). Tin Sensitization For Electroless Plating. (Masters Thesis). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/976

Chicago Manual of Style (16th Edition):

Wei, Xingfei. “Tin Sensitization For Electroless Plating.” 2013. Masters Thesis, University of Arkansas. Accessed April 04, 2020. https://scholarworks.uark.edu/etd/976.

MLA Handbook (7th Edition):

Wei, Xingfei. “Tin Sensitization For Electroless Plating.” 2013. Web. 04 Apr 2020.

Vancouver:

Wei X. Tin Sensitization For Electroless Plating. [Internet] [Masters thesis]. University of Arkansas; 2013. [cited 2020 Apr 04]. Available from: https://scholarworks.uark.edu/etd/976.

Council of Science Editors:

Wei X. Tin Sensitization For Electroless Plating. [Masters Thesis]. University of Arkansas; 2013. Available from: https://scholarworks.uark.edu/etd/976


New Jersey Institute of Technology

15. Mehta, Vishal R. Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells.

Degree: PhD, Committee for the Interdisciplinary Program in Materials Science and Engineering, 2010, New Jersey Institute of Technology

  Commercial multicrystalline silicon (me-Si) solar cells use screen-printing process for depositing both the Ag paste based gridded front and Al based back (whole area)… (more)

Subjects/Keywords: Screen printing; Thick film; Silicon solar cells; Silver; Contact metallization; Materials Science and Engineering

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APA (6th Edition):

Mehta, V. R. (2010). Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells. (Doctoral Dissertation). New Jersey Institute of Technology. Retrieved from https://digitalcommons.njit.edu/dissertations/215

Chicago Manual of Style (16th Edition):

Mehta, Vishal R. “Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells.” 2010. Doctoral Dissertation, New Jersey Institute of Technology. Accessed April 04, 2020. https://digitalcommons.njit.edu/dissertations/215.

MLA Handbook (7th Edition):

Mehta, Vishal R. “Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells.” 2010. Web. 04 Apr 2020.

Vancouver:

Mehta VR. Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells. [Internet] [Doctoral dissertation]. New Jersey Institute of Technology; 2010. [cited 2020 Apr 04]. Available from: https://digitalcommons.njit.edu/dissertations/215.

Council of Science Editors:

Mehta VR. Formation of screen-printed contacts on multicrystalline silicon (mc-Si) solar cells. [Doctoral Dissertation]. New Jersey Institute of Technology; 2010. Available from: https://digitalcommons.njit.edu/dissertations/215


Mid Sweden University

16. Yeshitela, Tizita. Flip-chip bonding by electroplated indium bump.

Degree: Electronics Design, 2015, Mid Sweden University

  In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly… (more)

Subjects/Keywords: Bumping; UMB (under bump metallization); electroplating; Electrical Engineering, Electronic Engineering, Information Engineering; Elektroteknik och elektronik

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APA (6th Edition):

Yeshitela, T. (2015). Flip-chip bonding by electroplated indium bump. (Thesis). Mid Sweden University. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27178

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Yeshitela, Tizita. “Flip-chip bonding by electroplated indium bump.” 2015. Thesis, Mid Sweden University. Accessed April 04, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27178.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Yeshitela, Tizita. “Flip-chip bonding by electroplated indium bump.” 2015. Web. 04 Apr 2020.

Vancouver:

Yeshitela T. Flip-chip bonding by electroplated indium bump. [Internet] [Thesis]. Mid Sweden University; 2015. [cited 2020 Apr 04]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27178.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Yeshitela T. Flip-chip bonding by electroplated indium bump. [Thesis]. Mid Sweden University; 2015. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27178

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

17. Huang, Timothy. Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers.

Degree: PhD, Materials Science and Engineering, 2017, Georgia Tech

 High quality copper plating in blind-vias and through-vias is crucial to achieve high electrical performance and reliability from the integrated circuit (IC) to the package… (more)

Subjects/Keywords: Copper; Adhesion; Glass; Metallization; Plating

metallization steps and research objectives highlighted. ................................. 9 Figure… …metallization of vias in glass. ............................................. 44 Figure 3.11… …quality Cu metallization. Poor adhesion between copper and glass can result in electrical… …metallization can be addressed through a better understanding of copper to glass adhesion and Cu… …metallization and adhesion of Cu to ultra-thin glass substrates with small diameter, fine-pitch TPVs… 

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APA (6th Edition):

Huang, T. (2017). Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59109

Chicago Manual of Style (16th Edition):

Huang, Timothy. “Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers.” 2017. Doctoral Dissertation, Georgia Tech. Accessed April 04, 2020. http://hdl.handle.net/1853/59109.

MLA Handbook (7th Edition):

Huang, Timothy. “Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers.” 2017. Web. 04 Apr 2020.

Vancouver:

Huang T. Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Apr 04]. Available from: http://hdl.handle.net/1853/59109.

Council of Science Editors:

Huang T. Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/59109

18. João Moreno Vilas Boas de Souza Silva. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo.

Degree: 2011, Universidade Federal do Rio Grande do Norte

As interfaces metal/cerâmicas utilizando zircônia têm dominado as aplicações industriais na última década, em virtude da alta resistência mecânica e tenacidade à fratura da zircônia,… (more)

Subjects/Keywords: Brazing; Zirconia; Mechanical metallization; Metal; Ceramic joining; Brasagem; Zircônia; Metalização mecânica; União metal; Cerâmica; ENGENHARIA MECANICA

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APA (6th Edition):

Silva, J. M. V. B. d. S. (2011). Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo. (Thesis). Universidade Federal do Rio Grande do Norte. Retrieved from http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=5045

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo.” 2011. Thesis, Universidade Federal do Rio Grande do Norte. Accessed April 04, 2020. http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=5045.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Silva, João Moreno Vilas Boas de Souza. “Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo.” 2011. Web. 04 Apr 2020.

Vancouver:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo. [Internet] [Thesis]. Universidade Federal do Rio Grande do Norte; 2011. [cited 2020 Apr 04]. Available from: http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=5045.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Silva JMVBdS. Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo. [Thesis]. Universidade Federal do Rio Grande do Norte; 2011. Available from: http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=5045

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

19. Andrea Medeiros de Aladim Araújo. Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana.

Degree: 2006, Universidade Federal do Rio Grande do Norte

The partial fixed prosthodontics restoration is used to rehabilitate form and function of partial or total compromised teeth, having to remain permanently joined to remainder… (more)

Subjects/Keywords: Sistemas metalocerâmicos; Filmes de titânio; Metalização por plasma; Tribocorrosão; ENGENHARIAS; Metal-ceramic systems; Titanium films; Plasma metallization; Tribocorrosion

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APA (6th Edition):

Araújo, A. M. d. A. (2006). Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana. (Thesis). Universidade Federal do Rio Grande do Norte. Retrieved from http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=588

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Araújo, Andrea Medeiros de Aladim. “Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana.” 2006. Thesis, Universidade Federal do Rio Grande do Norte. Accessed April 04, 2020. http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=588.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Araújo, Andrea Medeiros de Aladim. “Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana.” 2006. Web. 04 Apr 2020.

Vancouver:

Araújo AMdA. Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana. [Internet] [Thesis]. Universidade Federal do Rio Grande do Norte; 2006. [cited 2020 Apr 04]. Available from: http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=588.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Araújo AMdA. Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana. [Thesis]. Universidade Federal do Rio Grande do Norte; 2006. Available from: http://bdtd.bczm.ufrn.br/tedesimplificado//tde_busca/arquivo.php?codArquivo=588

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Texas A&M University

20. Jung, Yunbum. High-performance Organic Thin-film Transistor.

Degree: 2014, Texas A&M University

 Organic compounds have been regarded as insulators for a long time. However, a semi-conductive organic material was discovered in the late 1940s. Since then, many… (more)

Subjects/Keywords: organic semiconductor; organic thin-film transistor (OTFT); organic metal semiconductor field-effect transistor (OMESFET); dual-layer thermal nanoimprint; self-aligned metallization

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APA (6th Edition):

Jung, Y. (2014). High-performance Organic Thin-film Transistor. (Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/152553

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jung, Yunbum. “High-performance Organic Thin-film Transistor.” 2014. Thesis, Texas A&M University. Accessed April 04, 2020. http://hdl.handle.net/1969.1/152553.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jung, Yunbum. “High-performance Organic Thin-film Transistor.” 2014. Web. 04 Apr 2020.

Vancouver:

Jung Y. High-performance Organic Thin-film Transistor. [Internet] [Thesis]. Texas A&M University; 2014. [cited 2020 Apr 04]. Available from: http://hdl.handle.net/1969.1/152553.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jung Y. High-performance Organic Thin-film Transistor. [Thesis]. Texas A&M University; 2014. Available from: http://hdl.handle.net/1969.1/152553

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Oulu

21. Kordás, K. (Krisztián). Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics.

Degree: 2002, University of Oulu

 Abstract The demands toward the development of simple and cost-effective fabrication methods of metallic structures with high lateral resolution on different substrates - applied in… (more)

Subjects/Keywords: metallization; optical fiber; polyimide; porous silicon; printed circuit board

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APA (6th Edition):

Kordás, K. (. (2002). Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9514266862

Chicago Manual of Style (16th Edition):

Kordás, K (Krisztián). “Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics.” 2002. Doctoral Dissertation, University of Oulu. Accessed April 04, 2020. http://urn.fi/urn:isbn:9514266862.

MLA Handbook (7th Edition):

Kordás, K (Krisztián). “Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics.” 2002. Web. 04 Apr 2020.

Vancouver:

Kordás K(. Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics. [Internet] [Doctoral dissertation]. University of Oulu; 2002. [cited 2020 Apr 04]. Available from: http://urn.fi/urn:isbn:9514266862.

Council of Science Editors:

Kordás K(. Laser-assisted chemical liquid-phase deposition of metals for micro- and optoelectronics. [Doctoral Dissertation]. University of Oulu; 2002. Available from: http://urn.fi/urn:isbn:9514266862

22. Giraud, Damien. Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V».

Degree: Docteur es, Sciences et génie des matériaux, 2014, Paris, ENMP

La projection thermique cold spray consiste en l'envol de poudres à haute vitesse sur une cible : le substrat. Leur adhérence et leur accumulation mène… (more)

Subjects/Keywords: Cold spray; MET; Simulation par éléments finis; Métallisation des polymères; Titane; Cold spray; TEM; Finite element simulation; Polymer metallization; Titanium; 620

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APA (6th Edition):

Giraud, D. (2014). Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V». (Doctoral Dissertation). Paris, ENMP. Retrieved from http://www.theses.fr/2014ENMP0018

Chicago Manual of Style (16th Edition):

Giraud, Damien. “Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V».” 2014. Doctoral Dissertation, Paris, ENMP. Accessed April 04, 2020. http://www.theses.fr/2014ENMP0018.

MLA Handbook (7th Edition):

Giraud, Damien. “Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V».” 2014. Web. 04 Apr 2020.

Vancouver:

Giraud D. Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V». [Internet] [Doctoral dissertation]. Paris, ENMP; 2014. [cited 2020 Apr 04]. Available from: http://www.theses.fr/2014ENMP0018.

Council of Science Editors:

Giraud D. Étude des composantes mécanique et métallurgique dans la liaison revêtement-substrat obtenue par projection dynamique par gaz froid pour les systèmes «Aluminium/Polyamide6,6» et «Titane/TA6V» : Study of the mechanical and metallurgical contributions to coating-substrate bonding in cold spray for «Aluminium/Polyamide 66» and «Titanium/Ti-6Al-4V». [Doctoral Dissertation]. Paris, ENMP; 2014. Available from: http://www.theses.fr/2014ENMP0018


Université de Grenoble

23. Thibert, Sébastien. Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2014, Université de Grenoble

 À l'échelle industrielle, la métallisation de la face avant des cellules photovoltaïques est réalisée grâce au procédé de sérigraphie depuis plus de 40 ans. Une… (more)

Subjects/Keywords: Cellules photovoltaïques; Silicium; Électronique imprimée; Métallisation; Rhéologie; Plan d'expériences; Solar cells; Silicon; Printed electronic; Metallization; Rheology; Design of experiments; 620

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APA (6th Edition):

Thibert, S. (2014). Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2014GRENI025

Chicago Manual of Style (16th Edition):

Thibert, Sébastien. “Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells.” 2014. Doctoral Dissertation, Université de Grenoble. Accessed April 04, 2020. http://www.theses.fr/2014GRENI025.

MLA Handbook (7th Edition):

Thibert, Sébastien. “Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells.” 2014. Web. 04 Apr 2020.

Vancouver:

Thibert S. Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells. [Internet] [Doctoral dissertation]. Université de Grenoble; 2014. [cited 2020 Apr 04]. Available from: http://www.theses.fr/2014GRENI025.

Council of Science Editors:

Thibert S. Etude de la métallisation de la face avant des cellules photovoltaïques en silicium : Study of the front side metallization of silicon solar cells. [Doctoral Dissertation]. Université de Grenoble; 2014. Available from: http://www.theses.fr/2014GRENI025


Universidade do Rio Grande do Norte

24. Carneiro, Jaciane Moraísa. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .

Degree: 2014, Universidade do Rio Grande do Norte

 Metal-Ceramic (M/C) Zirconia-stainless steel interfaces have been processed through brazing techniques due to the excellent combination of properties such as high temperature stability, high corrosion… (more)

Subjects/Keywords: União metal/cerâmica. Metalização mecânica. Brasagem. Zircônia e aço inox; Metal-ceramic joint. Mechanical metallization. Brazing. Zirconia and stainless steel

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APA (6th Edition):

Carneiro, J. M. (2014). Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . (Thesis). Universidade do Rio Grande do Norte. Retrieved from http://repositorio.ufrn.br/handle/123456789/12850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Carneiro, Jaciane Moraísa. “Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .” 2014. Thesis, Universidade do Rio Grande do Norte. Accessed April 04, 2020. http://repositorio.ufrn.br/handle/123456789/12850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Carneiro, Jaciane Moraísa. “Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .” 2014. Web. 04 Apr 2020.

Vancouver:

Carneiro JM. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . [Internet] [Thesis]. Universidade do Rio Grande do Norte; 2014. [cited 2020 Apr 04]. Available from: http://repositorio.ufrn.br/handle/123456789/12850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Carneiro JM. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . [Thesis]. Universidade do Rio Grande do Norte; 2014. Available from: http://repositorio.ufrn.br/handle/123456789/12850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Penn State University

25. Tighe, Timothy Bernard. Metal Atom-Molecule Interactions in Self-Assembled Monolayers.

Degree: PhD, Chemistry, 2003, Penn State University

 ABSTRACT Determining the underlying chemistry of the interaction of deposited metal/inorganic oxide molecules with organic thin films and polymer surfaces is becoming increasingly important for… (more)

Subjects/Keywords: metal organic interface; alkane thiol; self-assembled monolayers; metallization

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APA (6th Edition):

Tighe, T. B. (2003). Metal Atom-Molecule Interactions in Self-Assembled Monolayers. (Doctoral Dissertation). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/6169

Chicago Manual of Style (16th Edition):

Tighe, Timothy Bernard. “Metal Atom-Molecule Interactions in Self-Assembled Monolayers.” 2003. Doctoral Dissertation, Penn State University. Accessed April 04, 2020. https://etda.libraries.psu.edu/catalog/6169.

MLA Handbook (7th Edition):

Tighe, Timothy Bernard. “Metal Atom-Molecule Interactions in Self-Assembled Monolayers.” 2003. Web. 04 Apr 2020.

Vancouver:

Tighe TB. Metal Atom-Molecule Interactions in Self-Assembled Monolayers. [Internet] [Doctoral dissertation]. Penn State University; 2003. [cited 2020 Apr 04]. Available from: https://etda.libraries.psu.edu/catalog/6169.

Council of Science Editors:

Tighe TB. Metal Atom-Molecule Interactions in Self-Assembled Monolayers. [Doctoral Dissertation]. Penn State University; 2003. Available from: https://etda.libraries.psu.edu/catalog/6169


University of Akron

26. Mulpuri, Vamsi. Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs.

Degree: MSin Engineering, Electrical Engineering, 2017, University of Akron

 The reliability of power semiconductor switches is important when considering their vital role in power electronic converters for aerospace, railway, hybrid electric vehicle, and power… (more)

Subjects/Keywords: Engineering; Silicon Carbide, Threshold Voltage, On state Resistance, Gate leakage Current, Gate Oxide, Metallization, Bond wire

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APA (6th Edition):

Mulpuri, V. (2017). Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs. (Masters Thesis). University of Akron. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=akron151076214366849

Chicago Manual of Style (16th Edition):

Mulpuri, Vamsi. “Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs.” 2017. Masters Thesis, University of Akron. Accessed April 04, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=akron151076214366849.

MLA Handbook (7th Edition):

Mulpuri, Vamsi. “Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs.” 2017. Web. 04 Apr 2020.

Vancouver:

Mulpuri V. Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs. [Internet] [Masters thesis]. University of Akron; 2017. [cited 2020 Apr 04]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=akron151076214366849.

Council of Science Editors:

Mulpuri V. Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs. [Masters Thesis]. University of Akron; 2017. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=akron151076214366849


Universidade Nova

27. Freitas, Pedro Nuno de Jesus Francisco. Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes.

Degree: 2016, Universidade Nova

 This work reports the design, fabrication and characterization of metal-insulator-metal (MIM) structures acting as conductive bridging random access memory (CBRAM) devices using biopolymer insulator. Chitosan… (more)

Subjects/Keywords: Chitosan; Hydroxypropyl cellulose; Resistive switching; Electrochemical metallization; Conductive bridge; Biopolymer; Domínio/Área Científica::Engenharia e Tecnologia::Engenharia dos Materiais

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APA (6th Edition):

Freitas, P. N. d. J. F. (2016). Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes. (Thesis). Universidade Nova. Retrieved from http://www.rcaap.pt/detail.jsp?id=oai:run.unl.pt:10362/19191

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Freitas, Pedro Nuno de Jesus Francisco. “Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes.” 2016. Thesis, Universidade Nova. Accessed April 04, 2020. http://www.rcaap.pt/detail.jsp?id=oai:run.unl.pt:10362/19191.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Freitas, Pedro Nuno de Jesus Francisco. “Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes.” 2016. Web. 04 Apr 2020.

Vancouver:

Freitas PNdJF. Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes. [Internet] [Thesis]. Universidade Nova; 2016. [cited 2020 Apr 04]. Available from: http://www.rcaap.pt/detail.jsp?id=oai:run.unl.pt:10362/19191.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Freitas PNdJF. Conductive bridging RAM devices inspired on solid-state biopolymer electrolytes. [Thesis]. Universidade Nova; 2016. Available from: http://www.rcaap.pt/detail.jsp?id=oai:run.unl.pt:10362/19191

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Universidade do Rio Grande do Norte

28. Carneiro, Jaciane Moraísa. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .

Degree: 2014, Universidade do Rio Grande do Norte

 Metal-Ceramic (M/C) Zirconia-stainless steel interfaces have been processed through brazing techniques due to the excellent combination of properties such as high temperature stability, high corrosion… (more)

Subjects/Keywords: União metal/cerâmica. Metalização mecânica. Brasagem. Zircônia e aço inox; Metal-ceramic joint. Mechanical metallization. Brazing. Zirconia and stainless steel

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APA (6th Edition):

Carneiro, J. M. (2014). Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . (Masters Thesis). Universidade do Rio Grande do Norte. Retrieved from http://repositorio.ufrn.br/handle/123456789/12850

Chicago Manual of Style (16th Edition):

Carneiro, Jaciane Moraísa. “Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .” 2014. Masters Thesis, Universidade do Rio Grande do Norte. Accessed April 04, 2020. http://repositorio.ufrn.br/handle/123456789/12850.

MLA Handbook (7th Edition):

Carneiro, Jaciane Moraísa. “Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica .” 2014. Web. 04 Apr 2020.

Vancouver:

Carneiro JM. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . [Internet] [Masters thesis]. Universidade do Rio Grande do Norte; 2014. [cited 2020 Apr 04]. Available from: http://repositorio.ufrn.br/handle/123456789/12850.

Council of Science Editors:

Carneiro JM. Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica . [Masters Thesis]. Universidade do Rio Grande do Norte; 2014. Available from: http://repositorio.ufrn.br/handle/123456789/12850


Brigham Young University

29. Geng, Yanli. Metallization of DNA and DNA Origami Using a Pd Seeding Method.

Degree: PhD, 2013, Brigham Young University

 In this dissertation, I developed a Pd seeding method in association with electroless plating, to successfully metallize both lambda DNA and DNA origami templates on… (more)

Subjects/Keywords: conductivity measurements; copper; DNA-templated nanofabrication; DNA origami; electroless plating; gold; lambda DNA; metallization; nanocircuits; nanowires; Biochemistry; Chemistry

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APA (6th Edition):

Geng, Y. (2013). Metallization of DNA and DNA Origami Using a Pd Seeding Method. (Doctoral Dissertation). Brigham Young University. Retrieved from https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4856&context=etd

Chicago Manual of Style (16th Edition):

Geng, Yanli. “Metallization of DNA and DNA Origami Using a Pd Seeding Method.” 2013. Doctoral Dissertation, Brigham Young University. Accessed April 04, 2020. https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4856&context=etd.

MLA Handbook (7th Edition):

Geng, Yanli. “Metallization of DNA and DNA Origami Using a Pd Seeding Method.” 2013. Web. 04 Apr 2020.

Vancouver:

Geng Y. Metallization of DNA and DNA Origami Using a Pd Seeding Method. [Internet] [Doctoral dissertation]. Brigham Young University; 2013. [cited 2020 Apr 04]. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4856&context=etd.

Council of Science Editors:

Geng Y. Metallization of DNA and DNA Origami Using a Pd Seeding Method. [Doctoral Dissertation]. Brigham Young University; 2013. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4856&context=etd


Brigham Young University

30. Liu, Jianfei. Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication.

Degree: PhD, 2011, Brigham Young University

 This work examines the selective deposition of metallic and semiconductor materials onto DNA templates for the fabrication of nanodevices. DNA origami provides a simple and… (more)

Subjects/Keywords: DNA origami; metallization; electroless plating; nanowire; site-specific; nickel; gold; silver; copper; semiconductor; tellurium; bismuth telluride; conductivity test; nanocircuits; Chemical Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Liu, J. (2011). Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication. (Doctoral Dissertation). Brigham Young University. Retrieved from https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4142&context=etd

Chicago Manual of Style (16th Edition):

Liu, Jianfei. “Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication.” 2011. Doctoral Dissertation, Brigham Young University. Accessed April 04, 2020. https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4142&context=etd.

MLA Handbook (7th Edition):

Liu, Jianfei. “Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication.” 2011. Web. 04 Apr 2020.

Vancouver:

Liu J. Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication. [Internet] [Doctoral dissertation]. Brigham Young University; 2011. [cited 2020 Apr 04]. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4142&context=etd.

Council of Science Editors:

Liu J. Selective Deposition of Metallic and Semiconductor Materials onto DNA Templates for Nanofabrication. [Doctoral Dissertation]. Brigham Young University; 2011. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=4142&context=etd

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