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1. Verburg, Paul Christiaan. Laser-induced subsurface modification of silicon wafers.

Degree: Faculty of Engineering Technology, 2015, University of Twente

Wafer dicing is the technology to separate wafers into divided components known as dies. New developments in the semiconductor industry, such as die stacking and the development of microelectromechanical systems, present significant challenges to the dicing process. A promising wafer dicing method is laser-induced subsurface separation, as it is dry and debris-free. This method consists of two steps. First, sub-surface modifications are created inside the wafer by pulsed lasers, without inducing any damage to the surface. Secondly, a force is exerted on the wafer, causing it to separate along the laser-induced modifications. The objective of this thesis is to investigate the laser-material interaction during the formation of subsurface odifications in crystalline silicon. Based on experiments and numerical simulations, laser processes are proposed that are suitable for integration in industrial equipment. Advisors/Committee Members: Huis in 't Veld, Bert, Römer, Gerardus Richardus, Bernardus, Engelina.

Subjects/Keywords: IR-94830; METIS-310002

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Verburg, P. C. (2015). Laser-induced subsurface modification of silicon wafers. (Doctoral Dissertation). University of Twente. Retrieved from https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html ; urn:nbn:nl:ui:28-94830 ; 3c82353a-5558-4708-92a6-d19d139b7c57 ; 10.3990/1.9789036538381 ; urn:isbn:978-90-365-3838-1 ; urn:nbn:nl:ui:28-94830 ; https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html

Chicago Manual of Style (16th Edition):

Verburg, Paul Christiaan. “Laser-induced subsurface modification of silicon wafers.” 2015. Doctoral Dissertation, University of Twente. Accessed October 24, 2020. https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html ; urn:nbn:nl:ui:28-94830 ; 3c82353a-5558-4708-92a6-d19d139b7c57 ; 10.3990/1.9789036538381 ; urn:isbn:978-90-365-3838-1 ; urn:nbn:nl:ui:28-94830 ; https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html.

MLA Handbook (7th Edition):

Verburg, Paul Christiaan. “Laser-induced subsurface modification of silicon wafers.” 2015. Web. 24 Oct 2020.

Vancouver:

Verburg PC. Laser-induced subsurface modification of silicon wafers. [Internet] [Doctoral dissertation]. University of Twente; 2015. [cited 2020 Oct 24]. Available from: https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html ; urn:nbn:nl:ui:28-94830 ; 3c82353a-5558-4708-92a6-d19d139b7c57 ; 10.3990/1.9789036538381 ; urn:isbn:978-90-365-3838-1 ; urn:nbn:nl:ui:28-94830 ; https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html.

Council of Science Editors:

Verburg PC. Laser-induced subsurface modification of silicon wafers. [Doctoral Dissertation]. University of Twente; 2015. Available from: https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html ; urn:nbn:nl:ui:28-94830 ; 3c82353a-5558-4708-92a6-d19d139b7c57 ; 10.3990/1.9789036538381 ; urn:isbn:978-90-365-3838-1 ; urn:nbn:nl:ui:28-94830 ; https://research.utwente.nl/en/publications/laserinduced-subsurface-modification-of-silicon-wafers(3c82353a-5558-4708-92a6-d19d139b7c57).html

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