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University: National University of Singapore

You searched for subject:(Lead Free). Showing records 1 – 10 of 10 total matches.

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1. YOONG HERNG YAU. FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS.

Degree: 2018, National University of Singapore

Subjects/Keywords: Ferroelectricity; Resistive Switching; Lead-Free; Thin Film; BiFeO3; Hf0.5Zr0.5O2

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

YAU, Y. H. (2018). FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/150326

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

YAU, YOONG HERNG. “FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS.” 2018. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/150326.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

YAU, YOONG HERNG. “FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS.” 2018. Web. 17 Aug 2019.

Vancouver:

YAU YH. FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS. [Internet] [Thesis]. National University of Singapore; 2018. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/150326.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

YAU YH. FERROELECTRIC RESISTIVE SWITCHING BEHAVIOR IN LEAD-FREE THIN FILMS. [Thesis]. National University of Singapore; 2018. Available from: http://scholarbank.nus.edu.sg/handle/10635/150326

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. GUO KUN. BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD.

Degree: 2018, National University of Singapore

Subjects/Keywords: lead-free; piezoelectric ceramic; perovskite structure; coating; thermal spray; microstructure

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

KUN, G. (2018). BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD. (Thesis). National University of Singapore. Retrieved from https://scholarbank.nus.edu.sg/handle/10635/153734

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

KUN, GUO. “BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD.” 2018. Thesis, National University of Singapore. Accessed August 17, 2019. https://scholarbank.nus.edu.sg/handle/10635/153734.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

KUN, GUO. “BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD.” 2018. Web. 17 Aug 2019.

Vancouver:

KUN G. BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD. [Internet] [Thesis]. National University of Singapore; 2018. [cited 2019 Aug 17]. Available from: https://scholarbank.nus.edu.sg/handle/10635/153734.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

KUN G. BISMUTH SODIUM TITANATE (BNT)-BASED LEAD-FREE PIEZOELECTRIC CERAMIC COATINGS BY THERMAL SPRAYING METHOD. [Thesis]. National University of Singapore; 2018. Available from: https://scholarbank.nus.edu.sg/handle/10635/153734

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

3. NAI MUI LING, SHARON. Development of Advanced Nanocomposite for Micro/Nanosystems Packaging.

Degree: 2008, National University of Singapore

Subjects/Keywords: Lead-free solder; composite solder; carbon nanotubes; mechanical properties; aging; binding energy

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

NAI MUI LING, S. (2008). Development of Advanced Nanocomposite for Micro/Nanosystems Packaging. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/16041

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

NAI MUI LING, SHARON. “Development of Advanced Nanocomposite for Micro/Nanosystems Packaging.” 2008. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/16041.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

NAI MUI LING, SHARON. “Development of Advanced Nanocomposite for Micro/Nanosystems Packaging.” 2008. Web. 17 Aug 2019.

Vancouver:

NAI MUI LING S. Development of Advanced Nanocomposite for Micro/Nanosystems Packaging. [Internet] [Thesis]. National University of Singapore; 2008. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/16041.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

NAI MUI LING S. Development of Advanced Nanocomposite for Micro/Nanosystems Packaging. [Thesis]. National University of Singapore; 2008. Available from: http://scholarbank.nus.edu.sg/handle/10635/16041

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

4. KATTA MOHAN KUMAR. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.

Degree: 2009, National University of Singapore

Subjects/Keywords: nano-particles; lead-free solders; CTE; mechanical properties; microstructure; reliability

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

KUMAR, K. M. (2009). NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/16554

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

KUMAR, KATTA MOHAN. “NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.” 2009. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/16554.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

KUMAR, KATTA MOHAN. “NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.” 2009. Web. 17 Aug 2019.

Vancouver:

KUMAR KM. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. [Internet] [Thesis]. National University of Singapore; 2009. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/16554.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

KUMAR KM. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. [Thesis]. National University of Singapore; 2009. Available from: http://scholarbank.nus.edu.sg/handle/10635/16554

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

5. PAYMAN BABAGHORBANI. Development of Lead-Free Nanocomposite Solders for Electronic Packaging.

Degree: 2008, National University of Singapore

Subjects/Keywords: Lead-free solder; composite solder; nano copper particulates; mechanical properties

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

BABAGHORBANI, P. (2008). Development of Lead-Free Nanocomposite Solders for Electronic Packaging. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/16624

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

BABAGHORBANI, PAYMAN. “Development of Lead-Free Nanocomposite Solders for Electronic Packaging.” 2008. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/16624.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

BABAGHORBANI, PAYMAN. “Development of Lead-Free Nanocomposite Solders for Electronic Packaging.” 2008. Web. 17 Aug 2019.

Vancouver:

BABAGHORBANI P. Development of Lead-Free Nanocomposite Solders for Electronic Packaging. [Internet] [Thesis]. National University of Singapore; 2008. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/16624.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

BABAGHORBANI P. Development of Lead-Free Nanocomposite Solders for Electronic Packaging. [Thesis]. National University of Singapore; 2008. Available from: http://scholarbank.nus.edu.sg/handle/10635/16624

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

6. MD ERSHADUL ALAM. Development of New Tin Based Formulations.

Degree: 2009, National University of Singapore

Subjects/Keywords: Lead-free solders; Powder metallurgy; Disintegrated melt deposition; Wettability; Strength and Ductility.

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APA (6th Edition):

ALAM, M. E. (2009). Development of New Tin Based Formulations. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/17385

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

ALAM, MD ERSHADUL. “Development of New Tin Based Formulations.” 2009. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/17385.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

ALAM, MD ERSHADUL. “Development of New Tin Based Formulations.” 2009. Web. 17 Aug 2019.

Vancouver:

ALAM ME. Development of New Tin Based Formulations. [Internet] [Thesis]. National University of Singapore; 2009. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/17385.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

ALAM ME. Development of New Tin Based Formulations. [Thesis]. National University of Singapore; 2009. Available from: http://scholarbank.nus.edu.sg/handle/10635/17385

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

7. SIVA SURI CHANDRA RAO BHESETTI. Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications.

Degree: 2012, National University of Singapore

Subjects/Keywords: Mechanical properties; Lead-free solder; Intermetallic compounds; Nanoindentation; Creep; Microbump Joints

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

BHESETTI, S. S. C. R. (2012). Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/37602

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

BHESETTI, SIVA SURI CHANDRA RAO. “Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications.” 2012. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/37602.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

BHESETTI, SIVA SURI CHANDRA RAO. “Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications.” 2012. Web. 17 Aug 2019.

Vancouver:

BHESETTI SSCR. Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications. [Internet] [Thesis]. National University of Singapore; 2012. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/37602.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

BHESETTI SSCR. Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications. [Thesis]. National University of Singapore; 2012. Available from: http://scholarbank.nus.edu.sg/handle/10635/37602

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

8. WANG YUMEI. POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS.

Degree: 2017, National University of Singapore

Subjects/Keywords: potassium sodium niobate; lead-free ceramic thin films; chemical solution deposition; high piezoelectric property; phase coexistence; orientation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

YUMEI, W. (2017). POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/138653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

YUMEI, WANG. “POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS.” 2017. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/138653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

YUMEI, WANG. “POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS.” 2017. Web. 17 Aug 2019.

Vancouver:

YUMEI W. POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS. [Internet] [Thesis]. National University of Singapore; 2017. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/138653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

YUMEI W. POTASSIUM SODIUM NIOBATE-BASED LEAD-FREE PIEZOELECTRIC THIN FILMS DERIVED FROM CHEMICAL SOLUTIONS. [Thesis]. National University of Singapore; 2017. Available from: http://scholarbank.nus.edu.sg/handle/10635/138653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

9. TEO SEH KIAT. OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE.

Degree: 2006, National University of Singapore

Subjects/Keywords: Yield; Cleaning Frequency; Lead-free; BGA; QFN; Pin; Modulus; Hardness; Grain Size; Reactivity; Resistance; Chemical Analysis; Phase Analysis

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APA (6th Edition):

KIAT, T. S. (2006). OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE. (Thesis). National University of Singapore. Retrieved from https://scholarbank.nus.edu.sg/handle/10635/154063

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

KIAT, TEO SEH. “OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE.” 2006. Thesis, National University of Singapore. Accessed August 17, 2019. https://scholarbank.nus.edu.sg/handle/10635/154063.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

KIAT, TEO SEH. “OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE.” 2006. Web. 17 Aug 2019.

Vancouver:

KIAT TS. OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE. [Internet] [Thesis]. National University of Singapore; 2006. [cited 2019 Aug 17]. Available from: https://scholarbank.nus.edu.sg/handle/10635/154063.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

KIAT TS. OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE. [Thesis]. National University of Singapore; 2006. Available from: https://scholarbank.nus.edu.sg/handle/10635/154063

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

10. ONG KAI CHUAN. Dynamic material characterisation of solder interconnects in microelectronic packaging.

Degree: 2006, National University of Singapore

Subjects/Keywords: Lead-free solder; Eutectic Sn-37Pb solder; Dynamic material response; Cooling rate; microstructure; Split Hopkinson Pressure Bar.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

CHUAN, O. K. (2006). Dynamic material characterisation of solder interconnects in microelectronic packaging. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/18878

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

CHUAN, ONG KAI. “Dynamic material characterisation of solder interconnects in microelectronic packaging.” 2006. Thesis, National University of Singapore. Accessed August 17, 2019. http://scholarbank.nus.edu.sg/handle/10635/18878.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

CHUAN, ONG KAI. “Dynamic material characterisation of solder interconnects in microelectronic packaging.” 2006. Web. 17 Aug 2019.

Vancouver:

CHUAN OK. Dynamic material characterisation of solder interconnects in microelectronic packaging. [Internet] [Thesis]. National University of Singapore; 2006. [cited 2019 Aug 17]. Available from: http://scholarbank.nus.edu.sg/handle/10635/18878.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

CHUAN OK. Dynamic material characterisation of solder interconnects in microelectronic packaging. [Thesis]. National University of Singapore; 2006. Available from: http://scholarbank.nus.edu.sg/handle/10635/18878

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.