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Level: masters

You searched for subject:(Lead Free). Showing records 1 – 19 of 19 total matches.

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Oregon State University

1. Mendez, Jose Eduardo. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.

Degree: MS, Materials Science, 2016, Oregon State University

 The ternary system (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ (BNT-BKT-BMgT) was explored along the [75-(x/2) ]Bi₀.₅Na₀.₅TiO₃ - [25-(x/2)]Bi₀.₅K₀.₅TiO₃ - [x]Bi(Mg₀.₅Ti₀.₅)O₃ composition line. Thin films were fabricated using chelated mixing route… (more)

Subjects/Keywords: Lead-free; Thin films

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APA (6th Edition):

Mendez, J. E. (2016). Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/60106

Chicago Manual of Style (16th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Masters Thesis, Oregon State University. Accessed August 26, 2019. http://hdl.handle.net/1957/60106.

MLA Handbook (7th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Web. 26 Aug 2019.

Vancouver:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Internet] [Masters thesis]. Oregon State University; 2016. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1957/60106.

Council of Science Editors:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Masters Thesis]. Oregon State University; 2016. Available from: http://hdl.handle.net/1957/60106


Delft University of Technology

2. Mascarenhas, N.T. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.

Degree: 2015, Delft University of Technology

 Vibrations are inherent part in an aircraft system and supressing them has always been a technological challenge. Over the recent years, damping of mechanical vibrations… (more)

Subjects/Keywords: lead free; piezoelectric composite; flexible

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APA (6th Edition):

Mascarenhas, N. T. (2015). Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74

Chicago Manual of Style (16th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Masters Thesis, Delft University of Technology. Accessed August 26, 2019. http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

MLA Handbook (7th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Web. 26 Aug 2019.

Vancouver:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Internet] [Masters thesis]. Delft University of Technology; 2015. [cited 2019 Aug 26]. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

Council of Science Editors:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Masters Thesis]. Delft University of Technology; 2015. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74


University of New South Wales

3. Tung, Patrick. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.

Degree: Materials Science & Engineering, 2014, University of New South Wales

Lead-free piezoelectric materials are likely to be needed in the near future to replace lead-based materials in applications due to regulatory, health and safety issues.… (more)

Subjects/Keywords: NBT; Diffuse scattering; Lead-free

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APA (6th Edition):

Tung, P. (2014). Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. (Masters Thesis). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Masters Thesis, University of New South Wales. Accessed August 26, 2019. http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

MLA Handbook (7th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Web. 26 Aug 2019.

Vancouver:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Internet] [Masters thesis]. University of New South Wales; 2014. [cited 2019 Aug 26]. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

Council of Science Editors:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Masters Thesis]. University of New South Wales; 2014. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true


Penn State University

4. Gurdal, Erkan Ahmet. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.

Degree: MS, Materials Science and Engineering, 2011, Penn State University

Lead-zirconate-titanate (PZT) has been overwhelmingly studied and it has dominated the last 50 years in piezoelectric applications. Although PZT has excellent piezoelectric properties and it… (more)

Subjects/Keywords: transformer; high power; lead-free; Piezoelectric

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APA (6th Edition):

Gurdal, E. A. (2011). (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. (Masters Thesis). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/11775

Chicago Manual of Style (16th Edition):

Gurdal, Erkan Ahmet. “(Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.” 2011. Masters Thesis, Penn State University. Accessed August 26, 2019. https://etda.libraries.psu.edu/catalog/11775.

MLA Handbook (7th Edition):

Gurdal, Erkan Ahmet. “(Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.” 2011. Web. 26 Aug 2019.

Vancouver:

Gurdal EA. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. [Internet] [Masters thesis]. Penn State University; 2011. [cited 2019 Aug 26]. Available from: https://etda.libraries.psu.edu/catalog/11775.

Council of Science Editors:

Gurdal EA. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. [Masters Thesis]. Penn State University; 2011. Available from: https://etda.libraries.psu.edu/catalog/11775


Universidade do Minho

5. Pereira, José Carlos Rodrigues. Impacto do azoto no processo de soldadura reflow .

Degree: 2015, Universidade do Minho

 Atualmente as empresas têm de estar organizadas para reagir rapidamente a mudanças estruturais pois cada vez mais os desafios competitivos derivam dos requisitos de qualidade… (more)

Subjects/Keywords: Reflow; Lead-free; Azoto; RoHS; DOE; Nitrogen

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APA (6th Edition):

Pereira, J. C. R. (2015). Impacto do azoto no processo de soldadura reflow . (Masters Thesis). Universidade do Minho. Retrieved from http://hdl.handle.net/1822/39170

Chicago Manual of Style (16th Edition):

Pereira, José Carlos Rodrigues. “Impacto do azoto no processo de soldadura reflow .” 2015. Masters Thesis, Universidade do Minho. Accessed August 26, 2019. http://hdl.handle.net/1822/39170.

MLA Handbook (7th Edition):

Pereira, José Carlos Rodrigues. “Impacto do azoto no processo de soldadura reflow .” 2015. Web. 26 Aug 2019.

Vancouver:

Pereira JCR. Impacto do azoto no processo de soldadura reflow . [Internet] [Masters thesis]. Universidade do Minho; 2015. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1822/39170.

Council of Science Editors:

Pereira JCR. Impacto do azoto no processo de soldadura reflow . [Masters Thesis]. Universidade do Minho; 2015. Available from: http://hdl.handle.net/1822/39170


University of Toronto

6. Kaila, Rishi. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.

Degree: 2011, University of Toronto

Due to the introduction of Restriction of Hazardous Substances (RoHS) directive Pb containing solders have been banned from the electronics industry and a reliable replacement… (more)

Subjects/Keywords: Lead Free Solder; Mixed Assembly; 0794

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APA (6th Edition):

Kaila, R. (2011). Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/30652

Chicago Manual of Style (16th Edition):

Kaila, Rishi. “Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.” 2011. Masters Thesis, University of Toronto. Accessed August 26, 2019. http://hdl.handle.net/1807/30652.

MLA Handbook (7th Edition):

Kaila, Rishi. “Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.” 2011. Web. 26 Aug 2019.

Vancouver:

Kaila R. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. [Internet] [Masters thesis]. University of Toronto; 2011. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1807/30652.

Council of Science Editors:

Kaila R. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. [Masters Thesis]. University of Toronto; 2011. Available from: http://hdl.handle.net/1807/30652


University of Toronto

7. Matijevic, Ivan. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.

Degree: 2017, University of Toronto

Compliance with RoHS requirements has necessitated the development of high reliability alternatives to SAC305 lead-free solder. Bismuth containing ternary and quaternary alloys are emerging as… (more)

Subjects/Keywords: Bismuth; Lead-free; Quaternary; Solvus; Ternary; 0794

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APA (6th Edition):

Matijevic, I. (2017). Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/91188

Chicago Manual of Style (16th Edition):

Matijevic, Ivan. “Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.” 2017. Masters Thesis, University of Toronto. Accessed August 26, 2019. http://hdl.handle.net/1807/91188.

MLA Handbook (7th Edition):

Matijevic, Ivan. “Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.” 2017. Web. 26 Aug 2019.

Vancouver:

Matijevic I. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. [Internet] [Masters thesis]. University of Toronto; 2017. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1807/91188.

Council of Science Editors:

Matijevic I. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. [Masters Thesis]. University of Toronto; 2017. Available from: http://hdl.handle.net/1807/91188

8. Lima, Ricardo Barbosa de. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).

Degree: Mestrado, Microeletrônica, 2011, University of São Paulo

Neste trabalho foram estudadas as etapas de processo envolvidas na tecnologia Pin-in-Paste (PIP) de soldagem por refusão de componentes convencionais (THCs - Through Hole Components… (more)

Subjects/Keywords: Circuito impresso; Electronic assembly; Lead-free; Lead-free; Montagem eletrônica; Pin-in-Paste; Pin-in-Paste; Printed circuit boards

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APA (6th Edition):

Lima, R. B. d. (2011). Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;

Chicago Manual of Style (16th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Masters Thesis, University of São Paulo. Accessed August 26, 2019. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

MLA Handbook (7th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Web. 26 Aug 2019.

Vancouver:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Internet] [Masters thesis]. University of São Paulo; 2011. [cited 2019 Aug 26]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

Council of Science Editors:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Masters Thesis]. University of São Paulo; 2011. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;


Virginia Tech

9. Jiang, Li. Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices.

Degree: MS, Materials Science and Engineering, 2010, Virginia Tech

 This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300 °C) sintering technique… (more)

Subjects/Keywords: Thermo-mechanical reliability; large-area die-attachment; lead-free.

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APA (6th Edition):

Jiang, L. (2010). Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/36429

Chicago Manual of Style (16th Edition):

Jiang, Li. “Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices.” 2010. Masters Thesis, Virginia Tech. Accessed August 26, 2019. http://hdl.handle.net/10919/36429.

MLA Handbook (7th Edition):

Jiang, Li. “Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices.” 2010. Web. 26 Aug 2019.

Vancouver:

Jiang L. Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices. [Internet] [Masters thesis]. Virginia Tech; 2010. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/10919/36429.

Council of Science Editors:

Jiang L. Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices. [Masters Thesis]. Virginia Tech; 2010. Available from: http://hdl.handle.net/10919/36429


University of Toronto

10. Madani, Ali. Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices.

Degree: 2015, University of Toronto

A thin film piezoelectric MEMS actuator is designed and simulated to be used as the actuation mechanism of an auto-focus system of a camera phone.… (more)

Subjects/Keywords: Actuator; Lead free; MEMS; Piezoelectric; Thin film; 0548

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APA (6th Edition):

Madani, A. (2015). Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/69235

Chicago Manual of Style (16th Edition):

Madani, Ali. “Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices.” 2015. Masters Thesis, University of Toronto. Accessed August 26, 2019. http://hdl.handle.net/1807/69235.

MLA Handbook (7th Edition):

Madani, Ali. “Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices.” 2015. Web. 26 Aug 2019.

Vancouver:

Madani A. Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices. [Internet] [Masters thesis]. University of Toronto; 2015. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1807/69235.

Council of Science Editors:

Madani A. Characterization of Thin Film (K,Na)NbO3 for Piezoelectric MEMS Actuators with Applications to Auto-Focus Systems of Hand-Held Devices. [Masters Thesis]. University of Toronto; 2015. Available from: http://hdl.handle.net/1807/69235


Georgia Tech

11. Gupta, Piyush. Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips.

Degree: MS, Materials Science and Engineering, 2004, Georgia Tech

 Georgia Techs Packaging Research Centers vision of System on Package (SOP) requires that the ball grid array (BGA) package be eliminated and the integrated circuit… (more)

Subjects/Keywords: Submodelling; FEM; Intermetallic; Lead-free solder

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APA (6th Edition):

Gupta, P. (2004). Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/4800

Chicago Manual of Style (16th Edition):

Gupta, Piyush. “Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips.” 2004. Masters Thesis, Georgia Tech. Accessed August 26, 2019. http://hdl.handle.net/1853/4800.

MLA Handbook (7th Edition):

Gupta, Piyush. “Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips.” 2004. Web. 26 Aug 2019.

Vancouver:

Gupta P. Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips. [Internet] [Masters thesis]. Georgia Tech; 2004. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1853/4800.

Council of Science Editors:

Gupta P. Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips. [Masters Thesis]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/4800


University of Kentucky

12. Nalagatla, Dinesh Reddy. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.

Degree: 2007, University of Kentucky

 The objective of this study is to understand the effect of surface roughness of the Cu substrate on the wetting of molten solder alloys. Eutectic… (more)

Subjects/Keywords: Wetting; surface roughness; hot-stage microscopy; lead solders; lead-free solders

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APA (6th Edition):

Nalagatla, D. R. (2007). INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/gradschool_theses/488

Chicago Manual of Style (16th Edition):

Nalagatla, Dinesh Reddy. “INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.” 2007. Masters Thesis, University of Kentucky. Accessed August 26, 2019. http://uknowledge.uky.edu/gradschool_theses/488.

MLA Handbook (7th Edition):

Nalagatla, Dinesh Reddy. “INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.” 2007. Web. 26 Aug 2019.

Vancouver:

Nalagatla DR. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. [Internet] [Masters thesis]. University of Kentucky; 2007. [cited 2019 Aug 26]. Available from: http://uknowledge.uky.edu/gradschool_theses/488.

Council of Science Editors:

Nalagatla DR. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. [Masters Thesis]. University of Kentucky; 2007. Available from: http://uknowledge.uky.edu/gradschool_theses/488

13. Mendes, Luiz Tadeu Freire. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".

Degree: Mestrado, Microeletrônica, 2009, University of São Paulo

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente… (more)

Subjects/Keywords: Assembly montage SMD; Electrochemical migration; Electronic soldering; Eletrônica; Eletroquímica; Lead free soldering; SMT; Soldagem elétrica; Solder paste

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APA (6th Edition):

Mendes, L. T. F. (2009). Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;

Chicago Manual of Style (16th Edition):

Mendes, Luiz Tadeu Freire. “Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".” 2009. Masters Thesis, University of São Paulo. Accessed August 26, 2019. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;.

MLA Handbook (7th Edition):

Mendes, Luiz Tadeu Freire. “Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".” 2009. Web. 26 Aug 2019.

Vancouver:

Mendes LTF. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". [Internet] [Masters thesis]. University of São Paulo; 2009. [cited 2019 Aug 26]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;.

Council of Science Editors:

Mendes LTF. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". [Masters Thesis]. University of São Paulo; 2009. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;


Wright State University

14. Cleaver, Patrick Joseph. Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films.

Degree: MSin Materials Science and Engineering MSMSE, Materials Science and Engineering, 2018, Wright State University

 Solar technology has a long history of incremental improvements in cost, reliability and efficiency. However, solar cells based on lead halide perovskite films have made… (more)

Subjects/Keywords: Materials Science; perovskite; perovskite solar; solution processable solar; bismuth perovskite; lead free perovskite; metal halide perovskite; low-dimentional perovskite

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APA (6th Edition):

Cleaver, P. J. (2018). Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films. (Masters Thesis). Wright State University. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=wright1547412870005544

Chicago Manual of Style (16th Edition):

Cleaver, Patrick Joseph. “Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films.” 2018. Masters Thesis, Wright State University. Accessed August 26, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=wright1547412870005544.

MLA Handbook (7th Edition):

Cleaver, Patrick Joseph. “Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films.” 2018. Web. 26 Aug 2019.

Vancouver:

Cleaver PJ. Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films. [Internet] [Masters thesis]. Wright State University; 2018. [cited 2019 Aug 26]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=wright1547412870005544.

Council of Science Editors:

Cleaver PJ. Electronic and Crystalline Characteristics of Mixed Metal Halide Perovskite Semiconductor Films. [Masters Thesis]. Wright State University; 2018. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=wright1547412870005544


University of Kentucky

15. Zhao, Ruiting. Microindentation of Bi57In26Sn17 Lead-Free Alloy.

Degree: 2015, University of Kentucky

 There is great need to understand the mechanical properties of lead-free alloys—an alternative of lead-based alloys—to address the environmental problems associated with the use of… (more)

Subjects/Keywords: Micro-indentation; Bi-In-Sn alloy; lead-free alloy; Vickers hardness; reduced contact modulus; indentation size effect.; Mechanics of Materials; Other Materials Science and Engineering

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APA (6th Edition):

Zhao, R. (2015). Microindentation of Bi57In26Sn17 Lead-Free Alloy. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/cme_etds/53

Chicago Manual of Style (16th Edition):

Zhao, Ruiting. “Microindentation of Bi57In26Sn17 Lead-Free Alloy.” 2015. Masters Thesis, University of Kentucky. Accessed August 26, 2019. http://uknowledge.uky.edu/cme_etds/53.

MLA Handbook (7th Edition):

Zhao, Ruiting. “Microindentation of Bi57In26Sn17 Lead-Free Alloy.” 2015. Web. 26 Aug 2019.

Vancouver:

Zhao R. Microindentation of Bi57In26Sn17 Lead-Free Alloy. [Internet] [Masters thesis]. University of Kentucky; 2015. [cited 2019 Aug 26]. Available from: http://uknowledge.uky.edu/cme_etds/53.

Council of Science Editors:

Zhao R. Microindentation of Bi57In26Sn17 Lead-Free Alloy. [Masters Thesis]. University of Kentucky; 2015. Available from: http://uknowledge.uky.edu/cme_etds/53


Wright State University

16. Stang, Eric Thomas. Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing.

Degree: MSME, Mechanical Engineering, 2018, Wright State University

 Environmental and safety concerns have necessitated a phase-out of lead-based alloys, which are often used in electronics solder applications. In order to properly assess suitable… (more)

Subjects/Keywords: Mechanical Engineering; Mechanics; Materials Science; Aerospace Materials; creep; Garofalo; solder; lead-free; power law; mechanical testing; constant strain-rate; CSR; Pb; Sn; Sb; Ag; Sn-Sb; electronics; electronics packaging

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APA (6th Edition):

Stang, E. T. (2018). Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing. (Masters Thesis). Wright State University. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472

Chicago Manual of Style (16th Edition):

Stang, Eric Thomas. “Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing.” 2018. Masters Thesis, Wright State University. Accessed August 26, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472.

MLA Handbook (7th Edition):

Stang, Eric Thomas. “Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing.” 2018. Web. 26 Aug 2019.

Vancouver:

Stang ET. Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing. [Internet] [Masters thesis]. Wright State University; 2018. [cited 2019 Aug 26]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472.

Council of Science Editors:

Stang ET. Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing. [Masters Thesis]. Wright State University; 2018. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472


Georgia Tech

17. Reid, Pamela Patrice. Variable Frequency Microwave Reflow of Lead-Free Solder Paste.

Degree: MS, Chemical Engineering, 2004, Georgia Tech

 As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of… (more)

Subjects/Keywords: Variable frequency microwave; Microelectronics; Lead-free solder; Microelectronics Research; Microwaves Industrial applications; Solder paste

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APA (6th Edition):

Reid, P. P. (2004). Variable Frequency Microwave Reflow of Lead-Free Solder Paste. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5011

Chicago Manual of Style (16th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Masters Thesis, Georgia Tech. Accessed August 26, 2019. http://hdl.handle.net/1853/5011.

MLA Handbook (7th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Web. 26 Aug 2019.

Vancouver:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Internet] [Masters thesis]. Georgia Tech; 2004. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/1853/5011.

Council of Science Editors:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Masters Thesis]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/5011


Virginia Tech

18. Stinson-Bagby, Kelly Lucile. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints.

Degree: MS, Materials Science and Engineering, 2002, Virginia Tech

 Currently, there are two major driving forces for considering alternative materials to lead- based products, specifically interconnections, in electronics applications, including the impending legislation or… (more)

Subjects/Keywords: Microstructural Evolution; Thermal Aging; Lead-Free Solder; Reliability; Large-Area Solder Bond; Thermal Cycling; Die Attach

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Stinson-Bagby, K. L. (2002). Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/34573

Chicago Manual of Style (16th Edition):

Stinson-Bagby, Kelly Lucile. “Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints.” 2002. Masters Thesis, Virginia Tech. Accessed August 26, 2019. http://hdl.handle.net/10919/34573.

MLA Handbook (7th Edition):

Stinson-Bagby, Kelly Lucile. “Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints.” 2002. Web. 26 Aug 2019.

Vancouver:

Stinson-Bagby KL. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. [Internet] [Masters thesis]. Virginia Tech; 2002. [cited 2019 Aug 26]. Available from: http://hdl.handle.net/10919/34573.

Council of Science Editors:

Stinson-Bagby KL. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. [Masters Thesis]. Virginia Tech; 2002. Available from: http://hdl.handle.net/10919/34573

19. Xu, Xinyue. Applied Meta-Analysis of Lead-Free Solder Reliability.

Degree: Industrial Engineering, 2014, Arizona State University

 This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including… (more)

Subjects/Keywords: Industrial engineering; Statistics; Bayesian inference; Lead-free solder; Markov Chain Monte Carlo; Meta-analysis; Reliability; Weibull regression

…42 vii 1 INTRODUCTION The lead free solder technique attracts lots of attention lately… …aerospace equipment. The gradually transition of traditional lead-based solder alloy to lead-free… …solder alloy makes it even more import ant to study the reliability of lead-free solder. 1.1… …1.1.1 Reason of Using Lead-free Materials Pollution Problem Lead is a very common metallic… …rather choose to do business with lead-free manufactories. Because more and more electronic and… 

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Xu, X. (2014). Applied Meta-Analysis of Lead-Free Solder Reliability. (Masters Thesis). Arizona State University. Retrieved from http://repository.asu.edu/items/26878

Chicago Manual of Style (16th Edition):

Xu, Xinyue. “Applied Meta-Analysis of Lead-Free Solder Reliability.” 2014. Masters Thesis, Arizona State University. Accessed August 26, 2019. http://repository.asu.edu/items/26878.

MLA Handbook (7th Edition):

Xu, Xinyue. “Applied Meta-Analysis of Lead-Free Solder Reliability.” 2014. Web. 26 Aug 2019.

Vancouver:

Xu X. Applied Meta-Analysis of Lead-Free Solder Reliability. [Internet] [Masters thesis]. Arizona State University; 2014. [cited 2019 Aug 26]. Available from: http://repository.asu.edu/items/26878.

Council of Science Editors:

Xu X. Applied Meta-Analysis of Lead-Free Solder Reliability. [Masters Thesis]. Arizona State University; 2014. Available from: http://repository.asu.edu/items/26878

.