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You searched for subject:(Electronics packaging). Showing records 1 – 30 of 83 total matches.

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1. Guo, Yuanbo. Development of a high current high temperature SiC MOSFET based solid-state power controller.

Degree: 2011, State University of New York at Buffalo

  Solid-State Power Controllers (SSPCs) are critical components in the development of electric aircraft and must be small in size, fast in response, and have… (more)

Subjects/Keywords: Engineering, Electronics and Electrical; Engineering, Packaging; Energy

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APA (6th Edition):

Guo, Y. (2011). Development of a high current high temperature SiC MOSFET based solid-state power controller. (Thesis). State University of New York at Buffalo. Retrieved from http://pqdtopen.proquest.com/#viewpdf?dispub=1488901

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Guo, Yuanbo. “Development of a high current high temperature SiC MOSFET based solid-state power controller.” 2011. Thesis, State University of New York at Buffalo. Accessed February 28, 2021. http://pqdtopen.proquest.com/#viewpdf?dispub=1488901.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Guo, Yuanbo. “Development of a high current high temperature SiC MOSFET based solid-state power controller.” 2011. Web. 28 Feb 2021.

Vancouver:

Guo Y. Development of a high current high temperature SiC MOSFET based solid-state power controller. [Internet] [Thesis]. State University of New York at Buffalo; 2011. [cited 2021 Feb 28]. Available from: http://pqdtopen.proquest.com/#viewpdf?dispub=1488901.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Guo Y. Development of a high current high temperature SiC MOSFET based solid-state power controller. [Thesis]. State University of New York at Buffalo; 2011. Available from: http://pqdtopen.proquest.com/#viewpdf?dispub=1488901

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Ruppi, Robert. Substrates for Packaging of Silicon Carbide Power Electronics .

Degree: Chalmers tekniska högskola / Institutionen för mikroteknologi och nanovetenskap (MC2), 2011, Chalmers University of Technology

 Silicon based power semiconductor devices are the fundamental components of electronic systems and circuits today. The need for high voltage devices that can operate at… (more)

Subjects/Keywords: Packaging; silicon carbide; SiC power electronics; printed electronics; substrates for power electronics

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APA (6th Edition):

Ruppi, R. (2011). Substrates for Packaging of Silicon Carbide Power Electronics . (Thesis). Chalmers University of Technology. Retrieved from http://hdl.handle.net/20.500.12380/300278

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Ruppi, Robert. “Substrates for Packaging of Silicon Carbide Power Electronics .” 2011. Thesis, Chalmers University of Technology. Accessed February 28, 2021. http://hdl.handle.net/20.500.12380/300278.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Ruppi, Robert. “Substrates for Packaging of Silicon Carbide Power Electronics .” 2011. Web. 28 Feb 2021.

Vancouver:

Ruppi R. Substrates for Packaging of Silicon Carbide Power Electronics . [Internet] [Thesis]. Chalmers University of Technology; 2011. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/20.500.12380/300278.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Ruppi R. Substrates for Packaging of Silicon Carbide Power Electronics . [Thesis]. Chalmers University of Technology; 2011. Available from: http://hdl.handle.net/20.500.12380/300278

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


San Jose State University

3. Werdowatz, Andrew Richard. Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink.

Degree: MS, Mechanical Engineering, 2016, San Jose State University

  Heat sinks are a critical component in numerous thermal management strategies, ranging from consumer electronics to data centers. The ability to perform an accurate… (more)

Subjects/Keywords: constriction resistance; electronics cooling; electronics packaging; heat sink; heat transfer; spreading resistance

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APA (6th Edition):

Werdowatz, A. R. (2016). Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink. (Masters Thesis). San Jose State University. Retrieved from https://doi.org/10.31979/etd.pq68-tx7x ; https://scholarworks.sjsu.edu/etd_theses/4711

Chicago Manual of Style (16th Edition):

Werdowatz, Andrew Richard. “Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink.” 2016. Masters Thesis, San Jose State University. Accessed February 28, 2021. https://doi.org/10.31979/etd.pq68-tx7x ; https://scholarworks.sjsu.edu/etd_theses/4711.

MLA Handbook (7th Edition):

Werdowatz, Andrew Richard. “Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink.” 2016. Web. 28 Feb 2021.

Vancouver:

Werdowatz AR. Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink. [Internet] [Masters thesis]. San Jose State University; 2016. [cited 2021 Feb 28]. Available from: https://doi.org/10.31979/etd.pq68-tx7x ; https://scholarworks.sjsu.edu/etd_theses/4711.

Council of Science Editors:

Werdowatz AR. Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink. [Masters Thesis]. San Jose State University; 2016. Available from: https://doi.org/10.31979/etd.pq68-tx7x ; https://scholarworks.sjsu.edu/etd_theses/4711


University of California – Berkeley

4. PARK, EUNG SEOK. Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems.

Degree: Electrical Engineering, 2013, University of California – Berkeley

 Printed electronics employing solution-processed materials is considered to be the key to realizing low-cost large-area electronic systems, but the performance of printed transistors is not… (more)

Subjects/Keywords: Engineering; Electrical engineering; Inkjet Printing; MEMS; Metals; Nanoparticles; Packaging; Printed Electronics

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APA (6th Edition):

PARK, E. S. (2013). Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems. (Thesis). University of California – Berkeley. Retrieved from http://www.escholarship.org/uc/item/8ts5n583

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

PARK, EUNG SEOK. “Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems.” 2013. Thesis, University of California – Berkeley. Accessed February 28, 2021. http://www.escholarship.org/uc/item/8ts5n583.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

PARK, EUNG SEOK. “Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems.” 2013. Web. 28 Feb 2021.

Vancouver:

PARK ES. Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems. [Internet] [Thesis]. University of California – Berkeley; 2013. [cited 2021 Feb 28]. Available from: http://www.escholarship.org/uc/item/8ts5n583.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

PARK ES. Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems. [Thesis]. University of California – Berkeley; 2013. Available from: http://www.escholarship.org/uc/item/8ts5n583

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Texas A&M University

5. Humood, Mohammad Muneer Mutlaq. Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites.

Degree: PhD, Mechanical Engineering, 2018, Texas A&M University

 Polymer-based multilayer nanocomposites have become favorable material choice for many applications such as gas barriers, water membranes, optoelectronic devices, biosensors, corrosion inhibitors and energy devices.… (more)

Subjects/Keywords: Nanomechanics; Nanoindentation; Nanocomposites; Flexible; Wearable Electronics; Food Packaging

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APA (6th Edition):

Humood, M. M. M. (2018). Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites. (Doctoral Dissertation). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/174053

Chicago Manual of Style (16th Edition):

Humood, Mohammad Muneer Mutlaq. “Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites.” 2018. Doctoral Dissertation, Texas A&M University. Accessed February 28, 2021. http://hdl.handle.net/1969.1/174053.

MLA Handbook (7th Edition):

Humood, Mohammad Muneer Mutlaq. “Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites.” 2018. Web. 28 Feb 2021.

Vancouver:

Humood MMM. Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites. [Internet] [Doctoral dissertation]. Texas A&M University; 2018. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1969.1/174053.

Council of Science Editors:

Humood MMM. Nanomechanics, Nanotribology and Fabrication of Flexible Multilayer Nanocomposites. [Doctoral Dissertation]. Texas A&M University; 2018. Available from: http://hdl.handle.net/1969.1/174053


Delft University of Technology

6. Popovic, J. Improving packaging and increasing the level of integration in power electronics.

Degree: 2005, Delft University of Technology

 The use of power electronics is growing extensively in applications such as the automotive field, lighting, power supplies, motor drives, etc. The ultimate goal is… (more)

Subjects/Keywords: integration; packaging; power electronics

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APA (6th Edition):

Popovic, J. (2005). Improving packaging and increasing the level of integration in power electronics. (Doctoral Dissertation). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1

Chicago Manual of Style (16th Edition):

Popovic, J. “Improving packaging and increasing the level of integration in power electronics.” 2005. Doctoral Dissertation, Delft University of Technology. Accessed February 28, 2021. http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1.

MLA Handbook (7th Edition):

Popovic, J. “Improving packaging and increasing the level of integration in power electronics.” 2005. Web. 28 Feb 2021.

Vancouver:

Popovic J. Improving packaging and increasing the level of integration in power electronics. [Internet] [Doctoral dissertation]. Delft University of Technology; 2005. [cited 2021 Feb 28]. Available from: http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1.

Council of Science Editors:

Popovic J. Improving packaging and increasing the level of integration in power electronics. [Doctoral Dissertation]. Delft University of Technology; 2005. Available from: http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; urn:NBN:nl:ui:24-uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1 ; http://resolver.tudelft.nl/uuid:68ef1d61-f3c3-43e8-bacd-d2e97bd0baa1

7. Dimarino, Christina Marie. Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen.

Degree: PhD, Electrical Engineering, 2019, Virginia Tech

 Electricity is the fastest-growing type of end-use energy consumption in the world, and its generation and usage trends are changing. Hence, the power electronics that… (more)

Subjects/Keywords: power electronics; silicon carbide; packaging; high voltage; electromagnetic interference

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APA (6th Edition):

Dimarino, C. M. (2019). Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/86596

Chicago Manual of Style (16th Edition):

Dimarino, Christina Marie. “Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen.” 2019. Doctoral Dissertation, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/86596.

MLA Handbook (7th Edition):

Dimarino, Christina Marie. “Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen.” 2019. Web. 28 Feb 2021.

Vancouver:

Dimarino CM. Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen. [Internet] [Doctoral dissertation]. Virginia Tech; 2019. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/86596.

Council of Science Editors:

Dimarino CM. Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen. [Doctoral Dissertation]. Virginia Tech; 2019. Available from: http://hdl.handle.net/10919/86596


Virginia Tech

8. Lostetter, Alexander B. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules.

Degree: MS, Electrical and Computer Engineering, 1998, Virginia Tech

 High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at… (more)

Subjects/Keywords: power electronics; thermal analysis; packaging

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APA (6th Edition):

Lostetter, A. B. (1998). Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/30909

Chicago Manual of Style (16th Edition):

Lostetter, Alexander B. “Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules.” 1998. Masters Thesis, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/30909.

MLA Handbook (7th Edition):

Lostetter, Alexander B. “Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules.” 1998. Web. 28 Feb 2021.

Vancouver:

Lostetter AB. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules. [Internet] [Masters thesis]. Virginia Tech; 1998. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/30909.

Council of Science Editors:

Lostetter AB. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules. [Masters Thesis]. Virginia Tech; 1998. Available from: http://hdl.handle.net/10919/30909


Virginia Tech

9. Webster, James R. Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments.

Degree: MS, Electrical Engineering, 1998, Virginia Tech

 This thesis presents the results of research into the performance of advanced polymer dielectrics for the realization of high-power electronic circuits in a miniature form.… (more)

Subjects/Keywords: Polymer; Dielectric; Electronics; Packaging

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APA (6th Edition):

Webster, J. R. (1998). Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/36887

Chicago Manual of Style (16th Edition):

Webster, James R. “Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments.” 1998. Masters Thesis, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/36887.

MLA Handbook (7th Edition):

Webster, James R. “Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments.” 1998. Web. 28 Feb 2021.

Vancouver:

Webster JR. Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments. [Internet] [Masters thesis]. Virginia Tech; 1998. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/36887.

Council of Science Editors:

Webster JR. Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments. [Masters Thesis]. Virginia Tech; 1998. Available from: http://hdl.handle.net/10919/36887


Virginia Tech

10. Ralston, Parrish Elaine. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.

Degree: PhD, Electrical Engineering, 2013, Virginia Tech

 Flip chip interconnections have superior performance for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in… (more)

Subjects/Keywords: liquid metal; electronics packaging; flip chip; 3D integration; MMIC integration

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APA (6th Edition):

Ralston, P. E. (2013). Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/50641

Chicago Manual of Style (16th Edition):

Ralston, Parrish Elaine. “Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.” 2013. Doctoral Dissertation, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/50641.

MLA Handbook (7th Edition):

Ralston, Parrish Elaine. “Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.” 2013. Web. 28 Feb 2021.

Vancouver:

Ralston PE. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. [Internet] [Doctoral dissertation]. Virginia Tech; 2013. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/50641.

Council of Science Editors:

Ralston PE. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. [Doctoral Dissertation]. Virginia Tech; 2013. Available from: http://hdl.handle.net/10919/50641


Virginia Tech

11. Collins, Gustina Bernette. Laser Processing of Polyimide on Copper.

Degree: MS, Electrical and Computer Engineering, 2001, Virginia Tech

 While work using a laser for processing a polymer dielectric is currently being studied, the purpose of this thesis is to present an effective and… (more)

Subjects/Keywords: electronics; packaging; copper; laser; polymer

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APA (6th Edition):

Collins, G. B. (2001). Laser Processing of Polyimide on Copper. (Masters Thesis). Virginia Tech. Retrieved from http://hdl.handle.net/10919/32559

Chicago Manual of Style (16th Edition):

Collins, Gustina Bernette. “Laser Processing of Polyimide on Copper.” 2001. Masters Thesis, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/32559.

MLA Handbook (7th Edition):

Collins, Gustina Bernette. “Laser Processing of Polyimide on Copper.” 2001. Web. 28 Feb 2021.

Vancouver:

Collins GB. Laser Processing of Polyimide on Copper. [Internet] [Masters thesis]. Virginia Tech; 2001. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/32559.

Council of Science Editors:

Collins GB. Laser Processing of Polyimide on Copper. [Masters Thesis]. Virginia Tech; 2001. Available from: http://hdl.handle.net/10919/32559


Delft University of Technology

12. Giannoulakis, Evangelos (author). Optimizing Packaging Availability for Reverse Logistics: A case study at ASML.

Degree: 2018, Delft University of Technology

 Background: The domain of Reverse Logistics, which is lately coming more in the forefront, will serve as the focal point of this project. In the… (more)

Subjects/Keywords: Reverse logistics; Supply Chain Management; Electronics; Value stream mapping; packaging; ASML

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APA (6th Edition):

Giannoulakis, E. (. (2018). Optimizing Packaging Availability for Reverse Logistics: A case study at ASML. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:5d4b42b5-685c-4bec-b347-62c4d45a6c99

Chicago Manual of Style (16th Edition):

Giannoulakis, Evangelos (author). “Optimizing Packaging Availability for Reverse Logistics: A case study at ASML.” 2018. Masters Thesis, Delft University of Technology. Accessed February 28, 2021. http://resolver.tudelft.nl/uuid:5d4b42b5-685c-4bec-b347-62c4d45a6c99.

MLA Handbook (7th Edition):

Giannoulakis, Evangelos (author). “Optimizing Packaging Availability for Reverse Logistics: A case study at ASML.” 2018. Web. 28 Feb 2021.

Vancouver:

Giannoulakis E(. Optimizing Packaging Availability for Reverse Logistics: A case study at ASML. [Internet] [Masters thesis]. Delft University of Technology; 2018. [cited 2021 Feb 28]. Available from: http://resolver.tudelft.nl/uuid:5d4b42b5-685c-4bec-b347-62c4d45a6c99.

Council of Science Editors:

Giannoulakis E(. Optimizing Packaging Availability for Reverse Logistics: A case study at ASML. [Masters Thesis]. Delft University of Technology; 2018. Available from: http://resolver.tudelft.nl/uuid:5d4b42b5-685c-4bec-b347-62c4d45a6c99

13. Letowski, Bastien. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.

Degree: Docteur es, Génie électrique, 2016, Université Grenoble Alpes (ComUE)

Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la… (more)

Subjects/Keywords: Electronique de puissance; Packaging 3D; Conception couplé composant/packaging; Collage direct métal-Métal; Fabrication collective; Packaging à l’échelle de la plaque; Power Electronics; 3D packaging; Wire-Bond-Less module; Wafer-Level packaging; Direct copper bonding; Coupled design device/package; 620

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APA (6th Edition):

Letowski, B. (2016). Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2016GREAT114

Chicago Manual of Style (16th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed February 28, 2021. http://www.theses.fr/2016GREAT114.

MLA Handbook (7th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Web. 28 Feb 2021.

Vancouver:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2016. [cited 2021 Feb 28]. Available from: http://www.theses.fr/2016GREAT114.

Council of Science Editors:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2016. Available from: http://www.theses.fr/2016GREAT114


Texas A&M University

14. Chiang, Juei-Chun. Design and characterization of nanowire array as thermal interface material for electronics packaging.

Degree: MS, Mechanical Engineering, 2009, Texas A&M University

 To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employed to cool down computer chips. However, cooling performance is limited… (more)

Subjects/Keywords: Nanowire; thermal interface material; electronics packaging

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APA (6th Edition):

Chiang, J. (2009). Design and characterization of nanowire array as thermal interface material for electronics packaging. (Masters Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/ETD-TAMU-3188

Chicago Manual of Style (16th Edition):

Chiang, Juei-Chun. “Design and characterization of nanowire array as thermal interface material for electronics packaging.” 2009. Masters Thesis, Texas A&M University. Accessed February 28, 2021. http://hdl.handle.net/1969.1/ETD-TAMU-3188.

MLA Handbook (7th Edition):

Chiang, Juei-Chun. “Design and characterization of nanowire array as thermal interface material for electronics packaging.” 2009. Web. 28 Feb 2021.

Vancouver:

Chiang J. Design and characterization of nanowire array as thermal interface material for electronics packaging. [Internet] [Masters thesis]. Texas A&M University; 2009. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-3188.

Council of Science Editors:

Chiang J. Design and characterization of nanowire array as thermal interface material for electronics packaging. [Masters Thesis]. Texas A&M University; 2009. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-3188


Western Michigan University

15. Ma, Ruoxi. Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging.

Degree: PhD, Chemical and Paper Engineering, 2018, Western Michigan University

  Fiber-based packaging materials have many advantages over their petroleum-based plastic competitors, such as sustainability, recyclability and stiffness/weight ratio. However, the poor barrier properties and… (more)

Subjects/Keywords: Barrier coating; smart packaging; printed electronics; moisture sensor; glucomannan; hemicellulose; Chemical Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Ma, R. (2018). Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging. (Doctoral Dissertation). Western Michigan University. Retrieved from https://scholarworks.wmich.edu/dissertations/3327

Chicago Manual of Style (16th Edition):

Ma, Ruoxi. “Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging.” 2018. Doctoral Dissertation, Western Michigan University. Accessed February 28, 2021. https://scholarworks.wmich.edu/dissertations/3327.

MLA Handbook (7th Edition):

Ma, Ruoxi. “Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging.” 2018. Web. 28 Feb 2021.

Vancouver:

Ma R. Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging. [Internet] [Doctoral dissertation]. Western Michigan University; 2018. [cited 2021 Feb 28]. Available from: https://scholarworks.wmich.edu/dissertations/3327.

Council of Science Editors:

Ma R. Screen Printed Moisture Sensor On Barrier Coated SBS Board: The Characterizations of the Hemicellulose-Based Biofilms and Their Applications for Smart Packaging. [Doctoral Dissertation]. Western Michigan University; 2018. Available from: https://scholarworks.wmich.edu/dissertations/3327

16. Bajad, Nupur. Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.

Degree: MSIE, 2017, Binghamton University

  A design of experiment analysis is reported on data from warpage simulations using finite element analysis of a lidded electronics package. Warpage in a… (more)

Subjects/Keywords: Applied sciences; Design of experiment; Electronics packaging; Finite element analysis; Parametric analysis; Engineering

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APA (6th Edition):

Bajad, N. (2017). Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis. (Thesis). Binghamton University. Retrieved from https://orb.binghamton.edu/dissertation_and_theses/53

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bajad, Nupur. “Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.” 2017. Thesis, Binghamton University. Accessed February 28, 2021. https://orb.binghamton.edu/dissertation_and_theses/53.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bajad, Nupur. “Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.” 2017. Web. 28 Feb 2021.

Vancouver:

Bajad N. Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis. [Internet] [Thesis]. Binghamton University; 2017. [cited 2021 Feb 28]. Available from: https://orb.binghamton.edu/dissertation_and_theses/53.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bajad N. Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis. [Thesis]. Binghamton University; 2017. Available from: https://orb.binghamton.edu/dissertation_and_theses/53

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

17. Bi, Xianghong. Evaluation of graphene oxide - silicone die attach adhesive in LED packaging.

Degree: 2014, Hong Kong University of Science and Technology

 The successful wide application of LED lighting in general lighting market requires reduction in product cost, among which, LED packaging cost is proved to be… (more)

Subjects/Keywords: Light emitting diodes ; Graphene ; Oxidation ; Solid state electronics ; Synthesis ; Microelectronic packaging ; Materials

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Bi, X. (2014). Evaluation of graphene oxide - silicone die attach adhesive in LED packaging. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-70835 ; https://doi.org/10.14711/thesis-b1333627 ; http://repository.ust.hk/ir/bitstream/1783.1-70835/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bi, Xianghong. “Evaluation of graphene oxide - silicone die attach adhesive in LED packaging.” 2014. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-70835 ; https://doi.org/10.14711/thesis-b1333627 ; http://repository.ust.hk/ir/bitstream/1783.1-70835/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bi, Xianghong. “Evaluation of graphene oxide - silicone die attach adhesive in LED packaging.” 2014. Web. 28 Feb 2021.

Vancouver:

Bi X. Evaluation of graphene oxide - silicone die attach adhesive in LED packaging. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2014. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-70835 ; https://doi.org/10.14711/thesis-b1333627 ; http://repository.ust.hk/ir/bitstream/1783.1-70835/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bi X. Evaluation of graphene oxide - silicone die attach adhesive in LED packaging. [Thesis]. Hong Kong University of Science and Technology; 2014. Available from: http://repository.ust.hk/ir/Record/1783.1-70835 ; https://doi.org/10.14711/thesis-b1333627 ; http://repository.ust.hk/ir/bitstream/1783.1-70835/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Arizona

18. Omer, Ahmed Adan, 1964-. Capacitance calculations for three-dimensional VLSI interconnection geometries .

Degree: 1991, University of Arizona

 An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI geometries is presented. A proper combination of 2D and 3D methods is… (more)

Subjects/Keywords: Engineering, Electronics and Electrical.; Engineering, Packaging.

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APA (6th Edition):

Omer, Ahmed Adan, 1. (1991). Capacitance calculations for three-dimensional VLSI interconnection geometries . (Masters Thesis). University of Arizona. Retrieved from http://hdl.handle.net/10150/291396

Chicago Manual of Style (16th Edition):

Omer, Ahmed Adan, 1964-. “Capacitance calculations for three-dimensional VLSI interconnection geometries .” 1991. Masters Thesis, University of Arizona. Accessed February 28, 2021. http://hdl.handle.net/10150/291396.

MLA Handbook (7th Edition):

Omer, Ahmed Adan, 1964-. “Capacitance calculations for three-dimensional VLSI interconnection geometries .” 1991. Web. 28 Feb 2021.

Vancouver:

Omer, Ahmed Adan 1. Capacitance calculations for three-dimensional VLSI interconnection geometries . [Internet] [Masters thesis]. University of Arizona; 1991. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10150/291396.

Council of Science Editors:

Omer, Ahmed Adan 1. Capacitance calculations for three-dimensional VLSI interconnection geometries . [Masters Thesis]. University of Arizona; 1991. Available from: http://hdl.handle.net/10150/291396


University of South Florida

19. Carballo, Jose Miguel. Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation.

Degree: 2015, University of South Florida

 The goal of the present work is to develop, and evaluate a parametric model of a basic microscale Self-Assembly (SA) interaction that provides scaling predictions… (more)

Subjects/Keywords: Electronics packaging; Measurement; Microassembly; Modeling; Performance evaluation; Surface tension; Materials Science and Engineering; Mechanical Engineering

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APA (6th Edition):

Carballo, J. M. (2015). Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation. (Thesis). University of South Florida. Retrieved from https://scholarcommons.usf.edu/etd/5653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Carballo, Jose Miguel. “Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation.” 2015. Thesis, University of South Florida. Accessed February 28, 2021. https://scholarcommons.usf.edu/etd/5653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Carballo, Jose Miguel. “Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation.” 2015. Web. 28 Feb 2021.

Vancouver:

Carballo JM. Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation. [Internet] [Thesis]. University of South Florida; 2015. [cited 2021 Feb 28]. Available from: https://scholarcommons.usf.edu/etd/5653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Carballo JM. Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation. [Thesis]. University of South Florida; 2015. Available from: https://scholarcommons.usf.edu/etd/5653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Maryland

20. Greve, Hannes Martin Hinrich. ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS.

Degree: Mechanical Engineering, 2017, University of Maryland

 Growing power densities of electronic products and application of electronic systems in high temperature environment increase the temperature requirements on electronic packaging systems. Conventional interconnect… (more)

Subjects/Keywords: Mechanical engineering; Electronic Packaging; High Temperature Electronics; Intermetallic Compounds; Sintering; Soldering; Transient Liquid Phase Sintering

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APA (6th Edition):

Greve, H. M. H. (2017). ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS. (Thesis). University of Maryland. Retrieved from http://hdl.handle.net/1903/19469

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Greve, Hannes Martin Hinrich. “ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS.” 2017. Thesis, University of Maryland. Accessed February 28, 2021. http://hdl.handle.net/1903/19469.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Greve, Hannes Martin Hinrich. “ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS.” 2017. Web. 28 Feb 2021.

Vancouver:

Greve HMH. ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS. [Internet] [Thesis]. University of Maryland; 2017. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1903/19469.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Greve HMH. ASSESSMENT OF PROPERTIES OF TRANSIENT LIQUID PHASE SINTERED (TLPS) INTERCONNECTS BY SIMULATION AND EXPERIMENTS. [Thesis]. University of Maryland; 2017. Available from: http://hdl.handle.net/1903/19469

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Virginia Tech

21. Cao, Xiao. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.

Degree: PhD, Electrical and Computer Engineering, 2011, Virginia Tech

 This study focuses on development a planar power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With… (more)

Subjects/Keywords: thermal management; high density integration; power module; thermo-mechanical stress; power electronics packaging; reliability test

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Cao, X. (2011). Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/77252

Chicago Manual of Style (16th Edition):

Cao, Xiao. “Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.” 2011. Doctoral Dissertation, Virginia Tech. Accessed February 28, 2021. http://hdl.handle.net/10919/77252.

MLA Handbook (7th Edition):

Cao, Xiao. “Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress.” 2011. Web. 28 Feb 2021.

Vancouver:

Cao X. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. [Internet] [Doctoral dissertation]. Virginia Tech; 2011. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10919/77252.

Council of Science Editors:

Cao X. Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress. [Doctoral Dissertation]. Virginia Tech; 2011. Available from: http://hdl.handle.net/10919/77252


University of Dayton

22. Smarra, Devin A. Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics.

Degree: MS(M.S.), Electrical Engineering, 2017, University of Dayton

 Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry… (more)

Subjects/Keywords: Electrical Engineering; LTCC; Electronic Packaging; Low Temperature Co-Fired Ceramic; High Temperature Electronics; Microelectronics

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APA (6th Edition):

Smarra, D. A. (2017). Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics. (Masters Thesis). University of Dayton. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894

Chicago Manual of Style (16th Edition):

Smarra, Devin A. “Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics.” 2017. Masters Thesis, University of Dayton. Accessed February 28, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.

MLA Handbook (7th Edition):

Smarra, Devin A. “Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics.” 2017. Web. 28 Feb 2021.

Vancouver:

Smarra DA. Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics. [Internet] [Masters thesis]. University of Dayton; 2017. [cited 2021 Feb 28]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.

Council of Science Editors:

Smarra DA. Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics. [Masters Thesis]. University of Dayton; 2017. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894


University of New Mexico

23. Suszko, Arthur. Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling.

Degree: Mechanical Engineering, 2015, University of New Mexico

 Microprocessors have substantially increased total power dissipation and transistors density over the past two decades, owing to the growth in complexity, performance, and parallelism of… (more)

Subjects/Keywords: Enhancement of nucleate boiling; dielectric liquids; immersion cooling; thermally anistropic composite heat spreasders; electronics cooling; thermal management; electronics packaging

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APA (6th Edition):

Suszko, A. (2015). Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling. (Doctoral Dissertation). University of New Mexico. Retrieved from http://hdl.handle.net/1928/30421

Chicago Manual of Style (16th Edition):

Suszko, Arthur. “Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling.” 2015. Doctoral Dissertation, University of New Mexico. Accessed February 28, 2021. http://hdl.handle.net/1928/30421.

MLA Handbook (7th Edition):

Suszko, Arthur. “Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling.” 2015. Web. 28 Feb 2021.

Vancouver:

Suszko A. Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling. [Internet] [Doctoral dissertation]. University of New Mexico; 2015. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1928/30421.

Council of Science Editors:

Suszko A. Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling. [Doctoral Dissertation]. University of New Mexico; 2015. Available from: http://hdl.handle.net/1928/30421


University of Arkansas

24. Bourland, Charles R. Environmental Reliability of Thin Film Sealing on Thick Film LTCC.

Degree: MS, 2015, University of Arkansas

  As electronic components and systems become more intricate and expand into new realms of use case scenarios, new materials systems must be explored. With… (more)

Subjects/Keywords: Applied sciences; Advanced electronic packaging; Advanced thin films; Ceramics; Extreme environment electronics; LTCC; Reliability of electronics; Electrical and Electronics; Electronic Devices and Semiconductor Manufacturing; Industrial Organization

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APA (6th Edition):

Bourland, C. R. (2015). Environmental Reliability of Thin Film Sealing on Thick Film LTCC. (Masters Thesis). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/1178

Chicago Manual of Style (16th Edition):

Bourland, Charles R. “Environmental Reliability of Thin Film Sealing on Thick Film LTCC.” 2015. Masters Thesis, University of Arkansas. Accessed February 28, 2021. https://scholarworks.uark.edu/etd/1178.

MLA Handbook (7th Edition):

Bourland, Charles R. “Environmental Reliability of Thin Film Sealing on Thick Film LTCC.” 2015. Web. 28 Feb 2021.

Vancouver:

Bourland CR. Environmental Reliability of Thin Film Sealing on Thick Film LTCC. [Internet] [Masters thesis]. University of Arkansas; 2015. [cited 2021 Feb 28]. Available from: https://scholarworks.uark.edu/etd/1178.

Council of Science Editors:

Bourland CR. Environmental Reliability of Thin Film Sealing on Thick Film LTCC. [Masters Thesis]. University of Arkansas; 2015. Available from: https://scholarworks.uark.edu/etd/1178


INP Toulouse

25. Msolli, Sabeur. Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics.

Degree: Docteur es, Génie Mécanique, Mécanique des Matériaux, 2011, INP Toulouse

L'utilisation du diamant comme composant d'électronique de puissance est une perspective intéressante tant en ce qui concerne les applications hautes température que forte puissance. La… (more)

Subjects/Keywords: Packaging électronique de puissance; Diamant; Viscoplasticité; Endommagement; Mef; Brasures; Métallisations; Haute température; Power electronics packaging; Diamond; Viscoplasticity; Damage; Fem; Solder joints; Metallization; High temperature

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APA (6th Edition):

Msolli, S. (2011). Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2011INPT0088

Chicago Manual of Style (16th Edition):

Msolli, Sabeur. “Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics.” 2011. Doctoral Dissertation, INP Toulouse. Accessed February 28, 2021. http://www.theses.fr/2011INPT0088.

MLA Handbook (7th Edition):

Msolli, Sabeur. “Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics.” 2011. Web. 28 Feb 2021.

Vancouver:

Msolli S. Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics. [Internet] [Doctoral dissertation]. INP Toulouse; 2011. [cited 2021 Feb 28]. Available from: http://www.theses.fr/2011INPT0088.

Council of Science Editors:

Msolli S. Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température : Thermomechanical modeling of a diamond based packaging for high temperature power electronics. [Doctoral Dissertation]. INP Toulouse; 2011. Available from: http://www.theses.fr/2011INPT0088


Brno University of Technology

26. Skácel, Josef. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.

Degree: 2018, Brno University of Technology

 This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution.… (more)

Subjects/Keywords: Pouzdření v elektronice; ANSYS Workbench; teplotní simulace; pouzdřící materiály; koeficient teplotní roztažnosti; TKR; Packaging in electronics; ANSYS Workbench; thermal simulation; packaging materials; coefficient of thermal expansion; CTE

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APA (6th Edition):

Skácel, J. (2018). Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/40254

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Skácel, Josef. “Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.” 2018. Thesis, Brno University of Technology. Accessed February 28, 2021. http://hdl.handle.net/11012/40254.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Skácel, Josef. “Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.” 2018. Web. 28 Feb 2021.

Vancouver:

Skácel J. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/11012/40254.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Skácel J. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/40254

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Ryerson University

27. Zhou., Ming. Testing and analysis of solder joint reliability for BGA assembly under flexural loading.

Degree: 2009, Ryerson University

 The solder joint reliability for BGA (Ball Grid Array) assembly is becoming a more concerned issue as these packages are featuring higher density interconnections, multiple… (more)

Subjects/Keywords: Ball grid array technology.; Electronic packaging.; Joints (Engineering)  – Reliability; Electric connectors; Lead-free electronics manufacturing processes.

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APA (6th Edition):

Zhou., M. (2009). Testing and analysis of solder joint reliability for BGA assembly under flexural loading. (Thesis). Ryerson University. Retrieved from https://digital.library.ryerson.ca/islandora/object/RULA%3A6699

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhou., Ming. “Testing and analysis of solder joint reliability for BGA assembly under flexural loading.” 2009. Thesis, Ryerson University. Accessed February 28, 2021. https://digital.library.ryerson.ca/islandora/object/RULA%3A6699.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhou., Ming. “Testing and analysis of solder joint reliability for BGA assembly under flexural loading.” 2009. Web. 28 Feb 2021.

Vancouver:

Zhou. M. Testing and analysis of solder joint reliability for BGA assembly under flexural loading. [Internet] [Thesis]. Ryerson University; 2009. [cited 2021 Feb 28]. Available from: https://digital.library.ryerson.ca/islandora/object/RULA%3A6699.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhou. M. Testing and analysis of solder joint reliability for BGA assembly under flexural loading. [Thesis]. Ryerson University; 2009. Available from: https://digital.library.ryerson.ca/islandora/object/RULA%3A6699

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Tampere University

28. Laurila, Mika-Matti. High-Precision Digital Printing Processes for Electronics Fabrication .

Degree: 2019, Tampere University

 This thesis investigates the capabilities of high-precision digital printing technologies in the fabrication of miniaturized components for electronics packaging, transistor intercon- nects and monolithically integrated… (more)

Subjects/Keywords: Printed electronics ; digital fabrication ; high-resolution inkjet ; MEMS packaging ; biosignal measurement ; Painettava elektroniikka ; digitaaliset valmistusmenetelmät ; korkean resolution mustesuihkutulostus ; MEMS pakkaus ; biosignaalimittaus

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Laurila, M. (2019). High-Precision Digital Printing Processes for Electronics Fabrication . (Doctoral Dissertation). Tampere University. Retrieved from https://trepo.tuni.fi/handle/10024/116831

Chicago Manual of Style (16th Edition):

Laurila, Mika-Matti. “High-Precision Digital Printing Processes for Electronics Fabrication .” 2019. Doctoral Dissertation, Tampere University. Accessed February 28, 2021. https://trepo.tuni.fi/handle/10024/116831.

MLA Handbook (7th Edition):

Laurila, Mika-Matti. “High-Precision Digital Printing Processes for Electronics Fabrication .” 2019. Web. 28 Feb 2021.

Vancouver:

Laurila M. High-Precision Digital Printing Processes for Electronics Fabrication . [Internet] [Doctoral dissertation]. Tampere University; 2019. [cited 2021 Feb 28]. Available from: https://trepo.tuni.fi/handle/10024/116831.

Council of Science Editors:

Laurila M. High-Precision Digital Printing Processes for Electronics Fabrication . [Doctoral Dissertation]. Tampere University; 2019. Available from: https://trepo.tuni.fi/handle/10024/116831


University of Michigan

29. Li, Chen. Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels.

Degree: PhD, Mechanical Engineering, 2019, University of Michigan

 Thermal management of electronic and optoelectronic devices has become increasingly challenging. For electronic devices, the challenge arises primarily from the drive for miniaturized, high-performance devices,… (more)

Subjects/Keywords: thermal management; nanoscale heat transfer; diode laser reliability; thermal management materials; phase change material; electronics packaging; Mechanical Engineering; Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Li, C. (2019). Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels. (Doctoral Dissertation). University of Michigan. Retrieved from http://hdl.handle.net/2027.42/150013

Chicago Manual of Style (16th Edition):

Li, Chen. “Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels.” 2019. Doctoral Dissertation, University of Michigan. Accessed February 28, 2021. http://hdl.handle.net/2027.42/150013.

MLA Handbook (7th Edition):

Li, Chen. “Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels.” 2019. Web. 28 Feb 2021.

Vancouver:

Li C. Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels. [Internet] [Doctoral dissertation]. University of Michigan; 2019. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/2027.42/150013.

Council of Science Editors:

Li C. Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels. [Doctoral Dissertation]. University of Michigan; 2019. Available from: http://hdl.handle.net/2027.42/150013


Queensland University of Technology

30. Enchelmaier, David Samuel. A miniaturised wideband frequency synthesiser.

Degree: 2009, Queensland University of Technology

 Wideband frequency synthesisers have application in many areas, including test instrumentation and defence electronics. Miniaturisation of these devices provides many advantages to system designers, particularly… (more)

Subjects/Keywords: Broadband; electronics; frequency synthesiser; microwave; microwave circuit design; microwave packaging; millimetre wave; wideband; phase locked loop; voltage controlled oscillator; wideband

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Enchelmaier, D. S. (2009). A miniaturised wideband frequency synthesiser. (Thesis). Queensland University of Technology. Retrieved from https://eprints.qut.edu.au/31851/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Enchelmaier, David Samuel. “A miniaturised wideband frequency synthesiser.” 2009. Thesis, Queensland University of Technology. Accessed February 28, 2021. https://eprints.qut.edu.au/31851/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Enchelmaier, David Samuel. “A miniaturised wideband frequency synthesiser.” 2009. Web. 28 Feb 2021.

Vancouver:

Enchelmaier DS. A miniaturised wideband frequency synthesiser. [Internet] [Thesis]. Queensland University of Technology; 2009. [cited 2021 Feb 28]. Available from: https://eprints.qut.edu.au/31851/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Enchelmaier DS. A miniaturised wideband frequency synthesiser. [Thesis]. Queensland University of Technology; 2009. Available from: https://eprints.qut.edu.au/31851/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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