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You searched for subject:(Electronic packaging). Showing records 1 – 30 of 143 total matches.

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Hong Kong University of Science and Technology

1. Guan, Chunhua. Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages.

Degree: 2013, Hong Kong University of Science and Technology

 Nowadays, die attach glue is widely used in adhesive die bonding packages, for its high heat dissipation ability and good resistance against thermal fatigue. However,… (more)

Subjects/Keywords: Microelectronic packaging ; Electronic packaging ; Adhesives

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APA (6th Edition):

Guan, C. (2013). Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-7883 ; https://doi.org/10.14711/thesis-b1213720 ; http://repository.ust.hk/ir/bitstream/1783.1-7883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Guan, Chunhua. “Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages.” 2013. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-7883 ; https://doi.org/10.14711/thesis-b1213720 ; http://repository.ust.hk/ir/bitstream/1783.1-7883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Guan, Chunhua. “Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages.” 2013. Web. 28 Feb 2021.

Vancouver:

Guan C. Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2013. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-7883 ; https://doi.org/10.14711/thesis-b1213720 ; http://repository.ust.hk/ir/bitstream/1783.1-7883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Guan C. Characterization and selecting criteria of die attach film (DAF) for adhesive die bonding packages. [Thesis]. Hong Kong University of Science and Technology; 2013. Available from: http://repository.ust.hk/ir/Record/1783.1-7883 ; https://doi.org/10.14711/thesis-b1213720 ; http://repository.ust.hk/ir/bitstream/1783.1-7883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Rochester Institute of Technology

2. Nazareth, Mathew. Design and simulation of a multichip module.

Degree: Electrical Engineering, 1994, Rochester Institute of Technology

Electronic packaging has undergone basic changes in the last few years to keep up with an ever increasing demand for speed and miniaturization. Multichip… (more)

Subjects/Keywords: Electronic packaging

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APA (6th Edition):

Nazareth, M. (1994). Design and simulation of a multichip module. (Thesis). Rochester Institute of Technology. Retrieved from https://scholarworks.rit.edu/theses/5595

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nazareth, Mathew. “Design and simulation of a multichip module.” 1994. Thesis, Rochester Institute of Technology. Accessed February 28, 2021. https://scholarworks.rit.edu/theses/5595.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nazareth, Mathew. “Design and simulation of a multichip module.” 1994. Web. 28 Feb 2021.

Vancouver:

Nazareth M. Design and simulation of a multichip module. [Internet] [Thesis]. Rochester Institute of Technology; 1994. [cited 2021 Feb 28]. Available from: https://scholarworks.rit.edu/theses/5595.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nazareth M. Design and simulation of a multichip module. [Thesis]. Rochester Institute of Technology; 1994. Available from: https://scholarworks.rit.edu/theses/5595

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

3. He, Peng. Thiol material selection for better adhesion and reliability for copper/epoxy interface.

Degree: 2011, Hong Kong University of Science and Technology

 With the shrinking size and increasing density of electronic packages, reliability becomes one of the most critical issues. Especially delamination, such as the weak adhesion… (more)

Subjects/Keywords: Electronic packaging  – Materials ; Thiols ; Adhesion

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APA (6th Edition):

He, P. (2011). Thiol material selection for better adhesion and reliability for copper/epoxy interface. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

He, Peng. “Thiol material selection for better adhesion and reliability for copper/epoxy interface.” 2011. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

He, Peng. “Thiol material selection for better adhesion and reliability for copper/epoxy interface.” 2011. Web. 28 Feb 2021.

Vancouver:

He P. Thiol material selection for better adhesion and reliability for copper/epoxy interface. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2011. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

He P. Thiol material selection for better adhesion and reliability for copper/epoxy interface. [Thesis]. Hong Kong University of Science and Technology; 2011. Available from: http://repository.ust.hk/ir/Record/1783.1-7422 ; https://doi.org/10.14711/thesis-b1155691 ; http://repository.ust.hk/ir/bitstream/1783.1-7422/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

4. Zhang, Chenbo. Failure analysis for small outline transistor (SOT) packages under high temperature storage test.

Degree: 2015, Hong Kong University of Science and Technology

 Nowadays, electronic packages have been widely applied in many fields. Higher and higher requirement in thermal and mechanical reliabilities are plaguing a lot of researchers… (more)

Subjects/Keywords: Electronic packaging ; Thermal properties ; Reliability

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APA (6th Edition):

Zhang, C. (2015). Failure analysis for small outline transistor (SOT) packages under high temperature storage test. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-78896 ; https://doi.org/10.14711/thesis-b1514630 ; http://repository.ust.hk/ir/bitstream/1783.1-78896/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhang, Chenbo. “Failure analysis for small outline transistor (SOT) packages under high temperature storage test.” 2015. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-78896 ; https://doi.org/10.14711/thesis-b1514630 ; http://repository.ust.hk/ir/bitstream/1783.1-78896/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhang, Chenbo. “Failure analysis for small outline transistor (SOT) packages under high temperature storage test.” 2015. Web. 28 Feb 2021.

Vancouver:

Zhang C. Failure analysis for small outline transistor (SOT) packages under high temperature storage test. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2015. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-78896 ; https://doi.org/10.14711/thesis-b1514630 ; http://repository.ust.hk/ir/bitstream/1783.1-78896/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang C. Failure analysis for small outline transistor (SOT) packages under high temperature storage test. [Thesis]. Hong Kong University of Science and Technology; 2015. Available from: http://repository.ust.hk/ir/Record/1783.1-78896 ; https://doi.org/10.14711/thesis-b1514630 ; http://repository.ust.hk/ir/bitstream/1783.1-78896/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Michigan State University

5. Hall, C., William. The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films.

Degree: MS, School of Packaging, 1991, Michigan State University

Subjects/Keywords: Electronic packaging

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APA (6th Edition):

Hall, C., W. (1991). The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films. (Masters Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:23140

Chicago Manual of Style (16th Edition):

Hall, C., William. “The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films.” 1991. Masters Thesis, Michigan State University. Accessed February 28, 2021. http://etd.lib.msu.edu/islandora/object/etd:23140.

MLA Handbook (7th Edition):

Hall, C., William. “The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films.” 1991. Web. 28 Feb 2021.

Vancouver:

Hall, C. W. The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films. [Internet] [Masters thesis]. Michigan State University; 1991. [cited 2021 Feb 28]. Available from: http://etd.lib.msu.edu/islandora/object/etd:23140.

Council of Science Editors:

Hall, C. W. The evaluation of a recommended test procedure for quantifying the triboelectric charging propensity of conductive, dissipative and insulative films. [Masters Thesis]. Michigan State University; 1991. Available from: http://etd.lib.msu.edu/islandora/object/etd:23140


Montana State University

6. Lambert, Adrien Pascal. Thermal-mechanical analysis of system-level electronic packages for space applications.

Degree: MS, College of Engineering, 2012, Montana State University

 A position sensitive radiation sensor is being designed in conjunction with a field programmable gate array (FPGA) in order to further harden space flight computers… (more)

Subjects/Keywords: Electronic packaging.; Vibration.; Thermal analysis.

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APA (6th Edition):

Lambert, A. P. (2012). Thermal-mechanical analysis of system-level electronic packages for space applications. (Masters Thesis). Montana State University. Retrieved from https://scholarworks.montana.edu/xmlui/handle/1/1696

Chicago Manual of Style (16th Edition):

Lambert, Adrien Pascal. “Thermal-mechanical analysis of system-level electronic packages for space applications.” 2012. Masters Thesis, Montana State University. Accessed February 28, 2021. https://scholarworks.montana.edu/xmlui/handle/1/1696.

MLA Handbook (7th Edition):

Lambert, Adrien Pascal. “Thermal-mechanical analysis of system-level electronic packages for space applications.” 2012. Web. 28 Feb 2021.

Vancouver:

Lambert AP. Thermal-mechanical analysis of system-level electronic packages for space applications. [Internet] [Masters thesis]. Montana State University; 2012. [cited 2021 Feb 28]. Available from: https://scholarworks.montana.edu/xmlui/handle/1/1696.

Council of Science Editors:

Lambert AP. Thermal-mechanical analysis of system-level electronic packages for space applications. [Masters Thesis]. Montana State University; 2012. Available from: https://scholarworks.montana.edu/xmlui/handle/1/1696


University of Waterloo

7. Laor, Ariel. A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement.

Degree: 2016, University of Waterloo

 Flip chip is an electronic packaging technology that is becoming more popular in first level electronic packaging as the need for high density electrical interconnects… (more)

Subjects/Keywords: Flip Chip Electronic Packaging CMOS

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APA (6th Edition):

Laor, A. (2016). A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/10452

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Laor, Ariel. “A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement.” 2016. Thesis, University of Waterloo. Accessed February 28, 2021. http://hdl.handle.net/10012/10452.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Laor, Ariel. “A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement.” 2016. Web. 28 Feb 2021.

Vancouver:

Laor A. A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement. [Internet] [Thesis]. University of Waterloo; 2016. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10012/10452.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Laor A. A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement. [Thesis]. University of Waterloo; 2016. Available from: http://hdl.handle.net/10012/10452

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

8. Liu, Dong. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.

Degree: 2014, Hong Kong University of Science and Technology

 Wire bonding is one of the dominant microelectronic connection technologies, which provides electrical connection between integrated circuits and external leads. A solid free air ball… (more)

Subjects/Keywords: Wire bonding (Electronic packaging) ; Microelectronic packaging ; Interconnects (Integrated circuit technology)

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APA (6th Edition):

Liu, D. (2014). A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Web. 28 Feb 2021.

Vancouver:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2014. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Thesis]. Hong Kong University of Science and Technology; 2014. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

9. Spurney, Robert Grant. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.

Degree: PhD, Materials Science and Engineering, 2019, Georgia Tech

 Capacitors are key components for power conversion, delivery, and management. Along with inductors, they dictate the size and performance of voltage regulators in power distribution… (more)

Subjects/Keywords: Power components; Electronic packaging; Capacitors; Energy materials

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APA (6th Edition):

Spurney, R. G. (2019). Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62279

Chicago Manual of Style (16th Edition):

Spurney, Robert Grant. “Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.” 2019. Doctoral Dissertation, Georgia Tech. Accessed February 28, 2021. http://hdl.handle.net/1853/62279.

MLA Handbook (7th Edition):

Spurney, Robert Grant. “Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators.” 2019. Web. 28 Feb 2021.

Vancouver:

Spurney RG. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1853/62279.

Council of Science Editors:

Spurney RG. Advanced materials and processes for high-density capacitors for next-generation integrated voltage regulators. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62279


University of Johannesburg

10. Gerber, Mark Benjamin. On packaging techniques for a high power density DC/DC converter.

Degree: 2009, University of Johannesburg

M.Ing.

Power electronic systems are often treated purely as electronic circuits. This results in manufactured systems that are electrically functional but not optimised in terms… (more)

Subjects/Keywords: DC-to-DC converters; Electronic packaging

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APA (6th Edition):

Gerber, M. B. (2009). On packaging techniques for a high power density DC/DC converter. (Thesis). University of Johannesburg. Retrieved from http://hdl.handle.net/10210/2167

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Gerber, Mark Benjamin. “On packaging techniques for a high power density DC/DC converter.” 2009. Thesis, University of Johannesburg. Accessed February 28, 2021. http://hdl.handle.net/10210/2167.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Gerber, Mark Benjamin. “On packaging techniques for a high power density DC/DC converter.” 2009. Web. 28 Feb 2021.

Vancouver:

Gerber MB. On packaging techniques for a high power density DC/DC converter. [Internet] [Thesis]. University of Johannesburg; 2009. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10210/2167.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gerber MB. On packaging techniques for a high power density DC/DC converter. [Thesis]. University of Johannesburg; 2009. Available from: http://hdl.handle.net/10210/2167

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

11. Lim, Jun Zhang. Glass frit hermetic encapsulation for harsh environment multi-chip module application .

Degree: 2013, Nanyang Technological University

 This research project aims to investigate the suitability of glass frit bonding for multi-chip module (MCM) package encapsulation that needs to operate at a high… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Lim, J. Z. (2013). Glass frit hermetic encapsulation for harsh environment multi-chip module application . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/59379

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lim, Jun Zhang. “Glass frit hermetic encapsulation for harsh environment multi-chip module application .” 2013. Thesis, Nanyang Technological University. Accessed February 28, 2021. http://hdl.handle.net/10356/59379.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lim, Jun Zhang. “Glass frit hermetic encapsulation for harsh environment multi-chip module application .” 2013. Web. 28 Feb 2021.

Vancouver:

Lim JZ. Glass frit hermetic encapsulation for harsh environment multi-chip module application . [Internet] [Thesis]. Nanyang Technological University; 2013. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10356/59379.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lim JZ. Glass frit hermetic encapsulation for harsh environment multi-chip module application . [Thesis]. Nanyang Technological University; 2013. Available from: http://hdl.handle.net/10356/59379

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

12. Lau, Fu Long. Electrical properties of AU-GE solder under high temperature .

Degree: 2014, Nanyang Technological University

 Ruggedized electronics are defined as electronics that can withstand harsh operating environment. A key requirement for ruggedized electronics is reliability. One of the areas for… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Lau, F. L. (2014). Electrical properties of AU-GE solder under high temperature . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/61875

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lau, Fu Long. “Electrical properties of AU-GE solder under high temperature .” 2014. Thesis, Nanyang Technological University. Accessed February 28, 2021. http://hdl.handle.net/10356/61875.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lau, Fu Long. “Electrical properties of AU-GE solder under high temperature .” 2014. Web. 28 Feb 2021.

Vancouver:

Lau FL. Electrical properties of AU-GE solder under high temperature . [Internet] [Thesis]. Nanyang Technological University; 2014. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10356/61875.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lau FL. Electrical properties of AU-GE solder under high temperature . [Thesis]. Nanyang Technological University; 2014. Available from: http://hdl.handle.net/10356/61875

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

13. I Made Riko. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .

Degree: 2011, Nanyang Technological University

 Vertically stacking and bonding individual processed wafers with through-Si vias (TSV) to form three dimensional integrated circuits (3DIC) introduces the possibility of reducing signal propagation… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Riko, I. M. (2011). Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/43639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Riko, I Made. “Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .” 2011. Thesis, Nanyang Technological University. Accessed February 28, 2021. http://hdl.handle.net/10356/43639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Riko, I Made. “Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits .” 2011. Web. 28 Feb 2021.

Vancouver:

Riko IM. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . [Internet] [Thesis]. Nanyang Technological University; 2011. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10356/43639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Riko IM. Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits . [Thesis]. Nanyang Technological University; 2011. Available from: http://hdl.handle.net/10356/43639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Nanyang Technological University

14. Luo, Kaiming. Investigation of nano-copper for electronic packaging application : solder metallization and die attach .

Degree: 2016, Nanyang Technological University

 Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the… (more)

Subjects/Keywords: DRNTU::Engineering::Materials::Electronic packaging materials

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APA (6th Edition):

Luo, K. (2016). Investigation of nano-copper for electronic packaging application : solder metallization and die attach . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10356/66939

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Luo, Kaiming. “Investigation of nano-copper for electronic packaging application : solder metallization and die attach .” 2016. Thesis, Nanyang Technological University. Accessed February 28, 2021. http://hdl.handle.net/10356/66939.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Luo, Kaiming. “Investigation of nano-copper for electronic packaging application : solder metallization and die attach .” 2016. Web. 28 Feb 2021.

Vancouver:

Luo K. Investigation of nano-copper for electronic packaging application : solder metallization and die attach . [Internet] [Thesis]. Nanyang Technological University; 2016. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10356/66939.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Luo K. Investigation of nano-copper for electronic packaging application : solder metallization and die attach . [Thesis]. Nanyang Technological University; 2016. Available from: http://hdl.handle.net/10356/66939

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

15. Zhang, Qiming. Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading.

Degree: 2017, Hong Kong University of Science and Technology

 Pad cratering is a dominant failure mode for BGA-PCB assemblies with the non-solder mask defined pad opening configuration. Over the last 20 years, due to… (more)

Subjects/Keywords: Electronic packaging ; Cracking ; Printed circuits ; Reliability

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APA (6th Edition):

Zhang, Q. (2017). Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-90930 ; https://doi.org/10.14711/thesis-991012555360903412 ; http://repository.ust.hk/ir/bitstream/1783.1-90930/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhang, Qiming. “Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading.” 2017. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-90930 ; https://doi.org/10.14711/thesis-991012555360903412 ; http://repository.ust.hk/ir/bitstream/1783.1-90930/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhang, Qiming. “Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading.” 2017. Web. 28 Feb 2021.

Vancouver:

Zhang Q. Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2017. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-90930 ; https://doi.org/10.14711/thesis-991012555360903412 ; http://repository.ust.hk/ir/bitstream/1783.1-90930/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang Q. Strain dominant failure criteria for board level pad cratering under over-stress and fatigue loading. [Thesis]. Hong Kong University of Science and Technology; 2017. Available from: http://repository.ust.hk/ir/Record/1783.1-90930 ; https://doi.org/10.14711/thesis-991012555360903412 ; http://repository.ust.hk/ir/bitstream/1783.1-90930/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

16. Zhang, Minshu. Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages.

Degree: 2010, Hong Kong University of Science and Technology

 Hygrothermal failure is a long existing issue for plastic encapsulated IC packages. The moisture absorbed by plastic packages will vaporize and produce high internal pressure… (more)

Subjects/Keywords: Electronic packaging ; Hygrothermoelasticity

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APA (6th Edition):

Zhang, M. (2010). Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-7040 ; https://doi.org/10.14711/thesis-b1115379 ; http://repository.ust.hk/ir/bitstream/1783.1-7040/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhang, Minshu. “Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages.” 2010. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-7040 ; https://doi.org/10.14711/thesis-b1115379 ; http://repository.ust.hk/ir/bitstream/1783.1-7040/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhang, Minshu. “Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages.” 2010. Web. 28 Feb 2021.

Vancouver:

Zhang M. Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2010. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-7040 ; https://doi.org/10.14711/thesis-b1115379 ; http://repository.ust.hk/ir/bitstream/1783.1-7040/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang M. Investigation and analysis on hygrothermal failure in quad flat no-lead (QFN) packages. [Thesis]. Hong Kong University of Science and Technology; 2010. Available from: http://repository.ust.hk/ir/Record/1783.1-7040 ; https://doi.org/10.14711/thesis-b1115379 ; http://repository.ust.hk/ir/bitstream/1783.1-7040/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

17. Liu, Yan. Superhydrophobic surfaces for electronic packaging and energy applications.

Degree: PhD, Materials Science and Engineering, 2013, Georgia Tech

 Superhydrophobic surfaces, which display water contact angles of larger than 150°, have attracted more and more attention due to their importance in both fundamental research… (more)

Subjects/Keywords: Superhydrophobic surfaces; Electronic packaging; Solar cells

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APA (6th Edition):

Liu, Y. (2013). Superhydrophobic surfaces for electronic packaging and energy applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52164

Chicago Manual of Style (16th Edition):

Liu, Yan. “Superhydrophobic surfaces for electronic packaging and energy applications.” 2013. Doctoral Dissertation, Georgia Tech. Accessed February 28, 2021. http://hdl.handle.net/1853/52164.

MLA Handbook (7th Edition):

Liu, Yan. “Superhydrophobic surfaces for electronic packaging and energy applications.” 2013. Web. 28 Feb 2021.

Vancouver:

Liu Y. Superhydrophobic surfaces for electronic packaging and energy applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2013. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1853/52164.

Council of Science Editors:

Liu Y. Superhydrophobic surfaces for electronic packaging and energy applications. [Doctoral Dissertation]. Georgia Tech; 2013. Available from: http://hdl.handle.net/1853/52164


University of Tennessee – Knoxville

18. Wang, Jiaqi. Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective.

Degree: MS, Mechanical Engineering, 2018, University of Tennessee – Knoxville

 Sintering of nanomaterials has been broadly utilized as a joining technique in various applications for achieving excellent mechanical, thermal, and electronic properties. However, the joining… (more)

Subjects/Keywords: Nanostructures; molecular dynamics; sintering; electronic packaging

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APA (6th Edition):

Wang, J. (2018). Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective. (Thesis). University of Tennessee – Knoxville. Retrieved from https://trace.tennessee.edu/utk_gradthes/5092

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Jiaqi. “Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective.” 2018. Thesis, University of Tennessee – Knoxville. Accessed February 28, 2021. https://trace.tennessee.edu/utk_gradthes/5092.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Jiaqi. “Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective.” 2018. Web. 28 Feb 2021.

Vancouver:

Wang J. Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective. [Internet] [Thesis]. University of Tennessee – Knoxville; 2018. [cited 2021 Feb 28]. Available from: https://trace.tennessee.edu/utk_gradthes/5092.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Mass Transport of Metallic Nanostructures during Sintering Process: A Molecular Dynamics Perspective. [Thesis]. University of Tennessee – Knoxville; 2018. Available from: https://trace.tennessee.edu/utk_gradthes/5092

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Loughborough University

19. Wasley, Thomas J. Digitally driven microfabrication of 3D multilayer embedded electronic systems.

Degree: PhD, 2016, Loughborough University

 The integration of multiple digitally driven processes is seen as the solution to many of the current limitations arising from standalone Additive Manufacturing (AM) techniques.… (more)

Subjects/Keywords: 621.381; Additive manufacturing; Electronic packaging; Stereolithography; Multilayer

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APA (6th Edition):

Wasley, T. J. (2016). Digitally driven microfabrication of 3D multilayer embedded electronic systems. (Doctoral Dissertation). Loughborough University. Retrieved from http://hdl.handle.net/2134/23237

Chicago Manual of Style (16th Edition):

Wasley, Thomas J. “Digitally driven microfabrication of 3D multilayer embedded electronic systems.” 2016. Doctoral Dissertation, Loughborough University. Accessed February 28, 2021. http://hdl.handle.net/2134/23237.

MLA Handbook (7th Edition):

Wasley, Thomas J. “Digitally driven microfabrication of 3D multilayer embedded electronic systems.” 2016. Web. 28 Feb 2021.

Vancouver:

Wasley TJ. Digitally driven microfabrication of 3D multilayer embedded electronic systems. [Internet] [Doctoral dissertation]. Loughborough University; 2016. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/2134/23237.

Council of Science Editors:

Wasley TJ. Digitally driven microfabrication of 3D multilayer embedded electronic systems. [Doctoral Dissertation]. Loughborough University; 2016. Available from: http://hdl.handle.net/2134/23237

20. Oh, Yoonchan. Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration.

Degree: PhD, Mechanical Engineering, 2005, Texas A&M University

 The demands for higher clock speeds and larger current magnitude in high-performance flip-chip electronic packaging configurations of small footprint have inevitably raised the concern over… (more)

Subjects/Keywords: electronic packaging

…indispensable to our daily lives are enabled by the electronic packaging technology keeping face with… …packaging electronic equipment” [1], mainly deals with efficient ways of… …improving electronic packaging reliability, so that better quality and higher yield can be… …the Journal of Electronic Packaging. 2 packages will be briefly described along with the… …a given electronic packaging with two three-layer chips mounted on the top a two-layer… 

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APA (6th Edition):

Oh, Y. (2005). Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration. (Doctoral Dissertation). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/2719

Chicago Manual of Style (16th Edition):

Oh, Yoonchan. “Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration.” 2005. Doctoral Dissertation, Texas A&M University. Accessed February 28, 2021. http://hdl.handle.net/1969.1/2719.

MLA Handbook (7th Edition):

Oh, Yoonchan. “Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration.” 2005. Web. 28 Feb 2021.

Vancouver:

Oh Y. Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration. [Internet] [Doctoral dissertation]. Texas A&M University; 2005. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1969.1/2719.

Council of Science Editors:

Oh Y. Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration. [Doctoral Dissertation]. Texas A&M University; 2005. Available from: http://hdl.handle.net/1969.1/2719


Portland State University

21. Cope, Alexander Randon. Solid State Pre-Formed Electronics Adhesive (SPEA).

Degree: MS(M.S.) in Mechanical Engineering, Mechanical and Materials Engineering, 2013, Portland State University

  In mobile and handheld consumer electronic markets, product use conditions drive the requirement for mechanical strength and device durability. The majority of relatively large… (more)

Subjects/Keywords: Surface mount technology; Electronic packaging  – Design and construction; Electronic packaging  – Testing; Materials Science and Engineering

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APA (6th Edition):

Cope, A. R. (2013). Solid State Pre-Formed Electronics Adhesive (SPEA). (Masters Thesis). Portland State University. Retrieved from https://pdxscholar.library.pdx.edu/open_access_etds/1842

Chicago Manual of Style (16th Edition):

Cope, Alexander Randon. “Solid State Pre-Formed Electronics Adhesive (SPEA).” 2013. Masters Thesis, Portland State University. Accessed February 28, 2021. https://pdxscholar.library.pdx.edu/open_access_etds/1842.

MLA Handbook (7th Edition):

Cope, Alexander Randon. “Solid State Pre-Formed Electronics Adhesive (SPEA).” 2013. Web. 28 Feb 2021.

Vancouver:

Cope AR. Solid State Pre-Formed Electronics Adhesive (SPEA). [Internet] [Masters thesis]. Portland State University; 2013. [cited 2021 Feb 28]. Available from: https://pdxscholar.library.pdx.edu/open_access_etds/1842.

Council of Science Editors:

Cope AR. Solid State Pre-Formed Electronics Adhesive (SPEA). [Masters Thesis]. Portland State University; 2013. Available from: https://pdxscholar.library.pdx.edu/open_access_etds/1842

22. Lin, Ye. Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via .

Degree: 2019, Nanyang Technological University

 In this thesis, a novel integrated capacitor, called “three-dimensional (3-D) embedded capacitor” is proposed, designed, fabricated, and characterized for application in integrated circuits (ICs) with… (more)

Subjects/Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging

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APA (6th Edition):

Lin, Y. (2019). Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via . (Thesis). Nanyang Technological University. Retrieved from http://hdl.handle.net/10220/48586

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lin, Ye. “Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via .” 2019. Thesis, Nanyang Technological University. Accessed February 28, 2021. http://hdl.handle.net/10220/48586.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lin, Ye. “Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via .” 2019. Web. 28 Feb 2021.

Vancouver:

Lin Y. Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via . [Internet] [Thesis]. Nanyang Technological University; 2019. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/10220/48586.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lin Y. Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via . [Thesis]. Nanyang Technological University; 2019. Available from: http://hdl.handle.net/10220/48586

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Michigan State University

23. Whitcomb, Jon Phillip. Cost effectiveness of using foam cushioning for electronic piece parts.

Degree: MS, School of Packaging, 1983, Michigan State University

Subjects/Keywords: Electronic apparatus and appliances – Packaging; Transistors – Packaging; Packaging – Research

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APA (6th Edition):

Whitcomb, J. P. (1983). Cost effectiveness of using foam cushioning for electronic piece parts. (Masters Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:27435

Chicago Manual of Style (16th Edition):

Whitcomb, Jon Phillip. “Cost effectiveness of using foam cushioning for electronic piece parts.” 1983. Masters Thesis, Michigan State University. Accessed February 28, 2021. http://etd.lib.msu.edu/islandora/object/etd:27435.

MLA Handbook (7th Edition):

Whitcomb, Jon Phillip. “Cost effectiveness of using foam cushioning for electronic piece parts.” 1983. Web. 28 Feb 2021.

Vancouver:

Whitcomb JP. Cost effectiveness of using foam cushioning for electronic piece parts. [Internet] [Masters thesis]. Michigan State University; 1983. [cited 2021 Feb 28]. Available from: http://etd.lib.msu.edu/islandora/object/etd:27435.

Council of Science Editors:

Whitcomb JP. Cost effectiveness of using foam cushioning for electronic piece parts. [Masters Thesis]. Michigan State University; 1983. Available from: http://etd.lib.msu.edu/islandora/object/etd:27435


Hong Kong University of Science and Technology

24. Tang, Chi Wang. Properties and selection of materials for flip chip packages with low-K die.

Degree: 2007, Hong Kong University of Science and Technology

 The implementation of the Copper/Low-dielectric constants (Cu/low-k) technology at the wafer level brings new challenges to electronic packaging. The more fragile low-k layer has poorer… (more)

Subjects/Keywords: Electronic packaging  – Materials ; Electronic packaging  – Reliability ; Multichip modules (Microelectronics)

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APA (6th Edition):

Tang, C. W. (2007). Properties and selection of materials for flip chip packages with low-K die. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-5291 ; https://doi.org/10.14711/thesis-b944770 ; http://repository.ust.hk/ir/bitstream/1783.1-5291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tang, Chi Wang. “Properties and selection of materials for flip chip packages with low-K die.” 2007. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-5291 ; https://doi.org/10.14711/thesis-b944770 ; http://repository.ust.hk/ir/bitstream/1783.1-5291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tang, Chi Wang. “Properties and selection of materials for flip chip packages with low-K die.” 2007. Web. 28 Feb 2021.

Vancouver:

Tang CW. Properties and selection of materials for flip chip packages with low-K die. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2007. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-5291 ; https://doi.org/10.14711/thesis-b944770 ; http://repository.ust.hk/ir/bitstream/1783.1-5291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tang CW. Properties and selection of materials for flip chip packages with low-K die. [Thesis]. Hong Kong University of Science and Technology; 2007. Available from: http://repository.ust.hk/ir/Record/1783.1-5291 ; https://doi.org/10.14711/thesis-b944770 ; http://repository.ust.hk/ir/bitstream/1783.1-5291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

25. Joung, Yeun-Ho. Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures.

Degree: PhD, Electrical and Computer Engineering, 2003, Georgia Tech

Subjects/Keywords: Electronic packaging; Microelectromechanical systems; Microelectromechanical systems; Electronic packaging

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APA (6th Edition):

Joung, Y. (2003). Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5325

Chicago Manual of Style (16th Edition):

Joung, Yeun-Ho. “Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures.” 2003. Doctoral Dissertation, Georgia Tech. Accessed February 28, 2021. http://hdl.handle.net/1853/5325.

MLA Handbook (7th Edition):

Joung, Yeun-Ho. “Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures.” 2003. Web. 28 Feb 2021.

Vancouver:

Joung Y. Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures. [Internet] [Doctoral dissertation]. Georgia Tech; 2003. [cited 2021 Feb 28]. Available from: http://hdl.handle.net/1853/5325.

Council of Science Editors:

Joung Y. Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures. [Doctoral Dissertation]. Georgia Tech; 2003. Available from: http://hdl.handle.net/1853/5325


Ryerson University

26. Marami, Mohsen. Generation and evaluation of dynamic compact thermal model of electronic packages.

Degree: 2007, Ryerson University

 The goal of this research is to develop a Dynamic Compact Thermal Model (DCTM) of electronic packages. The general objectives of thermal modeling are to… (more)

Subjects/Keywords: Electronic packaging; Thermal properties

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APA (6th Edition):

Marami, M. (2007). Generation and evaluation of dynamic compact thermal model of electronic packages. (Thesis). Ryerson University. Retrieved from https://digital.library.ryerson.ca/islandora/object/RULA%3A464

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Marami, Mohsen. “Generation and evaluation of dynamic compact thermal model of electronic packages.” 2007. Thesis, Ryerson University. Accessed February 28, 2021. https://digital.library.ryerson.ca/islandora/object/RULA%3A464.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Marami, Mohsen. “Generation and evaluation of dynamic compact thermal model of electronic packages.” 2007. Web. 28 Feb 2021.

Vancouver:

Marami M. Generation and evaluation of dynamic compact thermal model of electronic packages. [Internet] [Thesis]. Ryerson University; 2007. [cited 2021 Feb 28]. Available from: https://digital.library.ryerson.ca/islandora/object/RULA%3A464.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Marami M. Generation and evaluation of dynamic compact thermal model of electronic packages. [Thesis]. Ryerson University; 2007. Available from: https://digital.library.ryerson.ca/islandora/object/RULA%3A464

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Penn State University

27. Reainthippayasakul, Wuttichai. PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS.

Degree: 2019, Penn State University

 Novel photocurable epoxy acrylate polymers and composites were investigated with different crosslinking agents and fillers. The photocurable materials with crosslinking agents containing rigid chemical structure… (more)

Subjects/Keywords: photocurable; dielectrics; composites; electronic packaging; thermal conductivity; crosslinking

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APA (6th Edition):

Reainthippayasakul, W. (2019). PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS. (Thesis). Penn State University. Retrieved from https://submit-etda.libraries.psu.edu/catalog/17096wyr5024

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Reainthippayasakul, Wuttichai. “PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS.” 2019. Thesis, Penn State University. Accessed February 28, 2021. https://submit-etda.libraries.psu.edu/catalog/17096wyr5024.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Reainthippayasakul, Wuttichai. “PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS.” 2019. Web. 28 Feb 2021.

Vancouver:

Reainthippayasakul W. PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS. [Internet] [Thesis]. Penn State University; 2019. [cited 2021 Feb 28]. Available from: https://submit-etda.libraries.psu.edu/catalog/17096wyr5024.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Reainthippayasakul W. PHOTOCURABLE DIELECTRICS FOR ELECTRONIC PACKAGING AND ENCAPSULANT APPLICATIONS. [Thesis]. Penn State University; 2019. Available from: https://submit-etda.libraries.psu.edu/catalog/17096wyr5024

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

28. Liu, Lilin. Materials science in pre-plated leadframes for electronic packages.

Degree: 2006, Hong Kong University of Science and Technology

 Au/Pd/Ni pre-plated leadframes (PPF) are high performance frames for accommodating high-end electronic packages. Cost and reliability are major concerns in their wide application. The present… (more)

Subjects/Keywords: Electronic packaging  – Materials ; Thin films

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Liu, L. (2006). Materials science in pre-plated leadframes for electronic packages. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Lilin. “Materials science in pre-plated leadframes for electronic packages.” 2006. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Lilin. “Materials science in pre-plated leadframes for electronic packages.” 2006. Web. 28 Feb 2021.

Vancouver:

Liu L. Materials science in pre-plated leadframes for electronic packages. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2006. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu L. Materials science in pre-plated leadframes for electronic packages. [Thesis]. Hong Kong University of Science and Technology; 2006. Available from: http://repository.ust.hk/ir/Record/1783.1-2879 ; https://doi.org/10.14711/thesis-b943786 ; http://repository.ust.hk/ir/bitstream/1783.1-2879/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

29. Kwok, Stephen Chin To. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.

Degree: 2015, Hong Kong University of Science and Technology

 The advanced consumer electronic gadgets are tending to be miniaturized in size and incorporated with multi-function purposes. The mechanical and electrical reliability of such products… (more)

Subjects/Keywords: Electronic packaging ; Materials ; Epoxy compounds ; Self-assembly (Chemistry) ; Thiols ; Adhesion

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Kwok, S. C. T. (2015). Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kwok, Stephen Chin To. “Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.” 2015. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kwok, Stephen Chin To. “Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.” 2015. Web. 28 Feb 2021.

Vancouver:

Kwok SCT. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2015. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kwok SCT. Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement. [Thesis]. Hong Kong University of Science and Technology; 2015. Available from: http://repository.ust.hk/ir/Record/1783.1-74291 ; https://doi.org/10.14711/thesis-b1449477 ; http://repository.ust.hk/ir/bitstream/1783.1-74291/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

30. Zhang, Rong. Wafer level LED packaging with integrated DRIE trenches for encapsulation.

Degree: 2008, Hong Kong University of Science and Technology

 Light emitting diodes (LEDs) are a promising candidate for solid-state lighting (SSL). Nowadays, LEDs are widely used in mobile phones, display panels, traffic lights, automobiles,… (more)

Subjects/Keywords: Light emitting diodes ; Electronic packaging

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Zhang, R. (2008). Wafer level LED packaging with integrated DRIE trenches for encapsulation. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-5177 ; https://doi.org/10.14711/thesis-b1029543 ; http://repository.ust.hk/ir/bitstream/1783.1-5177/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhang, Rong. “Wafer level LED packaging with integrated DRIE trenches for encapsulation.” 2008. Thesis, Hong Kong University of Science and Technology. Accessed February 28, 2021. http://repository.ust.hk/ir/Record/1783.1-5177 ; https://doi.org/10.14711/thesis-b1029543 ; http://repository.ust.hk/ir/bitstream/1783.1-5177/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhang, Rong. “Wafer level LED packaging with integrated DRIE trenches for encapsulation.” 2008. Web. 28 Feb 2021.

Vancouver:

Zhang R. Wafer level LED packaging with integrated DRIE trenches for encapsulation. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2008. [cited 2021 Feb 28]. Available from: http://repository.ust.hk/ir/Record/1783.1-5177 ; https://doi.org/10.14711/thesis-b1029543 ; http://repository.ust.hk/ir/bitstream/1783.1-5177/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang R. Wafer level LED packaging with integrated DRIE trenches for encapsulation. [Thesis]. Hong Kong University of Science and Technology; 2008. Available from: http://repository.ust.hk/ir/Record/1783.1-5177 ; https://doi.org/10.14711/thesis-b1029543 ; http://repository.ust.hk/ir/bitstream/1783.1-5177/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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