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You searched for subject:(Electromigration). Showing records 1 – 30 of 91 total matches.

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Texas A&M University

1. Liu, Guojun. Process and reliability assessment of plasma-based copper etch process.

Degree: 2009, Texas A&M University

 The plasma-based etching processes of copper (Cu) and titanium tungsten (TiW) thin films, and the electromigration of the copper lines patterned by above etching processes… (more)

Subjects/Keywords: copper; plasma etch; electromigration

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APA (6th Edition):

Liu, G. (2009). Process and reliability assessment of plasma-based copper etch process. (Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/ETD-TAMU-2902

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Guojun. “Process and reliability assessment of plasma-based copper etch process.” 2009. Thesis, Texas A&M University. Accessed February 22, 2020. http://hdl.handle.net/1969.1/ETD-TAMU-2902.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Guojun. “Process and reliability assessment of plasma-based copper etch process.” 2009. Web. 22 Feb 2020.

Vancouver:

Liu G. Process and reliability assessment of plasma-based copper etch process. [Internet] [Thesis]. Texas A&M University; 2009. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2902.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu G. Process and reliability assessment of plasma-based copper etch process. [Thesis]. Texas A&M University; 2009. Available from: http://hdl.handle.net/1969.1/ETD-TAMU-2902

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Ruytenberg, Thomas. Electromigration in Bismuth.

Degree: 2015, Leiden University

Electromigration in bismuth is studied as a way to create bismuth(111) bilayers. Temperature-dependent electromigration measurements have been performed and a model incorporating Joule heating is… (more)

Subjects/Keywords: bismuth; electromigration; topological insulator

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APA (6th Edition):

Ruytenberg, T. (2015). Electromigration in Bismuth. (Masters Thesis). Leiden University. Retrieved from http://hdl.handle.net/1887/37084

Chicago Manual of Style (16th Edition):

Ruytenberg, Thomas. “Electromigration in Bismuth.” 2015. Masters Thesis, Leiden University. Accessed February 22, 2020. http://hdl.handle.net/1887/37084.

MLA Handbook (7th Edition):

Ruytenberg, Thomas. “Electromigration in Bismuth.” 2015. Web. 22 Feb 2020.

Vancouver:

Ruytenberg T. Electromigration in Bismuth. [Internet] [Masters thesis]. Leiden University; 2015. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/1887/37084.

Council of Science Editors:

Ruytenberg T. Electromigration in Bismuth. [Masters Thesis]. Leiden University; 2015. Available from: http://hdl.handle.net/1887/37084


NSYSU

3. Liu, Lee-cheng. Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

 The effect of electromigration on void formation and the failure mechanism of FCBGA packages under a current density of 1*104 A/cm2 and an environmental temperature… (more)

Subjects/Keywords: IMC; Electromigration; Void; Current Crowding

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APA (6th Edition):

Liu, L. (2009). Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706109-124801

Chicago Manual of Style (16th Edition):

Liu, Lee-cheng. “Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints.” 2009. Doctoral Dissertation, NSYSU. Accessed February 22, 2020. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706109-124801.

MLA Handbook (7th Edition):

Liu, Lee-cheng. “Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints.” 2009. Web. 22 Feb 2020.

Vancouver:

Liu L. Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints. [Internet] [Doctoral dissertation]. NSYSU; 2009. [cited 2020 Feb 22]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706109-124801.

Council of Science Editors:

Liu L. Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints. [Doctoral Dissertation]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706109-124801


Queens University

4. Lucht, Benjamin. Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle .

Degree: Physics, Engineering Physics and Astronomy, 2010, Queens University

 First proposed in the late 1990's, a nanomechanical electron shuttle is a device where an electrically isolated island moves a definite number of electrons between… (more)

Subjects/Keywords: physics; electromigration; electron shuttle; nanofabrication

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APA (6th Edition):

Lucht, B. (2010). Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle . (Thesis). Queens University. Retrieved from http://hdl.handle.net/1974/5413

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lucht, Benjamin. “Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle .” 2010. Thesis, Queens University. Accessed February 22, 2020. http://hdl.handle.net/1974/5413.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lucht, Benjamin. “Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle .” 2010. Web. 22 Feb 2020.

Vancouver:

Lucht B. Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle . [Internet] [Thesis]. Queens University; 2010. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/1974/5413.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lucht B. Towards the Fabrication and Characterization of a Nanomechanical Electron Shuttle . [Thesis]. Queens University; 2010. Available from: http://hdl.handle.net/1974/5413

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Minnesota

5. Mishra, Vivek. Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits.

Degree: PhD, Electrical Engineering, 2016, University of Minnesota

 Modern electronic machines are powered by the integrated-circuit (IC), a semiconductor device consisting of compact electronic circuits on a silicon substrate. ICs can contain over… (more)

Subjects/Keywords: electromigration; power grid; probabilistic; recovery; redundancy; reliability

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APA (6th Edition):

Mishra, V. (2016). Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits. (Doctoral Dissertation). University of Minnesota. Retrieved from http://hdl.handle.net/11299/182163

Chicago Manual of Style (16th Edition):

Mishra, Vivek. “Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits.” 2016. Doctoral Dissertation, University of Minnesota. Accessed February 22, 2020. http://hdl.handle.net/11299/182163.

MLA Handbook (7th Edition):

Mishra, Vivek. “Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits.” 2016. Web. 22 Feb 2020.

Vancouver:

Mishra V. Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits. [Internet] [Doctoral dissertation]. University of Minnesota; 2016. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/11299/182163.

Council of Science Editors:

Mishra V. Electromigration-Induced Interconnect Aging and its Repercussions on the Performance of Nanometer-Scale VLSI Circuits. [Doctoral Dissertation]. University of Minnesota; 2016. Available from: http://hdl.handle.net/11299/182163


University of Toronto

6. Fawaz, Mohammad. Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits.

Degree: 2013, University of Toronto

Electromigration in metal lines has re-emerged as a significant concern in modern VLSI circuits. The higher levels of temperature and the large number of EM… (more)

Subjects/Keywords: Power Grid; Electromigration; Verification; Optimization; 0544

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APA (6th Edition):

Fawaz, M. (2013). Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/42835

Chicago Manual of Style (16th Edition):

Fawaz, Mohammad. “Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits.” 2013. Masters Thesis, University of Toronto. Accessed February 22, 2020. http://hdl.handle.net/1807/42835.

MLA Handbook (7th Edition):

Fawaz, Mohammad. “Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits.” 2013. Web. 22 Feb 2020.

Vancouver:

Fawaz M. Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits. [Internet] [Masters thesis]. University of Toronto; 2013. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/1807/42835.

Council of Science Editors:

Fawaz M. Electromigration Reliability Analysis of Power Delivery Networks in Integrated Circuits. [Masters Thesis]. University of Toronto; 2013. Available from: http://hdl.handle.net/1807/42835


University of Toronto

7. Chatterjee, Sandeep. Redundancy-aware Electromigration Checking for Mesh Power Grids.

Degree: 2013, University of Toronto

Electromigration is re-emerging as a significant problem in modern integrated circuits (IC). Especially in power-grids, due to shrinking wire widths and increasing current densities, there… (more)

Subjects/Keywords: Electromigration Checking; Power Grids; Verification; Redundancy; 0544

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APA (6th Edition):

Chatterjee, S. (2013). Redundancy-aware Electromigration Checking for Mesh Power Grids. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/42716

Chicago Manual of Style (16th Edition):

Chatterjee, Sandeep. “Redundancy-aware Electromigration Checking for Mesh Power Grids.” 2013. Masters Thesis, University of Toronto. Accessed February 22, 2020. http://hdl.handle.net/1807/42716.

MLA Handbook (7th Edition):

Chatterjee, Sandeep. “Redundancy-aware Electromigration Checking for Mesh Power Grids.” 2013. Web. 22 Feb 2020.

Vancouver:

Chatterjee S. Redundancy-aware Electromigration Checking for Mesh Power Grids. [Internet] [Masters thesis]. University of Toronto; 2013. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/1807/42716.

Council of Science Editors:

Chatterjee S. Redundancy-aware Electromigration Checking for Mesh Power Grids. [Masters Thesis]. University of Toronto; 2013. Available from: http://hdl.handle.net/1807/42716


University of Texas – Austin

8. Pak, Jiwoo. Electromigration modeling and layout optimization for advanced VLSI.

Degree: PhD, Electrical and Computer Engineering, 2014, University of Texas – Austin

Electromigration (EM) is a critical problem for interconnect reliability in advanced VLSI design. Because EM is a strong function of current density, a smaller cross-sectional… (more)

Subjects/Keywords: Electromigration; VLSI; Layout; Physical Design; EDA

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APA (6th Edition):

Pak, J. (2014). Electromigration modeling and layout optimization for advanced VLSI. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/30944

Chicago Manual of Style (16th Edition):

Pak, Jiwoo. “Electromigration modeling and layout optimization for advanced VLSI.” 2014. Doctoral Dissertation, University of Texas – Austin. Accessed February 22, 2020. http://hdl.handle.net/2152/30944.

MLA Handbook (7th Edition):

Pak, Jiwoo. “Electromigration modeling and layout optimization for advanced VLSI.” 2014. Web. 22 Feb 2020.

Vancouver:

Pak J. Electromigration modeling and layout optimization for advanced VLSI. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2014. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/2152/30944.

Council of Science Editors:

Pak J. Electromigration modeling and layout optimization for advanced VLSI. [Doctoral Dissertation]. University of Texas – Austin; 2014. Available from: http://hdl.handle.net/2152/30944

9. Nadgouda, Rahul. Electromigration Analysis of Signal Nets.

Degree: The Institute of Technology, 2014, Linköping UniversityLinköping University

  The scaling down of technologies presents new challenges in reliability, one of them being electromigration. Electromigration was not cause of concern until interconnects widths… (more)

Subjects/Keywords: Electromigration; analog; design methodology; signal nets

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APA (6th Edition):

Nadgouda, R. (2014). Electromigration Analysis of Signal Nets. (Thesis). Linköping UniversityLinköping University. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-112893

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nadgouda, Rahul. “Electromigration Analysis of Signal Nets.” 2014. Thesis, Linköping UniversityLinköping University. Accessed February 22, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-112893.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nadgouda, Rahul. “Electromigration Analysis of Signal Nets.” 2014. Web. 22 Feb 2020.

Vancouver:

Nadgouda R. Electromigration Analysis of Signal Nets. [Internet] [Thesis]. Linköping UniversityLinköping University; 2014. [cited 2020 Feb 22]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-112893.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nadgouda R. Electromigration Analysis of Signal Nets. [Thesis]. Linköping UniversityLinköping University; 2014. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-112893

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Grenoble

10. Galand, Romain. Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study.

Degree: Docteur es, Sciences des matériaux, 2011, Université de Grenoble

L'electromigration est identifiée comme la principale cause de dégradation des interconnexions en cuivre limitant ainsi la fiabilité des produits issus de la microélectronique. Dans ces… (more)

Subjects/Keywords: Fiabilité; Electromigration; Interconnexion; Microstructure; EBSD; Cuivre; Reliability; Electromigration; Interconnect; Copper; Microstructure; EBSD

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APA (6th Edition):

Galand, R. (2011). Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2011GRENI052

Chicago Manual of Style (16th Edition):

Galand, Romain. “Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study.” 2011. Doctoral Dissertation, Université de Grenoble. Accessed February 22, 2020. http://www.theses.fr/2011GRENI052.

MLA Handbook (7th Edition):

Galand, Romain. “Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study.” 2011. Web. 22 Feb 2020.

Vancouver:

Galand R. Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study. [Internet] [Doctoral dissertation]. Université de Grenoble; 2011. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2011GRENI052.

Council of Science Editors:

Galand R. Caractérisation physique de la microstructure des interconnexions avancées Cu/Low-k pour l'étude des défaillances par électromigration : Physical characterization of the microstructure of advanced Cu/Low-k interconnections for electromigration failure study. [Doctoral Dissertation]. Université de Grenoble; 2011. Available from: http://www.theses.fr/2011GRENI052

11. Ouattara, Boukary. Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes.

Degree: Docteur es, Microélectronique, 2014, Université Pierre et Marie Curie – Paris VI

L'électromigration (EMG) est l'une des conséquences de la course à la miniaturisation des composants électroniques en général et la réduction des dimensions des interconnexions en… (more)

Subjects/Keywords: Electromigration; Fiabilité; Circuits intégrés; Redondance; Interconnexions; Densité de courant; Electromigration; Current density; 621.381

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APA (6th Edition):

Ouattara, B. (2014). Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes. (Doctoral Dissertation). Université Pierre et Marie Curie – Paris VI. Retrieved from http://www.theses.fr/2014PA066253

Chicago Manual of Style (16th Edition):

Ouattara, Boukary. “Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes.” 2014. Doctoral Dissertation, Université Pierre et Marie Curie – Paris VI. Accessed February 22, 2020. http://www.theses.fr/2014PA066253.

MLA Handbook (7th Edition):

Ouattara, Boukary. “Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes.” 2014. Web. 22 Feb 2020.

Vancouver:

Ouattara B. Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes. [Internet] [Doctoral dissertation]. Université Pierre et Marie Curie – Paris VI; 2014. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2014PA066253.

Council of Science Editors:

Ouattara B. Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en noeuds technologiques submicroniques. : Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes. [Doctoral Dissertation]. Université Pierre et Marie Curie – Paris VI; 2014. Available from: http://www.theses.fr/2014PA066253


Université de Grenoble

12. Bana, Franck Lionel. Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2013, Université de Grenoble

Les circuits intégrés sont partie prenante de tous les secteurs industriels et de la vie couranteactuels. Leurs dimensions sont sans cesse réduites afin d’accroître leurs… (more)

Subjects/Keywords: Fiabilité; Durée de vie; Electromigration; Interconnexions; Analyse statistique; Défaillances précoces; Reliability; Lifetime; Electromigration; Interconnects; Statistical analysis; Early failures; 620

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APA (6th Edition):

Bana, F. L. (2013). Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2013GRENI081

Chicago Manual of Style (16th Edition):

Bana, Franck Lionel. “Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis.” 2013. Doctoral Dissertation, Université de Grenoble. Accessed February 22, 2020. http://www.theses.fr/2013GRENI081.

MLA Handbook (7th Edition):

Bana, Franck Lionel. “Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis.” 2013. Web. 22 Feb 2020.

Vancouver:

Bana FL. Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis. [Internet] [Doctoral dissertation]. Université de Grenoble; 2013. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2013GRENI081.

Council of Science Editors:

Bana FL. Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces : Electromigration degradation in copper interconnects : study of lifetimes improvement factors and early failures analysis. [Doctoral Dissertation]. Université de Grenoble; 2013. Available from: http://www.theses.fr/2013GRENI081


Université de Grenoble

13. Vincent, Romain. Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor.

Degree: Docteur es, Physique, 2012, Université de Grenoble

Cette thèse se situe à la croisée de trois domaines : la spintronique qui s'attache à utiliser le degré de liberté du spin de l'électron… (more)

Subjects/Keywords: Spintronique; Aimant moléculaire; Spin nucléaire; Electromigration; Dynamique de spin; Boîte quantique; Spintronic; Molecular magnet; Nuclear spin; Electromigration; Spin Dynamic; Quantum dot

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APA (6th Edition):

Vincent, R. (2012). Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2012GRENY113

Chicago Manual of Style (16th Edition):

Vincent, Romain. “Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor.” 2012. Doctoral Dissertation, Université de Grenoble. Accessed February 22, 2020. http://www.theses.fr/2012GRENY113.

MLA Handbook (7th Edition):

Vincent, Romain. “Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor.” 2012. Web. 22 Feb 2020.

Vancouver:

Vincent R. Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor. [Internet] [Doctoral dissertation]. Université de Grenoble; 2012. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2012GRENY113.

Council of Science Editors:

Vincent R. Spintronique moléculaire : étude de la dynamique d'un spin nucléaire unique : Electronic read-out of a single nuclear spin based on a molecular spin transistor. [Doctoral Dissertation]. Université de Grenoble; 2012. Available from: http://www.theses.fr/2012GRENY113

14. Marti, Giulio. Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding.

Degree: Docteur es, Matériaux, Mécanique, Génie civil, Electrochimie, 2016, Grenoble Alpes

Ok

Ok

Advisors/Committee Members: Wouters, Yves (thesis director).

Subjects/Keywords: Electromigration; Modélisation; Tests électriques; Electromigration; Modelization; Electrical tests; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Marti, G. (2016). Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding. (Doctoral Dissertation). Grenoble Alpes. Retrieved from http://www.theses.fr/2016GREAI111

Chicago Manual of Style (16th Edition):

Marti, Giulio. “Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding.” 2016. Doctoral Dissertation, Grenoble Alpes. Accessed February 22, 2020. http://www.theses.fr/2016GREAI111.

MLA Handbook (7th Edition):

Marti, Giulio. “Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding.” 2016. Web. 22 Feb 2020.

Vancouver:

Marti G. Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding. [Internet] [Doctoral dissertation]. Grenoble Alpes; 2016. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2016GREAI111.

Council of Science Editors:

Marti G. Etude et amélioration de l'électromigration pour améliorer la durée de vie des interconnexions des technologies CMOS : Interconnexion life time optimisation by improvement of electromigration understanding. [Doctoral Dissertation]. Grenoble Alpes; 2016. Available from: http://www.theses.fr/2016GREAI111

15. Thaker, Kandarp K. Electrokinetic remediation of contaminated soils; -.

Degree: Engineering, 2012, Nirma University

Environmental degradation has become a major societal issue. It is a result of uncontrolled anthropogenic activity, besides natural factors. There is a growing need for… (more)

Subjects/Keywords: Electromigration; Electrokinetic remediation; multivariate regression; artificial neural network; ANN; Electroosmosis; soils

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APA (6th Edition):

Thaker, K. K. (2012). Electrokinetic remediation of contaminated soils; -. (Thesis). Nirma University. Retrieved from http://shodhganga.inflibnet.ac.in/handle/10603/9719

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Thaker, Kandarp K. “Electrokinetic remediation of contaminated soils; -.” 2012. Thesis, Nirma University. Accessed February 22, 2020. http://shodhganga.inflibnet.ac.in/handle/10603/9719.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Thaker, Kandarp K. “Electrokinetic remediation of contaminated soils; -.” 2012. Web. 22 Feb 2020.

Vancouver:

Thaker KK. Electrokinetic remediation of contaminated soils; -. [Internet] [Thesis]. Nirma University; 2012. [cited 2020 Feb 22]. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/9719.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Thaker KK. Electrokinetic remediation of contaminated soils; -. [Thesis]. Nirma University; 2012. Available from: http://shodhganga.inflibnet.ac.in/handle/10603/9719

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

16. Jhan, Yi-Tian. Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

 According to the fast development of Semiconductor Technology, currently the trend of electronic products development is to ward âlight, thin, and high densityâ. The demand… (more)

Subjects/Keywords: Joule heating; Micro SnAg Stripe; Electromigration; IC package; Infrared

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jhan, Y. (2013). Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0611113-160201

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jhan, Yi-Tian. “Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared.” 2013. Thesis, NSYSU. Accessed February 22, 2020. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0611113-160201.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jhan, Yi-Tian. “Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared.” 2013. Web. 22 Feb 2020.

Vancouver:

Jhan Y. Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared. [Internet] [Thesis]. NSYSU; 2013. [cited 2020 Feb 22]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0611113-160201.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhan Y. Study of Electromigration in Micro SnAg Stripe by the Application of the Infrared. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0611113-160201

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Western Australia

17. Hodges, Daniel James. Permanganate electromigration in low permeability media.

Degree: M. Eng.Sc., 2010, University of Western Australia

A series of laboratory experiments were carried out to transport permanganate through a low permeability media using electrokinetics. During the undertaking of the laboratory experiments… (more)

Subjects/Keywords: Electrokinetics; Permanganate; In-situ chemical oxidation; Groundwater contamination; Groundwater remediation; Electromigration

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APA (6th Edition):

Hodges, D. J. (2010). Permanganate electromigration in low permeability media. (Masters Thesis). University of Western Australia. Retrieved from http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=30992&local_base=GEN01-INS01

Chicago Manual of Style (16th Edition):

Hodges, Daniel James. “Permanganate electromigration in low permeability media.” 2010. Masters Thesis, University of Western Australia. Accessed February 22, 2020. http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=30992&local_base=GEN01-INS01.

MLA Handbook (7th Edition):

Hodges, Daniel James. “Permanganate electromigration in low permeability media.” 2010. Web. 22 Feb 2020.

Vancouver:

Hodges DJ. Permanganate electromigration in low permeability media. [Internet] [Masters thesis]. University of Western Australia; 2010. [cited 2020 Feb 22]. Available from: http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=30992&local_base=GEN01-INS01.

Council of Science Editors:

Hodges DJ. Permanganate electromigration in low permeability media. [Masters Thesis]. University of Western Australia; 2010. Available from: http://repository.uwa.edu.au:80/R/?func=dbin-jump-full&object_id=30992&local_base=GEN01-INS01


Penn State University

18. Yanamandra, Aditya. Exploring Power Reliability Tradeoffs in On-Chip Networks.

Degree: PhD, Computer Science and Engineering, 2010, Penn State University

 The past decade has seen a shift in the arms race of the microprocessor industry from increasing the clock frequency to increasing the number of… (more)

Subjects/Keywords: Electromigration; Soft Errors; Reliability; Network on chip; Router Cache; Iso-reliable

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APA (6th Edition):

Yanamandra, A. (2010). Exploring Power Reliability Tradeoffs in On-Chip Networks. (Doctoral Dissertation). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/11155

Chicago Manual of Style (16th Edition):

Yanamandra, Aditya. “Exploring Power Reliability Tradeoffs in On-Chip Networks.” 2010. Doctoral Dissertation, Penn State University. Accessed February 22, 2020. https://etda.libraries.psu.edu/catalog/11155.

MLA Handbook (7th Edition):

Yanamandra, Aditya. “Exploring Power Reliability Tradeoffs in On-Chip Networks.” 2010. Web. 22 Feb 2020.

Vancouver:

Yanamandra A. Exploring Power Reliability Tradeoffs in On-Chip Networks. [Internet] [Doctoral dissertation]. Penn State University; 2010. [cited 2020 Feb 22]. Available from: https://etda.libraries.psu.edu/catalog/11155.

Council of Science Editors:

Yanamandra A. Exploring Power Reliability Tradeoffs in On-Chip Networks. [Doctoral Dissertation]. Penn State University; 2010. Available from: https://etda.libraries.psu.edu/catalog/11155


Penn State University

19. Downey, Brian P. High Current Density Stability of Ohmic Contacts to Silicon Carbide.

Degree: PhD, Materials Science and Engineering, 2011, Penn State University

 The materials properties of SiC, such as wide bandgap, high breakdown electric field, and good thermal conductivity, make it an appealing option for high temperature… (more)

Subjects/Keywords: high current; electromigration; Pd; contact; ohmic; SiC; stability

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APA (6th Edition):

Downey, B. P. (2011). High Current Density Stability of Ohmic Contacts to Silicon Carbide. (Doctoral Dissertation). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/12376

Chicago Manual of Style (16th Edition):

Downey, Brian P. “High Current Density Stability of Ohmic Contacts to Silicon Carbide.” 2011. Doctoral Dissertation, Penn State University. Accessed February 22, 2020. https://etda.libraries.psu.edu/catalog/12376.

MLA Handbook (7th Edition):

Downey, Brian P. “High Current Density Stability of Ohmic Contacts to Silicon Carbide.” 2011. Web. 22 Feb 2020.

Vancouver:

Downey BP. High Current Density Stability of Ohmic Contacts to Silicon Carbide. [Internet] [Doctoral dissertation]. Penn State University; 2011. [cited 2020 Feb 22]. Available from: https://etda.libraries.psu.edu/catalog/12376.

Council of Science Editors:

Downey BP. High Current Density Stability of Ohmic Contacts to Silicon Carbide. [Doctoral Dissertation]. Penn State University; 2011. Available from: https://etda.libraries.psu.edu/catalog/12376


Penn State University

20. Mangalagiri, Prasanth. A Reliable Design Flow for Platform FPGAs.

Degree: PhD, Computer Science and Engineering, 2010, Penn State University

 Aggressive technology scaling over the years has led to increased levels of integration and heterogeneity in the design fabric of Field Programmable Gate Arrays (FPGAs).… (more)

Subjects/Keywords: FPGA; TDDB; HCI; NBTI; CMOS; Dual Vdd; Thermal Estimation; Electromigration

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APA (6th Edition):

Mangalagiri, P. (2010). A Reliable Design Flow for Platform FPGAs. (Doctoral Dissertation). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/10497

Chicago Manual of Style (16th Edition):

Mangalagiri, Prasanth. “A Reliable Design Flow for Platform FPGAs.” 2010. Doctoral Dissertation, Penn State University. Accessed February 22, 2020. https://etda.libraries.psu.edu/catalog/10497.

MLA Handbook (7th Edition):

Mangalagiri, Prasanth. “A Reliable Design Flow for Platform FPGAs.” 2010. Web. 22 Feb 2020.

Vancouver:

Mangalagiri P. A Reliable Design Flow for Platform FPGAs. [Internet] [Doctoral dissertation]. Penn State University; 2010. [cited 2020 Feb 22]. Available from: https://etda.libraries.psu.edu/catalog/10497.

Council of Science Editors:

Mangalagiri P. A Reliable Design Flow for Platform FPGAs. [Doctoral Dissertation]. Penn State University; 2010. Available from: https://etda.libraries.psu.edu/catalog/10497

21. Kim, Taeyoung. System-Level Electromigration-Induced Dynamic Reliability Management.

Degree: Computer Science, 2017, University of California – Riverside

 Technology scaling has led to further processor integration, and future manycore chips will have more cores integrated. However, due to the diminishing of Dennard’s scaling,… (more)

Subjects/Keywords: Computer science; DRM; Electromigration; Integrated Circuit; Optimization; Reliability; VLSI

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APA (6th Edition):

Kim, T. (2017). System-Level Electromigration-Induced Dynamic Reliability Management. (Thesis). University of California – Riverside. Retrieved from http://www.escholarship.org/uc/item/9tc8w0b9

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kim, Taeyoung. “System-Level Electromigration-Induced Dynamic Reliability Management.” 2017. Thesis, University of California – Riverside. Accessed February 22, 2020. http://www.escholarship.org/uc/item/9tc8w0b9.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kim, Taeyoung. “System-Level Electromigration-Induced Dynamic Reliability Management.” 2017. Web. 22 Feb 2020.

Vancouver:

Kim T. System-Level Electromigration-Induced Dynamic Reliability Management. [Internet] [Thesis]. University of California – Riverside; 2017. [cited 2020 Feb 22]. Available from: http://www.escholarship.org/uc/item/9tc8w0b9.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kim T. System-Level Electromigration-Induced Dynamic Reliability Management. [Thesis]. University of California – Riverside; 2017. Available from: http://www.escholarship.org/uc/item/9tc8w0b9

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


UCLA

22. Tian, Tian. The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints.

Degree: Materials Science and Engineering, 2012, UCLA

 The advanced packaging technology is a business of billions of dollars. The reliability issues of the packaging products are of keen interest. In the microelectronic… (more)

Subjects/Keywords: Materials Science; Electromigration; Laminography; Solder; Statistics; Synchrotron Radiation; Tomography

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APA (6th Edition):

Tian, T. (2012). The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints. (Thesis). UCLA. Retrieved from http://www.escholarship.org/uc/item/8q47b3fp

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Tian, Tian. “The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints.” 2012. Thesis, UCLA. Accessed February 22, 2020. http://www.escholarship.org/uc/item/8q47b3fp.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Tian, Tian. “The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints.” 2012. Web. 22 Feb 2020.

Vancouver:

Tian T. The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints. [Internet] [Thesis]. UCLA; 2012. [cited 2020 Feb 22]. Available from: http://www.escholarship.org/uc/item/8q47b3fp.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Tian T. The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints. [Thesis]. UCLA; 2012. Available from: http://www.escholarship.org/uc/item/8q47b3fp

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Iowa State University

23. Patra, Srijita. Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects.

Degree: 2014, Iowa State University

 This thesis focuses on the reliability modeling of metal interconnects under time-dependent stress. Whereas most existing reliability models are based upon the assumption that stress… (more)

Subjects/Keywords: Electromigration; Reliability; Thermal gradient; Time dependent stress; Electrical and Electronics

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APA (6th Edition):

Patra, S. (2014). Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects. (Thesis). Iowa State University. Retrieved from https://lib.dr.iastate.edu/etd/14054

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Patra, Srijita. “Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects.” 2014. Thesis, Iowa State University. Accessed February 22, 2020. https://lib.dr.iastate.edu/etd/14054.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Patra, Srijita. “Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects.” 2014. Web. 22 Feb 2020.

Vancouver:

Patra S. Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects. [Internet] [Thesis]. Iowa State University; 2014. [cited 2020 Feb 22]. Available from: https://lib.dr.iastate.edu/etd/14054.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Patra S. Effects of electrical, thermal and thermal gradient stress on reliability of metal interconnects. [Thesis]. Iowa State University; 2014. Available from: https://lib.dr.iastate.edu/etd/14054

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Iowa State University

24. Wang, Tianhan. On-chip current measurement for multi-site electromigration monitoring.

Degree: 2011, Iowa State University

 Power consumption and die heating are of major concern in high-density high-speed integrated circuits. The performance of modern IC designs is limited by power consumption… (more)

Subjects/Keywords: Current measurement; Electromigration monitoring; Electrical and Computer Engineering

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APA (6th Edition):

Wang, T. (2011). On-chip current measurement for multi-site electromigration monitoring. (Thesis). Iowa State University. Retrieved from https://lib.dr.iastate.edu/etd/10451

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Tianhan. “On-chip current measurement for multi-site electromigration monitoring.” 2011. Thesis, Iowa State University. Accessed February 22, 2020. https://lib.dr.iastate.edu/etd/10451.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Tianhan. “On-chip current measurement for multi-site electromigration monitoring.” 2011. Web. 22 Feb 2020.

Vancouver:

Wang T. On-chip current measurement for multi-site electromigration monitoring. [Internet] [Thesis]. Iowa State University; 2011. [cited 2020 Feb 22]. Available from: https://lib.dr.iastate.edu/etd/10451.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang T. On-chip current measurement for multi-site electromigration monitoring. [Thesis]. Iowa State University; 2011. Available from: https://lib.dr.iastate.edu/etd/10451

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

25. Van Zanten, David. Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles.

Degree: Docteur es, Physique de la matière condensée et du rayonnement, 2015, Grenoble Alpes

 Le contrôle du nombre et de l'état quantique d'électrons individuels est un élément clé pour la construction d'applications innovantes comme les sources à un électron… (more)

Subjects/Keywords: Electromigration; Boite Quantique; Métrologie; Landau-Zener; Jonctions supraconductrices; Single electron transistor; Single electron transistor; Electromigration; Meteorological standard; Landau-Zener; Superconducting junctions; Quantum dot; 530

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APA (6th Edition):

Van Zanten, D. (2015). Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles. (Doctoral Dissertation). Grenoble Alpes. Retrieved from http://www.theses.fr/2015GREAY028

Chicago Manual of Style (16th Edition):

Van Zanten, David. “Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles.” 2015. Doctoral Dissertation, Grenoble Alpes. Accessed February 22, 2020. http://www.theses.fr/2015GREAY028.

MLA Handbook (7th Edition):

Van Zanten, David. “Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles.” 2015. Web. 22 Feb 2020.

Vancouver:

Van Zanten D. Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles. [Internet] [Doctoral dissertation]. Grenoble Alpes; 2015. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2015GREAY028.

Council of Science Editors:

Van Zanten D. Dynamique quantique dans un tourniquet à électrons basé sur une boîte quantique : Quantum dynamics revealed in weakly coupled quantum dot - superconductor turnstiles. [Doctoral Dissertation]. Grenoble Alpes; 2015. Available from: http://www.theses.fr/2015GREAY028

26. Meinshausen, Lutz. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.

Degree: Docteur es, Electronique, 2014, Bordeaux; Universität Hannover

L'assemblage tridimensionnel des circuits microélectroniques et leur utilisation dansdes conditions environnementales extrêmement sévères nécessitent ledéveloppement d’alternatives plus robustes pour les contacts électriques. Unetechnique prometteuse est… (more)

Subjects/Keywords: Fiabilité; Thermomigration; Electromigration; Formation d'intermétalliques; Modélisation; Brasure sans plomb; Reliability; Thermomigration; Electromigration; Transient Liquid Phase Soldering (TLPS); Intermetallic Compound (IMC) formation; Modeling; Lead free solder

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APA (6th Edition):

Meinshausen, L. (2014). Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. (Doctoral Dissertation). Bordeaux; Universität Hannover. Retrieved from http://www.theses.fr/2014BORD0149

Chicago Manual of Style (16th Edition):

Meinshausen, Lutz. “Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.” 2014. Doctoral Dissertation, Bordeaux; Universität Hannover. Accessed February 22, 2020. http://www.theses.fr/2014BORD0149.

MLA Handbook (7th Edition):

Meinshausen, Lutz. “Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.” 2014. Web. 22 Feb 2020.

Vancouver:

Meinshausen L. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. [Internet] [Doctoral dissertation]. Bordeaux; Universität Hannover; 2014. [cited 2020 Feb 22]. Available from: http://www.theses.fr/2014BORD0149.

Council of Science Editors:

Meinshausen L. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. [Doctoral Dissertation]. Bordeaux; Universität Hannover; 2014. Available from: http://www.theses.fr/2014BORD0149


University of Minnesota

27. Wang, Xiaofei. Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies.

Degree: PhD, Electrical Engineering, 2014, University of Minnesota

 Integrated circuit reliability has become an increasingly important design consideration as the CMOS technology keeps aggressively scaling to its physical limit. The parametric shifts and… (more)

Subjects/Keywords: Bias temperature instability; Circuit aging; Circuit reliability; Electromigration; Hot carrier injection; On-chip sensor

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APA (6th Edition):

Wang, X. (2014). Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies. (Doctoral Dissertation). University of Minnesota. Retrieved from http://hdl.handle.net/11299/177085

Chicago Manual of Style (16th Edition):

Wang, Xiaofei. “Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies.” 2014. Doctoral Dissertation, University of Minnesota. Accessed February 22, 2020. http://hdl.handle.net/11299/177085.

MLA Handbook (7th Edition):

Wang, Xiaofei. “Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies.” 2014. Web. 22 Feb 2020.

Vancouver:

Wang X. Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies. [Internet] [Doctoral dissertation]. University of Minnesota; 2014. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/11299/177085.

Council of Science Editors:

Wang X. Circuit-Based Reliability Characterization Methods in Advanced CMOS Technologies. [Doctoral Dissertation]. University of Minnesota; 2014. Available from: http://hdl.handle.net/11299/177085


University of Illinois – Urbana-Champaign

28. Aref, Thomas. Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses.

Degree: PhD, 0240, 2011, University of Illinois – Urbana-Champaign

 Quantum phase slips (QPS) or the macroscopic quantum tunneling (MQT) of a nanowire???s order parameter through an activation energy barrier have remained the subject of… (more)

Subjects/Keywords: quantum phase slip; superconducting nanowires; electromigration; pulsing; high bias voltage; QPS; TAPS; phase slip

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Aref, T. (2011). Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses. (Doctoral Dissertation). University of Illinois – Urbana-Champaign. Retrieved from http://hdl.handle.net/2142/18460

Chicago Manual of Style (16th Edition):

Aref, Thomas. “Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses.” 2011. Doctoral Dissertation, University of Illinois – Urbana-Champaign. Accessed February 22, 2020. http://hdl.handle.net/2142/18460.

MLA Handbook (7th Edition):

Aref, Thomas. “Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses.” 2011. Web. 22 Feb 2020.

Vancouver:

Aref T. Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses. [Internet] [Doctoral dissertation]. University of Illinois – Urbana-Champaign; 2011. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/2142/18460.

Council of Science Editors:

Aref T. Probing quantum phase slips in superconducting nanowires modified using high bias voltage pulses. [Doctoral Dissertation]. University of Illinois – Urbana-Champaign; 2011. Available from: http://hdl.handle.net/2142/18460


Universidade do Rio Grande do Sul

29. Posser, Gracieli. Electromigration aware cell design.

Degree: 2015, Universidade do Rio Grande do Sul

Electromigration (EM) in on-chip metal interconnects is a critical reliability failure mechanism in nanometer-scale technologies. Usually works in the literature that address EM are concerned… (more)

Subjects/Keywords: Electromigration; Microeletrônica; Circuit lifetime; Cmos; Tolerancia : Falhas; Cell-level; AC EM; Physical design; Microelectronics

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Posser, G. (2015). Electromigration aware cell design. (Thesis). Universidade do Rio Grande do Sul. Retrieved from http://hdl.handle.net/10183/114798

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Posser, Gracieli. “Electromigration aware cell design.” 2015. Thesis, Universidade do Rio Grande do Sul. Accessed February 22, 2020. http://hdl.handle.net/10183/114798.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Posser, Gracieli. “Electromigration aware cell design.” 2015. Web. 22 Feb 2020.

Vancouver:

Posser G. Electromigration aware cell design. [Internet] [Thesis]. Universidade do Rio Grande do Sul; 2015. [cited 2020 Feb 22]. Available from: http://hdl.handle.net/10183/114798.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Posser G. Electromigration aware cell design. [Thesis]. Universidade do Rio Grande do Sul; 2015. Available from: http://hdl.handle.net/10183/114798

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of California – Riverside

30. Huang, Xin. Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits.

Degree: Electrical Engineering, 2016, University of California – Riverside

 Reliability has become a more serious design challenge for current nanometer very- large- scale integrated (VLSI) circuits especially as the technology has advanced into 7nm.… (more)

Subjects/Keywords: Electrical engineering; Computer engineering; Electromigration; interconnects; lifetime; power grid; Time-dependent-dielectric-breakdown; VLSI circuit

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Huang, X. (2016). Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits. (Thesis). University of California – Riverside. Retrieved from http://www.escholarship.org/uc/item/3q15c8c5

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Huang, Xin. “Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits.” 2016. Thesis, University of California – Riverside. Accessed February 22, 2020. http://www.escholarship.org/uc/item/3q15c8c5.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Huang, Xin. “Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits.” 2016. Web. 22 Feb 2020.

Vancouver:

Huang X. Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits. [Internet] [Thesis]. University of California – Riverside; 2016. [cited 2020 Feb 22]. Available from: http://www.escholarship.org/uc/item/3q15c8c5.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Huang X. Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits. [Thesis]. University of California – Riverside; 2016. Available from: http://www.escholarship.org/uc/item/3q15c8c5

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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