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You searched for subject:(Cu Electroplating). Showing records 1 – 2 of 2 total matches.

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Indian Institute of Science

1. Baheti, Varun A. Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging.

Degree: 2017, Indian Institute of Science

The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in the solid–state during storage at room temperature and service at an elevated temperature leading to degradation of the contacts. In this thesis, the diffusion–controlled growth mechanism of the phases and the formation of the Kirkendall voids at the interface of UBM (Cu, Ni, Au, Pd, Pt) and Sn (bulk/electroplated) are studied extensively. Based on the microstructural analysis in SEM and TEM, the presence of bifurcation of the Kirkendall marker plane, a very special phenomenon discovered recently, is found in the Cu–Sn system. The estimated diffusion coefficients at these marker planes indicate one of the reasons for the growth of the Kirkendall voids, which is one of the major reliability concerns in a microelectronic component. Systematic experiments using different purity of Cu are conducted to understand the effect of impurities on the growth of the Kirkendall voids. It is conclusively shown that increase in impurity enhances the growth of voids. The growth rates of the interdiffusion zone are found to be comparable in the Cu–Sn and the Ni–Sn systems. EPMA and TEM analyses indicate the growth of a metastable phase in the Ni–Sn system in the low temperature range. Following, the role of Ni addition in Cu on the growth of IMCs in the Cu–Sn system is studied based on the quantitative diffusion analysis. The analysis of thermodynamic driving forces, microstructure and crystal structure of Cu6Sn5 shed light on the atomic mechanism of diffusion. It does not change the crystal structure of phases; however, the microstructural evolution, the diffusion rates of components and the growth of the Kirkendall voids are strongly influenced in the presence of Ni. Considering microstructure of the product phases in various Cu/Sn and Cu(Ni)/Sn diffusion couples, it has been observed that (i) phases have smaller grains and nucleate repeatedly, when they grow from Cu or Cu(Ni) alloy, and (ii) the same phases have elongated grains, when they grow from another phase. A difference in growth rate of the phases is found in bulk and electroplated diffusion couples in the Au–Sn system. The is explained in AuSn4 based on the estimated tracer diffusion coefficients, homologous temperature of the experiments, grain size distribution and crystal structure of the phase. The growth rates of the phases in the Au–Sn system are compared with the Pd–Sn and the Pt–Sn systems. Similar to the Au–Sn system, the growth rate of the interdiffusion zone is found to be parabolic in the Pd–Sn system; however, it is linear in the Pt–Sn system. Following, the effect of addition of Au, Pd and Pt in Cu is studied on growth rate of the phases. An analysis on the formation of the Kirkendall voids indicates that the addition of Pd or Pt is deleterious to the structure compared to the addition of Au. This study indicates that… Advisors/Committee Members: Paul, Aloke, Kumar, Praveen.

Subjects/Keywords: Electroplating - Copper Deposition; Electroplating - Tin Deposition; Kirkendall Voids; Solid-state Diffusion-controlled Growth; Melanocyte Pigmentation; Cu–Sn Systems; Ni–Sn Systems; Au–Sn Systems; Pd–Sn Systems; Pt–Sn Systems; Cu–Sn System; Cu(Ni)–Sn System; Co–Ni–Ta System; Co–Ta System; Materials Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Baheti, V. A. (2017). Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging. (Thesis). Indian Institute of Science. Retrieved from http://etd.iisc.ernet.in/2005/3985 ; http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Baheti, Varun A. “Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging.” 2017. Thesis, Indian Institute of Science. Accessed October 24, 2019. http://etd.iisc.ernet.in/2005/3985 ; http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Baheti, Varun A. “Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging.” 2017. Web. 24 Oct 2019.

Vancouver:

Baheti VA. Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging. [Internet] [Thesis]. Indian Institute of Science; 2017. [cited 2019 Oct 24]. Available from: http://etd.iisc.ernet.in/2005/3985 ; http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Baheti VA. Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging. [Thesis]. Indian Institute of Science; 2017. Available from: http://etd.iisc.ernet.in/2005/3985 ; http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


The Ohio State University

2. Apaydin, Elif. Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications.

Degree: PhD, Biomedical Engineering, 2009, The Ohio State University

The demand for flexible substrates in the electronics industry and medicine has highlighted the importance of applicable printing techniques on these materials. Neural prosthetics interfacing with soft tissues and tight packaging requirements in the high-frequency electronics field require application-specific fabrication methodologies for printing conductors on or embedded in flexible substrates. The purpose of this dissertation is to introduce novel fabrication techniques for printing metal patterns on silicone elastomers. In pursuing this goal, two applications in the biomedical and antennas fields are given. These applications require printing of metals on silicone elastomers and the requirements of these applications are met with application-specific microfabrication processes. The initial project involves printing microwave structures on PDMS-ceramic composites. These structures include transmission lines, a patch antenna and a feeding pattern for a GPS antenna. The second work requires the fabrication of a microelectrode array for recording neural signals from the brain cortex surface. Microfabrication techniques have been developed for the device fabrications. In the first application, a novel technique for direct printing of patterned conducting geometries on silicone-based, flexible polymer composites is presented. Specifically, micro-texturing is applied on the polymer composite surface followed by evaporation of a buffer titanium layer and a seed layer of copper. Electroplating is also applied as a final step to increase conductor layer thickness to accommodate polymer layer bending while maintaining good RF conductivity. The printed examples include 5 mm wide copper microstrip lines on polymer composite substrates. These printed microstrip lines demonstrated very low sheet resistivity of 0.1 ohm per square for frequencies up to several GHz. They were also shown to maintain low resistance during large bending deformations. To investigate RF performance, a patch antenna was also printed on a polymer-ceramic composite and shown to perform as predicted. Apart from patch antenna, a more complex patterned microwave structure that is a hybrid feeding structure of a GPS antenna has been fabricated. The performance evaluation of this hybrid feeding is in accordance with the simulated results and demonstrates the working fabrication process. In the second application, the neural microelectrode has been fabricated based on a silicone elastomer substrate with an array of three-dimensional platinum contacts as the recording sites. Platinum contacts are exposed on the elastomer surface and these recording sites are embedded in elastomer, forming a robust three-dimensional structure suitable for surface recording. This robust yet flexible device is fabricated with microfabrication techniques including evaporation, photolithography, wet etching, electroplating and welding. Cytocompatibility of the device was tested with mouse fibroblasts and mouse forebrain neurons. The cell viability results verify the… Advisors/Committee Members: Hansford, Derek (Advisor).

Subjects/Keywords: Engineering; Microfabrication Techniques; Flexible electronics; PDMS elastomers; Patterned Metal Printing; Microtextured Surface; Flexible Antennas; Flexible Neural Microelectrode Array; Brain Cortical Surface Recording; Pt Electroplating; Cu Electroplating

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Apaydin, E. (2009). Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications. (Doctoral Dissertation). The Ohio State University. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=osu1253138931

Chicago Manual of Style (16th Edition):

Apaydin, Elif. “Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications.” 2009. Doctoral Dissertation, The Ohio State University. Accessed October 24, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=osu1253138931.

MLA Handbook (7th Edition):

Apaydin, Elif. “Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications.” 2009. Web. 24 Oct 2019.

Vancouver:

Apaydin E. Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications. [Internet] [Doctoral dissertation]. The Ohio State University; 2009. [cited 2019 Oct 24]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=osu1253138931.

Council of Science Editors:

Apaydin E. Microfabrication Techniques for Printing on PDMS Elastomers for Antenna and Biomedical Applications. [Doctoral Dissertation]. The Ohio State University; 2009. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=osu1253138931

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