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NSYSU
1. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047
Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 04 Mar 2021.
Vancouver:
Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Waterloo
2. Hook, Michael. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.
Degree: 2018, University of Waterloo
URL: http://hdl.handle.net/10012/13827
Subjects/Keywords: Wire Bonding; Reliability; Copper Wire; Process Development; Accelerated Failure Time Model; High-Temperature Storage; Humidity Testing
Record Details
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APA (6th Edition):
Hook, M. (2018). Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/13827
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/13827.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Web. 04 Mar 2021.
Vancouver:
Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Internet] [Thesis]. University of Waterloo; 2018. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/13827.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Thesis]. University of Waterloo; 2018. Available from: http://hdl.handle.net/10012/13827
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Waterloo
3. Pequegnat, Andrew. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.
Degree: 2010, University of Waterloo
URL: http://hdl.handle.net/10012/5136
Subjects/Keywords: Thermosonic wire bonding; Electrical flame off process; Copper wire bonding; Gold wire bonding; Free air ball; Ball bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Pequegnat, A. (2010). A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5136
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/5136.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Web. 04 Mar 2021.
Vancouver:
Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/5136.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5136
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
4. Gau, Hua-de. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754
Subjects/Keywords: Gold thermosonic wire bonding; Finite element method; Copper thermosonic wire bonding; Thermo-mechanical coupling analysis
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Gau, H. (2010). Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Web. 04 Mar 2021.
Vancouver:
Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Internet] [Thesis]. NSYSU; 2010. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Waterloo
5. Rezvanigilkolaee, Alireza. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.
Degree: 2014, University of Waterloo
URL: http://hdl.handle.net/10012/8199
Subjects/Keywords: Stitch Bonding Process; Wire Bonding; Microelectronics; Finite Element Analysis; ABAQUS
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Rezvanigilkolaee, A. (2014). Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/8199
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/8199.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Web. 04 Mar 2021.
Vancouver:
Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2014. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/8199.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Thesis]. University of Waterloo; 2014. Available from: http://hdl.handle.net/10012/8199
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
6. Shih, Hsin-Chih. Orientation effects on Cu wire bonding by finite element method.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258
Subjects/Keywords: Molecular dynamics; Finite element method; Copper wire bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Shih, H. (2009). Orientation effects on Cu wire bonding by finite element method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Web. 04 Mar 2021.
Vancouver:
Shih H. Orientation effects on Cu wire bonding by finite element method. [Internet] [Thesis]. NSYSU; 2009. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Shih H. Orientation effects on Cu wire bonding by finite element method. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
7. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258
Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 04 Mar 2021.
Vancouver:
Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Hong Kong University of Science and Technology
8. Zhang, Xiaodong. Characterization of copper diffusion in advanced packaging.
Degree: 2007, Hong Kong University of Science and Technology
URL: http://repository.ust.hk/ir/Record/1783.1-2883
;
https://doi.org/10.14711/thesis-b943792
;
http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html
Subjects/Keywords: Wire bonding (Electronic packaging) ; Copper
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Zhang, X. (2007). Characterization of copper diffusion in advanced packaging. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Web. 04 Mar 2021.
Vancouver:
Zhang X. Characterization of copper diffusion in advanced packaging. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2007. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Zhang X. Characterization of copper diffusion in advanced packaging. [Thesis]. Hong Kong University of Science and Technology; 2007. Available from: http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
9. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336
Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 04 Mar 2021.
Vancouver:
Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
10. Chiu, Chia-ai. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.
Degree: Master, Materials and Optoelectronic Science, 2014, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434
Subjects/Keywords: the Al-Cu-Pd ternary system; mic-contact of Cu-wire and Al-pad; wire-bonding process; diffusion couple; phase diagram
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Chiu, C. (2014). The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Web. 04 Mar 2021.
Vancouver:
Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Michigan State University
11. Wu, Yuelin. Corrosion-induced failure analysis of Cu wire bonded packages.
Degree: 2018, Michigan State University
URL: http://etd.lib.msu.edu/islandora/object/etd:19342
Subjects/Keywords: Copper wire; Wire bonding (Electronic packaging); Microelectronic packaging; Copper – Corrosion; Electrolytic corrosion; Metals – Corrosion fatigue; Integrated circuits – Reliability – Research; Chemical engineering; Materials Science
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Wu, Y. (2018). Corrosion-induced failure analysis of Cu wire bonded packages. (Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:19342
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Wu, Yuelin. “Corrosion-induced failure analysis of Cu wire bonded packages.” 2018. Thesis, Michigan State University. Accessed March 04, 2021. http://etd.lib.msu.edu/islandora/object/etd:19342.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Wu, Yuelin. “Corrosion-induced failure analysis of Cu wire bonded packages.” 2018. Web. 04 Mar 2021.
Vancouver:
Wu Y. Corrosion-induced failure analysis of Cu wire bonded packages. [Internet] [Thesis]. Michigan State University; 2018. [cited 2021 Mar 04]. Available from: http://etd.lib.msu.edu/islandora/object/etd:19342.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Wu Y. Corrosion-induced failure analysis of Cu wire bonded packages. [Thesis]. Michigan State University; 2018. Available from: http://etd.lib.msu.edu/islandora/object/etd:19342
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Waterloo
12. Lum, Ivan. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.
Degree: 2007, University of Waterloo
URL: http://hdl.handle.net/10012/3439
Subjects/Keywords: microelectronics; wire bond; mechanism; ultrasound; deformation; gold; copper; wear; finite element; bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Lum, I. (2007). Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/3439
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/3439.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Web. 04 Mar 2021.
Vancouver:
Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2007. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/3439.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Thesis]. University of Waterloo; 2007. Available from: http://hdl.handle.net/10012/3439
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Brigham Young University
13. George, Jonathan Alan. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.
Degree: MS, 2010, Brigham Young University
URL: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd
Subjects/Keywords: EDM; PID; plasma arc; nano-particles; dielectric; process machine; copper; electrical discharge; water; wire; Mechanical Engineering
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
George, J. A. (2010). Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. (Masters Thesis). Brigham Young University. Retrieved from https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd
Chicago Manual of Style (16th Edition):
George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Masters Thesis, Brigham Young University. Accessed March 04, 2021. https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.
MLA Handbook (7th Edition):
George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Web. 04 Mar 2021.
Vancouver:
George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Internet] [Masters thesis]. Brigham Young University; 2010. [cited 2021 Mar 04]. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.
Council of Science Editors:
George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Masters Thesis]. Brigham Young University; 2010. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd
NSYSU
14. Hsu, Kuo-Chuan. The Reliability Study of Cu Wire Bonding.
Degree: Master, Materials and Optoelectronic Science, 2012, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550
Subjects/Keywords: IMC; wire bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Hsu, K. (2012). The Reliability Study of Cu Wire Bonding. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Web. 04 Mar 2021.
Vancouver:
Hsu K. The Reliability Study of Cu Wire Bonding. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Hsu K. The Reliability Study of Cu Wire Bonding. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
15. Ho, Ming-Chi. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.
Degree: PhD, Materials and Optoelectronic Science, 2016, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209
Subjects/Keywords: Ag-Al-Au phase diagram; Ag wire bonding; Cu wire bonding; IMC; IC package
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Ho, M. (2016). Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209
Chicago Manual of Style (16th Edition):
Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Doctoral Dissertation, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.
MLA Handbook (7th Edition):
Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Web. 04 Mar 2021.
Vancouver:
Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Internet] [Doctoral dissertation]. NSYSU; 2016. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.
Council of Science Editors:
Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Doctoral Dissertation]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209
Delft University of Technology
16. Kopally, Hima (author). A new experimental approach to investigate the physics-of-failure of wirebond interconnects.
Degree: 2018, Delft University of Technology
URL: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a
Subjects/Keywords: wire bonding; physics-of-failure; interconnects; four wire resistance measurement; fatigue
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Kopally, H. (. (2018). A new experimental approach to investigate the physics-of-failure of wirebond interconnects. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a
Chicago Manual of Style (16th Edition):
Kopally, Hima (author). “A new experimental approach to investigate the physics-of-failure of wirebond interconnects.” 2018. Masters Thesis, Delft University of Technology. Accessed March 04, 2021. http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a.
MLA Handbook (7th Edition):
Kopally, Hima (author). “A new experimental approach to investigate the physics-of-failure of wirebond interconnects.” 2018. Web. 04 Mar 2021.
Vancouver:
Kopally H(. A new experimental approach to investigate the physics-of-failure of wirebond interconnects. [Internet] [Masters thesis]. Delft University of Technology; 2018. [cited 2021 Mar 04]. Available from: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a.
Council of Science Editors:
Kopally H(. A new experimental approach to investigate the physics-of-failure of wirebond interconnects. [Masters Thesis]. Delft University of Technology; 2018. Available from: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a
NSYSU
17. Chen, Ying-Chou. Passive Component Wire Bonding Evaluation in a Hybrid IC Package.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653
Subjects/Keywords: IC assembly Substrate; Gold Wire Bonding Process; Passive Component; Non-Conductive Glue
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Chen, Y. (2007). Passive Component Wire Bonding Evaluation in a Hybrid IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Web. 04 Mar 2021.
Vancouver:
Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Internet] [Thesis]. NSYSU; 2007. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Thesis]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Arkansas
18. Nasiri, Ardalan. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.
Degree: PhD, 2020, University of Arkansas
URL: https://scholarworks.uark.edu/etd/3755
Subjects/Keywords: Ceramic synthesis; Die-attach process; Electronic Packaging; High-temperature; Integrated Electronics; Wire bonding; Ceramic Materials; Electrical and Electronics; Electronic Devices and Semiconductor Manufacturing
Record Details
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APA (6th Edition):
Nasiri, A. (2020). Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. (Doctoral Dissertation). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/3755
Chicago Manual of Style (16th Edition):
Nasiri, Ardalan. “Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.” 2020. Doctoral Dissertation, University of Arkansas. Accessed March 04, 2021. https://scholarworks.uark.edu/etd/3755.
MLA Handbook (7th Edition):
Nasiri, Ardalan. “Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.” 2020. Web. 04 Mar 2021.
Vancouver:
Nasiri A. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. [Internet] [Doctoral dissertation]. University of Arkansas; 2020. [cited 2021 Mar 04]. Available from: https://scholarworks.uark.edu/etd/3755.
Council of Science Editors:
Nasiri A. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. [Doctoral Dissertation]. University of Arkansas; 2020. Available from: https://scholarworks.uark.edu/etd/3755
19. Gomes, Jimy. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.
Degree: 2015, University of Waterloo
URL: http://hdl.handle.net/10012/9740
Subjects/Keywords: Thermosonic wire bonding; Palladium coated silver wire; Bond stress; Process temperature
…substrate terminals. The vast majority of ICs are interconnected using the wire bonding process… …wire bonding process. High electrical conductivity, low hardness, high malleability, and… …Cu wire bonding to prevent in-process oxidation which is a recurring cost added to the… …bonding process. The drawbacks of Cu wire makes Ag a more favorable alternative to Au since the… …detailed study on the PCS wire bonding process has not been reported. More research is necessary…
Record Details
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APA (6th Edition):
Gomes, J. (2015). A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/9740
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/9740.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Web. 04 Mar 2021.
Vancouver:
Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Internet] [Thesis]. University of Waterloo; 2015. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/9740.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Thesis]. University of Waterloo; 2015. Available from: http://hdl.handle.net/10012/9740
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Brno University of Technology
20. Houserek, Jiří. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.
Degree: 2018, Brno University of Technology
URL: http://hdl.handle.net/11012/27100
Subjects/Keywords: Wire-bonding; simulace; kontaktování čipů; Ansys; Wire-bounding; simulations; chips contacts; Ansys
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Houserek, J. (2018). Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/27100
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.” 2018. Thesis, Brno University of Technology. Accessed March 04, 2021. http://hdl.handle.net/11012/27100.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.” 2018. Web. 04 Mar 2021.
Vancouver:
Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/11012/27100.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/27100
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
INP Toulouse
21. Sanfins, William. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.
Degree: Docteur es, Génie Électrique, 2017, INP Toulouse
URL: http://www.theses.fr/2017INPT0066
Subjects/Keywords: Fail-to-short; Clip; Wire-bonding; Tolérant à la panne; Sécurisé; Fail-to-short; Clip; Wire-bonding; Fault-tolerant; Safety
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Sanfins, W. (2017). Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2017INPT0066
Chicago Manual of Style (16th Edition):
Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Doctoral Dissertation, INP Toulouse. Accessed March 04, 2021. http://www.theses.fr/2017INPT0066.
MLA Handbook (7th Edition):
Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Web. 04 Mar 2021.
Vancouver:
Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Internet] [Doctoral dissertation]. INP Toulouse; 2017. [cited 2021 Mar 04]. Available from: http://www.theses.fr/2017INPT0066.
Council of Science Editors:
Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Doctoral Dissertation]. INP Toulouse; 2017. Available from: http://www.theses.fr/2017INPT0066
University of California – Irvine
22. Wu, Jiaqi. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.
Degree: Engineering, 2018, University of California – Irvine
URL: http://www.escholarship.org/uc/item/6595h5br
Subjects/Keywords: Materials Science; die attachment; direct bonding; electronic packaging; reliability; Silver; wire bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Wu, J. (2018). Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. (Thesis). University of California – Irvine. Retrieved from http://www.escholarship.org/uc/item/6595h5br
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Thesis, University of California – Irvine. Accessed March 04, 2021. http://www.escholarship.org/uc/item/6595h5br.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Web. 04 Mar 2021.
Vancouver:
Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Internet] [Thesis]. University of California – Irvine; 2018. [cited 2021 Mar 04]. Available from: http://www.escholarship.org/uc/item/6595h5br.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Thesis]. University of California – Irvine; 2018. Available from: http://www.escholarship.org/uc/item/6595h5br
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
23. Letowski, Bastien. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.
Degree: Docteur es, Génie électrique, 2016, Université Grenoble Alpes (ComUE)
URL: http://www.theses.fr/2016GREAT114
Subjects/Keywords: Electronique de puissance; Packaging 3D; Conception couplé composant/packaging; Collage direct métal-Métal; Fabrication collective; Packaging à l’échelle de la plaque; Power Electronics; 3D packaging; Wire-Bond-Less module; Wafer-Level packaging; Direct copper bonding; Coupled design device/package; 620
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Letowski, B. (2016). Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2016GREAT114
Chicago Manual of Style (16th Edition):
Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed March 04, 2021. http://www.theses.fr/2016GREAT114.
MLA Handbook (7th Edition):
Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Web. 04 Mar 2021.
Vancouver:
Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2016. [cited 2021 Mar 04]. Available from: http://www.theses.fr/2016GREAT114.
Council of Science Editors:
Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2016. Available from: http://www.theses.fr/2016GREAT114
NSYSU
24. Huang, Han-Peng. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.
Degree: Master, Electrical Engineering, 2008, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647
Subjects/Keywords: Pull Strength; Wire Bonding; Au/Al/Pt pads; Plasma Cleaning
Record Details
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APA (6th Edition):
Huang, H. (2008). A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Web. 04 Mar 2021.
Vancouver:
Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Internet] [Thesis]. NSYSU; 2008. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Thesis]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
NSYSU
25. Wang, Jyun-hao. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.
Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU
URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920
Subjects/Keywords: Molecular Dynamics; Cu-Al; Wire bonding; Intermetallic compound; Mechanical properties
Record Details
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APA (6th Edition):
Wang, J. (2014). Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Web. 04 Mar 2021.
Vancouver:
Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Hong Kong University of Science and Technology
26. Chan, Yu Hin. Optimization of metallization and process variables in low temperature wire bonding technology.
Degree: 2003, Hong Kong University of Science and Technology
URL: http://repository.ust.hk/ir/Record/1783.1-5257
;
https://doi.org/10.14711/thesis-b805047
;
http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html
Subjects/Keywords: Wire bonding (Electronic packaging) ; Metallizing
Record Details
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APA (6th Edition):
Chan, Y. H. (2003). Optimization of metallization and process variables in low temperature wire bonding technology. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Web. 04 Mar 2021.
Vancouver:
Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2003. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Thesis]. Hong Kong University of Science and Technology; 2003. Available from: http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Hong Kong University of Science and Technology
27. Liu, Dong. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.
Degree: 2014, Hong Kong University of Science and Technology
URL: http://repository.ust.hk/ir/Record/1783.1-87490
;
https://doi.org/10.14711/thesis-b1333922
;
http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html
Subjects/Keywords: Wire bonding (Electronic packaging) ; Microelectronic packaging ; Interconnects (Integrated circuit technology)
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Liu, D. (2014). A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Web. 04 Mar 2021.
Vancouver:
Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2014. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Thesis]. Hong Kong University of Science and Technology; 2014. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Waterloo
28. McCracken, Michael. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.
Degree: 2010, University of Waterloo
URL: http://hdl.handle.net/10012/5132
Subjects/Keywords: Reliability; Sensor; Wire; Bonding
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
McCracken, M. (2010). Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5132
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/5132.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Web. 04 Mar 2021.
Vancouver:
McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/5132.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5132
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
University of Cincinnati
29. XU, PENG. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.
Degree: MS, Engineering : Electrical Engineering, 2003, University of Cincinnati
URL: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
Subjects/Keywords: wet bulk silicon etching; PI2611 polyimide multilayer process; MMIC circuit; wire bonding; on water microwave measurement
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
XU, P. (2003). HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. (Masters Thesis). University of Cincinnati. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
Chicago Manual of Style (16th Edition):
XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Masters Thesis, University of Cincinnati. Accessed March 04, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.
MLA Handbook (7th Edition):
XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Web. 04 Mar 2021.
Vancouver:
XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Internet] [Masters thesis]. University of Cincinnati; 2003. [cited 2021 Mar 04]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.
Council of Science Editors:
XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Masters Thesis]. University of Cincinnati; 2003. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
Addis Ababa University
30. Ashreka, Yenus. Development of Material for Train Overhead Contact Wire .
Degree: 2015, Addis Ababa University
URL: http://etd.aau.edu.et/dspace/handle/123456789/7071
Subjects/Keywords: Train Overhead Contact Wire; copper alloys; Addis Ababa light rail train
Record Details
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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager
APA (6th Edition):
Ashreka, Y. (2015). Development of Material for Train Overhead Contact Wire . (Thesis). Addis Ababa University. Retrieved from http://etd.aau.edu.et/dspace/handle/123456789/7071
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Chicago Manual of Style (16th Edition):
Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Thesis, Addis Ababa University. Accessed March 04, 2021. http://etd.aau.edu.et/dspace/handle/123456789/7071.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
MLA Handbook (7th Edition):
Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Web. 04 Mar 2021.
Vancouver:
Ashreka Y. Development of Material for Train Overhead Contact Wire . [Internet] [Thesis]. Addis Ababa University; 2015. [cited 2021 Mar 04]. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071.
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation
Council of Science Editors:
Ashreka Y. Development of Material for Train Overhead Contact Wire . [Thesis]. Addis Ababa University; 2015. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071
Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation