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You searched for subject:(Copper wire bonding process). Showing records 1 – 30 of 25175 total matches.

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University of Waterloo

1. Pequegnat, Andrew. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.

Degree: 2010, University of Waterloo

 Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold… (more)

Subjects/Keywords: Thermosonic wire bonding; Electrical flame off process; Copper wire bonding; Gold wire bonding; Free air ball; Ball bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Pequegnat, A. (2010). A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Web. 20 Mar 2019.

Vancouver:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

2. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

 Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction… (more)

Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 20 Mar 2019.

Vancouver:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

3. Hook, Michael. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.

Degree: 2018, University of Waterloo

 Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package sizes… (more)

Subjects/Keywords: Wire Bonding; Reliability; Copper Wire; Process Development; Accelerated Failure Time Model; High-Temperature Storage; Humidity Testing

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APA (6th Edition):

Hook, M. (2018). Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Web. 20 Mar 2019.

Vancouver:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Internet] [Thesis]. University of Waterloo; 2018. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Thesis]. University of Waterloo; 2018. Available from: http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

4. Gau, Hua-de. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU

 ããWire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has… (more)

Subjects/Keywords: Gold thermosonic wire bonding; Finite element method; Copper thermosonic wire bonding; Thermo-mechanical coupling analysis

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Gau, H. (2010). Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Web. 20 Mar 2019.

Vancouver:

Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Internet] [Thesis]. NSYSU; 2010. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

5. Rezvanigilkolaee, Alireza. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.

Degree: 2014, University of Waterloo

 The goal of this thesis is to improve the understanding of the stitch bonding process in microelectronic wire bonding. In particular, it focuses on investigating… (more)

Subjects/Keywords: Stitch Bonding Process; Wire Bonding; Microelectronics; Finite Element Analysis; ABAQUS

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Rezvanigilkolaee, A. (2014). Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/8199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/8199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Web. 20 Mar 2019.

Vancouver:

Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2014. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/8199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Thesis]. University of Waterloo; 2014. Available from: http://hdl.handle.net/10012/8199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

6. Shih, Hsin-Chih. Orientation effects on Cu wire bonding by finite element method.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

 Ball bonding with gold wire has been the preferred choice to connect semiconductor chip and a lead frame. Recently, copper wires have been increasingly used… (more)

Subjects/Keywords: Molecular dynamics; Finite element method; Copper wire bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Shih, H. (2009). Orientation effects on Cu wire bonding by finite element method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Web. 20 Mar 2019.

Vancouver:

Shih H. Orientation effects on Cu wire bonding by finite element method. [Internet] [Thesis]. NSYSU; 2009. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Shih H. Orientation effects on Cu wire bonding by finite element method. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

7. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has… (more)

Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 20 Mar 2019.

Vancouver:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

8. Zhang, Xiaodong. Characterization of copper diffusion in advanced packaging.

Degree: 2007, Hong Kong University of Science and Technology

 Three dimensional packaging (3DP) is emerging as the solution for microelectronics development toward system in package (SIP). 3D die stacking either with flip chip bonding(more)

Subjects/Keywords: Wire bonding (Electronic packaging); Copper

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Zhang, X. (2007). Characterization of copper diffusion in advanced packaging. (Thesis). Hong Kong University of Science and Technology. Retrieved from https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Thesis, Hong Kong University of Science and Technology. Accessed March 20, 2019. https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Web. 20 Mar 2019.

Vancouver:

Zhang X. Characterization of copper diffusion in advanced packaging. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2007. [cited 2019 Mar 20]. Available from: https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang X. Characterization of copper diffusion in advanced packaging. [Thesis]. Hong Kong University of Science and Technology; 2007. Available from: https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

9. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

 Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous… (more)

Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 20 Mar 2019.

Vancouver:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

10. Chiu, Chia-ai. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.

Degree: Master, Materials and Optoelectronic Science, 2014, NSYSU

Wire bonding is a widely used method in electronic package, which gold wire bonds to aluminum pad to form the I/O joints. Because of the… (more)

Subjects/Keywords: the Al-Cu-Pd ternary system; mic-contact of Cu-wire and Al-pad; wire-bonding process; diffusion couple; phase diagram

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chiu, C. (2014). The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Web. 20 Mar 2019.

Vancouver:

Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Internet] [Thesis]. NSYSU; 2014. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

11. McCracken, Michael. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.

Degree: 2010, University of Waterloo

Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, and removing samples at intervals to assess… (more)

Subjects/Keywords: Reliability; Sensor; Wire; Bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

McCracken, M. (2010). Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5132

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/5132.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Web. 20 Mar 2019.

Vancouver:

McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/5132.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5132

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Waterloo

12. Lum, Ivan. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.

Degree: 2007, University of Waterloo

 Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the… (more)

Subjects/Keywords: microelectronics; wire bond; mechanism; ultrasound; deformation; gold; copper; wear; finite element; bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lum, I. (2007). Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/3439

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/3439.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Web. 20 Mar 2019.

Vancouver:

Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2007. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/3439.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Thesis]. University of Waterloo; 2007. Available from: http://hdl.handle.net/10012/3439

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brigham Young University

13. George, Jonathan Alan. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.

Degree: MS, 2010, Brigham Young University

 A plasma arc erosion process can be used to create metal and metal oxide particles in the ultra-fine size range (<70 µm). An electric arc… (more)

Subjects/Keywords: EDM; PID; plasma arc; nano-particles; dielectric; process machine; copper; electrical discharge; water; wire; Mechanical Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

George, J. A. (2010). Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. (Masters Thesis). Brigham Young University. Retrieved from https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd

Chicago Manual of Style (16th Edition):

George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Masters Thesis, Brigham Young University. Accessed March 20, 2019. https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.

MLA Handbook (7th Edition):

George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Web. 20 Mar 2019.

Vancouver:

George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Internet] [Masters thesis]. Brigham Young University; 2010. [cited 2019 Mar 20]. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.

Council of Science Editors:

George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Masters Thesis]. Brigham Young University; 2010. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd


NSYSU

14. Hsu, Kuo-Chuan. The Reliability Study of Cu Wire Bonding.

Degree: Master, Materials and Optoelectronic Science, 2012, NSYSU

none Advisors/Committee Members: Liu-Wen Chang (chair), Yung-Tsun Pan (chair), Ker-Chang Hsieh (committee member), Te-Hsien Kan (chair).

Subjects/Keywords: IMC; wire bonding

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APA (6th Edition):

Hsu, K. (2012). The Reliability Study of Cu Wire Bonding. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Web. 20 Mar 2019.

Vancouver:

Hsu K. The Reliability Study of Cu Wire Bonding. [Internet] [Thesis]. NSYSU; 2012. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsu K. The Reliability Study of Cu Wire Bonding. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

15. Ho, Ming-Chi. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.

Degree: PhD, Materials and Optoelectronic Science, 2016, NSYSU

 For lower cost considerations, copper wire bonding has been applied in IC packaging in recent years. In this study, the intermetallics(IMCs) formed, growth and crack… (more)

Subjects/Keywords: Ag-Al-Au phase diagram; Ag wire bonding; Cu wire bonding; IMC; IC package

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APA (6th Edition):

Ho, M. (2016). Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209

Chicago Manual of Style (16th Edition):

Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Doctoral Dissertation, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.

MLA Handbook (7th Edition):

Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Web. 20 Mar 2019.

Vancouver:

Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Internet] [Doctoral dissertation]. NSYSU; 2016. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.

Council of Science Editors:

Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Doctoral Dissertation]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209


NSYSU

16. Chen, Ying-Chou. Passive Component Wire Bonding Evaluation in a Hybrid IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU

 As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New… (more)

Subjects/Keywords: IC assembly Substrate; Gold Wire Bonding Process; Passive Component; Non-Conductive Glue

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APA (6th Edition):

Chen, Y. (2007). Passive Component Wire Bonding Evaluation in a Hybrid IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Web. 20 Mar 2019.

Vancouver:

Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Internet] [Thesis]. NSYSU; 2007. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Thesis]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

17. Li, Zhiwen. Characterization and selecting criteria of epoxy molding compound for copper wiring packages.

Degree: 2010, Hong Kong University of Science and Technology

Wire bonding technology is the earliest chip level interconnection technology, but it is still the most widely used one in integrated circuit (IC) assembly for… (more)

Subjects/Keywords: Copper wire; Electronic packaging  – Materials; Epoxy compounds

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APA (6th Edition):

Li, Z. (2010). Characterization and selecting criteria of epoxy molding compound for copper wiring packages. (Thesis). Hong Kong University of Science and Technology. Retrieved from https://doi.org/10.14711/thesis-b1114563 ; http://repository.ust.hk/ir/bitstream/1783.1-7063/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Li, Zhiwen. “Characterization and selecting criteria of epoxy molding compound for copper wiring packages.” 2010. Thesis, Hong Kong University of Science and Technology. Accessed March 20, 2019. https://doi.org/10.14711/thesis-b1114563 ; http://repository.ust.hk/ir/bitstream/1783.1-7063/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Li, Zhiwen. “Characterization and selecting criteria of epoxy molding compound for copper wiring packages.” 2010. Web. 20 Mar 2019.

Vancouver:

Li Z. Characterization and selecting criteria of epoxy molding compound for copper wiring packages. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2010. [cited 2019 Mar 20]. Available from: https://doi.org/10.14711/thesis-b1114563 ; http://repository.ust.hk/ir/bitstream/1783.1-7063/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li Z. Characterization and selecting criteria of epoxy molding compound for copper wiring packages. [Thesis]. Hong Kong University of Science and Technology; 2010. Available from: https://doi.org/10.14711/thesis-b1114563 ; http://repository.ust.hk/ir/bitstream/1783.1-7063/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

18. Gomes, Jimy. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.

Degree: 2015, University of Waterloo

 In the past ten years, the increasing price of gold has motivated the wire bonding industry to look for alternative bonding wire materials in the… (more)

Subjects/Keywords: Thermosonic wire bonding; Palladium coated silver wire; Bond stress; Process temperature

…substrate terminals. The vast majority of ICs are interconnected using the wire bonding process… …wire bonding process. High electrical conductivity, low hardness, high malleability, and… …Cu wire bonding to prevent in-process oxidation which is a recurring cost added to the… …bonding process. The drawbacks of Cu wire makes Ag a more favorable alternative to Au since the… …detailed study on the PCS wire bonding process has not been reported. More research is necessary… 

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APA (6th Edition):

Gomes, J. (2015). A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/9740

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Thesis, University of Waterloo. Accessed March 20, 2019. http://hdl.handle.net/10012/9740.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Web. 20 Mar 2019.

Vancouver:

Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Internet] [Thesis]. University of Waterloo; 2015. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/10012/9740.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Thesis]. University of Waterloo; 2015. Available from: http://hdl.handle.net/10012/9740

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

19. Houserek, Jiří. Modelování technologických kroků kontaktování čipu mikrodrátkem .

Degree: 2013, Brno University of Technology

 Tato práce se zabývá teoretickým rozborem kontaktování polovodičových čipů metodou wire-bonding. Jsou zde zmíněny základní typy pouzder polovodičových čipů a metoda jejich kontaktování. Dále je… (more)

Subjects/Keywords: Wire-bonding; simulace; kontaktování čipů; Ansys; Wire-bounding; simulations; chips contacts; Ansys

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Houserek, J. (2013). Modelování technologických kroků kontaktování čipu mikrodrátkem . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/27100

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem .” 2013. Thesis, Brno University of Technology. Accessed March 20, 2019. http://hdl.handle.net/11012/27100.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem .” 2013. Web. 20 Mar 2019.

Vancouver:

Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem . [Internet] [Thesis]. Brno University of Technology; 2013. [cited 2019 Mar 20]. Available from: http://hdl.handle.net/11012/27100.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem . [Thesis]. Brno University of Technology; 2013. Available from: http://hdl.handle.net/11012/27100

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


INP Toulouse

20. Sanfins, William. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.

Degree: Docteur es, Génie Électrique, 2017, INP Toulouse

 Dans les modules de puissance à connexion filaire de type wire-bonding (WB), les forts courants commutés (jusqu’à 200A pour une puce de 10x10mm²) imposent de… (more)

Subjects/Keywords: Fail-to-short; Clip; Wire-bonding; Tolérant à la panne; Sécurisé; Fail-to-short; Clip; Wire-bonding; Fault-tolerant; Safety

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APA (6th Edition):

Sanfins, W. (2017). Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2017INPT0066

Chicago Manual of Style (16th Edition):

Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Doctoral Dissertation, INP Toulouse. Accessed March 20, 2019. http://www.theses.fr/2017INPT0066.

MLA Handbook (7th Edition):

Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Web. 20 Mar 2019.

Vancouver:

Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Internet] [Doctoral dissertation]. INP Toulouse; 2017. [cited 2019 Mar 20]. Available from: http://www.theses.fr/2017INPT0066.

Council of Science Editors:

Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Doctoral Dissertation]. INP Toulouse; 2017. Available from: http://www.theses.fr/2017INPT0066


University of California – Irvine

21. Wu, Jiaqi. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.

Degree: Engineering, 2018, University of California – Irvine

 Despite the superior physical properties of silver (Ag) and its alloys such as high electrical and thermal conductivities and high ductility, their applications in electronics… (more)

Subjects/Keywords: Materials Science; die attachment; direct bonding; electronic packaging; reliability; Silver; wire bonding

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APA (6th Edition):

Wu, J. (2018). Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. (Thesis). University of California – Irvine. Retrieved from http://www.escholarship.org/uc/item/6595h5br

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Thesis, University of California – Irvine. Accessed March 20, 2019. http://www.escholarship.org/uc/item/6595h5br.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Web. 20 Mar 2019.

Vancouver:

Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Internet] [Thesis]. University of California – Irvine; 2018. [cited 2019 Mar 20]. Available from: http://www.escholarship.org/uc/item/6595h5br.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Thesis]. University of California – Irvine; 2018. Available from: http://www.escholarship.org/uc/item/6595h5br

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

22. Letowski, Bastien. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.

Degree: Docteur es, Génie électrique, 2016, Grenoble Alpes

Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la… (more)

Subjects/Keywords: Electronique de puissance; Packaging 3D; Conception couplé composant/packaging; Collage direct métal-Métal; Fabrication collective; Packaging à l’échelle de la plaque; Power Electronics; 3D packaging; Wire-Bond-Less module; Wafer-Level packaging; Direct copper bonding; Coupled design device/package; 620

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APA (6th Edition):

Letowski, B. (2016). Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. (Doctoral Dissertation). Grenoble Alpes. Retrieved from http://www.theses.fr/2016GREAT114

Chicago Manual of Style (16th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Doctoral Dissertation, Grenoble Alpes. Accessed March 20, 2019. http://www.theses.fr/2016GREAT114.

MLA Handbook (7th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Web. 20 Mar 2019.

Vancouver:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Internet] [Doctoral dissertation]. Grenoble Alpes; 2016. [cited 2019 Mar 20]. Available from: http://www.theses.fr/2016GREAT114.

Council of Science Editors:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Doctoral Dissertation]. Grenoble Alpes; 2016. Available from: http://www.theses.fr/2016GREAT114


NSYSU

23. Huang, Han-Peng. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.

Degree: Master, Electrical Engineering, 2008, NSYSU

 To improve the wire bondability, interfacial adhesion and popcorn cracking resistance in the packaging processing of IC and MEMS chips, this thesis utilized oxygen and… (more)

Subjects/Keywords: Pull Strength; Wire Bonding; Au/Al/Pt pads; Plasma Cleaning

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APA (6th Edition):

Huang, H. (2008). A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Web. 20 Mar 2019.

Vancouver:

Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Internet] [Thesis]. NSYSU; 2008. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Thesis]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

24. Wang, Jyun-hao. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 In the IC packaging industry, due to the highly maturity and reliability of wire bonding technology, it has been the most widely used method for… (more)

Subjects/Keywords: Molecular Dynamics; Cu-Al; Wire bonding; Intermetallic compound; Mechanical properties

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APA (6th Edition):

Wang, J. (2014). Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Thesis, NSYSU. Accessed March 20, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Web. 20 Mar 2019.

Vancouver:

Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2019 Mar 20]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

25. Liu, Dong. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.

Degree: 2014, Hong Kong University of Science and Technology

Wire bonding is one of the dominant microelectronic connection technologies, which provides electrical connection between integrated circuits and external leads. A solid free air ball… (more)

Subjects/Keywords: Wire bonding (Electronic packaging); Microelectronic packaging; Interconnects (Integrated circuit technology)

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Liu, D. (2014). A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. (Thesis). Hong Kong University of Science and Technology. Retrieved from https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Thesis, Hong Kong University of Science and Technology. Accessed March 20, 2019. https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Web. 20 Mar 2019.

Vancouver:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2014. [cited 2019 Mar 20]. Available from: https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Thesis]. Hong Kong University of Science and Technology; 2014. Available from: https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Hong Kong University of Science and Technology

26. Chan, Yu Hin. Optimization of metallization and process variables in low temperature wire bonding technology.

Degree: 2003, Hong Kong University of Science and Technology

Wire bonding is a widely used interconnection technology in electronic packaging. Due to the advantages of fast bonding process, high productivity, good electrical and thermal… (more)

Subjects/Keywords: Wire bonding (Electronic packaging); Metallizing

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APA (6th Edition):

Chan, Y. H. (2003). Optimization of metallization and process variables in low temperature wire bonding technology. (Thesis). Hong Kong University of Science and Technology. Retrieved from https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Thesis, Hong Kong University of Science and Technology. Accessed March 20, 2019. https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Web. 20 Mar 2019.

Vancouver:

Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2003. [cited 2019 Mar 20]. Available from: https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Thesis]. Hong Kong University of Science and Technology; 2003. Available from: https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Cincinnati

27. XU, PENG. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.

Degree: MS, Engineering : Electrical Engineering, 2003, University of Cincinnati

 In this thesis, design, processing and characterization of a hybrid X-band power amplifier is presented for a vertically interconnected multilayer monolithic microwave (M3) module for… (more)

Subjects/Keywords: wet bulk silicon etching; PI2611 polyimide multilayer process; MMIC circuit; wire bonding; on water microwave measurement

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

XU, P. (2003). HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. (Masters Thesis). University of Cincinnati. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754

Chicago Manual of Style (16th Edition):

XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Masters Thesis, University of Cincinnati. Accessed March 20, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.

MLA Handbook (7th Edition):

XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Web. 20 Mar 2019.

Vancouver:

XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Internet] [Masters thesis]. University of Cincinnati; 2003. [cited 2019 Mar 20]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.

Council of Science Editors:

XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Masters Thesis]. University of Cincinnati; 2003. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754


Delft University of Technology

28. Haagen, H.C.J. A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :.

Degree: 2014, Delft University of Technology

A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades. Different approaches, a design proposal and evaluation of the approaches and proposal Advisors/Committee Members: Bersma, A., Smits, J., Caubo, G..

Subjects/Keywords: structural bonding; curtain wall; process; optimisation

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APA (6th Edition):

Haagen, H. C. J. (2014). A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:6c7b9ce8-d90f-463e-ad3f-e907fd7e2435

Chicago Manual of Style (16th Edition):

Haagen, H C J. “A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :.” 2014. Masters Thesis, Delft University of Technology. Accessed March 20, 2019. http://resolver.tudelft.nl/uuid:6c7b9ce8-d90f-463e-ad3f-e907fd7e2435.

MLA Handbook (7th Edition):

Haagen, H C J. “A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :.” 2014. Web. 20 Mar 2019.

Vancouver:

Haagen HCJ. A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :. [Internet] [Masters thesis]. Delft University of Technology; 2014. [cited 2019 Mar 20]. Available from: http://resolver.tudelft.nl/uuid:6c7b9ce8-d90f-463e-ad3f-e907fd7e2435.

Council of Science Editors:

Haagen HCJ. A research on the optimization of the process: structural bonding of glazing in unitized curtain wall facades :. [Masters Thesis]. Delft University of Technology; 2014. Available from: http://resolver.tudelft.nl/uuid:6c7b9ce8-d90f-463e-ad3f-e907fd7e2435


Addis Ababa University

29. Ashreka, Yenus. Development of Material for Train Overhead Contact Wire .

Degree: 2015, Addis Ababa University

 This paper presents the development of material for train overhead contact wire. In view of the current Addis Ababa Light Rail Train overhead contact wire(more)

Subjects/Keywords: Train Overhead Contact Wire; copper alloys; Addis Ababa light rail train

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Ashreka, Y. (2015). Development of Material for Train Overhead Contact Wire . (Thesis). Addis Ababa University. Retrieved from http://etd.aau.edu.et/dspace/handle/123456789/7071

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Thesis, Addis Ababa University. Accessed March 20, 2019. http://etd.aau.edu.et/dspace/handle/123456789/7071.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Web. 20 Mar 2019.

Vancouver:

Ashreka Y. Development of Material for Train Overhead Contact Wire . [Internet] [Thesis]. Addis Ababa University; 2015. [cited 2019 Mar 20]. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Ashreka Y. Development of Material for Train Overhead Contact Wire . [Thesis]. Addis Ababa University; 2015. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Wollongong

30. Bothma, Nicolaas Christian. The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process.

Degree: PhD, 2012, University of Wollongong

  Welding processes have been optimised to ensure that the best productivity and quality can be achieved. However to ensure that this level of optimisation… (more)

Subjects/Keywords: FFR (fume formation rate); copper coated wires; optimisation; GMAW; welding wire

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Bothma, N. C. (2012). The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process. (Doctoral Dissertation). University of Wollongong. Retrieved from 091008 Manufacturing Safety and Quality, 091207 Metals and Alloy Materials, 861206 Structural Metal Products ; http://ro.uow.edu.au/theses/3761

Chicago Manual of Style (16th Edition):

Bothma, Nicolaas Christian. “The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process.” 2012. Doctoral Dissertation, University of Wollongong. Accessed March 20, 2019. 091008 Manufacturing Safety and Quality, 091207 Metals and Alloy Materials, 861206 Structural Metal Products ; http://ro.uow.edu.au/theses/3761.

MLA Handbook (7th Edition):

Bothma, Nicolaas Christian. “The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process.” 2012. Web. 20 Mar 2019.

Vancouver:

Bothma NC. The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process. [Internet] [Doctoral dissertation]. University of Wollongong; 2012. [cited 2019 Mar 20]. Available from: 091008 Manufacturing Safety and Quality, 091207 Metals and Alloy Materials, 861206 Structural Metal Products ; http://ro.uow.edu.au/theses/3761.

Council of Science Editors:

Bothma NC. The influence of copper coating on the fume formation rate of carbon steel welding wire during the gas metal arc welding process. [Doctoral Dissertation]. University of Wollongong; 2012. Available from: 091008 Manufacturing Safety and Quality, 091207 Metals and Alloy Materials, 861206 Structural Metal Products ; http://ro.uow.edu.au/theses/3761

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