subject:(Copper wire bonding process)

NSYSU

1. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

► Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction… (more)

Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 04 Mar 2021.

Vancouver:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Waterloo

2. Hook, Michael. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.

Degree: 2018, University of Waterloo

URL: http://hdl.handle.net/10012/13827

► Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package sizes… (more)

▼ Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package sizes and operation in harsher environments, such as in automotive applications. At the same time, manufacturers are seeking to reduce production costs by using new materials, for example in wire bonding by replacing costly gold wire with more economical copper. Because microelectronic devices are expected to function reliably for years or even decades, depending on the application, reliability testing is commonly accelerated, e.g. by using elevated temperature and/or humidity. Even so, testing is often time consuming, requiring weeks or months for product qualification. Furthermore, although standard test conditions exist, little guidance is available in the literature to indicate how long products passing these tests will survive in operation. Non-destructive testing methods provide a great deal of information regarding product degradation and reliability. With proper statistical analysis, strong conclusions can be made about device reliability with relatively short test durations, since testing need not continue until all samples fail. However, data analysis techniques used in the electronics packaging literature are often limited, with statistical analyses and confidence bounds rarely presented. Analysis of incomplete or censored data requires specialized techniques from the field of survival analysis. The contributions of this thesis can be divided in two topics. The first topic is the equipment and techniques used to obtain new reliability results, including a method for temperature calibration of the miniature ovens used, a modification of those ovens for use as environmental chambers with humidity control, and procedures for optimization of wire bonding processes. Second, statistical techniques for analysis of reliability data are demonstrated, using accelerated failure time models to analyze resistance data from copper wire bonds in high temperature storage testing. In doing so, new information was provided to answer an important open question in the field of copper wire bonding, namely, the maximum temperature at which one can expect copper wire bonds on aluminum metallization to perform reliably. In particular, ball bonds made from 25 µm diameter palladium-coated copper wire are estimated to be highly reliable up to at least 167 °C in a clean environment without encapsulation, with failure rate of only 1 ppm after 12000 h. PCC wires were more reliable than bare Cu wires when unencapsulated or when encapsulated in silicone. Conversely, bare Cu was more reliable than PCC when encapsulated in epoxy. The best-performing encapsulated bonds tested were bare Cu wire with a highly heat tolerant epoxy, which are estimated to survive 12000 h with 1 ppm failure probability at 159 °C. Effects of several other factors on bond reliability were also investigated, namely the cleaning…

Subjects/Keywords: Wire Bonding; Reliability; Copper Wire; Process Development; Accelerated Failure Time Model; High-Temperature Storage; Humidity Testing

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Hook, M. (2018). Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hook, Michael. “Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation.” 2018. Web. 04 Mar 2021.

Vancouver:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Internet] [Thesis]. University of Waterloo; 2018. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/13827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hook M. Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation. [Thesis]. University of Waterloo; 2018. Available from: http://hdl.handle.net/10012/13827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Waterloo

3. Pequegnat, Andrew. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.

Degree: 2010, University of Waterloo

URL: http://hdl.handle.net/10012/5136

► Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold… (more)

Subjects/Keywords: Thermosonic wire bonding; Electrical flame off process; Copper wire bonding; Gold wire bonding; Free air ball; Ball bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Pequegnat, A. (2010). A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Pequegnat, Andrew. “A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials.” 2010. Web. 04 Mar 2021.

Vancouver:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/5136.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pequegnat A. A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5136

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

4. Gau, Hua-de. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754

► ããWire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has… (more)

Subjects/Keywords: Gold thermosonic wire bonding; Finite element method; Copper thermosonic wire bonding; Thermo-mechanical coupling analysis

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Gau, H. (2010). Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Gau, Hua-de. “Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation.” 2010. Web. 04 Mar 2021.

Vancouver:

Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Internet] [Thesis]. NSYSU; 2010. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gau H. Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Waterloo

5. Rezvanigilkolaee, Alireza. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.

Degree: 2014, University of Waterloo

URL: http://hdl.handle.net/10012/8199

► The goal of this thesis is to improve the understanding of the stitch bonding process in microelectronic wire bonding. In particular, it focuses on investigating… (more)

Subjects/Keywords: Stitch Bonding Process; Wire Bonding; Microelectronics; Finite Element Analysis; ABAQUS

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Rezvanigilkolaee, A. (2014). Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/8199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/8199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Rezvanigilkolaee, Alireza. “Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding.” 2014. Web. 04 Mar 2021.

Vancouver:

Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2014. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/8199.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Rezvanigilkolaee A. Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding. [Thesis]. University of Waterloo; 2014. Available from: http://hdl.handle.net/10012/8199

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

6. Shih, Hsin-Chih. Orientation effects on Cu wire bonding by finite element method.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258

► Ball bonding with gold wire has been the preferred choice to connect semiconductor chip and a lead frame. Recently, copper wires have been increasingly used… (more)

Subjects/Keywords: Molecular dynamics; Finite element method; Copper wire bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Shih, H. (2009). Orientation effects on Cu wire bonding by finite element method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Shih, Hsin-Chih. “Orientation effects on Cu wire bonding by finite element method.” 2009. Web. 04 Mar 2021.

Vancouver:

Shih H. Orientation effects on Cu wire bonding by finite element method. [Internet] [Thesis]. NSYSU; 2009. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Shih H. Orientation effects on Cu wire bonding by finite element method. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0720109-184258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

7. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

► Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has… (more)

Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 04 Mar 2021.

Vancouver:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Hong Kong University of Science and Technology

8. Zhang, Xiaodong. Characterization of copper diffusion in advanced packaging.

Degree: 2007, Hong Kong University of Science and Technology

URL: http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html

► Three dimensional packaging (3DP) is emerging as the solution for microelectronics development toward system in package (SIP). 3D die stacking either with flip chip bonding… (more)

▼ Three dimensional packaging (3DP) is emerging as the solution for microelectronics development toward system in package (SIP). 3D die stacking either with flip chip bonding or with wire bonding has a very good potential for the implementation of 3D packaging. With the new interconnection materials Cu introduced in this advanced packaging, special attention should be paid to Cu-to-Si diffusion due to the fast diffusion of Cu in Si and impact of Cu on the silicon devices. In this study, the Cu-to-Si diffusion in through silicon vias (TSVs) and in wire bonding are investigated. The interlayers for TSVs with sidewall multilayer and for wire bonding with bonding pad layers are characterized. Firstly secondary ion mass spectrometry (SIMS) depth profiling is implemented for the Cu-to-Si diffusion analysis. The standard Cu/Si samples are prepared for SIMS depth profile verification. Compared with the finite element model (FEM) analysis results, the Cu diffusivity determined by SIMS analysis is in good agreement with FEM analysis. For the flip chip bonding, through silicon vias (TSVs) are adopted as vertical interconnection within the silicon die. The TSVs formation method, namely, deep reactive ion etching (DRIE), is evaluated. The experimental results and comparisons in terms of via uniformity, aspect ratio dependent etching, undercutting, and effects of various mask materials are discussed in detail for sub-micron silicon via. To prevent Cu diffusion, improve the Cu adhesion and provide electrical insulation, the interfacial multilayer is deposited on the TSVs sidewall. Regarding Cu-to-Si diffusion, the effects of Si surface roughness, insulation layer, barrier layer and the Cu source supply are investigated. The phase transition during thermal annealing is studied. Experimental results show that the SiO2 layer not only serves for electrical insulation, but also helps to maintain the integrity of the Ti barrier layer and to prevent further diffusion of Cu into the silicon. From a surface roughness comparative study, the experimental results show that a rougher silicon surface may promote Cu diffusion depth and subsequently will impose a higher threat on the IC devices. Therefore, a smooth surface is preferred for the deposition of interfacial multilayers on the sidewall of TSVs. The Ti barrier layer in the interfacial multilayer structure on a smooth silicon substrate can effectively prevent Cu diffusion at an annealing temperature lower than 300℃. However, when the annealing temperature is raised to 300℃ or above, the barrier layer tends to breakdown and the Cu element will surpass the Ti layer. It is also identified that the Cu layer thickness may affect the Cu diffusion depth. In general, a thicker Cu layer will promote the Cu diffusion depth. This effect reveals that the Cu diffusion in TSVs for 3D packaging should be different from that in the Cu damascene structure for on-chip interconnection. Furthermore, from X-ray diffraction (XRD), Energy Dispersive X-ray (EDX) analysis, scanning electron microscopy (SEM)…

Subjects/Keywords: Wire bonding (Electronic packaging) ; Copper

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Zhang, X. (2007). Characterization of copper diffusion in advanced packaging. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Zhang, Xiaodong. “Characterization of copper diffusion in advanced packaging.” 2007. Web. 04 Mar 2021.

Vancouver:

Zhang X. Characterization of copper diffusion in advanced packaging. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2007. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zhang X. Characterization of copper diffusion in advanced packaging. [Thesis]. Hong Kong University of Science and Technology; 2007. Available from: http://repository.ust.hk/ir/Record/1783.1-2883 ; https://doi.org/10.14711/thesis-b943792 ; http://repository.ust.hk/ir/bitstream/1783.1-2883/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

9. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

► Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous… (more)

▼ Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous stringent environmental conditions have been established for low-temperature processes. This has increased costs and created additional processing steps. Recently, researchers have proposed a couples-polishing activation-bonding (CAB) process. This process involves using ultrasonic vibration technology to induce interfacial friction, thereby increasing temperatures at the interface. Subsequently, atomic diffusion leaving copper contacts generate engagement. This process can be performed at room temperature. In this study, the finite-element method was used to establish a micro-copper block ultrasonic-vibration-bonding 3D simulation model. In addition, the effects of various ultrasonic-vibration frequencies on the stress, strain, and temperature fields of the interface were explored, and the effects of the coefficients of friction and amplitude on interface strain were analyzed. The simulation results showed that at 50 kHz, the bonding process was successful after 1500 Î¼s. The equivalent stress could be divided into stress upward, stress downward, and stress stabilization phases. Based on the results, it may be suggested that ultrasound-vibration frequencies affect energy transfer rates. The results obtained at 50 kHz showed that the outermost strain was less than 23% of the center strain. By increasing the frequency, a critical frequency was determined regarding the period necessary to obtain a steady stress rate. Finally, when the friction coefficient and amplitude were changed, at a fixed frequency, the coefficient of friction rose from 0.1 to 0.15, which was a larger increase in strain than 0.15 to 0.2. Regarding amplitude changes, when the frequency was low, the amplitude exhibited an increased effect on the maximum equivalent strain. Advisors/Committee Members: Rung-Hung Suen (chair), Chi-Hui Chien (committee member), Chung-Ting Wang (chair), Ting-Lang Hsiao (chair).

Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 04 Mar 2021.

Vancouver:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

10. Chiu, Chia-ai. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.

Degree: Master, Materials and Optoelectronic Science, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434

► Wire bonding is a widely used method in electronic package, which gold wire bonds to aluminum pad to form the I/O joints. Because of the… (more)

Subjects/Keywords: the Al-Cu-Pd ternary system; mic-contact of Cu-wire and Al-pad; wire-bonding process; diffusion couple; phase diagram

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chiu, C. (2014). The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chiu, Chia-ai. “The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram.” 2014. Web. 04 Mar 2021.

Vancouver:

Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chiu C. The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0706114-154434

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Michigan State University

11. Wu, Yuelin. Corrosion-induced failure analysis of Cu wire bonded packages.

Degree: 2018, Michigan State University

URL: http://etd.lib.msu.edu/islandora/object/etd:19342

►

Thesis Ph. D. Michigan State University. Chemical Engineering 2018

Due to the demand of cost reduction and higher input-output density in the integrated circuit (IC),… (more)

▼

Thesis Ph. D. Michigan State University. Chemical Engineering 2018

Due to the demand of cost reduction and higher input-output density in the integrated circuit (IC), Cu has become the material of choice over Au in the wire bonded electronic package. Although high-quality Cu wire bonds can be achieved by modifying the bonding conditions and process parameters, the long-term service reliability of the Cu-Al ball-bond interface in humid condition remains a major concern, especially to the automobile industry. At the Cu-Al ball-bond interface, two thin layers of intermetallics, Cu9Al4 and CuAl2, are sandwiched between the Cu wire and the Al pad. Accelerated humidity reliability tests showed Cu9Al4 disappeared, while Cu, CuAl2, and Al remained. The disappearance of Cu9Al4 cannot be explained based on the nobility ranking of the metallic entities present. Consequently, the corrosion-induced failure mechanism of the Cu-Al ball-bond interface remains unclear. This dissertation focuses on understanding the preferential attack on Cu9Al4 and its role in the ball-bond failure by using electrochemical and non-electrochemical techniques. Corrosion-mitigating mechanisms of current solutions can also be explained. Galvanic corrosion is considered as a major cause of bond failure due to the direct contact between dissimilar metallic entities at the ball-bond interface. Due to encapsulation, the galvanic corrosion should occur in a thin layer of the electrolyte at the mold-bond interface. The high ohmic resistance of this thin-layer electrolyte may constrain the galvanic corrosion at the contact interfaces between adjacent entities. Galvanic current density measurements showed the galvanic corrosion rate was higher between Cu9Al4 and CuAl2 than those between Cu and Cu9Al4 as well as between CuAl2 and Al. A crack should propagate faster along the interface between Cu9Al4 and CuAl2. A large area of residual alumina, which originates from the Al pad, is found between Cu9Al4 and CuAl2. Due to weak bonding between alumina and the intermetallics, the electrolyte can seep in more easily and accelerate the corrosion-induced crack growth. Due to the influx of Cu, CuAl2 is slowly transformed to Cu9Al4 during the annealing. Voids form within the residual alumina between Cu9Al4 and CuAl2 due to internal stress buildup. These voids between Cu9Al4 and CuAl2 can also facilitate the crack propagation. Therefore, the Cu-Al ball bond should fail at the interface between Cu9Al4 and CuAl2. The failure separates Cu and Cu9Al4 from CuAl2 and Al. For the Cu-Cu9Al4 couple, Cu9Al4 the anode should corrode much faster due to strong galvanic effect imposed by a larger area of Cu. For the CuAl2-Al couple, Al the anode should not be affected since the galvanic effect imposed by a small area of CuAl2 is weak. Therefore, Cu9Al4 appears to corrode faster than Cu, CuAl2, and Al.Pd-coated Cu wire and the "green" molding compound with a low chloride concentration are commonly used to mitigate the bond corrosion. Galvanic current density measurements showed that…

Advisors/Committee Members: Lee, Andre, Barton, Scott C, Lai, Wei, Chahal, Prem.

Subjects/Keywords: Copper wire; Wire bonding (Electronic packaging); Microelectronic packaging; Copper – Corrosion; Electrolytic corrosion; Metals – Corrosion fatigue; Integrated circuits – Reliability – Research; Chemical engineering; Materials Science

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APA (6^th Edition):

Wu, Y. (2018). Corrosion-induced failure analysis of Cu wire bonded packages. (Thesis). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:19342

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wu, Yuelin. “Corrosion-induced failure analysis of Cu wire bonded packages.” 2018. Thesis, Michigan State University. Accessed March 04, 2021. http://etd.lib.msu.edu/islandora/object/etd:19342.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wu, Yuelin. “Corrosion-induced failure analysis of Cu wire bonded packages.” 2018. Web. 04 Mar 2021.

Vancouver:

Wu Y. Corrosion-induced failure analysis of Cu wire bonded packages. [Internet] [Thesis]. Michigan State University; 2018. [cited 2021 Mar 04]. Available from: http://etd.lib.msu.edu/islandora/object/etd:19342.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wu Y. Corrosion-induced failure analysis of Cu wire bonded packages. [Thesis]. Michigan State University; 2018. Available from: http://etd.lib.msu.edu/islandora/object/etd:19342

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Waterloo

12. Lum, Ivan. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.

Degree: 2007, University of Waterloo

URL: http://hdl.handle.net/10012/3439

► Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the… (more)

▼ Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the process. In order for there to be improvements in the process a better understanding of the process is required. The mechanism of the bond formation in ultrasonic wire bonding is not known. Although there have been theories proposed, inconsistencies have been shown to exist in them. One of the main inconsistencies is the contribution of ultrasound to the bonding process. A series of experiments to investigate the mechanism of bond formation are performed on a semi automatic wire bonder at room temperature. 25 µm diameter Au wire is ball bonded and also 25 µm diameter Al wire is wedge-wedge bonded onto polished Cu sheets of thickness 2 mm. It is found that a modified microslip theory can describe the evolution of bonding. With increasing ultrasonic power the bond contact transitions from microslip into gross sliding. The reciprocating tangential relative motion at the bond interface results in wear of surface contaminants which leads to clean metal/metal contact and bonding. The effect of superimposed ultrasound during deformation on the residual hardness of a bonded ball is systematically studied for the first time. An innovative bonding procedure with in-situ ball deformation and hardness measurement is developed using an ESEC WB3100 automatic ball bonder. 50 µm diameter Au wire is bonded at various ultrasound levels onto Au metallized PCB substrate at room temperature. It is found that sufficient ultrasound which is applied during the deformation leads to a bonded ball which is softer than a ball with a similar amount of deformation without ultrasound. No hardening of the 100 µm diameter Au ball is observed even with the maximum ultrasonic power capable of the equipment of 900 mW. In summary, the fundamental effect of ultrasound in the wire bonding process is the reciprocating tangential displacement at the bond interface resulting in contaminant dispersal and bonding. A second effect of ultrasound is the softening of the bonded material when compared to a similarly non-ultrasound deformed ball.

Subjects/Keywords: microelectronics; wire bond; mechanism; ultrasound; deformation; gold; copper; wear; finite element; bonding

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APA (6^th Edition):

Lum, I. (2007). Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/3439

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/3439.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Lum, Ivan. “Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding.” 2007. Web. 04 Mar 2021.

Vancouver:

Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Internet] [Thesis]. University of Waterloo; 2007. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/3439.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lum I. Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding. [Thesis]. University of Waterloo; 2007. Available from: http://hdl.handle.net/10012/3439

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Brigham Young University

13. George, Jonathan Alan. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.

Degree: MS, 2010, Brigham Young University

URL: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd

► A plasma arc erosion process can be used to create metal and metal oxide particles in the ultra-fine size range (<70 µm). An electric arc… (more)

Subjects/Keywords: EDM; PID; plasma arc; nano-particles; dielectric; process machine; copper; electrical discharge; water; wire; Mechanical Engineering

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

George, J. A. (2010). Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. (Masters Thesis). Brigham Young University. Retrieved from https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd

Chicago Manual of Style (16^th Edition):

George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Masters Thesis, Brigham Young University. Accessed March 04, 2021. https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.

MLA Handbook (7^th Edition):

George, Jonathan Alan. “Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock.” 2010. Web. 04 Mar 2021.

Vancouver:

George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Internet] [Masters thesis]. Brigham Young University; 2010. [cited 2021 Mar 04]. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd.

Council of Science Editors:

George JA. Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock. [Masters Thesis]. Brigham Young University; 2010. Available from: https://scholarsarchive.byu.edu/cgi/viewcontent.cgi?article=3046&context=etd

NSYSU

14. Hsu, Kuo-Chuan. The Reliability Study of Cu Wire Bonding.

Degree: Master, Materials and Optoelectronic Science, 2012, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550

none Advisors/Committee Members: Liu-Wen Chang (chair), Yung-Tsun Pan (chair), Ker-Chang Hsieh (committee member), Te-Hsien Kan (chair).

Subjects/Keywords: IMC; wire bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Hsu, K. (2012). The Reliability Study of Cu Wire Bonding. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hsu, Kuo-Chuan. “The Reliability Study of Cu Wire Bonding.” 2012. Web. 04 Mar 2021.

Vancouver:

Hsu K. The Reliability Study of Cu Wire Bonding. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsu K. The Reliability Study of Cu Wire Bonding. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0823112-120550

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

15. Ho, Ming-Chi. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.

Degree: PhD, Materials and Optoelectronic Science, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209

► For lower cost considerations, copper wire bonding has been applied in IC packaging in recent years. In this study, the intermetallics(IMCs) formed, growth and crack… (more)

Subjects/Keywords: Ag-Al-Au phase diagram; Ag wire bonding; Cu wire bonding; IMC; IC package

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Ho, M. (2016). Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209

Chicago Manual of Style (16^th Edition):

Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Doctoral Dissertation, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.

MLA Handbook (7^th Edition):

Ho, Ming-Chi. “Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging.” 2016. Web. 04 Mar 2021.

Vancouver:

Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Internet] [Doctoral dissertation]. NSYSU; 2016. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209.

Council of Science Editors:

Ho M. Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging. [Doctoral Dissertation]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-130209

Delft University of Technology

16. Kopally, Hima (author). A new experimental approach to investigate the physics-of-failure of wirebond interconnects.

Degree: 2018, Delft University of Technology

URL: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a

►

Wirebonding is an interconnection technology used to connect a chip to its LED package. It is currently not well understood which wirebond characteristics are best… (more)

Subjects/Keywords: wire bonding; physics-of-failure; interconnects; four wire resistance measurement; fatigue

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Kopally, H. (. (2018). A new experimental approach to investigate the physics-of-failure of wirebond interconnects. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a

Chicago Manual of Style (16^th Edition):

Kopally, Hima (author). “A new experimental approach to investigate the physics-of-failure of wirebond interconnects.” 2018. Masters Thesis, Delft University of Technology. Accessed March 04, 2021. http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a.

MLA Handbook (7^th Edition):

Kopally, Hima (author). “A new experimental approach to investigate the physics-of-failure of wirebond interconnects.” 2018. Web. 04 Mar 2021.

Vancouver:

Kopally H(. A new experimental approach to investigate the physics-of-failure of wirebond interconnects. [Internet] [Masters thesis]. Delft University of Technology; 2018. [cited 2021 Mar 04]. Available from: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a.

Council of Science Editors:

Kopally H(. A new experimental approach to investigate the physics-of-failure of wirebond interconnects. [Masters Thesis]. Delft University of Technology; 2018. Available from: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a

NSYSU

17. Chen, Ying-Chou. Passive Component Wire Bonding Evaluation in a Hybrid IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653

► As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New… (more)

Subjects/Keywords: IC assembly Substrate; Gold Wire Bonding Process; Passive Component; Non-Conductive Glue

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APA (6^th Edition):

Chen, Y. (2007). Passive Component Wire Bonding Evaluation in a Hybrid IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen, Ying-Chou. “Passive Component Wire Bonding Evaluation in a Hybrid IC Package.” 2007. Web. 04 Mar 2021.

Vancouver:

Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Internet] [Thesis]. NSYSU; 2007. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen Y. Passive Component Wire Bonding Evaluation in a Hybrid IC Package. [Thesis]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212107-162653

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Arkansas

18. Nasiri, Ardalan. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.

Degree: PhD, 2020, University of Arkansas

URL: https://scholarworks.uark.edu/etd/3755

► This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and… (more)

▼ This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal aging and thermal cycling were carried out on the synthesized paste. XPS analysis revealed a higher oxygen bonding percentage for the 10% nanosilica ceramic sample than other samples. XRD peak broadening is largest for the 10% nano-silica ceramic which indicated smaller crystallite sizes. The smaller crystallite size for the 10% nanosilica sample introduces a larger microstrain to the alumina crystal structure. FTIR revealed the presence of alumina-silicate bonds on these samples with the largest amount present in the 10% nanosilica samples. SEM and EDX results showed a uniform bond line for the 10% sample and uniform material distribution. An electronic packaging technology that survives the Venusian condition was developed. Alumina ceramic substrates and gold conductors on alumina were evaluated for electrical and mechanical performance. The most promising die-attach materials were found to be thick-film gold and alumina-based ceramic pastes. Alumina, sapphire, silicon, and silicon carbide dice were attached to the alumina substrates using these die-attach materials and exposed to the Venusian condition for 244 hours. The devices on the packaging substrates were encapsulated by a ceramic encapsulant with no significant increase in cracks and voids after the Venusian simulator test. Wire pull strength tests were conducted on the gold bond wire to evaluate mechanical durability before and after the Venusian simulator exposure test with about 30.8% decrease which satisfied the minimum requirement for the MIL-STD-885 method. The overall wire-bond daisy-chain resistance change was 0.47% after the Venus simulator test, indicating a promising wire bond integrity. A titanium package was fabricated to house the ceramic packaging substrate and a two-level metalized feedthrough was fabricated to provide electrical interfaces to the package. A double-layer ceramic electronic packaging technology that survives the Venusian surface condition was developed using a ceramic interlayer dielectric with gold conductors. A 60-µm ceramic interlayer dielectric served as the insulator between the top and bottom gold conductors on high-purity ceramic substrates. Test devices with AuPtPd metallization were attached to the top gold pads using a thick-film gold… Advisors/Committee Members: Hameed A. Naseem, Silke Alexandra Spiesshoefer, David Huitink.

Subjects/Keywords: Ceramic synthesis; Die-attach process; Electronic Packaging; High-temperature; Integrated Electronics; Wire bonding; Ceramic Materials; Electrical and Electronics; Electronic Devices and Semiconductor Manufacturing

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Nasiri, A. (2020). Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. (Doctoral Dissertation). University of Arkansas. Retrieved from https://scholarworks.uark.edu/etd/3755

Chicago Manual of Style (16^th Edition):

Nasiri, Ardalan. “Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.” 2020. Doctoral Dissertation, University of Arkansas. Accessed March 04, 2021. https://scholarworks.uark.edu/etd/3755.

MLA Handbook (7^th Edition):

Nasiri, Ardalan. “Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging.” 2020. Web. 04 Mar 2021.

Vancouver:

Nasiri A. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. [Internet] [Doctoral dissertation]. University of Arkansas; 2020. [cited 2021 Mar 04]. Available from: https://scholarworks.uark.edu/etd/3755.

Council of Science Editors:

Nasiri A. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging. [Doctoral Dissertation]. University of Arkansas; 2020. Available from: https://scholarworks.uark.edu/etd/3755

19. Gomes, Jimy. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.

Degree: 2015, University of Waterloo

URL: http://hdl.handle.net/10012/9740

► In the past ten years, the increasing price of gold has motivated the wire bonding industry to look for alternative bonding wire materials in the… (more)

▼ In the past ten years, the increasing price of gold has motivated the wire bonding industry to look for alternative bonding wire materials in the field of microelectronics packaging. A new candidate wire to replace gold is palladium coated silver wire. In this thesis, the effect of the two specific process parameters “bond stress” and “process temperature” on the ball bonds made with the new candidate wire are investigated. Using 20 μm diameter wire and various level-combinations of these process parameter, ball bonds are produced according to a special accelerated optimization method to result in a target diameter of 46 ± 0.5 μm and target height of 16 ± 0.5 μm. Three different levels are used for each of the specific process parameters. After pre-selecting a few process parameters, the accelerated method determines the levels for the process parameters “impact force” and “electric flame-off current” with a 2×2 design of experiments. Then, the ultrasound parameter is maximized up to a level where a pre-selected ultrasonic deformation occurs to the bonds, maintaining the target bond diameter and height. The bond quality is measured by measuring the shear strength of the bonds. The results show that • the bond geometry is not affected by the bond stress, • the optimized specific process parameters vary by less than ~0.5 % when bond stress values are varied from 60 to 100 MPa, • the variations in optimized parameters are larger than ~3.0 % when the BT is changed from 100 to 200 ºC, • ball bonds achieve acceptable shear strength (> 120 MPa) when the values for both, bond stress and bond temperature, are high, • ultrasound level and shear stress interact, the higher shear stress the lower the ultrasound level required. An average shear strength of ~120 MPa is achieved with 11.4 % ultrasound, 100 MPa bond stress, and 200 ºC bond process temperature. In summary, a robust methodology is presented in this thesis to efficiently optimize the ball bonding process as demonstrated with the new candidate wire has a bondability similar to that of gold wire with only minor adjustment in the bonding process needed.

Subjects/Keywords: Thermosonic wire bonding; Palladium coated silver wire; Bond stress; Process temperature

…substrate terminals. The vast majority of ICs are interconnected using the wire bonding process… …wire bonding process. High electrical conductivity, low hardness, high malleability, and… …Cu wire bonding to prevent in-process oxidation which is a recurring cost added to the… …bonding process. The drawbacks of Cu wire makes Ag a more favorable alternative to Au since the… …detailed study on the PCS wire bonding process has not been reported. More research is necessary…

11 more images…

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APA (6^th Edition):

Gomes, J. (2015). A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/9740

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/9740.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Gomes, Jimy. “A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization.” 2015. Web. 04 Mar 2021.

Vancouver:

Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Internet] [Thesis]. University of Waterloo; 2015. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/9740.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gomes J. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization. [Thesis]. University of Waterloo; 2015. Available from: http://hdl.handle.net/10012/9740

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Brno University of Technology

20. Houserek, Jiří. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.

Degree: 2018, Brno University of Technology

URL: http://hdl.handle.net/11012/27100

► This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts.… (more)

Subjects/Keywords: Wire-bonding; simulace; kontaktování čipů; Ansys; Wire-bounding; simulations; chips contacts; Ansys

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APA (6^th Edition):

Houserek, J. (2018). Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/27100

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.” 2018. Thesis, Brno University of Technology. Accessed March 04, 2021. http://hdl.handle.net/11012/27100.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Houserek, Jiří. “Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection.” 2018. Web. 04 Mar 2021.

Vancouver:

Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/11012/27100.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Houserek J. Modelování technologických kroků kontaktování čipu mikrodrátkem: Modeling of wirebonding technological steps for chip connection. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/27100

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

INP Toulouse

21. Sanfins, William. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.

Degree: Docteur es, Génie Électrique, 2017, INP Toulouse

URL: http://www.theses.fr/2017INPT0066

► Dans les modules de puissance à connexion filaire de type wire-bonding (WB), les forts courants commutés (jusqu’à 200A pour une puce de 10x10mm²) imposent de… (more)

▼ Dans les modules de puissance à connexion filaire de type wire-bonding (WB), les forts courants commutés (jusqu’à 200A pour une puce de 10x10mm²) imposent de faibles résistances et inductances d’interconnexion pour réduire la chute de tension et les surtensions. Pour cette raison, les concepteurs multiplient les fils de bonding de grand diamètre (jusqu’à 500μm) en parallèle. De plus, quand la surface de puce le permet, les WB sont soudés à au moins deux endroits différents pour améliorer la distribution du courant. A la différence d’un assemblage standard de type WB, dans un module de puissance de type Direct-Lead-Bonding (DLB), la puce et la diode sont généralement brasées d’un côté, via la technique du flip-chip, sur le dissipateur intégré. L’autre face est brasée ou frittée directement sur une broche (ou clip) interne large pour former la maille électrique grâce à une brasure à base d'étain, d’argent et de cuivre (SAC ou Sn-Ag-Cu), très épaisse pour éviter le claquage broche-terminaison de puce. Par conséquent, le DLB peut offrir une surface de contact plus performante sur les plans électrique et thermique que le WB, réduisant ainsi la résistance de contact d’environ 50% selon la bibliographie (d’un facteur dix selon nos simulations électromagnétiques), améliorant la distribution du courant dans les puces et homogénéisant la température au sein du composant. De plus, l’inductance parasite interne peut être atténuée de 57% comparé au WB selon la littérature. Si l’on aborde la dimension sécuritaire, la tenue en surintensité ou I²T d’un module de puissance WB rempli de gel de silicone est faible et procure un effet fusible naturel bien qu’imparfait (mode de défaut circuit-ouvert). Les fils de bonding subissent un phénomène de soulèvement même si leur design n’a pas été pensé dans ce sens. En remplaçant le gel par de la résine époxy, ce comportement se dégrade pour donner un mode de défaut intermédiaire dû à la limitation en température de la résine. A l’inverse, le DLB devrait montrer un très fort I²T et donc, un mode de défaut se rapprochant du court-circuit. Ces travaux proposent une approche innovante sur le thème du design des topologies de conversion sécurisées à tolérance de panne : pourquoi ne pas construire une topologie autour du mode de défaillance intrinsèque d’un module de puissance, au lieu de mettre en place des moyens classiques pour le contrecarrer, i.e. essayer d'isoler systématiquement le défaut avec des fusibles ? Le module de puissance DLB était le candidat idéal pour mettre à l’œuvre notre philosophie. Dans un premier temps, nous avons cherché à comparer les modes de défaillance des deux technologies, WB et DLB, grâce à des essais destructifs d’énergies maîtrisés. Les résistances de défaut, énergies critiques et I²T ont été mesurées sur un banc dédié, de même que des analyses d'endommagements des zones de défaillance ont été réalisées au sein du CNES-THALES Lab de Toulouse par une méthode non intrusive de type Lock-In-Thermography (LIT). Il a été montré que la technologie DLB pouvait présenter… Advisors/Committee Members: Richardeau, Frédéric (thesis director), Risaletto, Damien (thesis director).

Subjects/Keywords: Fail-to-short; Clip; Wire-bonding; Tolérant à la panne; Sécurisé; Fail-to-short; Clip; Wire-bonding; Fault-tolerant; Safety

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Sanfins, W. (2017). Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. (Doctoral Dissertation). INP Toulouse. Retrieved from http://www.theses.fr/2017INPT0066

Chicago Manual of Style (16^th Edition):

Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Doctoral Dissertation, INP Toulouse. Accessed March 04, 2021. http://www.theses.fr/2017INPT0066.

MLA Handbook (7^th Edition):

Sanfins, William. “Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application.” 2017. Web. 04 Mar 2021.

Vancouver:

Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Internet] [Doctoral dissertation]. INP Toulouse; 2017. [cited 2021 Mar 04]. Available from: http://www.theses.fr/2017INPT0066.

Council of Science Editors:

Sanfins W. Caractérisation et modélisation de modules de puissance « fail-to-short » pour convertisseurs sécurisés à tolérance de pannes : application véhicule électrique hybride : Characterisation and modelling of fail-to-short power modules in fault-tolerant converters : electric hybrid vehicle application. [Doctoral Dissertation]. INP Toulouse; 2017. Available from: http://www.theses.fr/2017INPT0066

University of California – Irvine

22. Wu, Jiaqi. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.

Degree: Engineering, 2018, University of California – Irvine

URL: http://www.escholarship.org/uc/item/6595h5br

► Despite the superior physical properties of silver (Ag) and its alloys such as high electrical and thermal conductivities and high ductility, their applications in electronics… (more)

▼ Despite the superior physical properties of silver (Ag) and its alloys such as high electrical and thermal conductivities and high ductility, their applications in electronics have been quite limited due to corrosion and tarnishing concerns. To expand their applications in electronic packaging, developing new materials and processes and investigating new materials properties are essential. This PhD research aims to design and grow novel Ag alloys and address the intermetallic compound (IMC) issues associated with Ag wire bonds, followed by producing Ag and alloys in various forms for solid state bonding processes valuable for high temperature electronics.Firstly, the growth of homogeneous Ag solid solution phase with zinc (Zn) is conducted at two different compositions and their mechanical properties are evaluated by tensile test. According to the experimental results, Ag solid solution phase with Zn at either composition show tempered yield strength, high tensile strength and large uniform strain compared to those of Ag. Moreover, the tarnish resistance is improved with the alloying of zinc. Secondly, Ag3Al has been reported to be the weakest part in the Ag-Al wire bonds due to its low toughness and low corrosion resistance. A method to suppress Ag3Al through alloying indium (In) into Ag is devised. The working mechanism is studied through transmission electron microscopy (TEM) and thermodynamic modeling. Reaction kinetics and evolution of defects are further discussed. A new approach for die attachment through solid-state bonding using fine-grained Ag foils is developed. The bonding is conducted at 300 ℃, assisted by low pressure. The strength of the joints far exceeds the requirement specified in military standards. No degradation can be observed after aging test. This approach avoids the oxidation issue on bonding interfaces in present sintered-silver technique. Lastly, an Ag-Ag direct bonding process is invented using in-situ decomposition of silver oxide. The bonding is performed at 210 ℃ under 0.1 torr vacuum and assisted by only 1.4 MPa pressure. Encouragingly, the resulting Ag-Ag joints are strong with only sparse voids in nano-scale. Cross-sectional study shows that the bonding is formed by grain growth across the original interface. No residual oxygen is trapped. This new process is a breakthrough in Ag-Ag bonding at low temperature and low pressure that produce pure Ag joints. Its applications are wide open.The Ag solid solution phases investigated here show great potential not only in wire bonding and other mechanical component in electronic devices but also photonic applications. The novel bonding processes achieved in this study should be highly valuable for applications in advanced electronic and photonic packages where performance and reliability are highly preferred.

Subjects/Keywords: Materials Science; die attachment; direct bonding; electronic packaging; reliability; Silver; wire bonding

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APA (6^th Edition):

Wu, J. (2018). Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. (Thesis). University of California – Irvine. Retrieved from http://www.escholarship.org/uc/item/6595h5br

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Thesis, University of California – Irvine. Accessed March 04, 2021. http://www.escholarship.org/uc/item/6595h5br.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wu, Jiaqi. “Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics.” 2018. Web. 04 Mar 2021.

Vancouver:

Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Internet] [Thesis]. University of California – Irvine; 2018. [cited 2021 Mar 04]. Available from: http://www.escholarship.org/uc/item/6595h5br.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wu J. Investigation of new silver alloys and invention of Ag foil bonding and Ag-Ag direct bonding through in-situ reduction of surface oxides for high power and high temperature electronics. [Thesis]. University of California – Irvine; 2018. Available from: http://www.escholarship.org/uc/item/6595h5br

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

23. Letowski, Bastien. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.

Degree: Docteur es, Génie électrique, 2016, Université Grenoble Alpes (ComUE)

URL: http://www.theses.fr/2016GREAT114

►

Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la… (more)

▼

Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la fabrication et le packaging des semiconducteurs. Aujourd’hui, le packaging 3D apporte des réponses concrètes à ces problématiques en regard de l’approche standard (2D). Malgré les excellentes propriétés de ces modules 3D au niveau de la réduction de la signature CEM et du refroidissement, la réalisation, notamment les interconnexions, est complexe. Une approche globale prenant en compte un maximum de paramètres a été développée dans cette thèse. L’ensemble de ce travail s’appuie sur deux propositions que sont la conception couplée entre les composants et le packaging ainsi qu’une fabrication collective à l’échelle de la plaque des modules de puissance. Elles se combinent par la mise en place d’une filière d’étapes technologiques appuyée sur une boite à outils de procédés génériques. Cette approche est concrétisée par la réalisation d’un module de puissance 3D performant et robuste adressant des convertisseurs polyphasés avec des gains aussi bien sur les procédés de fabrication que le module lui-même ainsi que sur le système final.Ce travail offre une nouvelle vision alternative pour l’élaboration des modules électroniques de puissance. Il ouvre également des opportunités pour une fabrication et un packaging plus performants pour les nouveaux semiconducteurs grand gap.

Performances, efficiency and reliability are among the main issues in power electronics. Nowadays, 3D packaging solutions increase standard planar module (2D) performances, for instance EMC. However such integrations are based on complex manufacturing, especially concerning interconnections. Improvements require global and advanced solutions. This work depends on two proposed concepts: a coupled design of the power devices and their associated package and a collective wafer-level process fabrication. A technological offer is proposed based on an innovative power packaging toolbox. Our approach is materialized by the fabrication of a 3D polyphase power module which proved to be more efficient and reliable. The benefits are more precise process manufacturing, lower EMI generation and lower inductive interconnections.As a matter of fact, this work offers a new and advanced technological integration for future power electronics modules, perfectly suitable for the wide bandgap semiconductors.

Advisors/Committee Members: Crebier, Jean-Christophe (thesis director).

Subjects/Keywords: Electronique de puissance; Packaging 3D; Conception couplé composant/packaging; Collage direct métal-Métal; Fabrication collective; Packaging à l’échelle de la plaque; Power Electronics; 3D packaging; Wire-Bond-Less module; Wafer-Level packaging; Direct copper bonding; Coupled design device/package; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Letowski, B. (2016). Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2016GREAT114

Chicago Manual of Style (16^th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed March 04, 2021. http://www.theses.fr/2016GREAT114.

MLA Handbook (7^th Edition):

Letowski, Bastien. “Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules.” 2016. Web. 04 Mar 2021.

Vancouver:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2016. [cited 2021 Mar 04]. Available from: http://www.theses.fr/2016GREAT114.

Council of Science Editors:

Letowski B. Intégration technologique alternative pour l'élaboration de modules électroniques de puissance : Advanced technological integration for power electronics modules. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2016. Available from: http://www.theses.fr/2016GREAT114

NSYSU

24. Huang, Han-Peng. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.

Degree: Master, Electrical Engineering, 2008, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647

► To improve the wire bondability, interfacial adhesion and popcorn cracking resistance in the packaging processing of IC and MEMS chips, this thesis utilized oxygen and… (more)

Subjects/Keywords: Pull Strength; Wire Bonding; Au/Al/Pt pads; Plasma Cleaning

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APA (6^th Edition):

Huang, H. (2008). A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Huang, Han-Peng. “A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads.” 2008. Web. 04 Mar 2021.

Vancouver:

Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Internet] [Thesis]. NSYSU; 2008. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Huang H. A Study of the Influence of Plasma Cleaning Process on Mechanical and Electrical Characteristics of Gold, Aluminum and Platinum Pads. [Thesis]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0910108-125647

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

25. Wang, Jyun-hao. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920

► In the IC packaging industry, due to the highly maturity and reliability of wire bonding technology, it has been the most widely used method for… (more)

Subjects/Keywords: Molecular Dynamics; Cu-Al; Wire bonding; Intermetallic compound; Mechanical properties

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APA (6^th Edition):

Wang, J. (2014). Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Thesis, NSYSU. Accessed March 04, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang, Jyun-hao. “Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation.” 2014. Web. 04 Mar 2021.

Vancouver:

Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 04]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Investigation of mechanical properties of Cu-Al intermetallic compound in the wire bonding process of IC packaging by molecular dynamics simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714114-104920

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Hong Kong University of Science and Technology

26. Chan, Yu Hin. Optimization of metallization and process variables in low temperature wire bonding technology.

Degree: 2003, Hong Kong University of Science and Technology

URL: http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html

► Wire bonding is a widely used interconnection technology in electronic packaging. Due to the advantages of fast bonding process, high productivity, good electrical and thermal… (more)

Subjects/Keywords: Wire bonding (Electronic packaging) ; Metallizing

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APA (6^th Edition):

Chan, Y. H. (2003). Optimization of metallization and process variables in low temperature wire bonding technology. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chan, Yu Hin. “Optimization of metallization and process variables in low temperature wire bonding technology.” 2003. Web. 04 Mar 2021.

Vancouver:

Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2003. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chan YH. Optimization of metallization and process variables in low temperature wire bonding technology. [Thesis]. Hong Kong University of Science and Technology; 2003. Available from: http://repository.ust.hk/ir/Record/1783.1-5257 ; https://doi.org/10.14711/thesis-b805047 ; http://repository.ust.hk/ir/bitstream/1783.1-5257/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Hong Kong University of Science and Technology

27. Liu, Dong. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.

Degree: 2014, Hong Kong University of Science and Technology

URL: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

► Wire bonding is one of the dominant microelectronic connection technologies, which provides electrical connection between integrated circuits and external leads. A solid free air ball… (more)

Subjects/Keywords: Wire bonding (Electronic packaging) ; Microelectronic packaging ; Interconnects (Integrated circuit technology)

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Liu, D. (2014). A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. (Thesis). Hong Kong University of Science and Technology. Retrieved from http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Thesis, Hong Kong University of Science and Technology. Accessed March 04, 2021. http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Liu, Dong. “A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections.” 2014. Web. 04 Mar 2021.

Vancouver:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Internet] [Thesis]. Hong Kong University of Science and Technology; 2014. [cited 2021 Mar 04]. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu D. A study on the relationship of processing conditions, microstructure and properties of copper wirebond in microelectronic connections. [Thesis]. Hong Kong University of Science and Technology; 2014. Available from: http://repository.ust.hk/ir/Record/1783.1-87490 ; https://doi.org/10.14711/thesis-b1333922 ; http://repository.ust.hk/ir/bitstream/1783.1-87490/1/th_redirect.html

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Waterloo

28. McCracken, Michael. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.

Degree: 2010, University of Waterloo

URL: http://hdl.handle.net/10012/5132

► Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, and removing samples at intervals to assess… (more)

▼ Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, and removing samples at intervals to assess bond shear strength and characterize the bond cross sections. In this way, the degradation of the bond can be monitored at discrete time intervals, and it is determined whether the bond will be reliable during the specific service life. This process can be labour and time intensive. An alternative method is reported using an existing test chip that allows for contact resistance measurements and provides signals from piezoresistive integrated CMOS microsensors located around test bond pads. The sensors are sensitive to radial compressive or tensile stresses occurring on the bond pad due to intermetallic formation, oxidation, and crack formation at the bond interface. Two sets of identical test chips are bonded with optimized Au ball bonds and aged for 2000 h at 175 ºC. One set is connected to equipment which monitors signals from the stress sensors and the contact resistance of the bonds. The other set is destructively tested by shear tests and cross sectioning. It is found that the stress sensors are capable of indicating which stage of bond aging is experienced by relating the signal to the relative density of the intermetallic compounds (IMCs) and oxide which form during aging. This research offers a valuable new method for accelerating bond process development. By using the sensors to determine the stage of aging experienced and the magnitude of changes happening to the bond, the initial bond quality and bond reliability can be roughly characterized. A useful application is in comparing large samples of bonds made under varying conditions, and determining relative reliabilities of the bonds. A small sample size is required, as the sensors allow for complete continuous aging histories of individual bonds, which was not previously possible. A new test chip is designed for use in future studies which allows for contact resistance measurement, and provides stress signals for up to 55 bonds. A multiplexer integrated on the chip allows for measurements from one specified bond pad at a time. The chip is also equipped with x and yforce measurements which can be used to monitor bond process, and a resistive temperature detector for temperature measurement. A miniaturized bond aging system is designed to facilitate future works where chips are subject to high temperature storage. A heating element fits over the cavity of a microelectronic package containing the test chip, and allows for precise temperature control, while using less power than a conventional oven, and maintaining a low temperature at electrical connections to the package.

Subjects/Keywords: Reliability; Sensor; Wire; Bonding

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

McCracken, M. (2010). Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. (Thesis). University of Waterloo. Retrieved from http://hdl.handle.net/10012/5132

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Thesis, University of Waterloo. Accessed March 04, 2021. http://hdl.handle.net/10012/5132.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

McCracken, Michael. “Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors.” 2010. Web. 04 Mar 2021.

Vancouver:

McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Internet] [Thesis]. University of Waterloo; 2010. [cited 2021 Mar 04]. Available from: http://hdl.handle.net/10012/5132.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

McCracken M. Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors. [Thesis]. University of Waterloo; 2010. Available from: http://hdl.handle.net/10012/5132

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

University of Cincinnati

29. XU, PENG. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.

Degree: MS, Engineering : Electrical Engineering, 2003, University of Cincinnati

URL: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754

► In this thesis, design, processing and characterization of a hybrid X-band power amplifier is presented for a vertically interconnected multilayer monolithic microwave (M3) module for… (more)

Subjects/Keywords: wet bulk silicon etching; PI2611 polyimide multilayer process; MMIC circuit; wire bonding; on water microwave measurement

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

XU, P. (2003). HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. (Masters Thesis). University of Cincinnati. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754

Chicago Manual of Style (16^th Edition):

XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Masters Thesis, University of Cincinnati. Accessed March 04, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.

MLA Handbook (7^th Edition):

XU, PENG. “HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.” 2003. Web. 04 Mar 2021.

Vancouver:

XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Internet] [Masters thesis]. University of Cincinnati; 2003. [cited 2021 Mar 04]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.

Council of Science Editors:

XU P. HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE. [Masters Thesis]. University of Cincinnati; 2003. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754

Addis Ababa University

30. Ashreka, Yenus. Development of Material for Train Overhead Contact Wire .

Degree: 2015, Addis Ababa University

URL: http://etd.aau.edu.et/dspace/handle/123456789/7071

► This paper presents the development of material for train overhead contact wire. In view of the current Addis Ababa Light Rail Train overhead contact wire… (more)

▼ This paper presents the development of material for train overhead contact wire. In view of the current Addis Ababa Light Rail Train overhead contact wire with high material cost and low wear resistance ; the copper alloys which has better mechanical wear and corrosion resistance with moderately low cost, are developed. The mechanical properties and electrical conductivities of the prepared copper alloys were investigated by using lab testing machines. Wear tests were conducted by a pin- on-disc Tribometer which simulated the tribological conditions of sliding contact strip on overhead wires in the railway system. The copper-alloys in the form of cylindrical pins were forced to slide against a stainless steel disc with a sliding velocity of 80 km/h at room temperature under unlubricated condition and normal load up to 11N without electric current. In addition to this, the electrical conductivity of the copper alloys were investigated by multimeter . Among the alloys investigated, CuNiCr, which possesses quite good electrical conductivity and relatively high wear resistance (2 times that of Cu Ag) .Also in order to simulate costal and acidic environment, corrosion test is conducted in acid rain, salt solution and in distilled water. The corrosion from the specimens was studied by weight loss measured by analytical balance among the copper alloys Cu Ag is highly corroded and worn surfaces of the copper alloys pin were analyzed by optical microscope from these parallel and continuous scratches in the direction of motion observed. From this experimental investigation the dominated wear mechanisms are abrasive and adhesive wear in mechanical sliding frictional process. Finally the cost analysis of copper alloys per each pin performed and Cu- Ni -Cr takes less cost from others. By considering wear resistance, corrosion resistance, electrical conductivity and cost, Cu Ni Cr is appropriate for Addis Ababa light rail train and future national railway overhead line contact wire. Advisors/Committee Members: Dr.Daneil Tilahun (advisor).

Subjects/Keywords: Train Overhead Contact Wire; copper alloys; Addis Ababa light rail train

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Ashreka, Y. (2015). Development of Material for Train Overhead Contact Wire . (Thesis). Addis Ababa University. Retrieved from http://etd.aau.edu.et/dspace/handle/123456789/7071

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Thesis, Addis Ababa University. Accessed March 04, 2021. http://etd.aau.edu.et/dspace/handle/123456789/7071.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Ashreka, Yenus. “Development of Material for Train Overhead Contact Wire .” 2015. Web. 04 Mar 2021.

Vancouver:

Ashreka Y. Development of Material for Train Overhead Contact Wire . [Internet] [Thesis]. Addis Ababa University; 2015. [cited 2021 Mar 04]. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Ashreka Y. Development of Material for Train Overhead Contact Wire . [Thesis]. Addis Ababa University; 2015. Available from: http://etd.aau.edu.et/dspace/handle/123456789/7071

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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Open Access Theses and Dissertations