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NSYSU

1. Lien, Sheng-Huai. Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

The Composite electro-plating in-process sharpening (CEPIS) method is employed to sharpen the grinder during the grinding process. However, the coating thickness using CEPIS method is always increasing. To overcome this disadvantage, the pluse reverse current with off time is applied to this method to grind the SiC and the diamond film, and it is called the Composite electro-plating and electrolyzing in-process sharpening (CEPELIS) method. Experiment results show that, when the reverse-pluse time increases, the growth rate of the coating film in the grinder becomes slower and looser and the roughness of the diamond fi lm is decreased slowly at the current density of 4.5 ASD. A two-stage CEPELIS method at reverse-pluse time of 1500 μs is used to grind the CVD diamond film. In this first stage, a grit size of 10 μm is used to conduct CEPELIS grinding for 120 min, and then the grit size of 3 μm for 120 min. Finally, a mirror-like surface on the diamond film with an surface roughness of 0.05 μm is obtained, and the growth rate of the coating film is slightly increased. On the other hand, the coating thickness can be maintained constant in grinding SiC process at highter operating range. In addition, a mirror-like surface of SiC with an average surface roughness of 0.06 μm can be obtained. Advisors/Committee Members: Rong-Tsong Lee (committee member), Y.R. Jeng (chair), Yuang-Cherng Chiou (committee member), Jen-Fin Lin (chair).

Subjects/Keywords: CEPIS; CVD diamond film; Ultra-precision machining; Pluse current; SiC

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lien, S. (2013). Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0730113-150756

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lien, Sheng-Huai. “Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods.” 2013. Thesis, NSYSU. Accessed March 23, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0730113-150756.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lien, Sheng-Huai. “Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods.” 2013. Web. 23 Mar 2019.

Vancouver:

Lien S. Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods. [Internet] [Thesis]. NSYSU; 2013. [cited 2019 Mar 23]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0730113-150756.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lien S. Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0730113-150756

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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