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You searched for subject:(3D integration). Showing records 1 – 30 of 121 total matches.

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1. Fadloun, Sabrina. Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration.

Degree: Docteur es, Matériaux, Mécanique, Génie civil, Electrochimie, 2019, Université Grenoble Alpes (ComUE)

Les innovations issues du monde du semiconducteur évoluent vers de multiples applications et sont présentes dans de nombreux secteurs industriels, le médical, ou les biotechnologies.… (more)

Subjects/Keywords: Integration 3D; Cuivre; Mocvd; Copper; Mocvd; 3D Integration; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Fadloun, S. (2019). Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2019GREAI075

Chicago Manual of Style (16th Edition):

Fadloun, Sabrina. “Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration.” 2019. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2019GREAI075.

MLA Handbook (7th Edition):

Fadloun, Sabrina. “Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration.” 2019. Web. 17 Apr 2021.

Vancouver:

Fadloun S. Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2019. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2019GREAI075.

Council of Science Editors:

Fadloun S. Etude d'un procédé de dépôt de cuivre par MOCVD pour la réalisation de vias traversants à fort facteur de forme pour l'intégration 3D : Copper deposition by MOCVD for high form factor through silicon vias for 3D integration. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2019. Available from: http://www.theses.fr/2019GREAI075

2. Piccolboni, Giuseppe. Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application.

Degree: Docteur es, Nanoélectronique et nanotechnologie, 2016, Université Grenoble Alpes (ComUE)

 Le but de cette thèse était de caractériser et d’aider au développement des premières mémoires résistives verticales (VRRAM) fabriquées au LETI. Parmi les mémoires émergentes,… (more)

Subjects/Keywords: Memoires; Resistives; Integration; 3d; Memories; Resistive; Integration; 3d; 620

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APA (6th Edition):

Piccolboni, G. (2016). Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2016GREAT062

Chicago Manual of Style (16th Edition):

Piccolboni, Giuseppe. “Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application.” 2016. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2016GREAT062.

MLA Handbook (7th Edition):

Piccolboni, Giuseppe. “Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application.” 2016. Web. 17 Apr 2021.

Vancouver:

Piccolboni G. Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2016. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2016GREAT062.

Council of Science Editors:

Piccolboni G. Etude et intégration de mémoires résistives 3D pour application haute densité : Study and integration of 3D resistive memories for high density application. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2016. Available from: http://www.theses.fr/2016GREAT062


NSYSU

3. Huang, Tzu-Ming. SoC Integration and Verification of a 3D Graphics SoC.

Degree: Master, Computer Science and Engineering, 2011, NSYSU

 While consumer demand for electronic equipment and more mature systems integration capabilities, it makes the system complexity of chip design increasing significantly. Also accompany an… (more)

Subjects/Keywords: Verification; Bus Bridge; SoC; 3D Graphics; Integration

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APA (6th Edition):

Huang, T. (2011). SoC Integration and Verification of a 3D Graphics SoC. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726111-112303

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Huang, Tzu-Ming. “SoC Integration and Verification of a 3D Graphics SoC.” 2011. Thesis, NSYSU. Accessed April 17, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726111-112303.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Huang, Tzu-Ming. “SoC Integration and Verification of a 3D Graphics SoC.” 2011. Web. 17 Apr 2021.

Vancouver:

Huang T. SoC Integration and Verification of a 3D Graphics SoC. [Internet] [Thesis]. NSYSU; 2011. [cited 2021 Apr 17]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726111-112303.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Huang T. SoC Integration and Verification of a 3D Graphics SoC. [Thesis]. NSYSU; 2011. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726111-112303

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Université de Grenoble

4. Bertheau, Julien. Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2014, Université de Grenoble

Les objectifs technologiques de l'industrie de la microélectronique sont largement dictés par la loi de Moore qui vise une réduction permanente de la taille des… (more)

Subjects/Keywords: Interconnexion; Intermetallique; Integration 3D; Pillier de cuivre; Interconnection; Intermetallic; 3D integration; Copper pillars; 620

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APA (6th Edition):

Bertheau, J. (2014). Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2014GRENI043

Chicago Manual of Style (16th Edition):

Bertheau, Julien. “Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application.” 2014. Doctoral Dissertation, Université de Grenoble. Accessed April 17, 2021. http://www.theses.fr/2014GRENI043.

MLA Handbook (7th Edition):

Bertheau, Julien. “Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application.” 2014. Web. 17 Apr 2021.

Vancouver:

Bertheau J. Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application. [Internet] [Doctoral dissertation]. Université de Grenoble; 2014. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2014GRENI043.

Council of Science Editors:

Bertheau J. Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs : Study and characterization of intermetallics interconnections as CuSn for 3D stacking components application. [Doctoral Dissertation]. Université de Grenoble; 2014. Available from: http://www.theses.fr/2014GRENI043


Virginia Tech

5. Ralston, Parrish Elaine. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.

Degree: PhD, Electrical Engineering, 2013, Virginia Tech

 Flip chip interconnections have superior performance for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in… (more)

Subjects/Keywords: liquid metal; electronics packaging; flip chip; 3D integration; MMIC integration

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APA (6th Edition):

Ralston, P. E. (2013). Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/50641

Chicago Manual of Style (16th Edition):

Ralston, Parrish Elaine. “Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.” 2013. Doctoral Dissertation, Virginia Tech. Accessed April 17, 2021. http://hdl.handle.net/10919/50641.

MLA Handbook (7th Edition):

Ralston, Parrish Elaine. “Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies.” 2013. Web. 17 Apr 2021.

Vancouver:

Ralston PE. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. [Internet] [Doctoral dissertation]. Virginia Tech; 2013. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/10919/50641.

Council of Science Editors:

Ralston PE. Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies. [Doctoral Dissertation]. Virginia Tech; 2013. Available from: http://hdl.handle.net/10919/50641


Université de Grenoble

6. Tachi, Kiichi. Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures.

Degree: Docteur es, Micro et nanoélectronique, 2011, Université de Grenoble

Il a été démontré que la structure gate-all-around en nanofils de silicium peut radicalement supprimer les effets de canaux courts. De plus, l'introduction d'espaceurs internes… (more)

Subjects/Keywords: Transistors CMOS; Transistor nanofils; Mobilité; Intégration 3D; CMOS transistors; Nanowire transistors; Mobility; 3D integration; 620

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APA (6th Edition):

Tachi, K. (2011). Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2011GRENT084

Chicago Manual of Style (16th Edition):

Tachi, Kiichi. “Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures.” 2011. Doctoral Dissertation, Université de Grenoble. Accessed April 17, 2021. http://www.theses.fr/2011GRENT084.

MLA Handbook (7th Edition):

Tachi, Kiichi. “Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures.” 2011. Web. 17 Apr 2021.

Vancouver:

Tachi K. Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures. [Internet] [Doctoral dissertation]. Université de Grenoble; 2011. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2011GRENT084.

Council of Science Editors:

Tachi K. Etude physique et technologique d'architectures de transistors MOS à nanofils : Technological and physical study of etched nanowire transistors architectures. [Doctoral Dissertation]. Université de Grenoble; 2011. Available from: http://www.theses.fr/2011GRENT084

7. Merhej, Mouawad. Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips.

Degree: Docteur es, Nano electronique et nano technologies, 2018, Université Grenoble Alpes (ComUE); Institut interdisciplinaire d’innovation technologique – 3IT (Sherbrooke, Canada)

Les travaux de cette thèse portent sur l’idée de démontrer que la croissance des nanofils entre deux électrodes prédéfinies et plus particulièrement la croissance horizontale… (more)

Subjects/Keywords: Transistors; Intégration 3D; Nanofils; Diélectrophorèse; Nanodamscène; Transistors; 3D integration; Nanowires; Dielectrophoresis; Nanodamscene; 620

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APA (6th Edition):

Merhej, M. (2018). Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips. (Doctoral Dissertation). Université Grenoble Alpes (ComUE); Institut interdisciplinaire d’innovation technologique – 3IT (Sherbrooke, Canada). Retrieved from http://www.theses.fr/2018GREAT050

Chicago Manual of Style (16th Edition):

Merhej, Mouawad. “Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips.” 2018. Doctoral Dissertation, Université Grenoble Alpes (ComUE); Institut interdisciplinaire d’innovation technologique – 3IT (Sherbrooke, Canada). Accessed April 17, 2021. http://www.theses.fr/2018GREAT050.

MLA Handbook (7th Edition):

Merhej, Mouawad. “Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips.” 2018. Web. 17 Apr 2021.

Vancouver:

Merhej M. Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); Institut interdisciplinaire d’innovation technologique – 3IT (Sherbrooke, Canada); 2018. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2018GREAT050.

Council of Science Editors:

Merhej M. Intégration 3D des transistors à nanofils de silicium-germanium sur puces CMOS : 3D integration transistor silicon-germanium nanowires on CMOS chips. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); Institut interdisciplinaire d’innovation technologique – 3IT (Sherbrooke, Canada); 2018. Available from: http://www.theses.fr/2018GREAT050

8. Lu, Cao-Minh. Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration.

Degree: Docteur es, Nano electronique et nano technologies, 2017, Université Grenoble Alpes (ComUE)

Alors que la miniaturisation des transistors suivant la loi de Moore semble ralentir dû à des limites physique, technologique et économique, il devient essentiel de… (more)

Subjects/Keywords: Cmos; Basse temperature; Intégration 3D séquentielle; Cmos; Ultra-Low temperature; 3D sequential integration; 620

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APA (6th Edition):

Lu, C. (2017). Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2017GREAT109

Chicago Manual of Style (16th Edition):

Lu, Cao-Minh. “Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration.” 2017. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2017GREAT109.

MLA Handbook (7th Edition):

Lu, Cao-Minh. “Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration.” 2017. Web. 17 Apr 2021.

Vancouver:

Lu C. Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2017. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2017GREAT109.

Council of Science Editors:

Lu C. Fabrication de CMOS à basse température pour l'intégration 3D séquentielle : Low thermal budget CMOS processing for 3D Sequential Integration. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2017. Available from: http://www.theses.fr/2017GREAT109


Université de Grenoble

9. Baudin, Floriane. Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2013, Université de Grenoble

Le collage direct consiste en la mise en contact de deux surfaces suffisamment lisses et propres pour créer une adhérence entre-elles, et ce sans apport… (more)

Subjects/Keywords: Intégration 3D; Collage direct; Couches métalliques; 3D integration; Direct bonding; Metal layer; 620

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APA (6th Edition):

Baudin, F. (2013). Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2013GRENI057

Chicago Manual of Style (16th Edition):

Baudin, Floriane. “Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding.” 2013. Doctoral Dissertation, Université de Grenoble. Accessed April 17, 2021. http://www.theses.fr/2013GRENI057.

MLA Handbook (7th Edition):

Baudin, Floriane. “Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding.” 2013. Web. 17 Apr 2021.

Vancouver:

Baudin F. Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding. [Internet] [Doctoral dissertation]. Université de Grenoble; 2013. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2013GRENI057.

Council of Science Editors:

Baudin F. Contribution à l'étude des phénomènes mis en jeu par le collage direct à basse température de couches métalliques et oxydes métalliques : Investigation of the mechanisms involved in room temperature metal and oxides direct bonding. [Doctoral Dissertation]. Université de Grenoble; 2013. Available from: http://www.theses.fr/2013GRENI057

10. Guiller, Olivier. Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer.

Degree: Docteur es, Nanoélectronique et nanotechnologie, 2015, Université Grenoble Alpes (ComUE)

La densité des circuits intégrés n’a pas cessé d’augmenter depuis la découverte du transistor en 1947, à travers la réduction de la taille de leurs… (more)

Subjects/Keywords: Intégration 3D; Découplage; MIM; Interposeur silicium; 3D integration; Decoupling; PDN; MIM; Silicon interposer; 620

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APA (6th Edition):

Guiller, O. (2015). Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2015GREAT021

Chicago Manual of Style (16th Edition):

Guiller, Olivier. “Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer.” 2015. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2015GREAT021.

MLA Handbook (7th Edition):

Guiller, Olivier. “Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer.” 2015. Web. 17 Apr 2021.

Vancouver:

Guiller O. Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2015. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2015GREAT021.

Council of Science Editors:

Guiller O. Intégration de capacités verticales débouchantes au sein d'un interposeur silicium : Through silicon capacitor integration on silicon interposer. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2015. Available from: http://www.theses.fr/2015GREAT021

11. Gondcharton, Paul. Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2015, Université Grenoble Alpes (ComUE)

La microélectronique cherche à produire des composants toujours plus performants. Un axe d'amélioration est l'intégration de plus de fonctionnalités dans un volume toujours plus compact.… (more)

Subjects/Keywords: Collage; Couches minces métalliques; Intégration 3D; Wafer bonding; Metal thin films; 3D Integration; 620

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APA (6th Edition):

Gondcharton, P. (2015). Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2015GREAI048

Chicago Manual of Style (16th Edition):

Gondcharton, Paul. “Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions.” 2015. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2015GREAI048.

MLA Handbook (7th Edition):

Gondcharton, Paul. “Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions.” 2015. Web. 17 Apr 2021.

Vancouver:

Gondcharton P. Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2015. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2015GREAI048.

Council of Science Editors:

Gondcharton P. Intégration du collage direct : couches minces métalliques et évolutions morphologiques : Integration of direct bonding : metal thin films and morphological evolutions. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2015. Available from: http://www.theses.fr/2015GREAI048

12. Ouerghi, Issam. Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration.

Degree: Docteur es, Nanoélectronique et nanotechnologie, 2015, Université Grenoble Alpes (ComUE)

Les progrès technologiques de ces dernières années ont permis une très forte intégration des composants de la microélectronique à l'échelle nanométrique. Face aux limites de… (more)

Subjects/Keywords: Nanofil; Nems; Piezorésistivité; Nanoélectronique; Intégration 3D; Polysilicium; Nanowire; Nems; Piezoresistivity; Nanoelectronics; 3D integration; Polysilicon; 620

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APA (6th Edition):

Ouerghi, I. (2015). Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2015GREAT119

Chicago Manual of Style (16th Edition):

Ouerghi, Issam. “Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration.” 2015. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2015GREAT119.

MLA Handbook (7th Edition):

Ouerghi, Issam. “Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration.” 2015. Web. 17 Apr 2021.

Vancouver:

Ouerghi I. Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2015. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2015GREAT119.

Council of Science Editors:

Ouerghi I. Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense : Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2015. Available from: http://www.theses.fr/2015GREAT119

13. Ayres de sousa, Alexandre. Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond.

Degree: Docteur es, Nano electronique et nano technologies, 2017, Université Grenoble Alpes (ComUE)

L'intégration 3DVLSI, également connue sous le nom d'intégration monolithique ou séquentielle, est présentée et évaluée dans cette thèse comme une alternative à la réduction du… (more)

Subjects/Keywords: Intégration monolithique en 3D; Cps; Variabilité du circuit 3D; Modèle Statistique Unifié pour la 3D; Recommandations pour le Design 3D; Simulations 3D avec SPICE; 3D Monolithic Integration; Ppa; 3D circuit variability; 3D Unified Statistical Model; 3D Design Guidelines; 3D SPICE simulations; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Ayres de sousa, A. (2017). Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2017GREAT065

Chicago Manual of Style (16th Edition):

Ayres de sousa, Alexandre. “Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond.” 2017. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2017GREAT065.

MLA Handbook (7th Edition):

Ayres de sousa, Alexandre. “Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond.” 2017. Web. 17 Apr 2021.

Vancouver:

Ayres de sousa A. Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2017. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2017GREAT065.

Council of Science Editors:

Ayres de sousa A. Intégration monolithique en 3D : étude du potentiel en termes de consommation, performance et surface pour le nœud technologique 14nm et au-delà : 3D Monolithic Integration : performance, Power and Area Evaluation for 14nm and beyond. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2017. Available from: http://www.theses.fr/2017GREAT065


Georgia Tech

14. Jo, Paul K. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.

Degree: PhD, Electrical and Computer Engineering, 2019, Georgia Tech

 This research proposes and demonstrate 1) a new compliant interconnect that can provide cost-effective and simple fabrication process and allow high-degree of freedom in design… (more)

Subjects/Keywords: Compliant interconnect; Heterogeneous integration; Package; 2.5D; 3D; System-level integration; System-in-package

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APA (6th Edition):

Jo, P. K. (2019). Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62301

Chicago Manual of Style (16th Edition):

Jo, Paul K. “Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.” 2019. Doctoral Dissertation, Georgia Tech. Accessed April 17, 2021. http://hdl.handle.net/1853/62301.

MLA Handbook (7th Edition):

Jo, Paul K. “Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.” 2019. Web. 17 Apr 2021.

Vancouver:

Jo PK. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/1853/62301.

Council of Science Editors:

Jo PK. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62301


University of Texas – Austin

15. Yang, Jae-Seok. Nanometer VLSI design-manufacturing interface for large scale integration.

Degree: PhD, Electrical and Computer Engineering, 2011, University of Texas – Austin

 As nanometer Very Large Scale Integration (VLSI) demands more transistor density to fabricate multi-cores and memory blocks in a limited die size, many researches have… (more)

Subjects/Keywords: Double patterning; TSV; 3D integration; 3-D integration; Overlay; Layout decomposition; Lithography

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APA (6th Edition):

Yang, J. (2011). Nanometer VLSI design-manufacturing interface for large scale integration. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2011-05-3070

Chicago Manual of Style (16th Edition):

Yang, Jae-Seok. “Nanometer VLSI design-manufacturing interface for large scale integration.” 2011. Doctoral Dissertation, University of Texas – Austin. Accessed April 17, 2021. http://hdl.handle.net/2152/ETD-UT-2011-05-3070.

MLA Handbook (7th Edition):

Yang, Jae-Seok. “Nanometer VLSI design-manufacturing interface for large scale integration.” 2011. Web. 17 Apr 2021.

Vancouver:

Yang J. Nanometer VLSI design-manufacturing interface for large scale integration. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2011. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/2152/ETD-UT-2011-05-3070.

Council of Science Editors:

Yang J. Nanometer VLSI design-manufacturing interface for large scale integration. [Doctoral Dissertation]. University of Texas – Austin; 2011. Available from: http://hdl.handle.net/2152/ETD-UT-2011-05-3070


Texas A&M University

16. Song, Qian. Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data.

Degree: MS, Geophysics, 2013, Texas A&M University

 Increasing hydrocarbon reserves by finding new resources in frontier areas and improving recovery in the mature fields, to meet the high energy demands, is very… (more)

Subjects/Keywords: heterogeneity; quantification; integration; 3D seismic; well log; core; sandstone; reservoirs

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APA (6th Edition):

Song, Q. (2013). Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data. (Masters Thesis). Texas A&M University. Retrieved from http://hdl.handle.net/1969.1/149473

Chicago Manual of Style (16th Edition):

Song, Qian. “Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data.” 2013. Masters Thesis, Texas A&M University. Accessed April 17, 2021. http://hdl.handle.net/1969.1/149473.

MLA Handbook (7th Edition):

Song, Qian. “Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data.” 2013. Web. 17 Apr 2021.

Vancouver:

Song Q. Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data. [Internet] [Masters thesis]. Texas A&M University; 2013. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/1969.1/149473.

Council of Science Editors:

Song Q. Quantifying the Permeability Heterogeneity of Sandstone Reservoirs in Boonsville Field, Texas by Integrating Core, Well Log and 3D Seismic Data. [Masters Thesis]. Texas A&M University; 2013. Available from: http://hdl.handle.net/1969.1/149473


Princeton University

17. Yu, Ye. Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing .

Degree: PhD, 2019, Princeton University

 More transistors are integrated within the same footprint area as the technology node shrinks to deliver higher performance. However, this is accompanied by higher power… (more)

Subjects/Keywords: Deep learning; FinFET; Heterogeneous architecture; Monolithic 3D integration; Neural network

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APA (6th Edition):

Yu, Y. (2019). Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing . (Doctoral Dissertation). Princeton University. Retrieved from http://arks.princeton.edu/ark:/88435/dsp019g54xm540

Chicago Manual of Style (16th Edition):

Yu, Ye. “Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing .” 2019. Doctoral Dissertation, Princeton University. Accessed April 17, 2021. http://arks.princeton.edu/ark:/88435/dsp019g54xm540.

MLA Handbook (7th Edition):

Yu, Ye. “Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing .” 2019. Web. 17 Apr 2021.

Vancouver:

Yu Y. Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing . [Internet] [Doctoral dissertation]. Princeton University; 2019. [cited 2021 Apr 17]. Available from: http://arks.princeton.edu/ark:/88435/dsp019g54xm540.

Council of Science Editors:

Yu Y. Heterogeneous Monolithic 3D and FinFET Architectures for Energy-efficient Computing . [Doctoral Dissertation]. Princeton University; 2019. Available from: http://arks.princeton.edu/ark:/88435/dsp019g54xm540


Georgia Tech

18. Amir, Mohammad Faisal. Design methodology for 3d-stacked imaging systems with integrated deep learning.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The Internet of Things (IoT) revolution has brought along with it billions of always on, always connected devices and sensors, associated with which are huge… (more)

Subjects/Keywords: Neural networks; Image sensor; Energy harvesting; Deep learning; 3D integration

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APA (6th Edition):

Amir, M. F. (2018). Design methodology for 3d-stacked imaging systems with integrated deep learning. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/61609

Chicago Manual of Style (16th Edition):

Amir, Mohammad Faisal. “Design methodology for 3d-stacked imaging systems with integrated deep learning.” 2018. Doctoral Dissertation, Georgia Tech. Accessed April 17, 2021. http://hdl.handle.net/1853/61609.

MLA Handbook (7th Edition):

Amir, Mohammad Faisal. “Design methodology for 3d-stacked imaging systems with integrated deep learning.” 2018. Web. 17 Apr 2021.

Vancouver:

Amir MF. Design methodology for 3d-stacked imaging systems with integrated deep learning. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/1853/61609.

Council of Science Editors:

Amir MF. Design methodology for 3d-stacked imaging systems with integrated deep learning. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/61609


Georgia Tech

19. Gandhi, Saumya. Modeling, design, fabrication and demonstration of 3D IPAC glass power modules.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 The advent of smart and wearable systems along with their Internet of Things (IoT) applications are driving unparalleled product miniaturization and multifunctional integration with computing,… (more)

Subjects/Keywords: Interposers; Advanced packaging; 3D integration; Advanced passives; High-density capacitors

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APA (6th Edition):

Gandhi, S. (2015). Modeling, design, fabrication and demonstration of 3D IPAC glass power modules. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53906

Chicago Manual of Style (16th Edition):

Gandhi, Saumya. “Modeling, design, fabrication and demonstration of 3D IPAC glass power modules.” 2015. Doctoral Dissertation, Georgia Tech. Accessed April 17, 2021. http://hdl.handle.net/1853/53906.

MLA Handbook (7th Edition):

Gandhi, Saumya. “Modeling, design, fabrication and demonstration of 3D IPAC glass power modules.” 2015. Web. 17 Apr 2021.

Vancouver:

Gandhi S. Modeling, design, fabrication and demonstration of 3D IPAC glass power modules. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/1853/53906.

Council of Science Editors:

Gandhi S. Modeling, design, fabrication and demonstration of 3D IPAC glass power modules. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53906

20. René, Jakob. The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing .

Degree: Chalmers tekniska högskola / Institutionen för teknikens ekonomi och organisation, 2020, Chalmers University of Technology

3D-printer manufacturers, the business model they uses as well as the industry structure are in general severely understudied, especially when comparing to the overall interest… (more)

Subjects/Keywords: Business model innovation; Business model; Vertical integration; 3D-printing industry

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APA (6th Edition):

René, J. (2020). The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing . (Thesis). Chalmers University of Technology. Retrieved from http://hdl.handle.net/20.500.12380/301693

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

René, Jakob. “The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing .” 2020. Thesis, Chalmers University of Technology. Accessed April 17, 2021. http://hdl.handle.net/20.500.12380/301693.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

René, Jakob. “The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing .” 2020. Web. 17 Apr 2021.

Vancouver:

René J. The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing . [Internet] [Thesis]. Chalmers University of Technology; 2020. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/20.500.12380/301693.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

René J. The co-evolution of business models and eco-systems. A case study on the changing landscape within 3D-printing . [Thesis]. Chalmers University of Technology; 2020. Available from: http://hdl.handle.net/20.500.12380/301693

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

21. Li, Boren. Photometric stereo for micro-scale shape reconstruction.

Degree: PhD, Mechanical Engineering, 2017, Virginia Tech

 This dissertation proposes an approach for 3D micro-scale shape reconstruction using photometric stereo (PS) with surface normal integration (SNI). Based on the proposed approach, a… (more)

Subjects/Keywords: 3D Reconstruction; Photometric Stereo; Surface Normal Integration; Image Formation

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APA (6th Edition):

Li, B. (2017). Photometric stereo for micro-scale shape reconstruction. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/75021

Chicago Manual of Style (16th Edition):

Li, Boren. “Photometric stereo for micro-scale shape reconstruction.” 2017. Doctoral Dissertation, Virginia Tech. Accessed April 17, 2021. http://hdl.handle.net/10919/75021.

MLA Handbook (7th Edition):

Li, Boren. “Photometric stereo for micro-scale shape reconstruction.” 2017. Web. 17 Apr 2021.

Vancouver:

Li B. Photometric stereo for micro-scale shape reconstruction. [Internet] [Doctoral dissertation]. Virginia Tech; 2017. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/10919/75021.

Council of Science Editors:

Li B. Photometric stereo for micro-scale shape reconstruction. [Doctoral Dissertation]. Virginia Tech; 2017. Available from: http://hdl.handle.net/10919/75021


Princeton University

22. Bhattacharya, Debajit. Exploring the system hierarchy from devices to on-chip communication .

Degree: PhD, 2016, Princeton University

 FinFETs have replaced planar CMOS at and beyond the 22 nm node because of their superior short-channel behavior. Despite their significant advantages in electrostatics, FinFETs… (more)

Subjects/Keywords: 3D Monolithic integration; Capacitance extraction; FinFET; Network on chip; SRAM; TCAD

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APA (6th Edition):

Bhattacharya, D. (2016). Exploring the system hierarchy from devices to on-chip communication . (Doctoral Dissertation). Princeton University. Retrieved from http://arks.princeton.edu/ark:/88435/dsp01cc08hj107

Chicago Manual of Style (16th Edition):

Bhattacharya, Debajit. “Exploring the system hierarchy from devices to on-chip communication .” 2016. Doctoral Dissertation, Princeton University. Accessed April 17, 2021. http://arks.princeton.edu/ark:/88435/dsp01cc08hj107.

MLA Handbook (7th Edition):

Bhattacharya, Debajit. “Exploring the system hierarchy from devices to on-chip communication .” 2016. Web. 17 Apr 2021.

Vancouver:

Bhattacharya D. Exploring the system hierarchy from devices to on-chip communication . [Internet] [Doctoral dissertation]. Princeton University; 2016. [cited 2021 Apr 17]. Available from: http://arks.princeton.edu/ark:/88435/dsp01cc08hj107.

Council of Science Editors:

Bhattacharya D. Exploring the system hierarchy from devices to on-chip communication . [Doctoral Dissertation]. Princeton University; 2016. Available from: http://arks.princeton.edu/ark:/88435/dsp01cc08hj107


King Abdullah University of Science and Technology

23. Shaikh, Sohail F. Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems.

Degree: Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division, 2020, King Abdullah University of Science and Technology

 Electronic devices today are an integral part of human life thanks to state-of-the- art complementary metal oxide semiconductor (CMOS) technology. The progress in this area… (more)

Subjects/Keywords: Flexible Electronics; 3D IC; Flexible sensors; CMOS; Heterogeneous Integration; Modular Electronics

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APA (6th Edition):

Shaikh, S. F. (2020). Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems. (Thesis). King Abdullah University of Science and Technology. Retrieved from http://hdl.handle.net/10754/664340

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Shaikh, Sohail F. “Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems.” 2020. Thesis, King Abdullah University of Science and Technology. Accessed April 17, 2021. http://hdl.handle.net/10754/664340.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Shaikh, Sohail F. “Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems.” 2020. Web. 17 Apr 2021.

Vancouver:

Shaikh SF. Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems. [Internet] [Thesis]. King Abdullah University of Science and Technology; 2020. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/10754/664340.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Shaikh SF. Heterogeneous Integration Strategy for Obtaining Physically Flexible 3D Compliant Electronic Systems. [Thesis]. King Abdullah University of Science and Technology; 2020. Available from: http://hdl.handle.net/10754/664340

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

24. Maieron, Mcdonnell Araújo. Integração de dados abertos na geração de modelos 3D baseados em CityGML.

Degree: 2021, Brazil

Diante da crescente complexidade dos grandes centros urbanos causada pelo aumento populacional e pela natureza dinâmica das cidades, seus administradores buscam otimizar os serviços e… (more)

Subjects/Keywords: Informática; Smart cities.; Data integration; 3D models; CityGML

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APA (6th Edition):

Maieron, M. A. (2021). Integração de dados abertos na geração de modelos 3D baseados em CityGML. (Masters Thesis). Brazil. Retrieved from http://hdl.handle.net/10183/218220

Chicago Manual of Style (16th Edition):

Maieron, Mcdonnell Araújo. “Integração de dados abertos na geração de modelos 3D baseados em CityGML.” 2021. Masters Thesis, Brazil. Accessed April 17, 2021. http://hdl.handle.net/10183/218220.

MLA Handbook (7th Edition):

Maieron, Mcdonnell Araújo. “Integração de dados abertos na geração de modelos 3D baseados em CityGML.” 2021. Web. 17 Apr 2021.

Vancouver:

Maieron MA. Integração de dados abertos na geração de modelos 3D baseados em CityGML. [Internet] [Masters thesis]. Brazil; 2021. [cited 2021 Apr 17]. Available from: http://hdl.handle.net/10183/218220.

Council of Science Editors:

Maieron MA. Integração de dados abertos na geração de modelos 3D baseados em CityGML. [Masters Thesis]. Brazil; 2021. Available from: http://hdl.handle.net/10183/218220

25. Beilliard, Yann. Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2015, Université Grenoble Alpes (ComUE)

Cette thèse s'inscrit dans le contexte de l'intégration tridimensionnelle des dispositifs électroniques. Parmi les différentes techniques permettant d'assembler à la fois mécaniquement et électriquement les… (more)

Subjects/Keywords: Intégration 3D; Collage direct cuivre; Caractérisation; Morphologie; Fiabillité; Simulation; 3D Integration; Direct copper bonding; Characterisation; Morphology; Reliability; Simulation; 620

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APA (6th Edition):

Beilliard, Y. (2015). Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture. (Doctoral Dissertation). Université Grenoble Alpes (ComUE). Retrieved from http://www.theses.fr/2015GREAI008

Chicago Manual of Style (16th Edition):

Beilliard, Yann. “Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture.” 2015. Doctoral Dissertation, Université Grenoble Alpes (ComUE). Accessed April 17, 2021. http://www.theses.fr/2015GREAI008.

MLA Handbook (7th Edition):

Beilliard, Yann. “Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture.” 2015. Web. 17 Apr 2021.

Vancouver:

Beilliard Y. Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture. [Internet] [Doctoral dissertation]. Université Grenoble Alpes (ComUE); 2015. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2015GREAI008.

Council of Science Editors:

Beilliard Y. Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC : Study of the integration of copper/oxide direct bonding for the development of a 3D-SIC architecture. [Doctoral Dissertation]. Université Grenoble Alpes (ComUE); 2015. Available from: http://www.theses.fr/2015GREAI008


Université de Grenoble

26. Lafi, Walid. Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology.

Degree: Docteur es, Sciences et technologie industrielles, 2011, Université de Grenoble

Les travaux de cette thèse s'intéressent aux problèmes de performance et de coût des architectures MPSoC à base de NoC, en tirant parti des possibilités… (more)

Subjects/Keywords: Electronique numérique; Exploration d’architectures; Architectures distribuées; Intégration 3D; Télécommunications; Digital electronics; Exploration of architectures; 3D integration; Telecommunications

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lafi, W. (2011). Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2011GRENT037

Chicago Manual of Style (16th Edition):

Lafi, Walid. “Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology.” 2011. Doctoral Dissertation, Université de Grenoble. Accessed April 17, 2021. http://www.theses.fr/2011GRENT037.

MLA Handbook (7th Edition):

Lafi, Walid. “Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology.” 2011. Web. 17 Apr 2021.

Vancouver:

Lafi W. Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology. [Internet] [Doctoral dissertation]. Université de Grenoble; 2011. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2011GRENT037.

Council of Science Editors:

Lafi W. Architectures multiprocesseurs pour applications de télécommunication basées sur les technologies d'intégration 3D : Multiprocessor architectures for telecommunications applications based on 3d integration technology. [Doctoral Dissertation]. Université de Grenoble; 2011. Available from: http://www.theses.fr/2011GRENT037

27. Costa, Pedro Miguel Ferreira. Aplicação para intervenção em terapia ocupacional com o Leap Motion.

Degree: 2014, Instituto Politécnico do Porto

O projeto “À Descoberta das Ilhas” surge das lacunas de atenção e motivação por parte das crianças na realização de exercícios na terapia ocupacional, aliadas… (more)

Subjects/Keywords: Integração bilateral motora; Leap Motion; Jogo 3D; Terapia ocupacional; Bilateral motor integration; Leap Motion; 3D game; Occupational therapy

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Costa, P. M. F. (2014). Aplicação para intervenção em terapia ocupacional com o Leap Motion. (Thesis). Instituto Politécnico do Porto. Retrieved from http://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6313

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Costa, Pedro Miguel Ferreira. “Aplicação para intervenção em terapia ocupacional com o Leap Motion.” 2014. Thesis, Instituto Politécnico do Porto. Accessed April 17, 2021. http://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6313.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Costa, Pedro Miguel Ferreira. “Aplicação para intervenção em terapia ocupacional com o Leap Motion.” 2014. Web. 17 Apr 2021.

Vancouver:

Costa PMF. Aplicação para intervenção em terapia ocupacional com o Leap Motion. [Internet] [Thesis]. Instituto Politécnico do Porto; 2014. [cited 2021 Apr 17]. Available from: http://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6313.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Costa PMF. Aplicação para intervenção em terapia ocupacional com o Leap Motion. [Thesis]. Instituto Politécnico do Porto; 2014. Available from: http://www.rcaap.pt/detail.jsp?id=oai:recipp.ipp.pt:10400.22/6313

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

28. Gousseau, Simon. Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model.

Degree: Docteur es, Sciences et génie des matériaux, 2015, Paris, ENMP

L'intégration 3D, mode de conception par empilement des puces, vise à la fois la densification des systèmes et la diversification des fonctions. La réduction des… (more)

Subjects/Keywords: Électromigration; Caractérisation in operando; Modélisation multiphysique; Intégration 3D; Tsv; Electromigration; In operando characterization; Multiphysics modeling; 3D integration; Tsv; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Gousseau, S. (2015). Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model. (Doctoral Dissertation). Paris, ENMP. Retrieved from http://www.theses.fr/2015ENMP0015

Chicago Manual of Style (16th Edition):

Gousseau, Simon. “Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model.” 2015. Doctoral Dissertation, Paris, ENMP. Accessed April 17, 2021. http://www.theses.fr/2015ENMP0015.

MLA Handbook (7th Edition):

Gousseau, Simon. “Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model.” 2015. Web. 17 Apr 2021.

Vancouver:

Gousseau S. Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model. [Internet] [Doctoral dissertation]. Paris, ENMP; 2015. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2015ENMP0015.

Council of Science Editors:

Gousseau S. Caractérisation in operando de l’endommagement par électromigration des interconnexions 3D : Vers un modèle éléments finis prédictif : In Operando Characterization of Electromigration-Induced Damage in 3D Interconnects : Toward a predictive finite elements model. [Doctoral Dissertation]. Paris, ENMP; 2015. Available from: http://www.theses.fr/2015ENMP0015

29. Bouchoucha, Mohamed. Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp.

Degree: Docteur es, Matière condensée et Nanosciences, 2013, Aix Marseille Université

Les technologies d'empilement vertical de circuits intégrés, plus connues sous le terme « intégration 3D », ont connu un développement important durant les six dernières… (more)

Subjects/Keywords: Intégration 3D; TSV; Polymère; Contraintes thermomécaniques; Fiabilité; Packaging; 3D integration; TSV; Packaging; Polymer; Thermomechanical stress; Reliability

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Bouchoucha, M. (2013). Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp. (Doctoral Dissertation). Aix Marseille Université. Retrieved from http://www.theses.fr/2013AIXM4373

Chicago Manual of Style (16th Edition):

Bouchoucha, Mohamed. “Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp.” 2013. Doctoral Dissertation, Aix Marseille Université. Accessed April 17, 2021. http://www.theses.fr/2013AIXM4373.

MLA Handbook (7th Edition):

Bouchoucha, Mohamed. “Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp.” 2013. Web. 17 Apr 2021.

Vancouver:

Bouchoucha M. Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp. [Internet] [Doctoral dissertation]. Aix Marseille Université 2013. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2013AIXM4373.

Council of Science Editors:

Bouchoucha M. Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging : Molecular analysis of unreduced microgametes formation in Rosa spp. [Doctoral Dissertation]. Aix Marseille Université 2013. Available from: http://www.theses.fr/2013AIXM4373


Université de Grenoble

30. Navarro, Etienne. Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics.

Degree: Docteur es, Matériaux, mécanique, génie civil, électrochimie, 2014, Université de Grenoble

Lors de l'assemblage de wafers par adhésion moléculaire, un mince film d'air est piégé entre les deux wafers, créant ainsi un système fluide/structure couplé.La qualité… (more)

Subjects/Keywords: Collage direct; SOI; Propagation; Adhesion; Plaque mince; Intégration 3D; Direct bonding; 3D integration; Propagation; Adhesion; Overlay; Thin plate; 620

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Navarro, E. (2014). Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics. (Doctoral Dissertation). Université de Grenoble. Retrieved from http://www.theses.fr/2014GRENI023

Chicago Manual of Style (16th Edition):

Navarro, Etienne. “Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics.” 2014. Doctoral Dissertation, Université de Grenoble. Accessed April 17, 2021. http://www.theses.fr/2014GRENI023.

MLA Handbook (7th Edition):

Navarro, Etienne. “Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics.” 2014. Web. 17 Apr 2021.

Vancouver:

Navarro E. Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics. [Internet] [Doctoral dissertation]. Université de Grenoble; 2014. [cited 2021 Apr 17]. Available from: http://www.theses.fr/2014GRENI023.

Council of Science Editors:

Navarro E. Dynamique de l'assemblage de wafers par adhésion moléculaire : Direct wafer bonding dynamics. [Doctoral Dissertation]. Université de Grenoble; 2014. Available from: http://www.theses.fr/2014GRENI023

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