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You searched for subject:( lead free soldering). Showing records 1 – 30 of 9719 total matches.

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Brno University of Technology

1. Šula, Matěj. Optimalizace procesu pájení ve výrobě přístrojových transformátorů .

Degree: 2014, Brno University of Technology

 Tato diplomová práce se zabývá problematikou pájecího procesu ve výrobě přístrojových transformátorů. Shrnuje základní poznatky z pájecího procesu, bezolovnatých slitin a z vybraných testovacích metod… (more)

Subjects/Keywords: bezolovnatá pájka; ABB; ruční pájení; indukční pájení; lead-free solder; ABB; hand soldering; induction soldering

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APA (6th Edition):

Šula, M. (2014). Optimalizace procesu pájení ve výrobě přístrojových transformátorů . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32529

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Šula, Matěj. “Optimalizace procesu pájení ve výrobě přístrojových transformátorů .” 2014. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/32529.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Šula, Matěj. “Optimalizace procesu pájení ve výrobě přístrojových transformátorů .” 2014. Web. 26 Jan 2020.

Vancouver:

Šula M. Optimalizace procesu pájení ve výrobě přístrojových transformátorů . [Internet] [Thesis]. Brno University of Technology; 2014. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/32529.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Šula M. Optimalizace procesu pájení ve výrobě přístrojových transformátorů . [Thesis]. Brno University of Technology; 2014. Available from: http://hdl.handle.net/11012/32529

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

2. Mendes, Luiz Tadeu Freire. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".

Degree: Mestrado, Microeletrônica, 2009, University of São Paulo

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente… (more)

Subjects/Keywords: Assembly montage SMD; Electrochemical migration; Electronic soldering; Eletrônica; Eletroquímica; Lead free soldering; SMT; Soldagem elétrica; Solder paste

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APA (6th Edition):

Mendes, L. T. F. (2009). Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;

Chicago Manual of Style (16th Edition):

Mendes, Luiz Tadeu Freire. “Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".” 2009. Masters Thesis, University of São Paulo. Accessed January 26, 2020. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;.

MLA Handbook (7th Edition):

Mendes, Luiz Tadeu Freire. “Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\".” 2009. Web. 26 Jan 2020.

Vancouver:

Mendes LTF. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". [Internet] [Masters thesis]. University of São Paulo; 2009. [cited 2020 Jan 26]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;.

Council of Science Editors:

Mendes LTF. Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\". [Masters Thesis]. University of São Paulo; 2009. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/ ;


University of Akron

3. Faizan, Mohammad. EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING.

Degree: PhD, Mechanical Engineering, 2007, University of Akron

Soldering has become the predominant and established technique in electronic packaging industry for joining electronic components. The industry is aiming for the use of environment… (more)

Subjects/Keywords: lead-free; soldering; intermetallic compound; IMC; modeling; kinetics; particle dissolution; composite solder

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APA (6th Edition):

Faizan, M. (2007). EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING. (Doctoral Dissertation). University of Akron. Retrieved from http://rave.ohiolink.edu/etdc/view?acc_num=akron1195178338

Chicago Manual of Style (16th Edition):

Faizan, Mohammad. “EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING.” 2007. Doctoral Dissertation, University of Akron. Accessed January 26, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=akron1195178338.

MLA Handbook (7th Edition):

Faizan, Mohammad. “EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING.” 2007. Web. 26 Jan 2020.

Vancouver:

Faizan M. EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING. [Internet] [Doctoral dissertation]. University of Akron; 2007. [cited 2020 Jan 26]. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=akron1195178338.

Council of Science Editors:

Faizan M. EXPERIMENTAL STUDY AND MODELING OF METAL DISSOLUTION AND INTERMETALLIC COMPOUND GROWTH DURING SOLDERING. [Doctoral Dissertation]. University of Akron; 2007. Available from: http://rave.ohiolink.edu/etdc/view?acc_num=akron1195178338


Brno University of Technology

4. Lačný, Radek. Elektrická vodivost pájeného spoje a vliv na spolehlivost .

Degree: 2010, Brno University of Technology

 Tato práce se zabývá problematikou změn elektrické vodivosti bezolovnatých pájených spojů vlivem proudové zátěže a izotermálního stárnutí. V teoretické části jsou popsány faktory ovlivňující elektrickou… (more)

Subjects/Keywords: Elektrická vodivost; pájený spoj; bezolovnaté pájení; spolehlivost; Electric Conductivity; Solder Joint; Lead-free Soldering; Reliability

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APA (6th Edition):

Lačný, R. (2010). Elektrická vodivost pájeného spoje a vliv na spolehlivost . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/15850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lačný, Radek. “Elektrická vodivost pájeného spoje a vliv na spolehlivost .” 2010. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/15850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lačný, Radek. “Elektrická vodivost pájeného spoje a vliv na spolehlivost .” 2010. Web. 26 Jan 2020.

Vancouver:

Lačný R. Elektrická vodivost pájeného spoje a vliv na spolehlivost . [Internet] [Thesis]. Brno University of Technology; 2010. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/15850.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lačný R. Elektrická vodivost pájeného spoje a vliv na spolehlivost . [Thesis]. Brno University of Technology; 2010. Available from: http://hdl.handle.net/11012/15850

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

5. Jurásek, Matěj. Elektrické a tepelné vlastnosti bezolovnatých pájených spojů .

Degree: 2012, Brno University of Technology

 Tato práce je zamřena na problematiku pájení. V teoretické části popisuje základní požadavky na materiály a pájecí slitiny, které do tohoto procesu vstupují. Dále také… (more)

Subjects/Keywords: Bezolovnaté spoje; bezolovnaté pájení; odpor pájených spojů; dusíková atmosféra; elektrické vlastnosti; Lead-free joints; lead-free soldering; resistance of solder joints; nitrogen atmosphere; electrical properties

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APA (6th Edition):

Jurásek, M. (2012). Elektrické a tepelné vlastnosti bezolovnatých pájených spojů . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12455

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jurásek, Matěj. “Elektrické a tepelné vlastnosti bezolovnatých pájených spojů .” 2012. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/12455.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jurásek, Matěj. “Elektrické a tepelné vlastnosti bezolovnatých pájených spojů .” 2012. Web. 26 Jan 2020.

Vancouver:

Jurásek M. Elektrické a tepelné vlastnosti bezolovnatých pájených spojů . [Internet] [Thesis]. Brno University of Technology; 2012. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/12455.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jurásek M. Elektrické a tepelné vlastnosti bezolovnatých pájených spojů . [Thesis]. Brno University of Technology; 2012. Available from: http://hdl.handle.net/11012/12455

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

6. Lipavský, Lubomír. Roztékavost bezolovnatých pájek na keramických substrátech .

Degree: 2014, Brno University of Technology

 Tato diplomová práce se zabývá problematikou bezolovnatého pájení v ochranné atmosféře se zaměřením na test roztékavosti. Teoretická část je zaměřena na druhy bezolovnatých pájek, zkoušky… (more)

Subjects/Keywords: Bezolovnaté pájky; roztékavost; pájení přetavením; keramický substrát; dusíková atmosféra.; Lead – free solder; spreadability; reflow soldering; ceramic substrate; nitrogen atmosphere.

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APA (6th Edition):

Lipavský, L. (2014). Roztékavost bezolovnatých pájek na keramických substrátech . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32076

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lipavský, Lubomír. “Roztékavost bezolovnatých pájek na keramických substrátech .” 2014. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/32076.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lipavský, Lubomír. “Roztékavost bezolovnatých pájek na keramických substrátech .” 2014. Web. 26 Jan 2020.

Vancouver:

Lipavský L. Roztékavost bezolovnatých pájek na keramických substrátech . [Internet] [Thesis]. Brno University of Technology; 2014. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/32076.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lipavský L. Roztékavost bezolovnatých pájek na keramických substrátech . [Thesis]. Brno University of Technology; 2014. Available from: http://hdl.handle.net/11012/32076

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

7. Pícha, Jan. Studium spolehlivosti bezolovnatých pájených spojů .

Degree: 2010, Brno University of Technology

 Práce řeší problematiku bezolovnatého pájení se zaměřením na studium struktury spojů a jejich spolehlivost. V práci byly shrnuty používané bezolovnaté pájecí slitiny. V teoretické části… (more)

Subjects/Keywords: bezolovnaté pájení; struktura pájeného spoje; spolehlivost a životnost; lead-free soldering; sutructure of slofer joint; reliability and life-time

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APA (6th Edition):

Pícha, J. (2010). Studium spolehlivosti bezolovnatých pájených spojů . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17107

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pícha, Jan. “Studium spolehlivosti bezolovnatých pájených spojů .” 2010. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/17107.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pícha, Jan. “Studium spolehlivosti bezolovnatých pájených spojů .” 2010. Web. 26 Jan 2020.

Vancouver:

Pícha J. Studium spolehlivosti bezolovnatých pájených spojů . [Internet] [Thesis]. Brno University of Technology; 2010. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/17107.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pícha J. Studium spolehlivosti bezolovnatých pájených spojů . [Thesis]. Brno University of Technology; 2010. Available from: http://hdl.handle.net/11012/17107

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

8. Vala, Radek. Testování vlastností pájek v ochranné atmosféře .

Degree: 2013, Brno University of Technology

 Projekt řeší návrh a celkovou konstrukci zařízení nazývané exsikátor pro pájení v ochranné atmosféře. Pro zařízení bylo navrhnuto a vyrobeno chlazení a topný element. Pro… (more)

Subjects/Keywords: Pajení; dusík; ochranná atmosféra; chlazení; olovnaté pájky; bezolovnaté pájky; pájecí profil; Soldering; nitrogen; modified atmosphere; cooling; lead solder; lead-free solder; temperature profile

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APA (6th Edition):

Vala, R. (2013). Testování vlastností pájek v ochranné atmosféře . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/25017

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Vala, Radek. “Testování vlastností pájek v ochranné atmosféře .” 2013. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/25017.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Vala, Radek. “Testování vlastností pájek v ochranné atmosféře .” 2013. Web. 26 Jan 2020.

Vancouver:

Vala R. Testování vlastností pájek v ochranné atmosféře . [Internet] [Thesis]. Brno University of Technology; 2013. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/25017.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Vala R. Testování vlastností pájek v ochranné atmosféře . [Thesis]. Brno University of Technology; 2013. Available from: http://hdl.handle.net/11012/25017

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

9. Buchovecky, Eric Jon. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.

Degree: PhD, Solid Mechanics, 2010, Brown University

 The spontaneous growth of long, filamentary whiskers from the surface of Sn-plated Cu conductors poses a serious threat to the reliability of electronic components. While… (more)

Subjects/Keywords: lead-free

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APA (6th Edition):

Buchovecky, E. J. (2010). Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. (Doctoral Dissertation). Brown University. Retrieved from https://repository.library.brown.edu/studio/item/bdr:11052/

Chicago Manual of Style (16th Edition):

Buchovecky, Eric Jon. “Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.” 2010. Doctoral Dissertation, Brown University. Accessed January 26, 2020. https://repository.library.brown.edu/studio/item/bdr:11052/.

MLA Handbook (7th Edition):

Buchovecky, Eric Jon. “Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.” 2010. Web. 26 Jan 2020.

Vancouver:

Buchovecky EJ. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. [Internet] [Doctoral dissertation]. Brown University; 2010. [cited 2020 Jan 26]. Available from: https://repository.library.brown.edu/studio/item/bdr:11052/.

Council of Science Editors:

Buchovecky EJ. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. [Doctoral Dissertation]. Brown University; 2010. Available from: https://repository.library.brown.edu/studio/item/bdr:11052/


Brno University of Technology

10. Slavík, Pavel. Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 .

Degree: 2018, Brno University of Technology

 V teoretické části diplomové práce se věnuji seznámení se s procesem osazování a pájení desek plošných spojů. Jsou zde popsány vybrané typy bezolovnatých pájecích slitin.… (more)

Subjects/Keywords: Voidy; bezolovnaté pájení; pájecí pasta; reflow; pájení v parách; LED; FR4; IMS; x-ray; mikro výbrus; Voids; lead-free soldering; soldering paste; reflow; soldering vapor; LED; FR4; IMS; x-ray; micro-cut

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APA (6th Edition):

Slavík, P. (2018). Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/81219

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Slavík, Pavel. “Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 .” 2018. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/81219.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Slavík, Pavel. “Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 .” 2018. Web. 26 Jan 2020.

Vancouver:

Slavík P. Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 . [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/81219.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Slavík P. Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305 . [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/81219

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

11. Meinshausen, Lutz. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.

Degree: Docteur es, Electronique, 2014, Bordeaux; Universität Hannover

L'assemblage tridimensionnel des circuits microélectroniques et leur utilisation dansdes conditions environnementales extrêmement sévères nécessitent ledéveloppement d’alternatives plus robustes pour les contacts électriques. Unetechnique prometteuse est… (more)

Subjects/Keywords: Fiabilité; Thermomigration; Electromigration; Formation d'intermétalliques; Modélisation; Brasure sans plomb; Reliability; Thermomigration; Electromigration; Transient Liquid Phase Soldering (TLPS); Intermetallic Compound (IMC) formation; Modeling; Lead free solder

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Meinshausen, L. (2014). Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. (Doctoral Dissertation). Bordeaux; Universität Hannover. Retrieved from http://www.theses.fr/2014BORD0149

Chicago Manual of Style (16th Edition):

Meinshausen, Lutz. “Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.” 2014. Doctoral Dissertation, Bordeaux; Universität Hannover. Accessed January 26, 2020. http://www.theses.fr/2014BORD0149.

MLA Handbook (7th Edition):

Meinshausen, Lutz. “Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques.” 2014. Web. 26 Jan 2020.

Vancouver:

Meinshausen L. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. [Internet] [Doctoral dissertation]. Bordeaux; Universität Hannover; 2014. [cited 2020 Jan 26]. Available from: http://www.theses.fr/2014BORD0149.

Council of Science Editors:

Meinshausen L. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints : Modélisation de l’évolution de la microstructure d’alliage SAC sous contraintes thermiques, thermomécaniques et électriques. [Doctoral Dissertation]. Bordeaux; Universität Hannover; 2014. Available from: http://www.theses.fr/2014BORD0149


Brno University of Technology

12. Šimon, Vojtěch. Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost .

Degree: 2015, Brno University of Technology

 Tato práce se zabývá rozborem chybovosti bezolovnatého pájení, především pak výskytu dutin v bezolovnatých pájkách. Cílem bádání je izolovat mechanismy jejich vzniku a pokusit se… (more)

Subjects/Keywords: pájka; bezolovnaté pájení; dutina; makrodutina; mikrodutina; mikropropoj; spolehlivost; tavidlo; teplotní profil; povrchová úprava; rentgen; solder; lead-free soldering; void; macrovoid; microvoid; microVia; reliability; flux; heat profile; surface finish; X-Ray

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Šimon, V. (2015). Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/41639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Šimon, Vojtěch. “Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost .” 2015. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/41639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Šimon, Vojtěch. “Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost .” 2015. Web. 26 Jan 2020.

Vancouver:

Šimon V. Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost . [Internet] [Thesis]. Brno University of Technology; 2015. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/41639.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Šimon V. Mechanismy vzniku dutin u bezolovnatých pájených spojů a vliv na spolehlivost . [Thesis]. Brno University of Technology; 2015. Available from: http://hdl.handle.net/11012/41639

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

13. Smeliková, Lenka. Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou .

Degree: 2014, Brno University of Technology

 Tato diplomová práce se zabývá problematikou strojního pájení vlnou a aplikací metody Design of Experiments na nový produkt firmy. Shrnuje základní poznatky z technologie pájení,… (more)

Subjects/Keywords: Bezolovnatá pájecí slitina; DOE; IPC-A-610E; kontrola kvality; strojní pájení vlnou; metodika; Lead-free solder alloy; DOE; IPC A-610E; quality kontrol; wave soldering; methodics

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Smeliková, L. (2014). Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32581

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Smeliková, Lenka. “Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou .” 2014. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/32581.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Smeliková, Lenka. “Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou .” 2014. Web. 26 Jan 2020.

Vancouver:

Smeliková L. Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou . [Internet] [Thesis]. Brno University of Technology; 2014. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/32581.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Smeliková L. Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou . [Thesis]. Brno University of Technology; 2014. Available from: http://hdl.handle.net/11012/32581

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

14. Otáhal, Alexandr. Optimalizace procesu pájení na zařízení IR-400 .

Degree: 2010, Brno University of Technology

 Tento projekt pojednává o inovaci zařízení IR-400, jež spočívá v návrhu a realizaci regulace teploty horního i spodního ohřevu. Tato inovace umožní nastavování teplotního přetavovacího… (more)

Subjects/Keywords: infračervené pájení přetavením; bezolovnaté pájky; pájecí profil; opravy součástek; infrared reflow soldering; lead-free solder; solder profile; rework and repair of components

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Otáhal, A. (2010). Optimalizace procesu pájení na zařízení IR-400 . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17936

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Otáhal, Alexandr. “Optimalizace procesu pájení na zařízení IR-400 .” 2010. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/17936.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Otáhal, Alexandr. “Optimalizace procesu pájení na zařízení IR-400 .” 2010. Web. 26 Jan 2020.

Vancouver:

Otáhal A. Optimalizace procesu pájení na zařízení IR-400 . [Internet] [Thesis]. Brno University of Technology; 2010. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/17936.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Otáhal A. Optimalizace procesu pájení na zařízení IR-400 . [Thesis]. Brno University of Technology; 2010. Available from: http://hdl.handle.net/11012/17936

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

15. Šula, Matěj. Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace .

Degree: 2012, Brno University of Technology

 Bakalářská práce popisuje problematiku pájecího procesu. Shrnuje základní poznatky z pájecího procesu, bezolovnatých slitin a z vizuálního testování pájeného spoje. V práci se porovnává vliv… (more)

Subjects/Keywords: bezolovnatá pájka; ochranná atmosféra; smáčecí úhel; pájení přetavením; IPC-A-610.; lead free; protective atmosphere; wetting angle; reflow soldering; defects; IPC-A-610.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Šula, M. (2012). Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12474

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Šula, Matěj. “Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace .” 2012. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/12474.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Šula, Matěj. “Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace .” 2012. Web. 26 Jan 2020.

Vancouver:

Šula M. Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace . [Internet] [Thesis]. Brno University of Technology; 2012. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/12474.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Šula M. Vizuální porovnání bezolovnatých spojů pro různé materiálové kombinace . [Thesis]. Brno University of Technology; 2012. Available from: http://hdl.handle.net/11012/12474

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

16. Lipavský, Lubomír. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem .

Degree: 2012, Brno University of Technology

 Tato práce se zabývá problematikou bezolovnatého pájení v ochranné atmosféře se zaměřením na mechanické zkoušky. Teoretická část je zaměřena na druhy bezolovnatých pájek, mechanické zkoušky… (more)

Subjects/Keywords: Bezolovnaté pájky; test střihem; pájení přetavením; spolehlivost pájeného spoje; dusíková atmosféra.; Lead – free solder; shear test; reflow soldering; reliability of the solder joint; nitrogen atmosphere.

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APA (6th Edition):

Lipavský, L. (2012). Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12486

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lipavský, Lubomír. “Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem .” 2012. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/12486.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lipavský, Lubomír. “Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem .” 2012. Web. 26 Jan 2020.

Vancouver:

Lipavský L. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem . [Internet] [Thesis]. Brno University of Technology; 2012. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/12486.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lipavský L. Porovnání vlastností pájených spojů na keramických substrátech pomocí zkoušky střihem . [Thesis]. Brno University of Technology; 2012. Available from: http://hdl.handle.net/11012/12486

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

17. Jansa, Vojtěch. Pevnost pájených spojů na keramických substrátech .

Degree: 2013, Brno University of Technology

 Bakalářská práce se zabývá problematikou bezolovnatého pájení a následným testováním mechanických vlastností vytvořeného spoje. V teoretické části práce jsou rozebrány druhy bezolovnatých pájek, vliv ochranné… (more)

Subjects/Keywords: Bezolovnatá pájka; ochranná atmosféra; dusík; pájení přetavením; kvalita pájeného spoje; test střihem; Lead – free solder; protective atmosphere; nitrogen; reflow soldering; quality of solder joint; shear test

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jansa, V. (2013). Pevnost pájených spojů na keramických substrátech . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/26947

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jansa, Vojtěch. “Pevnost pájených spojů na keramických substrátech .” 2013. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/26947.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jansa, Vojtěch. “Pevnost pájených spojů na keramických substrátech .” 2013. Web. 26 Jan 2020.

Vancouver:

Jansa V. Pevnost pájených spojů na keramických substrátech . [Internet] [Thesis]. Brno University of Technology; 2013. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/26947.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jansa V. Pevnost pájených spojů na keramických substrátech . [Thesis]. Brno University of Technology; 2013. Available from: http://hdl.handle.net/11012/26947

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

18. Matras, Jan. Vliv povrchových úprav DPS na pájitelnost při pájení v parách .

Degree: 2016, Brno University of Technology

 Práce se zabývá problematikou pájení v parách a smáčením povrchu pájkou při procesu pájení. Podrobněji popisuje výhody a nedostatky jednotlivých povrchových úprav pájecí ploch na… (more)

Subjects/Keywords: Pájení v parách; povrchové úpravy; bezolovnatá pájka; tavidlo; pájitelnost; smáčivost; SSBA; Vapour soldering; surface finishes; lead-free solder; flux; solderability; wettability; SSBA

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Matras, J. (2016). Vliv povrchových úprav DPS na pájitelnost při pájení v parách . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/61734

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Matras, Jan. “Vliv povrchových úprav DPS na pájitelnost při pájení v parách .” 2016. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/61734.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Matras, Jan. “Vliv povrchových úprav DPS na pájitelnost při pájení v parách .” 2016. Web. 26 Jan 2020.

Vancouver:

Matras J. Vliv povrchových úprav DPS na pájitelnost při pájení v parách . [Internet] [Thesis]. Brno University of Technology; 2016. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/61734.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Matras J. Vliv povrchových úprav DPS na pájitelnost při pájení v parách . [Thesis]. Brno University of Technology; 2016. Available from: http://hdl.handle.net/11012/61734

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

19. Vala, Radek. Optimalizace procesu opakovaného pájení při opravách v povrchové montáži .

Degree: 2011, Brno University of Technology

 Projekt řeší využití zařízení IR 400 pro opravy a montáž součástek pájených bezolovnatými pájkami. Dále se zabývá optimalizací teplotního profilu, který je velice důležitý při… (more)

Subjects/Keywords: Infračervené pájení přetavením; bezolovnaté pájky; pájecí profil; montáž a opravy součástek; Infrared reflow soldering; lead-free solder; solder profile; assembly and repair of components

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Vala, R. (2011). Optimalizace procesu opakovaného pájení při opravách v povrchové montáži . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/8300

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Vala, Radek. “Optimalizace procesu opakovaného pájení při opravách v povrchové montáži .” 2011. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/8300.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Vala, Radek. “Optimalizace procesu opakovaného pájení při opravách v povrchové montáži .” 2011. Web. 26 Jan 2020.

Vancouver:

Vala R. Optimalizace procesu opakovaného pájení při opravách v povrchové montáži . [Internet] [Thesis]. Brno University of Technology; 2011. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/8300.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Vala R. Optimalizace procesu opakovaného pájení při opravách v povrchové montáži . [Thesis]. Brno University of Technology; 2011. Available from: http://hdl.handle.net/11012/8300

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Michigan State University

20. Rhee, Hongjoo. Roles of service parameters on the mechanical behavior of lead-free solder joints.

Degree: PhD, Department of Chemical Engineering and Materials Science, 2005, Michigan State University

Subjects/Keywords: Solder and soldering; Electronic packaging – Materials; Lead free electronics and manufacturing processes

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APA (6th Edition):

Rhee, H. (2005). Roles of service parameters on the mechanical behavior of lead-free solder joints. (Doctoral Dissertation). Michigan State University. Retrieved from http://etd.lib.msu.edu/islandora/object/etd:33401

Chicago Manual of Style (16th Edition):

Rhee, Hongjoo. “Roles of service parameters on the mechanical behavior of lead-free solder joints.” 2005. Doctoral Dissertation, Michigan State University. Accessed January 26, 2020. http://etd.lib.msu.edu/islandora/object/etd:33401.

MLA Handbook (7th Edition):

Rhee, Hongjoo. “Roles of service parameters on the mechanical behavior of lead-free solder joints.” 2005. Web. 26 Jan 2020.

Vancouver:

Rhee H. Roles of service parameters on the mechanical behavior of lead-free solder joints. [Internet] [Doctoral dissertation]. Michigan State University; 2005. [cited 2020 Jan 26]. Available from: http://etd.lib.msu.edu/islandora/object/etd:33401.

Council of Science Editors:

Rhee H. Roles of service parameters on the mechanical behavior of lead-free solder joints. [Doctoral Dissertation]. Michigan State University; 2005. Available from: http://etd.lib.msu.edu/islandora/object/etd:33401


University of New South Wales

21. Luo, Zhenhua. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.

Degree: Materials Science & Engineering, 2011, University of New South Wales

 This thesis investigates the electrical fatigue behaviour of Pb(Zr1-xTix)O3 (PZT), (1-x)Bi1/2Na1/2TiO3 – xBaTiO3 (BNT-BT) and (1-x-y)Bi1/2Na1/2TiO3 – xBaTiO3 – yK0.5Na0.5NbO3 (BNT-BT-KNN) piezoceramics.Fatigue has always been… (more)

Subjects/Keywords: Lead Free; Lead Free; Electrical Fatigue; PZT

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APA (6th Edition):

Luo, Z. (2011). Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Luo, Zhenhua. “Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.” 2011. Doctoral Dissertation, University of New South Wales. Accessed January 26, 2020. http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true.

MLA Handbook (7th Edition):

Luo, Zhenhua. “Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.” 2011. Web. 26 Jan 2020.

Vancouver:

Luo Z. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. [Internet] [Doctoral dissertation]. University of New South Wales; 2011. [cited 2020 Jan 26]. Available from: http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true.

Council of Science Editors:

Luo Z. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. [Doctoral Dissertation]. University of New South Wales; 2011. Available from: http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true


Brno University of Technology

22. Otáhal, Alexandr. Výzkum jakosti pájených spojů u pouzder BGA a QFN .

Degree: 2012, Brno University of Technology

 Tato diplomová práce popisuje specifika technologií a výrobu pouzder BGA a QFN. Dále shrnuje jejich nejpoužívanější metody zkoušek a kontroly jakosti. Popisuje výrobu zařízení pro… (more)

Subjects/Keywords: bezolovnaté pájky; pájení přetavením; BGA; QFN; kulové vývody; jakost; dusíková atmosféra; pájení v parách; opravy; lead-free solder; reflow soldering; BGA; QFN; ball terminals; quality; nitrogen atmosphere; vapor phase soldering; repair

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Otáhal, A. (2012). Výzkum jakosti pájených spojů u pouzder BGA a QFN . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/8349

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Otáhal, Alexandr. “Výzkum jakosti pájených spojů u pouzder BGA a QFN .” 2012. Thesis, Brno University of Technology. Accessed January 26, 2020. http://hdl.handle.net/11012/8349.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Otáhal, Alexandr. “Výzkum jakosti pájených spojů u pouzder BGA a QFN .” 2012. Web. 26 Jan 2020.

Vancouver:

Otáhal A. Výzkum jakosti pájených spojů u pouzder BGA a QFN . [Internet] [Thesis]. Brno University of Technology; 2012. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/11012/8349.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Otáhal A. Výzkum jakosti pájených spojů u pouzder BGA a QFN . [Thesis]. Brno University of Technology; 2012. Available from: http://hdl.handle.net/11012/8349

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Georgia Tech

23. Pei, Min. Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy.

Degree: PhD, Mechanical Engineering, 2007, Georgia Tech

Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. But these alloys have several drawbacks, such… (more)

Subjects/Keywords: Fatigue; Creep; Microstructure; Rare earth elements; Lead-free solder; Rare earths; Solder and soldering Mechanical properties; Lead-free electronics manufacturing processes; Microelectronics; Microstructure

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APA (6th Edition):

Pei, M. (2007). Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/14524

Chicago Manual of Style (16th Edition):

Pei, Min. “Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy.” 2007. Doctoral Dissertation, Georgia Tech. Accessed January 26, 2020. http://hdl.handle.net/1853/14524.

MLA Handbook (7th Edition):

Pei, Min. “Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy.” 2007. Web. 26 Jan 2020.

Vancouver:

Pei M. Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. [Internet] [Doctoral dissertation]. Georgia Tech; 2007. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/1853/14524.

Council of Science Editors:

Pei M. Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. [Doctoral Dissertation]. Georgia Tech; 2007. Available from: http://hdl.handle.net/1853/14524


Oregon State University

24. Mendez, Jose Eduardo. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.

Degree: MS, Materials Science, 2016, Oregon State University

 The ternary system (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ (BNT-BKT-BMgT) was explored along the [75-(x/2) ]Bi₀.₅Na₀.₅TiO₃ - [25-(x/2)]Bi₀.₅K₀.₅TiO₃ - [x]Bi(Mg₀.₅Ti₀.₅)O₃ composition line. Thin films were fabricated using chelated mixing route… (more)

Subjects/Keywords: Lead-free; Thin films

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APA (6th Edition):

Mendez, J. E. (2016). Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/60106

Chicago Manual of Style (16th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Masters Thesis, Oregon State University. Accessed January 26, 2020. http://hdl.handle.net/1957/60106.

MLA Handbook (7th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Web. 26 Jan 2020.

Vancouver:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Internet] [Masters thesis]. Oregon State University; 2016. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/1957/60106.

Council of Science Editors:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Masters Thesis]. Oregon State University; 2016. Available from: http://hdl.handle.net/1957/60106


Virginia Tech

25. Gupta, Shashaank. High Performance Lead – free Piezoelectric Materials.

Degree: PhD, Materials Science and Engineering, 2013, Virginia Tech

 Piezoelectric materials find applications in number of devices requiring inter-conversion of mechanical and electrical energy.  These devices include different types of sensors, actuators and energy… (more)

Subjects/Keywords: KNN; Ferroelectric; Piezoelectric; Lead free

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APA (6th Edition):

Gupta, S. (2013). High Performance Lead – free Piezoelectric Materials. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/50959

Chicago Manual of Style (16th Edition):

Gupta, Shashaank. “High Performance Lead – free Piezoelectric Materials.” 2013. Doctoral Dissertation, Virginia Tech. Accessed January 26, 2020. http://hdl.handle.net/10919/50959.

MLA Handbook (7th Edition):

Gupta, Shashaank. “High Performance Lead – free Piezoelectric Materials.” 2013. Web. 26 Jan 2020.

Vancouver:

Gupta S. High Performance Lead – free Piezoelectric Materials. [Internet] [Doctoral dissertation]. Virginia Tech; 2013. [cited 2020 Jan 26]. Available from: http://hdl.handle.net/10919/50959.

Council of Science Editors:

Gupta S. High Performance Lead – free Piezoelectric Materials. [Doctoral Dissertation]. Virginia Tech; 2013. Available from: http://hdl.handle.net/10919/50959


Delft University of Technology

26. Mascarenhas, N.T. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.

Degree: 2015, Delft University of Technology

 Vibrations are inherent part in an aircraft system and supressing them has always been a technological challenge. Over the recent years, damping of mechanical vibrations… (more)

Subjects/Keywords: lead free; piezoelectric composite; flexible

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APA (6th Edition):

Mascarenhas, N. T. (2015). Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74

Chicago Manual of Style (16th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Masters Thesis, Delft University of Technology. Accessed January 26, 2020. http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

MLA Handbook (7th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Web. 26 Jan 2020.

Vancouver:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Internet] [Masters thesis]. Delft University of Technology; 2015. [cited 2020 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

Council of Science Editors:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Masters Thesis]. Delft University of Technology; 2015. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74


University of New South Wales

27. Tung, Patrick. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.

Degree: Materials Science & Engineering, 2014, University of New South Wales

Lead-free piezoelectric materials are likely to be needed in the near future to replace lead-based materials in applications due to regulatory, health and safety issues.… (more)

Subjects/Keywords: NBT; Diffuse scattering; Lead-free

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APA (6th Edition):

Tung, P. (2014). Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. (Masters Thesis). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Masters Thesis, University of New South Wales. Accessed January 26, 2020. http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

MLA Handbook (7th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Web. 26 Jan 2020.

Vancouver:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Internet] [Masters thesis]. University of New South Wales; 2014. [cited 2020 Jan 26]. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

Council of Science Editors:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Masters Thesis]. University of New South Wales; 2014. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true


University of New South Wales

28. Ghasemian, Mohammad Bagher. Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications.

Degree: Materials Science & Engineering, 2018, University of New South Wales

 One dimensional (1D) piezoelectric materials such as nanofibers, nanowires and nanotubes have been applied largely in sensors, nanogenerators, microelectromechanical systems (MEMS), transducers etc. due to… (more)

Subjects/Keywords: Nanofiber; Lead-free; Piezoelectric; Nanotube

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APA (6th Edition):

Ghasemian, M. B. (2018). Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/60748 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:54032/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Ghasemian, Mohammad Bagher. “Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications.” 2018. Doctoral Dissertation, University of New South Wales. Accessed January 26, 2020. http://handle.unsw.edu.au/1959.4/60748 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:54032/SOURCE02?view=true.

MLA Handbook (7th Edition):

Ghasemian, Mohammad Bagher. “Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications.” 2018. Web. 26 Jan 2020.

Vancouver:

Ghasemian MB. Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications. [Internet] [Doctoral dissertation]. University of New South Wales; 2018. [cited 2020 Jan 26]. Available from: http://handle.unsw.edu.au/1959.4/60748 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:54032/SOURCE02?view=true.

Council of Science Editors:

Ghasemian MB. Lead-free piezoelectric nanofibers and nanotubes for energy harvesting applications. [Doctoral Dissertation]. University of New South Wales; 2018. Available from: http://handle.unsw.edu.au/1959.4/60748 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:54032/SOURCE02?view=true


Université de Lorraine

29. Sadiq, Muhammad. Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère.

Degree: Docteur es, Sciences des Matériaux, 2012, Université de Lorraine

Le besoin pressant de substitution du plomb dans les alliages de soudure a conduit à une introduction très rapide de nouveaux alliages sans plomb dont… (more)

Subjects/Keywords: Soudures sans plomb; Lanthane; Applications microélectroniques; Fiabilité; Environnement sévère; Nanotechnology; Lead-free soldering; Microstructure evolution; Mechanical behavior; Nanoindentation; Wettability; Thermal aging and coarsening; Creep behavior; Electronics Packaging; Microelectronics; Reliability; 621.381; 671.52

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APA (6th Edition):

Sadiq, M. (2012). Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère. (Doctoral Dissertation). Université de Lorraine. Retrieved from http://www.theses.fr/2012LORR0049

Chicago Manual of Style (16th Edition):

Sadiq, Muhammad. “Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère.” 2012. Doctoral Dissertation, Université de Lorraine. Accessed January 26, 2020. http://www.theses.fr/2012LORR0049.

MLA Handbook (7th Edition):

Sadiq, Muhammad. “Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère.” 2012. Web. 26 Jan 2020.

Vancouver:

Sadiq M. Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère. [Internet] [Doctoral dissertation]. Université de Lorraine; 2012. [cited 2020 Jan 26]. Available from: http://www.theses.fr/2012LORR0049.

Council of Science Editors:

Sadiq M. Design and Fabrication of Next-Generation Lanthanum-Doped Lead-free Solder for Reliable Microelectronics Applications in Severe Environment : Conception et fabrication d'une nouvelle génération de soudures sans plomb dopés en lanthane pour des applications microélectroniques fiables en environnement sévère. [Doctoral Dissertation]. Université de Lorraine; 2012. Available from: http://www.theses.fr/2012LORR0049


Delft University of Technology

30. Deubzer, O. Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future.

Degree: 2007, Delft University of Technology

 The Directive 2002/95/EC (RoHS Directive), among other substances, bans the use of lead in the electrical and electronics industry. This explorative study assesses the worldwide… (more)

Subjects/Keywords: lead-free soldering; electronics manufacturing; environmental impact; sustainability assessment; horizontal efficiency; vertical efficiency; top-down approach

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APA (6th Edition):

Deubzer, O. (2007). Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future. (Doctoral Dissertation). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e

Chicago Manual of Style (16th Edition):

Deubzer, O. “Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future.” 2007. Doctoral Dissertation, Delft University of Technology. Accessed January 26, 2020. http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e.

MLA Handbook (7th Edition):

Deubzer, O. “Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future.” 2007. Web. 26 Jan 2020.

Vancouver:

Deubzer O. Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future. [Internet] [Doctoral dissertation]. Delft University of Technology; 2007. [cited 2020 Jan 26]. Available from: http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e.

Council of Science Editors:

Deubzer O. Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future. [Doctoral Dissertation]. Delft University of Technology; 2007. Available from: http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; urn:NBN:nl:ui:24-uuid:f9a776cf-57c3-4815-a989-fe89ed59046e ; http://resolver.tudelft.nl/uuid:f9a776cf-57c3-4815-a989-fe89ed59046e

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