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You searched for subject:( lead AND lead free solders). Showing records 1 – 30 of 2072 total matches.

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Brno University of Technology

1. Dvořák, Jaroslav. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami .

Degree: 2011, Brno University of Technology

 Tato výzkumná práce je zaměřena na vlivy a velikosti termonapětí, které mohou ovlivňovat stejnosměrné obvody. Cílem této práce je sestrojit experimentální sestavu pro měření termonapětí… (more)

Subjects/Keywords: termonapětí; pájený spoj; olovnaté a bezolovnaté pájení; thermotension; solder joint; lead and lead-free solders

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APA (6th Edition):

Dvořák, J. (2011). Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1753

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Dvořák, Jaroslav. “Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami .” 2011. Thesis, Brno University of Technology. Accessed August 22, 2019. http://hdl.handle.net/11012/1753.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Dvořák, Jaroslav. “Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami .” 2011. Web. 22 Aug 2019.

Vancouver:

Dvořák J. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami . [Internet] [Thesis]. Brno University of Technology; 2011. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/11012/1753.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Dvořák J. Stanovení termonapětí pájených spojů realizovaných olovnatými a bezolovnatými pájkami . [Thesis]. Brno University of Technology; 2011. Available from: http://hdl.handle.net/11012/1753

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Oulu

2. Nousiainen, O. (Olli). Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.

Degree: 2010, University of Oulu

 Abstract Low-temperature co-fired ceramic (LTCC) based system-in-package (SiP) is an emerging multilayer module technology for wireless communication applications, mainly due to its excellent high-frequency material… (more)

Subjects/Keywords: LTCC; creep; lead-free solders; plastic-core solder balls; thermal fatigue

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APA (6th Edition):

Nousiainen, O. (. (2010). Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. (Doctoral Dissertation). University of Oulu. Retrieved from http://urn.fi/urn:isbn:9789514263538

Chicago Manual of Style (16th Edition):

Nousiainen, O (Olli). “Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.” 2010. Doctoral Dissertation, University of Oulu. Accessed August 22, 2019. http://urn.fi/urn:isbn:9789514263538.

MLA Handbook (7th Edition):

Nousiainen, O (Olli). “Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies.” 2010. Web. 22 Aug 2019.

Vancouver:

Nousiainen O(. Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. [Internet] [Doctoral dissertation]. University of Oulu; 2010. [cited 2019 Aug 22]. Available from: http://urn.fi/urn:isbn:9789514263538.

Council of Science Editors:

Nousiainen O(. Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies. [Doctoral Dissertation]. University of Oulu; 2010. Available from: http://urn.fi/urn:isbn:9789514263538


Univerzitet u Beogradu

3. Marković, Branislav R. Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković.

Degree: Tehnički fakultet u Boru, 2015, Univerzitet u Beogradu

Tehnicko-tehnološke nauke - Metalurško inženjerstvo / Technical and technological sciences-Metallurgical engineering

Fazne ravnoteže u Bi-Cu-Ni ternarnom sistemu proucavane su eksperimentalnim metodama (SEM-EDS, DTA i DSC),… (more)

Subjects/Keywords: Bi-Cu-Ni system; lead-free solders; phase equilibria; thermodynamic modeling; characterization

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APA (6th Edition):

Marković, B. R. (2015). Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković. (Thesis). Univerzitet u Beogradu. Retrieved from https://fedorabg.bg.ac.rs/fedora/get/o:9978/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Marković, Branislav R. “Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković.” 2015. Thesis, Univerzitet u Beogradu. Accessed August 22, 2019. https://fedorabg.bg.ac.rs/fedora/get/o:9978/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Marković, Branislav R. “Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković.” 2015. Web. 22 Aug 2019.

Vancouver:

Marković BR. Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković. [Internet] [Thesis]. Univerzitet u Beogradu; 2015. [cited 2019 Aug 22]. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:9978/bdef:Content/get.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Marković BR. Ispitivanje faznih ravnoteža i karakterizacija legura u sistemu Bi-Cu-Ni / Branislav R. Marković. [Thesis]. Univerzitet u Beogradu; 2015. Available from: https://fedorabg.bg.ac.rs/fedora/get/o:9978/bdef:Content/get

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Kentucky

4. Nalagatla, Dinesh Reddy. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.

Degree: 2007, University of Kentucky

 The objective of this study is to understand the effect of surface roughness of the Cu substrate on the wetting of molten solder alloys. Eutectic… (more)

Subjects/Keywords: Wetting; surface roughness; hot-stage microscopy; lead solders; lead-free solders

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APA (6th Edition):

Nalagatla, D. R. (2007). INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. (Masters Thesis). University of Kentucky. Retrieved from http://uknowledge.uky.edu/gradschool_theses/488

Chicago Manual of Style (16th Edition):

Nalagatla, Dinesh Reddy. “INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.” 2007. Masters Thesis, University of Kentucky. Accessed August 22, 2019. http://uknowledge.uky.edu/gradschool_theses/488.

MLA Handbook (7th Edition):

Nalagatla, Dinesh Reddy. “INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS.” 2007. Web. 22 Aug 2019.

Vancouver:

Nalagatla DR. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. [Internet] [Masters thesis]. University of Kentucky; 2007. [cited 2019 Aug 22]. Available from: http://uknowledge.uky.edu/gradschool_theses/488.

Council of Science Editors:

Nalagatla DR. INFLUENCE OF SURFACE ROUGHNESS OF COPPER SUBSTRATE ON WETTING BEHAVIOR OF MOLTEN SOLDER ALLOYS. [Masters Thesis]. University of Kentucky; 2007. Available from: http://uknowledge.uky.edu/gradschool_theses/488

5. Buchovecky, Eric Jon. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.

Degree: PhD, Solid Mechanics, 2010, Brown University

 The spontaneous growth of long, filamentary whiskers from the surface of Sn-plated Cu conductors poses a serious threat to the reliability of electronic components. While… (more)

Subjects/Keywords: lead-free

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APA (6th Edition):

Buchovecky, E. J. (2010). Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. (Doctoral Dissertation). Brown University. Retrieved from https://repository.library.brown.edu/studio/item/bdr:11052/

Chicago Manual of Style (16th Edition):

Buchovecky, Eric Jon. “Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.” 2010. Doctoral Dissertation, Brown University. Accessed August 22, 2019. https://repository.library.brown.edu/studio/item/bdr:11052/.

MLA Handbook (7th Edition):

Buchovecky, Eric Jon. “Numerical Simulation of Stress Generation and Whisker Growth in Sn Films.” 2010. Web. 22 Aug 2019.

Vancouver:

Buchovecky EJ. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. [Internet] [Doctoral dissertation]. Brown University; 2010. [cited 2019 Aug 22]. Available from: https://repository.library.brown.edu/studio/item/bdr:11052/.

Council of Science Editors:

Buchovecky EJ. Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. [Doctoral Dissertation]. Brown University; 2010. Available from: https://repository.library.brown.edu/studio/item/bdr:11052/


Loughborough University

6. Liu, Li. Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects.

Degree: PhD, 2016, Loughborough University

 A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction… (more)

Subjects/Keywords: Electroless Ni-W-P deposition; Crystallisation characteristics; Lead-free high temperature solders; Diffusion barrier characteristics; Power electronics; Interfacial reactions; IMCs

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APA (6th Edition):

Liu, L. (2016). Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects. (Doctoral Dissertation). Loughborough University. Retrieved from https://dspace.lboro.ac.uk/2134/23260 ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.763440

Chicago Manual of Style (16th Edition):

Liu, Li. “Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects.” 2016. Doctoral Dissertation, Loughborough University. Accessed August 22, 2019. https://dspace.lboro.ac.uk/2134/23260 ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.763440.

MLA Handbook (7th Edition):

Liu, Li. “Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects.” 2016. Web. 22 Aug 2019.

Vancouver:

Liu L. Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects. [Internet] [Doctoral dissertation]. Loughborough University; 2016. [cited 2019 Aug 22]. Available from: https://dspace.lboro.ac.uk/2134/23260 ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.763440.

Council of Science Editors:

Liu L. Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects. [Doctoral Dissertation]. Loughborough University; 2016. Available from: https://dspace.lboro.ac.uk/2134/23260 ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.763440


Brno University of Technology

7. Paško, Martin. Analýza změn v pájených spojích vzniklých vlivem stárnutí .

Degree: 2011, Brno University of Technology

 Práce se zabývá elektromigrací v pájeném spoji. V teoretické části jsou popsány bezolovnaté pájky, povrchové úpravy, formování pájeného spoje, intermetalické sloučeniny a elektromigrace. V praktické… (more)

Subjects/Keywords: pájený spoj; elektromigrace; intermetalické sloučeniny; bezolovnaté pájení; povrchové úpravy; solder joint; electromigration; intermetallic compounds; lead-free solders; surface finish

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APA (6th Edition):

Paško, M. (2011). Analýza změn v pájených spojích vzniklých vlivem stárnutí . (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/3579

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Paško, Martin. “Analýza změn v pájených spojích vzniklých vlivem stárnutí .” 2011. Thesis, Brno University of Technology. Accessed August 22, 2019. http://hdl.handle.net/11012/3579.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Paško, Martin. “Analýza změn v pájených spojích vzniklých vlivem stárnutí .” 2011. Web. 22 Aug 2019.

Vancouver:

Paško M. Analýza změn v pájených spojích vzniklých vlivem stárnutí . [Internet] [Thesis]. Brno University of Technology; 2011. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/11012/3579.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Paško M. Analýza změn v pájených spojích vzniklých vlivem stárnutí . [Thesis]. Brno University of Technology; 2011. Available from: http://hdl.handle.net/11012/3579

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of New South Wales

8. Luo, Zhenhua. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.

Degree: Materials Science & Engineering, 2011, University of New South Wales

 This thesis investigates the electrical fatigue behaviour of Pb(Zr1-xTix)O3 (PZT), (1-x)Bi1/2Na1/2TiO3 – xBaTiO3 (BNT-BT) and (1-x-y)Bi1/2Na1/2TiO3 – xBaTiO3 – yK0.5Na0.5NbO3 (BNT-BT-KNN) piezoceramics.Fatigue has always been… (more)

Subjects/Keywords: Lead Free; Lead Free; Electrical Fatigue; PZT

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APA (6th Edition):

Luo, Z. (2011). Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Luo, Zhenhua. “Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.” 2011. Doctoral Dissertation, University of New South Wales. Accessed August 22, 2019. http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true.

MLA Handbook (7th Edition):

Luo, Zhenhua. “Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics.” 2011. Web. 22 Aug 2019.

Vancouver:

Luo Z. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. [Internet] [Doctoral dissertation]. University of New South Wales; 2011. [cited 2019 Aug 22]. Available from: http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true.

Council of Science Editors:

Luo Z. Electrical fatigue of lead zirconate titanate and bismuth sodium titanate-based lead-free piezoelectric ceramics. [Doctoral Dissertation]. University of New South Wales; 2011. Available from: http://handle.unsw.edu.au/1959.4/51421 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:10105/SOURCE02?view=true


Oregon State University

9. Mendez, Jose Eduardo. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.

Degree: MS, Materials Science, 2016, Oregon State University

 The ternary system (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ (BNT-BKT-BMgT) was explored along the [75-(x/2) ]Bi₀.₅Na₀.₅TiO₃ - [25-(x/2)]Bi₀.₅K₀.₅TiO₃ - [x]Bi(Mg₀.₅Ti₀.₅)O₃ composition line. Thin films were fabricated using chelated mixing route… (more)

Subjects/Keywords: Lead-free; Thin films

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APA (6th Edition):

Mendez, J. E. (2016). Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. (Masters Thesis). Oregon State University. Retrieved from http://hdl.handle.net/1957/60106

Chicago Manual of Style (16th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Masters Thesis, Oregon State University. Accessed August 22, 2019. http://hdl.handle.net/1957/60106.

MLA Handbook (7th Edition):

Mendez, Jose Eduardo. “Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System.” 2016. Web. 22 Aug 2019.

Vancouver:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Internet] [Masters thesis]. Oregon State University; 2016. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1957/60106.

Council of Science Editors:

Mendez JE. Thin Films via Chemical Solution Deposition Synthesis from the (Bi₀.₅Na₀.₅)TiO₃-(Bi₀.₅K₀.₅)TiO₃-Bi(Mg₀.₅Ti₀.₅)O₃ Ternary System. [Masters Thesis]. Oregon State University; 2016. Available from: http://hdl.handle.net/1957/60106


Virginia Tech

10. Gupta, Shashaank. High Performance Lead – free Piezoelectric Materials.

Degree: PhD, Materials Science and Engineering, 2013, Virginia Tech

 Piezoelectric materials find applications in number of devices requiring inter-conversion of mechanical and electrical energy.  These devices include different types of sensors, actuators and energy… (more)

Subjects/Keywords: KNN; Ferroelectric; Piezoelectric; Lead free

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APA (6th Edition):

Gupta, S. (2013). High Performance Lead – free Piezoelectric Materials. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/50959

Chicago Manual of Style (16th Edition):

Gupta, Shashaank. “High Performance Lead – free Piezoelectric Materials.” 2013. Doctoral Dissertation, Virginia Tech. Accessed August 22, 2019. http://hdl.handle.net/10919/50959.

MLA Handbook (7th Edition):

Gupta, Shashaank. “High Performance Lead – free Piezoelectric Materials.” 2013. Web. 22 Aug 2019.

Vancouver:

Gupta S. High Performance Lead – free Piezoelectric Materials. [Internet] [Doctoral dissertation]. Virginia Tech; 2013. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/10919/50959.

Council of Science Editors:

Gupta S. High Performance Lead – free Piezoelectric Materials. [Doctoral Dissertation]. Virginia Tech; 2013. Available from: http://hdl.handle.net/10919/50959


Delft University of Technology

11. Mascarenhas, N.T. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.

Degree: 2015, Delft University of Technology

 Vibrations are inherent part in an aircraft system and supressing them has always been a technological challenge. Over the recent years, damping of mechanical vibrations… (more)

Subjects/Keywords: lead free; piezoelectric composite; flexible

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APA (6th Edition):

Mascarenhas, N. T. (2015). Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. (Masters Thesis). Delft University of Technology. Retrieved from http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74

Chicago Manual of Style (16th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Masters Thesis, Delft University of Technology. Accessed August 22, 2019. http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

MLA Handbook (7th Edition):

Mascarenhas, N T. “Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:.” 2015. Web. 22 Aug 2019.

Vancouver:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Internet] [Masters thesis]. Delft University of Technology; 2015. [cited 2019 Aug 22]. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74.

Council of Science Editors:

Mascarenhas NT. Highly Flexible lead-free piezoelectric composites- For vibration damping and noise cancellation application:. [Masters Thesis]. Delft University of Technology; 2015. Available from: http://resolver.tudelft.nl/uuid:d54fa42f-d731-443a-8178-73531f87ec74


University of New South Wales

12. Tung, Patrick. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.

Degree: Materials Science & Engineering, 2014, University of New South Wales

Lead-free piezoelectric materials are likely to be needed in the near future to replace lead-based materials in applications due to regulatory, health and safety issues.… (more)

Subjects/Keywords: NBT; Diffuse scattering; Lead-free

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APA (6th Edition):

Tung, P. (2014). Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. (Masters Thesis). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Masters Thesis, University of New South Wales. Accessed August 22, 2019. http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

MLA Handbook (7th Edition):

Tung, Patrick. “Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering.” 2014. Web. 22 Aug 2019.

Vancouver:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Internet] [Masters thesis]. University of New South Wales; 2014. [cited 2019 Aug 22]. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true.

Council of Science Editors:

Tung P. Modelling of Disorder in Lead-Free Sodium Bismuth Titanate Ferroelectric Single Crystals Using Diffuse X-ray Scattering. [Masters Thesis]. University of New South Wales; 2014. Available from: http://handle.unsw.edu.au/1959.4/53584 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:12279/SOURCE02?view=true

13. KATTA MOHAN KUMAR. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.

Degree: 2009, National University of Singapore

Subjects/Keywords: nano-particles; lead-free solders; CTE; mechanical properties; microstructure; reliability

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APA (6th Edition):

KUMAR, K. M. (2009). NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/16554

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

KUMAR, KATTA MOHAN. “NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.” 2009. Thesis, National University of Singapore. Accessed August 22, 2019. http://scholarbank.nus.edu.sg/handle/10635/16554.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

KUMAR, KATTA MOHAN. “NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS.” 2009. Web. 22 Aug 2019.

Vancouver:

KUMAR KM. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. [Internet] [Thesis]. National University of Singapore; 2009. [cited 2019 Aug 22]. Available from: http://scholarbank.nus.edu.sg/handle/10635/16554.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

KUMAR KM. NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. [Thesis]. National University of Singapore; 2009. Available from: http://scholarbank.nus.edu.sg/handle/10635/16554

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

14. MD ERSHADUL ALAM. Development of New Tin Based Formulations.

Degree: 2009, National University of Singapore

Subjects/Keywords: Lead-free solders; Powder metallurgy; Disintegrated melt deposition; Wettability; Strength and Ductility.

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APA (6th Edition):

ALAM, M. E. (2009). Development of New Tin Based Formulations. (Thesis). National University of Singapore. Retrieved from http://scholarbank.nus.edu.sg/handle/10635/17385

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

ALAM, MD ERSHADUL. “Development of New Tin Based Formulations.” 2009. Thesis, National University of Singapore. Accessed August 22, 2019. http://scholarbank.nus.edu.sg/handle/10635/17385.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

ALAM, MD ERSHADUL. “Development of New Tin Based Formulations.” 2009. Web. 22 Aug 2019.

Vancouver:

ALAM ME. Development of New Tin Based Formulations. [Internet] [Thesis]. National University of Singapore; 2009. [cited 2019 Aug 22]. Available from: http://scholarbank.nus.edu.sg/handle/10635/17385.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

ALAM ME. Development of New Tin Based Formulations. [Thesis]. National University of Singapore; 2009. Available from: http://scholarbank.nus.edu.sg/handle/10635/17385

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

15. Vigneshwaran, Murugan. Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用.

Degree: 博士(工学), 2017, Kyushu Institute of Technology / 九州工業大学

MAPbI3 with chloride additive is the suitable material for planar architecture of perovskite solar cells and it also have very good photoluminescence property. Addition of… (more)

Subjects/Keywords: Perovskite; Lead based; Grain size; Less defect; Lead free; Low bandgap

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APA (6th Edition):

Vigneshwaran, . M. (2017). Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用. (Thesis). Kyushu Institute of Technology / 九州工業大学. Retrieved from http://hdl.handle.net/10228/00006330

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Vigneshwaran, Murugan. “Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用.” 2017. Thesis, Kyushu Institute of Technology / 九州工業大学. Accessed August 22, 2019. http://hdl.handle.net/10228/00006330.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Vigneshwaran, Murugan. “Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用.” 2017. Web. 22 Aug 2019.

Vancouver:

Vigneshwaran M. Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用. [Internet] [Thesis]. Kyushu Institute of Technology / 九州工業大学; 2017. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/10228/00006330.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Vigneshwaran M. Inorganic light absorbers for printable solar cell applications : 無機光吸収材料のプリンタブル太陽電池への応用. [Thesis]. Kyushu Institute of Technology / 九州工業大学; 2017. Available from: http://hdl.handle.net/10228/00006330

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Penn State University

16. Gurdal, Erkan Ahmet. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.

Degree: MS, Materials Science and Engineering, 2011, Penn State University

Lead-zirconate-titanate (PZT) has been overwhelmingly studied and it has dominated the last 50 years in piezoelectric applications. Although PZT has excellent piezoelectric properties and it… (more)

Subjects/Keywords: transformer; high power; lead-free; Piezoelectric

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APA (6th Edition):

Gurdal, E. A. (2011). (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. (Masters Thesis). Penn State University. Retrieved from https://etda.libraries.psu.edu/catalog/11775

Chicago Manual of Style (16th Edition):

Gurdal, Erkan Ahmet. “(Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.” 2011. Masters Thesis, Penn State University. Accessed August 22, 2019. https://etda.libraries.psu.edu/catalog/11775.

MLA Handbook (7th Edition):

Gurdal, Erkan Ahmet. “(Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS.” 2011. Web. 22 Aug 2019.

Vancouver:

Gurdal EA. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. [Internet] [Masters thesis]. Penn State University; 2011. [cited 2019 Aug 22]. Available from: https://etda.libraries.psu.edu/catalog/11775.

Council of Science Editors:

Gurdal EA. (Na0.5K0.5)NbO3-BASED LEAD-FREE HIGH POWER PIEZOELECTRIC TRANSFORMERS. [Masters Thesis]. Penn State University; 2011. Available from: https://etda.libraries.psu.edu/catalog/11775


Universidade do Minho

17. Pereira, José Carlos Rodrigues. Impacto do azoto no processo de soldadura reflow .

Degree: 2015, Universidade do Minho

 Atualmente as empresas têm de estar organizadas para reagir rapidamente a mudanças estruturais pois cada vez mais os desafios competitivos derivam dos requisitos de qualidade… (more)

Subjects/Keywords: Reflow; Lead-free; Azoto; RoHS; DOE; Nitrogen

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APA (6th Edition):

Pereira, J. C. R. (2015). Impacto do azoto no processo de soldadura reflow . (Masters Thesis). Universidade do Minho. Retrieved from http://hdl.handle.net/1822/39170

Chicago Manual of Style (16th Edition):

Pereira, José Carlos Rodrigues. “Impacto do azoto no processo de soldadura reflow .” 2015. Masters Thesis, Universidade do Minho. Accessed August 22, 2019. http://hdl.handle.net/1822/39170.

MLA Handbook (7th Edition):

Pereira, José Carlos Rodrigues. “Impacto do azoto no processo de soldadura reflow .” 2015. Web. 22 Aug 2019.

Vancouver:

Pereira JCR. Impacto do azoto no processo de soldadura reflow . [Internet] [Masters thesis]. Universidade do Minho; 2015. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1822/39170.

Council of Science Editors:

Pereira JCR. Impacto do azoto no processo de soldadura reflow . [Masters Thesis]. Universidade do Minho; 2015. Available from: http://hdl.handle.net/1822/39170


University of Manchester

18. Khalf, Abdulkarim Ziedan. Lead-free ferroelectric glass-ceramics and composites.

Degree: 2018, University of Manchester

 Glass-ceramic composites and nanocrystalline glass-ceramics containing barium titanate (BT) or potassium sodium niobate (KNN) ferroelectric phases have been studied, with particular regard to their use… (more)

Subjects/Keywords: Lead free; glass-ceramics; XRD diffraction

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APA (6th Edition):

Khalf, A. Z. (2018). Lead-free ferroelectric glass-ceramics and composites. (Doctoral Dissertation). University of Manchester. Retrieved from http://www.manchester.ac.uk/escholar/uk-ac-man-scw:313700

Chicago Manual of Style (16th Edition):

Khalf, Abdulkarim Ziedan. “Lead-free ferroelectric glass-ceramics and composites.” 2018. Doctoral Dissertation, University of Manchester. Accessed August 22, 2019. http://www.manchester.ac.uk/escholar/uk-ac-man-scw:313700.

MLA Handbook (7th Edition):

Khalf, Abdulkarim Ziedan. “Lead-free ferroelectric glass-ceramics and composites.” 2018. Web. 22 Aug 2019.

Vancouver:

Khalf AZ. Lead-free ferroelectric glass-ceramics and composites. [Internet] [Doctoral dissertation]. University of Manchester; 2018. [cited 2019 Aug 22]. Available from: http://www.manchester.ac.uk/escholar/uk-ac-man-scw:313700.

Council of Science Editors:

Khalf AZ. Lead-free ferroelectric glass-ceramics and composites. [Doctoral Dissertation]. University of Manchester; 2018. Available from: http://www.manchester.ac.uk/escholar/uk-ac-man-scw:313700


University of Manchester

19. Khalf, Abdulkarim. Lead-free ferroelectric glass-ceramics and composites.

Degree: PhD, 2018, University of Manchester

 Glass-ceramic composites and nanocrystalline glass-ceramics containing barium titanate (BT) or potassium sodium niobate (KNN) ferroelectric phases have been studied, with particular regard to their use… (more)

Subjects/Keywords: 620; Lead free; glass-ceramics; XRD diffraction

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APA (6th Edition):

Khalf, A. (2018). Lead-free ferroelectric glass-ceramics and composites. (Doctoral Dissertation). University of Manchester. Retrieved from https://www.research.manchester.ac.uk/portal/en/theses/leadfree-ferroelectric-glassceramics-and-composites(33a5ca87-89ca-48d3-94c8-eb3c166067d5).html ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.740402

Chicago Manual of Style (16th Edition):

Khalf, Abdulkarim. “Lead-free ferroelectric glass-ceramics and composites.” 2018. Doctoral Dissertation, University of Manchester. Accessed August 22, 2019. https://www.research.manchester.ac.uk/portal/en/theses/leadfree-ferroelectric-glassceramics-and-composites(33a5ca87-89ca-48d3-94c8-eb3c166067d5).html ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.740402.

MLA Handbook (7th Edition):

Khalf, Abdulkarim. “Lead-free ferroelectric glass-ceramics and composites.” 2018. Web. 22 Aug 2019.

Vancouver:

Khalf A. Lead-free ferroelectric glass-ceramics and composites. [Internet] [Doctoral dissertation]. University of Manchester; 2018. [cited 2019 Aug 22]. Available from: https://www.research.manchester.ac.uk/portal/en/theses/leadfree-ferroelectric-glassceramics-and-composites(33a5ca87-89ca-48d3-94c8-eb3c166067d5).html ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.740402.

Council of Science Editors:

Khalf A. Lead-free ferroelectric glass-ceramics and composites. [Doctoral Dissertation]. University of Manchester; 2018. Available from: https://www.research.manchester.ac.uk/portal/en/theses/leadfree-ferroelectric-glassceramics-and-composites(33a5ca87-89ca-48d3-94c8-eb3c166067d5).html ; https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.740402


Virginia Tech

20. Yang, Su Chul. Lead - Free Piezoelectric Based Magnetoelectric Composites.

Degree: PhD, Materials Science and Engineering, 2012, Virginia Tech

 The prime objective of this dissertation is to design, synthesize and characterize lead-free piezoelectric based magnetostrictive components based magnetoelectric (ME) composites that exhibit self-bias characteristics… (more)

Subjects/Keywords: Lead-free; Piezoelectric; Magnetoelectric and self-bias.

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APA (6th Edition):

Yang, S. C. (2012). Lead - Free Piezoelectric Based Magnetoelectric Composites. (Doctoral Dissertation). Virginia Tech. Retrieved from http://hdl.handle.net/10919/49560

Chicago Manual of Style (16th Edition):

Yang, Su Chul. “Lead - Free Piezoelectric Based Magnetoelectric Composites.” 2012. Doctoral Dissertation, Virginia Tech. Accessed August 22, 2019. http://hdl.handle.net/10919/49560.

MLA Handbook (7th Edition):

Yang, Su Chul. “Lead - Free Piezoelectric Based Magnetoelectric Composites.” 2012. Web. 22 Aug 2019.

Vancouver:

Yang SC. Lead - Free Piezoelectric Based Magnetoelectric Composites. [Internet] [Doctoral dissertation]. Virginia Tech; 2012. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/10919/49560.

Council of Science Editors:

Yang SC. Lead - Free Piezoelectric Based Magnetoelectric Composites. [Doctoral Dissertation]. Virginia Tech; 2012. Available from: http://hdl.handle.net/10919/49560


KTH

21. Lewin, Susanne. Mechanical Reliability of Aged LeadFree Solders.

Degree: Materials Science and Engineering, 2012, KTH

  The usage of leadfree solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards… (more)

Subjects/Keywords: Solder Joints; Lead-free; Mechanical Reliability

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APA (6th Edition):

Lewin, S. (2012). Mechanical Reliability of Aged Lead-­Free Solders. (Thesis). KTH. Retrieved from http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-98372

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lewin, Susanne. “Mechanical Reliability of Aged Lead-­Free Solders.” 2012. Thesis, KTH. Accessed August 22, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-98372.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lewin, Susanne. “Mechanical Reliability of Aged Lead-­Free Solders.” 2012. Web. 22 Aug 2019.

Vancouver:

Lewin S. Mechanical Reliability of Aged Lead-­Free Solders. [Internet] [Thesis]. KTH; 2012. [cited 2019 Aug 22]. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-98372.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lewin S. Mechanical Reliability of Aged Lead-­Free Solders. [Thesis]. KTH; 2012. Available from: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-98372

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


University of Toronto

22. Kaila, Rishi. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.

Degree: 2011, University of Toronto

Due to the introduction of Restriction of Hazardous Substances (RoHS) directive Pb containing solders have been banned from the electronics industry and a reliable replacement… (more)

Subjects/Keywords: Lead Free Solder; Mixed Assembly; 0794

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APA (6th Edition):

Kaila, R. (2011). Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/30652

Chicago Manual of Style (16th Edition):

Kaila, Rishi. “Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.” 2011. Masters Thesis, University of Toronto. Accessed August 22, 2019. http://hdl.handle.net/1807/30652.

MLA Handbook (7th Edition):

Kaila, Rishi. “Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys.” 2011. Web. 22 Aug 2019.

Vancouver:

Kaila R. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. [Internet] [Masters thesis]. University of Toronto; 2011. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1807/30652.

Council of Science Editors:

Kaila R. Investigation of Mixed Solder Assemblies & Novel Lead-free Solder Alloys. [Masters Thesis]. University of Toronto; 2011. Available from: http://hdl.handle.net/1807/30652


University of Toronto

23. Matijevic, Ivan. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.

Degree: 2017, University of Toronto

Compliance with RoHS requirements has necessitated the development of high reliability alternatives to SAC305 lead-free solder. Bismuth containing ternary and quaternary alloys are emerging as… (more)

Subjects/Keywords: Bismuth; Lead-free; Quaternary; Solvus; Ternary; 0794

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APA (6th Edition):

Matijevic, I. (2017). Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. (Masters Thesis). University of Toronto. Retrieved from http://hdl.handle.net/1807/91188

Chicago Manual of Style (16th Edition):

Matijevic, Ivan. “Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.” 2017. Masters Thesis, University of Toronto. Accessed August 22, 2019. http://hdl.handle.net/1807/91188.

MLA Handbook (7th Edition):

Matijevic, Ivan. “Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys.” 2017. Web. 22 Aug 2019.

Vancouver:

Matijevic I. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. [Internet] [Masters thesis]. University of Toronto; 2017. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1807/91188.

Council of Science Editors:

Matijevic I. Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-free Solder Alloys. [Masters Thesis]. University of Toronto; 2017. Available from: http://hdl.handle.net/1807/91188


University of New South Wales

24. Marlton, Fred. Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics.

Degree: Materials Science & Engineering, 2018, University of New South Wales

 Piezoelectric ceramics are used in a wide range of technologies due to their ability to couple mechanical and electrical energy. These materials have traditionally been… (more)

Subjects/Keywords: lead-free; Piezoelectrics; x-ray diffraction

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APA (6th Edition):

Marlton, F. (2018). Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics. (Doctoral Dissertation). University of New South Wales. Retrieved from http://handle.unsw.edu.au/1959.4/60346 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:51892/SOURCE02?view=true

Chicago Manual of Style (16th Edition):

Marlton, Fred. “Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics.” 2018. Doctoral Dissertation, University of New South Wales. Accessed August 22, 2019. http://handle.unsw.edu.au/1959.4/60346 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:51892/SOURCE02?view=true.

MLA Handbook (7th Edition):

Marlton, Fred. “Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics.” 2018. Web. 22 Aug 2019.

Vancouver:

Marlton F. Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics. [Internet] [Doctoral dissertation]. University of New South Wales; 2018. [cited 2019 Aug 22]. Available from: http://handle.unsw.edu.au/1959.4/60346 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:51892/SOURCE02?view=true.

Council of Science Editors:

Marlton F. Combinatorial fabrication and structural analysis of ternary lead-free piezoelectrics. [Doctoral Dissertation]. University of New South Wales; 2018. Available from: http://handle.unsw.edu.au/1959.4/60346 ; https://unsworks.unsw.edu.au/fapi/datastream/unsworks:51892/SOURCE02?view=true


University of Arizona

25. Sane, Shantanu Madhavrao. Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion.

Degree: 2007, University of Arizona

 The disturbed state concept (DSC) based constitutive model is the focus of this research. It is applied for characterizing two problems; thermomechanical reliability analysis of… (more)

Subjects/Keywords: Disturbed State Concept; Lead Free Solders; Viscous behavior; Glacial till; Constitutive modeling; Laboratory Testing

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APA (6th Edition):

Sane, S. M. (2007). Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. (Doctoral Dissertation). University of Arizona. Retrieved from http://hdl.handle.net/10150/194615

Chicago Manual of Style (16th Edition):

Sane, Shantanu Madhavrao. “Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. ” 2007. Doctoral Dissertation, University of Arizona. Accessed August 22, 2019. http://hdl.handle.net/10150/194615.

MLA Handbook (7th Edition):

Sane, Shantanu Madhavrao. “Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. ” 2007. Web. 22 Aug 2019.

Vancouver:

Sane SM. Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. [Internet] [Doctoral dissertation]. University of Arizona; 2007. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/10150/194615.

Council of Science Editors:

Sane SM. Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. [Doctoral Dissertation]. University of Arizona; 2007. Available from: http://hdl.handle.net/10150/194615

26. Lima, Ricardo Barbosa de. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).

Degree: Mestrado, Microeletrônica, 2011, University of São Paulo

Neste trabalho foram estudadas as etapas de processo envolvidas na tecnologia Pin-in-Paste (PIP) de soldagem por refusão de componentes convencionais (THCs - Through Hole Components… (more)

Subjects/Keywords: Circuito impresso; Electronic assembly; Lead-free; Lead-free; Montagem eletrônica; Pin-in-Paste; Pin-in-Paste; Printed circuit boards

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APA (6th Edition):

Lima, R. B. d. (2011). Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). (Masters Thesis). University of São Paulo. Retrieved from http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;

Chicago Manual of Style (16th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Masters Thesis, University of São Paulo. Accessed August 22, 2019. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

MLA Handbook (7th Edition):

Lima, Ricardo Barbosa de. “Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC).” 2011. Web. 22 Aug 2019.

Vancouver:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Internet] [Masters thesis]. University of São Paulo; 2011. [cited 2019 Aug 22]. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;.

Council of Science Editors:

Lima RBd. Estudo da aplicação do processo Pin-in-Paste na montagem de placas de circuito impresso usando pasta de solda lead-free (SAC). [Masters Thesis]. University of São Paulo; 2011. Available from: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-03072012-182156/ ;


Georgia Tech

27. Tunga, Krishna Rajaram. Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry.

Degree: PhD, Mechanical Engineering, 2008, Georgia Tech

 This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moiré interferometry… (more)

Subjects/Keywords: Fatigue life prediction; Solder joint fatigue; Microstructure evolution; SAC405; SAC305; Laser moire interferometry; Finite element modeling; Lead-free solders; Moiré method; Ball grid array technology; Electronic packaging

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Tunga, K. R. (2008). Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/24805

Chicago Manual of Style (16th Edition):

Tunga, Krishna Rajaram. “Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry.” 2008. Doctoral Dissertation, Georgia Tech. Accessed August 22, 2019. http://hdl.handle.net/1853/24805.

MLA Handbook (7th Edition):

Tunga, Krishna Rajaram. “Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry.” 2008. Web. 22 Aug 2019.

Vancouver:

Tunga KR. Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1853/24805.

Council of Science Editors:

Tunga KR. Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/24805

28. Mattila, Toni. Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading.

Degree: 2005, Helsinki University of Technology

The reliability of portable electronic devices was studied by applying standardized test procedures for test vehicles that represent the technologies and lead-free materials typically used… (more)

Subjects/Keywords: drop testing; failure mechanism; failure mode; chip-scale package; lead-free

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APA (6th Edition):

Mattila, T. (2005). Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading. (Thesis). Helsinki University of Technology. Retrieved from http://lib.tkk.fi/Diss/2005/isbn9512279843/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Mattila, Toni. “Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading.” 2005. Thesis, Helsinki University of Technology. Accessed August 22, 2019. http://lib.tkk.fi/Diss/2005/isbn9512279843/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Mattila, Toni. “Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading.” 2005. Web. 22 Aug 2019.

Vancouver:

Mattila T. Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading. [Internet] [Thesis]. Helsinki University of Technology; 2005. [cited 2019 Aug 22]. Available from: http://lib.tkk.fi/Diss/2005/isbn9512279843/.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Mattila T. Reliability of High-Density Lead-Free Solder Interconnections under Thermal Cycling and Mechanical Shock Loading. [Thesis]. Helsinki University of Technology; 2005. Available from: http://lib.tkk.fi/Diss/2005/isbn9512279843/

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

29. Patterson, Eric Andrew. Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics.

Degree: PhD, Materials Science, 2012, Oregon State University

 Much recent research has focused on the development lead-free perovskite piezoelectrics as environmentally compatible alternatives to lead zirconate titanate (PZT). Two main categories of lead(more)

Subjects/Keywords: Lead-free Piezoelectric; Perovskite

…35 2.7 Lead-Free Perovskite Piezoelectrics… …67 Development. Characterization and Piezoelectric Fatigue Behavior of Lead- Free… …driving the development of the Pb-free solders that are currently in use throughout the… …electronics industry. Therefore, the search for lead-free alternatives to lead-zirconate-titanate… …lead-free systems will also be 2 evaluated in detail to determine if their behavior is as… 

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APA (6th Edition):

Patterson, E. A. (2012). Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics. (Doctoral Dissertation). Oregon State University. Retrieved from http://hdl.handle.net/1957/34828

Chicago Manual of Style (16th Edition):

Patterson, Eric Andrew. “Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics.” 2012. Doctoral Dissertation, Oregon State University. Accessed August 22, 2019. http://hdl.handle.net/1957/34828.

MLA Handbook (7th Edition):

Patterson, Eric Andrew. “Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics.” 2012. Web. 22 Aug 2019.

Vancouver:

Patterson EA. Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics. [Internet] [Doctoral dissertation]. Oregon State University; 2012. [cited 2019 Aug 22]. Available from: http://hdl.handle.net/1957/34828.

Council of Science Editors:

Patterson EA. Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics. [Doctoral Dissertation]. Oregon State University; 2012. Available from: http://hdl.handle.net/1957/34828


NSYSU

30. Wang, Tai-sheng. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU

 Solder bump is used to connect organic substrate with chip to form Flip Chip package. Comparing to wire bond package, the path is reduced so… (more)

Subjects/Keywords: Underfill; Lead Free Bump; 40nm Wafer Technology; Reliability Test

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, T. (2010). Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Tai-sheng. “Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.” 2010. Thesis, NSYSU. Accessed August 22, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Tai-sheng. “Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology.” 2010. Web. 22 Aug 2019.

Vancouver:

Wang T. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. [Internet] [Thesis]. NSYSU; 2010. [cited 2019 Aug 22]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang T. Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0202110-021248

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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