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You searched for +publisher:"University of Texas – Austin" +contributor:("Ho, Paul S."). Showing records 1 – 19 of 19 total matches.

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University of Texas – Austin

1. Chen, Boxue. Electrically active microfluidic fibers.

Degree: PhD, Electrical and Computer Engineering, 2019, University of Texas – Austin

 In recent years, novel materials processing techniques involving PDMS and paper materials have enabled revolutionary progress in performance and capability of chip-scale microfluidics. However, microfluidic… (more)

Subjects/Keywords: Multimaterial fibers; Microfluidics; Fiber pumps; Fiber flow sensors; Fiber distributed sensors; Flexible electronics

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APA (6th Edition):

Chen, B. (2019). Electrically active microfluidic fibers. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://dx.doi.org/10.26153/tsw/2217

Chicago Manual of Style (16th Edition):

Chen, Boxue. “Electrically active microfluidic fibers.” 2019. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://dx.doi.org/10.26153/tsw/2217.

MLA Handbook (7th Edition):

Chen, Boxue. “Electrically active microfluidic fibers.” 2019. Web. 02 Mar 2021.

Vancouver:

Chen B. Electrically active microfluidic fibers. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2019. [cited 2021 Mar 02]. Available from: http://dx.doi.org/10.26153/tsw/2217.

Council of Science Editors:

Chen B. Electrically active microfluidic fibers. [Doctoral Dissertation]. University of Texas – Austin; 2019. Available from: http://dx.doi.org/10.26153/tsw/2217


University of Texas – Austin

2. -6106-1067. Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing.

Degree: PhD, Electrical and Computer Engineering, 2018, University of Texas – Austin

 Investigations on how informative signals interact with optical light wave propagating in integrated photonic devices have been emerging research topics for various sensing and high-speed… (more)

Subjects/Keywords: Integrated photonics; Nanophotonics; Radio frequency photonics; Electro-optics modulation; True time delay; Polarization-selective devices; Absorption spectroscopy sensor

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APA (6th Edition):

-6106-1067. (2018). Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/68622

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Author name may be incomplete

Chicago Manual of Style (16th Edition):

-6106-1067. “Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing.” 2018. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/68622.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-6106-1067. “Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing.” 2018. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-6106-1067. Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2018. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/68622.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-6106-1067. Integrated photonic devices for electromagnetic wave sensing, optical true time delay, and trace gas sensing. [Doctoral Dissertation]. University of Texas – Austin; 2018. Available from: http://hdl.handle.net/2152/68622

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Author name may be incomplete


University of Texas – Austin

3. -8956-2349. Polymer-based integrated photonic devices for interconnects.

Degree: PhD, Electrical and Computer Engineering, 2018, University of Texas – Austin

 Integrated photonic devices based on optical waveguides have been extensively studied for various applications, especially the high-speed intra- and inter-chip interconnects. Usually, a waveguide contains… (more)

Subjects/Keywords: Polymer; Optics; Photonics; Silicon; Fabrication; Measurement; Waveguide; MUX; DEMUX; Integrated; Interconnects; Thermo-optic; Electro-optic; Roll-to-roll; Ring; Modulator; Switch; High speed; Antenna; PAA; TTD

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APA (6th Edition):

-8956-2349. (2018). Polymer-based integrated photonic devices for interconnects. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/65926

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Author name may be incomplete

Chicago Manual of Style (16th Edition):

-8956-2349. “Polymer-based integrated photonic devices for interconnects.” 2018. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/65926.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-8956-2349. “Polymer-based integrated photonic devices for interconnects.” 2018. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-8956-2349. Polymer-based integrated photonic devices for interconnects. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2018. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/65926.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-8956-2349. Polymer-based integrated photonic devices for interconnects. [Doctoral Dissertation]. University of Texas – Austin; 2018. Available from: http://hdl.handle.net/2152/65926

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete


University of Texas – Austin

4. Ryu, Suk-Kyu. Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures.

Degree: PhD, Aerospace Engineering, 2011, University of Texas – Austin

 Continual scaling of devices and on-chip wiring has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, three-dimensional (3-D)… (more)

Subjects/Keywords: 3-D interconnect; Trough-silicon vias; Thermomechanical reliability; Thermal stresses; Bending beam curvature technique; Raman spectroscopy

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APA (6th Edition):

Ryu, S. (2011). Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2011-12-4580

Chicago Manual of Style (16th Edition):

Ryu, Suk-Kyu. “Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures.” 2011. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2011-12-4580.

MLA Handbook (7th Edition):

Ryu, Suk-Kyu. “Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures.” 2011. Web. 02 Mar 2021.

Vancouver:

Ryu S. Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2011. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2011-12-4580.

Council of Science Editors:

Ryu S. Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures. [Doctoral Dissertation]. University of Texas – Austin; 2011. Available from: http://hdl.handle.net/2152/ETD-UT-2011-12-4580


University of Texas – Austin

5. Chen, Ying-Chen. Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications.

Degree: PhD, Electrical and Computer Engineering, 2019, University of Texas – Austin

 With increasing demand for high-density memory applications, alternative memory technology has been intensively investigated for replacing conventional charge-based flash memory. Among the emerging memory technology,… (more)

Subjects/Keywords: RRAM; Non-volatile memory; Nonlinearity; Selectorless

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APA (6th Edition):

Chen, Y. (2019). Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://dx.doi.org/10.26153/tsw/5799

Chicago Manual of Style (16th Edition):

Chen, Ying-Chen. “Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications.” 2019. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://dx.doi.org/10.26153/tsw/5799.

MLA Handbook (7th Edition):

Chen, Ying-Chen. “Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications.” 2019. Web. 02 Mar 2021.

Vancouver:

Chen Y. Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2019. [cited 2021 Mar 02]. Available from: http://dx.doi.org/10.26153/tsw/5799.

Council of Science Editors:

Chen Y. Selector-less resistive random access memory (RRAM) with intrinsic nonlinearity for crossbar array applications. [Doctoral Dissertation]. University of Texas – Austin; 2019. Available from: http://dx.doi.org/10.26153/tsw/5799


University of Texas – Austin

6. -9116-0082. Design and development of base-catalyzed materials for microelectronics applications.

Degree: PhD, Chemical engineering, 2016, University of Texas – Austin

 Most lithographic processes in the microelectronics industry rely on the use of processes catalyzed by photochemically generated acids. The generation of organic bases photochemically is… (more)

Subjects/Keywords: Base catalyzed; Polyimide; Packaging dielectric; Photobase generator

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APA (6th Edition):

-9116-0082. (2016). Design and development of base-catalyzed materials for microelectronics applications. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/41769

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Chicago Manual of Style (16th Edition):

-9116-0082. “Design and development of base-catalyzed materials for microelectronics applications.” 2016. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/41769.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-9116-0082. “Design and development of base-catalyzed materials for microelectronics applications.” 2016. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-9116-0082. Design and development of base-catalyzed materials for microelectronics applications. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2016. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/41769.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-9116-0082. Design and development of base-catalyzed materials for microelectronics applications. [Doctoral Dissertation]. University of Texas – Austin; 2016. Available from: http://hdl.handle.net/2152/41769

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Author name may be incomplete


University of Texas – Austin

7. Yum, Jung Hwan, 1978-. Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices.

Degree: PhD, Electrical and Computer Engineering, 2012, University of Texas – Austin

 The continuous improvement in the semiconductor industry has been successfully achieved by the reducing dimensions of CMOS (complementary metal oxide semiconductor) technology. For the last… (more)

Subjects/Keywords: ALD beryllium oxide; ALD BeO; Dimethylberyllium; Diethylberyllium

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APA (6th Edition):

Yum, Jung Hwan, 1. (2012). Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2012-05-4987

Chicago Manual of Style (16th Edition):

Yum, Jung Hwan, 1978-. “Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices.” 2012. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2012-05-4987.

MLA Handbook (7th Edition):

Yum, Jung Hwan, 1978-. “Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices.” 2012. Web. 02 Mar 2021.

Vancouver:

Yum, Jung Hwan 1. Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2012. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2012-05-4987.

Council of Science Editors:

Yum, Jung Hwan 1. Atomic layer deposited beryllium oxide as a gate dielectric or interfacial Layer for Si and III-V MOS devices. [Doctoral Dissertation]. University of Texas – Austin; 2012. Available from: http://hdl.handle.net/2152/ETD-UT-2012-05-4987


University of Texas – Austin

8. -8943-9305. Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications.

Degree: PhD, Electrical and Computer engineering, 2015, University of Texas – Austin

 Floating gate (FG) nonvolatile memory has been the main structure of nonvolatile memory devices, since its invention in 1967 by D. Kahng and S. M.… (more)

Subjects/Keywords: ReRAM; Silicon oxide

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APA (6th Edition):

-8943-9305. (2015). Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/32441

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Author name may be incomplete

Chicago Manual of Style (16th Edition):

-8943-9305. “Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications.” 2015. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/32441.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-8943-9305. “Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications.” 2015. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-8943-9305. Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2015. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/32441.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-8943-9305. Intrinsic unipolar SiOx-based resistive switching memory: characterization, mechanism and applications. [Doctoral Dissertation]. University of Texas – Austin; 2015. Available from: http://hdl.handle.net/2152/32441

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete


University of Texas – Austin

9. Chou, Harry. Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene.

Degree: PhD, Materials Science and Engineering, 2018, University of Texas – Austin

 Two dimensional materials have unique properties that are anisotropic in-plane and out-of-plane. They further exhibit unique properties when they are thinned down to an isolated… (more)

Subjects/Keywords: 2D materials; Graphene; Hexagonal boron nitride; TOF SIMS; SIMS; Photovoltaics

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APA (6th Edition):

Chou, H. (2018). Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://dx.doi.org/10.26153/tsw/2825

Chicago Manual of Style (16th Edition):

Chou, Harry. “Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene.” 2018. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://dx.doi.org/10.26153/tsw/2825.

MLA Handbook (7th Edition):

Chou, Harry. “Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene.” 2018. Web. 02 Mar 2021.

Vancouver:

Chou H. Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2018. [cited 2021 Mar 02]. Available from: http://dx.doi.org/10.26153/tsw/2825.

Council of Science Editors:

Chou H. Two-dimensional materials synthesis, characterization, and devices : working with hexagonal boron nitride and graphene. [Doctoral Dissertation]. University of Texas – Austin; 2018. Available from: http://dx.doi.org/10.26153/tsw/2825

10. -0109-2595. Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor.

Degree: PhD, Mechanical Engineering, 2018, University of Texas – Austin

 This research work presents the modeling, fabrication, and characterization of the optical microphone. The optical microphone detects diaphragm displacement due to input sound pressure, using… (more)

Subjects/Keywords: MEMS; Interferometry; Microphone; Optical; Diffraction; Noise; SNR

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APA (6th Edition):

-0109-2595. (2018). Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/68085

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Chicago Manual of Style (16th Edition):

-0109-2595. “Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor.” 2018. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/68085.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-0109-2595. “Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor.” 2018. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-0109-2595. Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2018. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/68085.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-0109-2595. Design of an optical microelectromechanical-system microphone with sub 15-dBA noise floor. [Doctoral Dissertation]. University of Texas – Austin; 2018. Available from: http://hdl.handle.net/2152/68085

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

11. Wakil, Jamil Abdul. Thermal and mechanical analysis of interconnect structures in 3D stacked packages.

Degree: PhD, Mechanical Engineering, 2010, University of Texas – Austin

 Physical scaling limits of microelectronic devices and the need to improve electrical performance have driven significant research and development into 3D architecture. The development of… (more)

Subjects/Keywords: 3D stacked packages; Thermal; Mechanical; Modeling; TSV; Transient; Interfacial resistance; Through-silicon vias

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APA (6th Edition):

Wakil, J. A. (2010). Thermal and mechanical analysis of interconnect structures in 3D stacked packages. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2010-05-993

Chicago Manual of Style (16th Edition):

Wakil, Jamil Abdul. “Thermal and mechanical analysis of interconnect structures in 3D stacked packages.” 2010. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2010-05-993.

MLA Handbook (7th Edition):

Wakil, Jamil Abdul. “Thermal and mechanical analysis of interconnect structures in 3D stacked packages.” 2010. Web. 02 Mar 2021.

Vancouver:

Wakil JA. Thermal and mechanical analysis of interconnect structures in 3D stacked packages. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2010. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2010-05-993.

Council of Science Editors:

Wakil JA. Thermal and mechanical analysis of interconnect structures in 3D stacked packages. [Doctoral Dissertation]. University of Texas – Austin; 2010. Available from: http://hdl.handle.net/2152/ETD-UT-2010-05-993

12. Koh, Donghyi. Advanced III-V MOSFET.

Degree: PhD, Electrical and Computer engineering, 2016, University of Texas – Austin

 As scaling of silicon-based CMOS devices approaches its end, there is an ever increasing interest in high mobility materials. Among potential candidates for future CMOS… (more)

Subjects/Keywords: III-V channel; InGaAs MOSFET; BeO; Interface quality; High-k gate stack

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APA (6th Edition):

Koh, D. (2016). Advanced III-V MOSFET. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/40246

Chicago Manual of Style (16th Edition):

Koh, Donghyi. “Advanced III-V MOSFET.” 2016. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/40246.

MLA Handbook (7th Edition):

Koh, Donghyi. “Advanced III-V MOSFET.” 2016. Web. 02 Mar 2021.

Vancouver:

Koh D. Advanced III-V MOSFET. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2016. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/40246.

Council of Science Editors:

Koh D. Advanced III-V MOSFET. [Doctoral Dissertation]. University of Texas – Austin; 2016. Available from: http://hdl.handle.net/2152/40246

13. Jiang, Tengfei. Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits.

Degree: PhD, Materials Science, 2015, University of Texas – Austin

 Copper (Cu) Through-silicon via (TSV) is a key enabling element that provides the vertical connection between stacked dies in three-dimensional (3D) integration. The thermal expansion… (more)

Subjects/Keywords: 3D integration; TSV; Microstructure; Reliability

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APA (6th Edition):

Jiang, T. (2015). Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/46563

Chicago Manual of Style (16th Edition):

Jiang, Tengfei. “Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits.” 2015. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/46563.

MLA Handbook (7th Edition):

Jiang, Tengfei. “Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits.” 2015. Web. 02 Mar 2021.

Vancouver:

Jiang T. Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2015. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/46563.

Council of Science Editors:

Jiang T. Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits. [Doctoral Dissertation]. University of Texas – Austin; 2015. Available from: http://hdl.handle.net/2152/46563

14. -6397-8706. Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology.

Degree: PhD, Electrical and Computer engineering, 2015, University of Texas – Austin

 The largest applications of layered two-dimensional (2D) materials such as graphene and transition metal dichalcogenides (TMDs) will likely be realized when combined with ubiquitous Si… (more)

Subjects/Keywords: Two-dimensional solids; Integrated silicon technology

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APA (6th Edition):

-6397-8706. (2015). Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/31378

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Chicago Manual of Style (16th Edition):

-6397-8706. “Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology.” 2015. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/31378.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

MLA Handbook (7th Edition):

-6397-8706. “Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology.” 2015. Web. 02 Mar 2021.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Vancouver:

-6397-8706. Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2015. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/31378.

Note: this citation may be lacking information needed for this citation format:
Author name may be incomplete

Council of Science Editors:

-6397-8706. Graphene and MoS2 devices for wafer-scale integrated silicon nanotechnology. [Doctoral Dissertation]. University of Texas – Austin; 2015. Available from: http://hdl.handle.net/2152/31378

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15. Kang, Min Kyoo. Swelling induced deformation and instability of hydrogels.

Degree: PhD, Engineering Mechanics, 2010, University of Texas – Austin

 A hydrogel consists of a cross-linked polymer network and solvent molecules, capable of large, reversible deformation in response to a variety of external stimuli. In… (more)

Subjects/Keywords: Surface instability; Hydrogel; Swelling; Hydrogel instability

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APA (6th Edition):

Kang, M. K. (2010). Swelling induced deformation and instability of hydrogels. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2010-08-1747

Chicago Manual of Style (16th Edition):

Kang, Min Kyoo. “Swelling induced deformation and instability of hydrogels.” 2010. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2010-08-1747.

MLA Handbook (7th Edition):

Kang, Min Kyoo. “Swelling induced deformation and instability of hydrogels.” 2010. Web. 02 Mar 2021.

Vancouver:

Kang MK. Swelling induced deformation and instability of hydrogels. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2010. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2010-08-1747.

Council of Science Editors:

Kang MK. Swelling induced deformation and instability of hydrogels. [Doctoral Dissertation]. University of Texas – Austin; 2010. Available from: http://hdl.handle.net/2152/ETD-UT-2010-08-1747

16. Hoy, Christopher Luk, 1982-. Development of femtosecond laser endoscopic microsurgery.

Degree: PhD, Mechanical Engineering, 2011, University of Texas – Austin

 Femtosecond laser microsurgery has emerged as a remarkable technique for precise ablation of biological systems with minimal damage to their surrounding tissues. The combination of… (more)

Subjects/Keywords: Nonlinear optics; Laser ablation; Endoscopy; Laser surgery

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APA (6th Edition):

Hoy, Christopher Luk, 1. (2011). Development of femtosecond laser endoscopic microsurgery. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2011-05-2659

Chicago Manual of Style (16th Edition):

Hoy, Christopher Luk, 1982-. “Development of femtosecond laser endoscopic microsurgery.” 2011. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2011-05-2659.

MLA Handbook (7th Edition):

Hoy, Christopher Luk, 1982-. “Development of femtosecond laser endoscopic microsurgery.” 2011. Web. 02 Mar 2021.

Vancouver:

Hoy, Christopher Luk 1. Development of femtosecond laser endoscopic microsurgery. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2011. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2011-05-2659.

Council of Science Editors:

Hoy, Christopher Luk 1. Development of femtosecond laser endoscopic microsurgery. [Doctoral Dissertation]. University of Texas – Austin; 2011. Available from: http://hdl.handle.net/2152/ETD-UT-2011-05-2659

17. Mei, Haixia. Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations.

Degree: PhD, Engineering Mechanics, 2011, University of Texas – Austin

 Different fracture modes have been observed in thin film structures. One common approach used in fracture analysis is based on the principle of linear elastic… (more)

Subjects/Keywords: Wrinkling; Buckle-delamination; Channel cracking; Thin films; Interface; Cohesive zone model

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Mei, H. (2011). Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2011-08-3877

Chicago Manual of Style (16th Edition):

Mei, Haixia. “Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations.” 2011. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2011-08-3877.

MLA Handbook (7th Edition):

Mei, Haixia. “Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations.” 2011. Web. 02 Mar 2021.

Vancouver:

Mei H. Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2011. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2011-08-3877.

Council of Science Editors:

Mei H. Fracture and delamination of elastic thin films on compliant substrates : modeling and simulations. [Doctoral Dissertation]. University of Texas – Austin; 2011. Available from: http://hdl.handle.net/2152/ETD-UT-2011-08-3877

18. Kameswaran, Jai Ganesh, 1983-. Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping.

Degree: PhD, Materials Science and Engineering, 2011, University of Texas – Austin

 The scaling required to accommodate faster chip performance in microelectronic devices has necessitated a reduction in the dimensions of copper interconnects at the back end… (more)

Subjects/Keywords: Orientation; Copper interconnects; Texture; Grain boundaries

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Kameswaran, Jai Ganesh, 1. (2011). Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2011-12-4937

Chicago Manual of Style (16th Edition):

Kameswaran, Jai Ganesh, 1983-. “Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping.” 2011. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2011-12-4937.

MLA Handbook (7th Edition):

Kameswaran, Jai Ganesh, 1983-. “Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping.” 2011. Web. 02 Mar 2021.

Vancouver:

Kameswaran, Jai Ganesh 1. Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2011. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2011-12-4937.

Council of Science Editors:

Kameswaran, Jai Ganesh 1. Effect of downscaling copper interconnects on the microstructure revealed by high resolution tem orientation mapping. [Doctoral Dissertation]. University of Texas – Austin; 2011. Available from: http://hdl.handle.net/2152/ETD-UT-2011-12-4937


University of Texas – Austin

19. Shi, Hualiang. Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery.

Degree: PhD, Physics, 2010, University of Texas – Austin

 Low-k dielectrics with porosity are being introduced to reduce the RC delay of Cu/low-k interconnect. However, during the O2 plasma ashing process, the porous low-k… (more)

Subjects/Keywords: Porous low-k dielectrics; Plasma; Diffusion; Radical; Photon; Ion; Thin film; Semiconductor; Characterization; Etching; Ashing; UV; Silylation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Shi, H. (2010). Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery. (Doctoral Dissertation). University of Texas – Austin. Retrieved from http://hdl.handle.net/2152/ETD-UT-2010-05-749

Chicago Manual of Style (16th Edition):

Shi, Hualiang. “Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery.” 2010. Doctoral Dissertation, University of Texas – Austin. Accessed March 02, 2021. http://hdl.handle.net/2152/ETD-UT-2010-05-749.

MLA Handbook (7th Edition):

Shi, Hualiang. “Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery.” 2010. Web. 02 Mar 2021.

Vancouver:

Shi H. Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery. [Internet] [Doctoral dissertation]. University of Texas – Austin; 2010. [cited 2021 Mar 02]. Available from: http://hdl.handle.net/2152/ETD-UT-2010-05-749.

Council of Science Editors:

Shi H. Mechanistic study of plasma damage to porous low-k : process development and dielectric recovery. [Doctoral Dissertation]. University of Texas – Austin; 2010. Available from: http://hdl.handle.net/2152/ETD-UT-2010-05-749

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