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You searched for +publisher:"NSYSU" +contributor:("Yeong-Shu Chen"). Showing records 1 – 3 of 3 total matches.

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NSYSU

1. Chen, You-Yi. Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

This study consists of two parts. First part is about the through via in printed circuit board (PCB). In the PCB, signal transmission between different layers occurs by way of through via. The excessive capacitance is generated near the through via. Such capacitance influences the signal transmission between different layers. Through via also cause return current path discontinuous. It excites parasitic transverse electromagnetic modes in PCB. Both excessive capacitance and return current path discontinuous cause the power loss. Some techniques solving this problem are discussed. Finite element method (FEM) is used to simulate the high frequency electromagnetism and extract the S-parameters. S-parameters are used to describe the electrical behavior of through via. By these model, we want to predict the signal transmission performance of the through via structure. Second part is about through silicon via (TSV). TSV which is used to connect stacked chips in a vertical fashion become the heart of this technique, because there are big signal attenuation in the wire bonding approach and large solder balls in the ï¬ip-chip. When a high frequency signal is transmitted vertically through the substrate via, low resistivity silicon substrate will cause significant signal attenuation and lead poor ratio frequency (RF) performance. 3D electromagnetic field solver is employed to build up finite element models. Equivalent circuit model is also used to simulate the electrical performance of TSV. The impact of different TSV shapes and materials on electrical performance is evaluated by using S-parameters. By these models, we want to propose an accurate finite element model to predict electrical performance of TSV and easily design 3D IC integration for designer. Advisors/Committee Members: Ben-Je Lwo (chair), Yeong-Shu Chen (chair), Mei-Ling Wu (committee member), Sheng-Chih Shen (chair).

Subjects/Keywords: Decoupling Capacitor; , Through Via; Shorting Via; Finite Element Method; Through Silicon Via; S-parameter; Equivalent Circuit Model

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen, Y. (2014). Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0406114-170143

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen, You-Yi. “Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields.” 2014. Thesis, NSYSU. Accessed March 08, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0406114-170143.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen, You-Yi. “Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields.” 2014. Web. 08 Mar 2021.

Vancouver:

Chen Y. Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 08]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0406114-170143.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen Y. Simulation and Analysis of 3D IC Through Silicon Vias (TSVs) Arrays under High-Frequency Electromagnetic Fields. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0406114-170143

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

2. Wang, Yung-Wen. Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

As the microelectronic package develops technologies for fabrication smaller, faster and economical, thermal management play an important role. Temperature variation caused by either environmental changes or power consumption, and the coefficient of thermal expansion (CTE) mismatch between different packages material lead to stress and strain in package assemblies especially in solder joint. This research builds up the viscoplastic finite element model to analyze thermal-mechanical behavior of solder joint under temperature cycling loading. The finite element software ANASYS is used to calculate the accumulative strain energy density of solder joint. Furthermore, a design of experiment (DoE) with factorial analysis is used to investigate the reliability impact of the design parameters, including solder material properties and geometry. Finally, we use the analysis of variance (ANOVA) to obtain the regression model and to find out optimization factors. The purpose of this research is to provide a quickly experimental design assessment to improve reliability of the solder joint. The assessment model can be used to predict the accumulative strain energy density and fatigue life of the solder joint in terms of cycles to failure. The smaller plastic strain can be achieved through a better combination of material properties and geometry parameters, which is helpful of packaging design before to manufacturing. Advisors/Committee Members: Mei-Ling Wu (committee member), Yeong-Shu Chen (chair), Ben-Je Lwo (chair), Sheng-Chih Shen (chair).

Subjects/Keywords: Fatigue Life; Design of Experiment; ANOVA; Accumulative Strain Energy Density; BGA Package

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, Y. (2014). Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712114-233942

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Yung-Wen. “Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis.” 2014. Thesis, NSYSU. Accessed March 08, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712114-233942.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Yung-Wen. “Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis.” 2014. Web. 08 Mar 2021.

Vancouver:

Wang Y. Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 08]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712114-233942.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang Y. Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712114-233942

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

3. Wang, Ming-Han. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

Polymer material tends to absorb moisture of environment to cause volume swelling among various materials of electronic package, such as underfill and substrate. The residual moisture of the package would also be vaporized into vapor phase in the reflow process. These phenomena render expansion mismatch and stress concentration at the interface between each components. If stress induced by moisture, vapor pressure and temperature up to mechanical strength, the product have the risk to damage and affect the operation. This paper adopt the finite element software, ANSYS v14.5, to investigate moisture diffusion and structure effects of hygro-thermal-vapor pressure coupling. This study is divided into two parts: First part is about 3D IC package. Second part is about 2.5D IC package. In 3D IC research, whether the mold compound covered and through silicon vias, micro-bumps are discussed under moisture, vapor pressure and temperature effects. In 2.5D IC research, the traditional inorganic passivation layer, Si3N4, is analyzed, in addition, the low-cost organic material is also investigated. Besides, the material properies of organic material will have a sharply change after reflow temperature up to the glass transition temperature (Tg). This paper also focus on this issue and compare the results of these two advanced package under hygro-thermal-vapor pressure coupling. Advisors/Committee Members: Chung-Ting Wang (chair), Ben-Je Lwo (chair), Sheng-Chih Shen (chair), Yeong-Shu Chen (chair), Mei-Ling Wu (committee member).

Subjects/Keywords: Finite element; Glass transition temperature; Vapor pressure; Organic passivation; Moisture; 2.5D IC Package; 3D IC Package

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, M. (2014). Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Thesis, NSYSU. Accessed March 08, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Web. 08 Mar 2021.

Vancouver:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Mar 08]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.