+publisher:"NSYSU" +contributor:("Ting Nung Shiau")

NSYSU

1. Hsieh, Ming-chun. A Study of Spider Silk for Energy Harvester.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717117-002205

► In this study, the piezoelectric properties of spider silk (dragline) produced by Taiwan local spider (Nephila pilipes) was confirmed. Firstly, electron microscopy was used to… (more)

▼ In this study, the piezoelectric properties of spider silk (dragline) produced by Taiwan local spider (Nephila pilipes) was confirmed. Firstly, electron microscopy was used to observe the surface morphology and diameter of spider silk, in order to describing its smooth characteristic. Then the mechanical properties of spider silk were investigated by micro-tensile test and nano-indentation test. The results showed that the elastic modulus of spider silk was between 5 and 7 GPa, the strength ranged from 510 to 850 MPa, and the extensibility was between 20-25%. It can be concluded that spider silk has good mechanical strength and ductility. The positive piezoelectric effect test was performed by using a 4 Hz beater to apply a fixed deformation on the spider silk, and the output of the voltage signal confirmed the positive piezoelectric effect of the spider silk. The converse piezoelectric test confirmed that when an alternating electric field was given, it can cause the silk to be deformed which proved that the spider silk has piezoelectric properties. By polarizing the spiderâs silk, the output values of peak voltage and peak current showed significantly improved. The peak voltage value rose up from 13.4 mV to 46.7 mV, and the peak current value rose up from 70.6 nA to 105 nA. These results were caused from the high voltage electric field made the internal structure of the material more directional. Impedance matching test was to obtain the maximum output power when the load resistance equals to the internal resistance. The energy harvester made from non-polarized spider silk can produce a maximum output power of 24.93 pW when it was in parallel with 4.7 MÎ© resistor, yet the energy harvester made from polarized spider silk can produce a maximum output power of 59.5 pW when it was in parallel with 8.2 MÎ© resistor. Fourier Transform Infrared Spectroscopy (FTIR) test indicated that the additional electric field does make spiderâs silk more directional in structure. By analyzing polarized and non-polarized spider silk, it can be found that the secondary structure of Î±-helix and Î²-sheet in spider silk were increased after polarized. Advisors/Committee Members: Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Jung-Hung Sun (chair), Cheng-Tang Pan (committee member).

Subjects/Keywords: Spider silk; Nature protein fiber; Piezoelectricity; Energy havester

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APA (6^th Edition):

Hsieh, M. (2017). A Study of Spider Silk for Energy Harvester. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717117-002205

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hsieh, Ming-chun. “A Study of Spider Silk for Energy Harvester.” 2017. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717117-002205.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hsieh, Ming-chun. “A Study of Spider Silk for Energy Harvester.” 2017. Web. 19 Feb 2019.

Vancouver:

Hsieh M. A Study of Spider Silk for Energy Harvester. [Internet] [Thesis]. NSYSU; 2017. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717117-002205.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsieh M. A Study of Spider Silk for Energy Harvester. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717117-002205

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

2. Lee, Wei-Chi. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

► As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device… (more)

▼ As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device is important for communication through optical fiber networks. The temperature of the device affects its lifetime, the quality of communication and the coupling efficiency of the optical fiber. Since some of the components of the Optical Fiber Transceiver Device can be made of various materials, this work constructs a threeâdimensional Optical Fiber Transceiver Device model using the ANSYS 15.0/Fluent software for implementing the finite volume method, and to investigate the effects of the thermal conductivity coefficient of the materials on heat dissipation by the device. Among five components which have alternative materials â substrate, housing, coating, SMT substrate and solder ball ââ the results revealed the dissipation of heat by the device was dominated by the variations of substrate and SMT substrateâs thermal conductivity coefficient. These critical variables were fitted using equations in terms of the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling. The effect of the laser power on the fitting model was considered. Then, the design rule corresponding to the critical componentsâ thermal conductivity coefficient of the Optical Fiber Transceiver Device was obtained successfully. The errors between the simulated and the fitted results which were concluding the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling were less than 9%. At a heat dissipation by the laser of 210mW, when the thermal conductivity coefficients of the substrate and the SMT substrateâs material were 2W/mâ and 60W/mâ, the maximum temperature of the device and the difference between the inlet and outlet temperatures were less than 85â and 12â, respectively. Advisors/Committee Members: Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Jung-Hung Sun (chair), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair).

Subjects/Keywords: optical fiber transceiver device; heat dissipation; finite volume method; design rule; thermal conductivity coefficient

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Lee, W. (2016). The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Web. 19 Feb 2019.

Vancouver:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Internet] [Thesis]. NSYSU; 2016. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

3. Gan, Jia-lun. Measurement of the Residual Stress in Cr-Film by Using DIC.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725115-143720

► In the past, if a researcher intended to measure the residual stress in a thin film coated on a substrate, the Stoney's equation was adopted… (more)

Subjects/Keywords: digital image correlation; film thickness; residual stress; coating film; cantilever beam

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Gan, J. (2015). Measurement of the Residual Stress in Cr-Film by Using DIC. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725115-143720

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Gan, Jia-lun. “Measurement of the Residual Stress in Cr-Film by Using DIC.” 2015. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725115-143720.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Gan, Jia-lun. “Measurement of the Residual Stress in Cr-Film by Using DIC.” 2015. Web. 19 Feb 2019.

Vancouver:

Gan J. Measurement of the Residual Stress in Cr-Film by Using DIC. [Internet] [Thesis]. NSYSU; 2015. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725115-143720.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gan J. Measurement of the Residual Stress in Cr-Film by Using DIC. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725115-143720

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

4. Hu, Yao-lun. The Effect of Deformation on the Efficiency of PEMFC.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723115-031201

► Energy crisis is a global issue, and many countries are eager to search or develop new energy resources. Fuel cell is one potential energy resource… (more)

▼ Energy crisis is a global issue, and many countries are eager to search or develop new energy resources. Fuel cell is one potential energy resource of new energy resources. In all kinds of fuel cells, proton exchange membrane fuel cell (PEMFC) is the most profitable one. However, many researches were focus on improving efficiency through chemical reactions, and rarely discussed the effect of structural deformations on efficiency. The purpose of this research was to build up a three dimensional and full PEMFC model through finite element method (FEM), and to investigate deformations caused by internal heat and bolt pre-loading under real operating condition. Furthermore, effects of variations of bolt pre-loadings, flow channel cross-sectional area designs and flow channel fillets on deformations of PEMFC, compression ratio of gas diffusion layers and intrusion rate of flow channels were studied. The results showed that deformation of PEMFC caused by bolt pre-loading could not be ignored, and average equivalent stress of graphite plates and gas diffusion layers increased linearly with increasing bolt pre-loadings which generated maximum equivalent stress at inlet or outlet of flow channels. With increasing bolt pre-loadings, compression ratio of gas diffusion layer increased linearly, and thus increased the efficiency of PEMFC. However, when bolt pre-loading reached 7 MPa, compression ratio of gas diffusion layer exceeded 15% and degraded the efficiency. The intrusion rate of flow channels increased non-linearly with increasing bolt pre-loading. When bolt pre-loading was 6 MPa, the cross-sectional area of flow channels was 92.54% of its original state and decreased the efficiency. In part of flow channel cross-sectional area designs, when bolt pre-loading was 6 MPa and if cross-sectional area increased 27%, the flow rate of reactants could be promoted 17.42%, and the fuel cell efficiency can be improved also. Advisors/Committee Members: Jung-Hung Sun (chair), Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: flow channel intrusion rate; gas diffusion layer compression ratio; fuel cell efficiency; finite element method; proton exchange membrane fuel cell; flow channel cross-sectional area; bolt pre-loading

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Hu, Y. (2015). The Effect of Deformation on the Efficiency of PEMFC. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723115-031201

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hu, Yao-lun. “The Effect of Deformation on the Efficiency of PEMFC.” 2015. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723115-031201.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hu, Yao-lun. “The Effect of Deformation on the Efficiency of PEMFC.” 2015. Web. 19 Feb 2019.

Vancouver:

Hu Y. The Effect of Deformation on the Efficiency of PEMFC. [Internet] [Thesis]. NSYSU; 2015. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723115-031201.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hu Y. The Effect of Deformation on the Efficiency of PEMFC. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723115-031201

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

5. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

► Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has… (more)

Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 19 Feb 2019.

Vancouver:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

6. Chen, Chang-i. To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2011, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0810111-105508

► Ultrasonic is a transport form of sound. There is no mass transportation, only energy transportation occurs in transfer process. Recently, the ultrasonic was widely used… (more)

Subjects/Keywords: finite element method; equivalent strain; skin; ultrasonic

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chen, C. (2011). To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0810111-105508

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen, Chang-i. “To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation.” 2011. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0810111-105508.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen, Chang-i. “To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation.” 2011. Web. 19 Feb 2019.

Vancouver:

Chen C. To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation. [Internet] [Thesis]. NSYSU; 2011. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0810111-105508.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen C. To Study the Effects of Ultrasonic Irradiation on the Skin Tissue by Using Finite Element Simulation. [Thesis]. NSYSU; 2011. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0810111-105508

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

7. Wang, Hui-chi. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

► Nowadays, using the LED as backlight module's light source becomes generalization gradually, and the application of LED light source develops from the liquid crystal display… (more)

▼ Nowadays, using the LED as backlight module's light source becomes generalization gradually, and the application of LED light source develops from the liquid crystal display to the liquid crystal TV. However, thermal dissipative problem of LED component is still an important issue to study presently, since it can affect the service lives of LED and LCD seriously. In order to increase the luminous energy of the LED component, one need to increase the supply of electric power and it will cause the increment of thermal dissipative problem of the LED component also. Therefore, by considering the LED components as the light source of the backlight module , the purpose of this study is to reduce number of the required LED components in order to decrease the thermal dissipative problem of LEDs, and maintain the luminous and uniformity of the backlight module simultaneously. A new packaging for LED, named SMD type metallic reflection cup LED component, was proposed in this study. The new LED package not only has a better thermal dissipative property, but also can control its radiation property by changing the angle of its reflection cup. So, the proposed LED package can be applied for different purposes. By applying the proposed LED components as the light source of a backlight module, under the condition of same illumination, it can be shown that the required number of LED components can be decreased tremendously and so the thermal dissipative problem can be decreased too. Also, the numerical simulated results showed that by choosing the suitable angle of the reflection cup, the uniformity of the backlight module can be improved. Besides, this study proposed a modified method for assessing the uniformity of a backlight module. The simulated results showed that the proposed method can assess the uniformity of a backlight module more suitable than the traditional nine points measurement method can do. Advisors/Committee Members: Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Chi-Chang Hsieh (chair), Jung-Hung Sun (chair).

Subjects/Keywords: Uniformity; Reflection cup; LED; Backlight module

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang, H. (2009). SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Web. 19 Feb 2019.

Vancouver:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Internet] [Thesis]. NSYSU; 2009. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

8. Chen, Chih-chuan. A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716109-185827

► The pipeline is playing an important role in industry nowadays. However, the inner wall of pipeline may suffer corrosion after a long service time. When… (more)

Subjects/Keywords: GUI system; Thickness measurement; Modified wave velocity curve; PZT sensor

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chen, C. (2009). A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716109-185827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen, Chih-chuan. “A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT.” 2009. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716109-185827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen, Chih-chuan. “A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT.” 2009. Web. 19 Feb 2019.

Vancouver:

Chen C. A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT. [Internet] [Thesis]. NSYSU; 2009. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716109-185827.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen C. A Study on A36 Steel Pipe On-Line Thickness Measurement Subjected to High-Temperature by Using PZT. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716109-185827

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

9. Chen, Li-chong. Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2010, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803110-104114

► In general, a PEMFC was assembled by using a number of locked bolts. But this assembly will cause concentrated loads existed on the upper and… (more)

Subjects/Keywords: Micro-PEMFC; Gas diffusion layers; Bolts locking sequence; Uniformity; Flow-channel plates

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APA (6^th Edition):

Chen, L. (2010). Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803110-104114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen, Li-chong. “Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC.” 2010. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803110-104114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen, Li-chong. “Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC.” 2010. Web. 19 Feb 2019.

Vancouver:

Chen L. Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC. [Internet] [Thesis]. NSYSU; 2010. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803110-104114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen L. Effect of Bolts Assembly on the Deformation and Pressure Distribution of Flow-Channel Plates in Micro-PEMFC. [Thesis]. NSYSU; 2010. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803110-104114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

10. Su, Fang-I. Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2011, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815111-123009

► In this studing, application of the digital image correlation method (DIC) for determining the coefficient of thermal expansion (CTE) of Indium Tin Oxide/Polyethylene Terephthalate(ITO/PET) thin… (more)

Subjects/Keywords: Coefficient of Thermal Expansion; Indium Tin Oxide Film; Digital Image Correlation Method; Thickness; Polyethylene Terephthalate Substrat

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Su, F. (2011). Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815111-123009

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Su, Fang-I. “Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film.” 2011. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815111-123009.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Su, Fang-I. “Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film.” 2011. Web. 19 Feb 2019.

Vancouver:

Su F. Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film. [Internet] [Thesis]. NSYSU; 2011. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815111-123009.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Su F. Effects of Thickness on the Thermal Expansion Coefficient of ITO/PET Film. [Thesis]. NSYSU; 2011. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815111-123009

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

11. Chung, Yu-Lin. A projective LED dental lamp design.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2011, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817111-021622

► Halogen lamps are mostly applied as a light source to the traditional lamp for medical treatment due to its proper color temperature, but it has… (more)

Subjects/Keywords: light shape; light guide; optics simulation; projective lamp; light emitting diode

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APA (6^th Edition):

Chung, Y. (2011). A projective LED dental lamp design. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817111-021622

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chung, Yu-Lin. “A projective LED dental lamp design.” 2011. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817111-021622.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chung, Yu-Lin. “A projective LED dental lamp design.” 2011. Web. 19 Feb 2019.

Vancouver:

Chung Y. A projective LED dental lamp design. [Internet] [Thesis]. NSYSU; 2011. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817111-021622.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chung Y. A projective LED dental lamp design. [Thesis]. NSYSU; 2011. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817111-021622

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

12. Tsai, Ming-Lang. Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708112-224115

► Dye-sensitized solar cells (DSSCs), based on use of a black counter electrode (BCE) and thin TiO2 electrode (photoelectrode), have been developed to reduce related manufacturing… (more)

Subjects/Keywords: dye-sensitized solar cell; metal-based light scattering layer; black counter electrode; external lightguide; light harvesting efficiency

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Tsai, M. (2012). Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708112-224115

Chicago Manual of Style (16^th Edition):

Tsai, Ming-Lang. “Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells.” 2012. Doctoral Dissertation, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708112-224115.

MLA Handbook (7^th Edition):

Tsai, Ming-Lang. “Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells.” 2012. Web. 19 Feb 2019.

Vancouver:

Tsai M. Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells. [Internet] [Doctoral dissertation]. NSYSU; 2012. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708112-224115.

Council of Science Editors:

Tsai M. Applied Studies of Metal-Based Light Scattering Layer and External Lightguide on Dye-Sensitized Solar Cells. [Doctoral Dissertation]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708112-224115

NSYSU

13. Su, Ting-Hsuan. A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620117-173718

► During thin film deposition, the mismatching of thermal expansion coefficients between thin film and substrate may induce residual stress in the film, and damaging the… (more)

▼ During thin film deposition, the mismatching of thermal expansion coefficients between thin film and substrate may induce residual stress in the film, and damaging the coated specimen. Most researchers adopted Stoneyâs equation to obtaining the residual stress at a coated thin film. However, only the average longitudinal residual stress at a coated thin film can be found. But due to variations of many parameters in the coating process, such as crystalline particle size and the unevenness of the thickness of coated film, will resulting in different residual stress at each location of a coated thin film. Also, in addition to longitudinal residual stress, the transverse residual stress will occur on the coated film. In this study, a novel experimental technique, by combining the 3-D digital image correlation technique and the modified Stoneyâs equation, is proposed, which can measure both longitudinal and transverse residual stresses at any location in a coated thin film. Considering a thin Ni-film coated on a Si-substrate, and the residual stress at the thin film was measured by using the proposed technique and 3-D surface profile with software Istar31, separately. By comparing the experimental results obtained from both approaches, it can be shown that the accuracy error of the proposed technique is less than 7%. Then, the proposed technique was adopted to study effects of thickness variations of thin Cr-film, which was coated on Si-substrate, on magnitude and distributive uniformity of residual stress at the film. Here, the residual stress means the equivalent residual stress resulted from longitudinal and transverse residual stresses. The experimental results indicate that the average equivalent residual stress decreased as the thickness of the coated thin film increased. When thicknesses of thin film increasing from 1Î¼m to 3Î¼m, the average equivalent residual stress was decreased by 92.47%. The results also show that if the film thickness increases enough, the distribution of equivalent residual stress will get more uniform. As the thickness increasing from 1Î¼m to 3Î¼m, the distributive uniformity of the equivalent residual stresses can be increased by 23.91%. Advisors/Committee Members: Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Jung-Hung Sun (chair), Jao-Hwa Kuang (chair), Shou-Shing Hsieh (chair), Cheng-Tang Pan (chair).

Subjects/Keywords: Distributive uniformity; Residual stress; Three-dimensional digital image correlation; Coated thin film

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Su, T. (2017). A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620117-173718

Chicago Manual of Style (16^th Edition):

Su, Ting-Hsuan. “A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films.” 2017. Doctoral Dissertation, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620117-173718.

MLA Handbook (7^th Edition):

Su, Ting-Hsuan. “A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films.” 2017. Web. 19 Feb 2019.

Vancouver:

Su T. A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films. [Internet] [Doctoral dissertation]. NSYSU; 2017. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620117-173718.

Council of Science Editors:

Su T. A Study of Variations of Thickness on Residual Stresses Distribution of the Coating Chromium Thin Films. [Doctoral Dissertation]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620117-173718

NSYSU

14. Hung, Chien-Hsiung. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.

Degree: Master, Mechanical Engineering, 2000, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114

► Abstractï¼ The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC… (more)

Subjects/Keywords: IC package; shadow moire; moisture; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Hung, C. (2000). The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hung, Chien-Hsiung. “The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.” 2000. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hung, Chien-Hsiung. “The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process.” 2000. Web. 19 Feb 2019.

Vancouver:

Hung C. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. [Internet] [Thesis]. NSYSU; 2000. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hung C. The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process. [Thesis]. NSYSU; 2000. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828100-135114

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

15. Chang, Chih-Fang. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.

Degree: Master, Mechanical Engineering, 2000, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745

► The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage… (more)

Subjects/Keywords: Warpage; Fringe Order; IC Package; Holographic Interferometry

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chang, C. (2000). The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chang, Chih-Fang. “The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.” 2000. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chang, Chih-Fang. “The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process.” 2000. Web. 19 Feb 2019.

Vancouver:

Chang C. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. [Internet] [Thesis]. NSYSU; 2000. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chang C. The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process. [Thesis]. NSYSU; 2000. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0906100-193745

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

16. Wang, Che-Ming. The Study of the Deformation-Mechanism of PBGA in IR-Reflow process.

Degree: Master, Mechanical Engineering, 2001, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731101-223205

► The main objective of this research is to studying the deformation mechanism of PBGA via IR-Reflow process by utilizing the Finite Element Method and assuming… (more)

Subjects/Keywords: æéåç´ æ³; åå°é«æ§è£é«; ç¿¹æ²

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang, C. (2001). The Study of the Deformation-Mechanism of PBGA in IR-Reflow process. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731101-223205

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang, Che-Ming. “The Study of the Deformation-Mechanism of PBGA in IR-Reflow process.” 2001. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731101-223205.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang, Che-Ming. “The Study of the Deformation-Mechanism of PBGA in IR-Reflow process.” 2001. Web. 19 Feb 2019.

Vancouver:

Wang C. The Study of the Deformation-Mechanism of PBGA in IR-Reflow process. [Internet] [Thesis]. NSYSU; 2001. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731101-223205.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang C. The Study of the Deformation-Mechanism of PBGA in IR-Reflow process. [Thesis]. NSYSU; 2001. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731101-223205

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

17. Yen, Jia-Jin. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.

Degree: Master, Mechanical Engineering, 2001, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158

► The main objective of this paper is to utilizing the Shadow Moiré method to study the effect of IR-reflow Condition Variations on the warpage of… (more)

Subjects/Keywords: Peak Temperature; Waiting Time; Warpage; Moisture

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Yen, J. (2001). The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Yen, Jia-Jin. “The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.” 2001. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Yen, Jia-Jin. “The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages.” 2001. Web. 19 Feb 2019.

Vancouver:

Yen J. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. [Internet] [Thesis]. NSYSU; 2001. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Yen J. The Study of IR-reflow Condition Variations on the Warpage of PBGA Packages. [Thesis]. NSYSU; 2001. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0905101-171158

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

18. Lin, Chi-Chau. The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2003, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728103-120957

► The effects of different ferrule length and epoxy layer thickness of the module of optical fiber connector under thermal cycling are investigated in this thesis.… (more)

Subjects/Keywords: fatigue life; thermal cycling; optical fiber connector

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Lin, C. (2003). The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728103-120957

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Lin, Chi-Chau. “The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling.” 2003. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728103-120957.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Lin, Chi-Chau. “The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling.” 2003. Web. 19 Feb 2019.

Vancouver:

Lin C. The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling. [Internet] [Thesis]. NSYSU; 2003. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728103-120957.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lin C. The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling. [Thesis]. NSYSU; 2003. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0728103-120957

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

19. Yang, Cong-Ming. The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2004, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0825104-141347

► A novel room temperature bonding method is used to package the micro-component. The bonding method utilizes metal microcap to package the micro-component under room temperature… (more)

▼ A novel room temperature bonding method is used to package the micro-component. The bonding method utilizes metal microcap to package the micro-component under room temperature status, which not only can provide micro-component mechanical support also can prevent micro-component from contamination. The bonding condition under room temperature is the most conventional method can not achieve, which characteristic is the most significant effect factor to drive the wafer-level packaging process to improve in today. Utilizing ASTM standard, which was used as a macroscopic standard to evaluate and analyze the bonding shear strength relationship between the ASTM standard specimen and the metal microcap. The carrier wafer has been oxidized before photolithography process; the diameter of cavity and the contact area between the metal microcap and glass substrate were controlled by the photomask design and the accuracy of the photoresist exposure. The passivation treatment was developed to separate the microcap from the carrier wafer more easily. In this thesis, the metal microcap was fabricated by using electroforming process, which can control the thickness of metal microcap. The advantages of microcap are superior to the thin film poly-silicon made by the surface micromachining technique on the quality and mechanical properties. A glass is used as substrate of the metal microcap, and its transparent characteristic is a feature how we perform UV curing process. The adhesive can be cured under room temperature and the results exhibit the adhesive has excellent bonding strength. SEM is used to analyze the passivation result, the increasing rate of electroforming thickness. The shear stress-strain relationship between the metal microcap and the ASTM standard specimen is also discussed and analyzed in this thesis. Advisors/Committee Members: Chi-Hui Chien (committee member), Yii-Tay Chiou (chair), Nung%20Shiau%22%29&pagesize-30">Ting-Nung Shiau (chair), Cheng-Tang Pan (committee member).

Subjects/Keywords: room temperature bonding; metal microcap; bonding shear strength

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APA (6^th Edition):

Yang, C. (2004). The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0825104-141347

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Yang, Cong-Ming. “The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis.” 2004. Thesis, NSYSU. Accessed February 19, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0825104-141347.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Yang, Cong-Ming. “The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis.” 2004. Web. 19 Feb 2019.

Vancouver:

Yang C. The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis. [Internet] [Thesis]. NSYSU; 2004. [cited 2019 Feb 19]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0825104-141347.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Yang C. The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis. [Thesis]. NSYSU; 2004. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0825104-141347

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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