+publisher:"NSYSU" +contributor:("T. N. Shiau")

NSYSU

1. Han Tsai, Cing. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

► The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC,… (more)

▼ The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC, Marc, and other packages, is available. Some of the software does not include enough material properties, and especially too few properties that are relate to temperature. Accordingly the results of simulations not close to the reality. The study uses the LAMMPS, which is software for simulating molecular dynamics, to simulate the experiments on the friction. The coefficient of the kinetic friction at high temperature is thus obtained. This work successfully developed a complete calculating package of coefficient of the kinetic friction. The user can change the metal and the temperature. Comparing experimental at room temperature in the literature with the results of the simulation yields a, single crystalline model error of 7.66% and a polycrystalline model error of 8.33%. This investigation discusses the effects of the frictional properties by copper on copper at various friction velocities, depth of ploughing and temperatures. In recent years, a few people have studied the polycrystalline model. In this work, not only a single crystalline model but also polycrystalline model is developed and utilized to describe the real structure of a material. The results obtained herein yield a depth of ploughing of 2.50 nm, a simulated temperature of 293.0 K and an increase in tip velocity from 100.0 m/s to 400.0 m/s. The coefficient of kinetic friction of the single crystalline structure decreased from 2.30 to 1.24 and that of the polycrystalline structure decreased from 1.86 to 1.44. When the tip velocity is 100 m/s, temperature is 293.0 K and the depth of ploughing increased from 1.00 nm to 2.50 nm. The coefficient of kinetic friction of the single crystal structure decreased from 4.30 to 2.30 and that of the polycrystalline structure is decreased from 2.25 to 1.86. Finally, when the tip velocity is 100 m/s, the depth of ploughing is 2.50 nm and temperature increased from 293.0 K to 1000.0 K. The single crystal structure decreased from 2.30 to 1.38 and that of the polycrystalline structure is maintained between 1.77 to 1.90. Advisors/Committee Members: CHChien (committee member), Jung-Hung Sun (chair), Chung-Ting Wang (chair), T. N. Shiau (chair).

Subjects/Keywords: molecular dynamics; temperature effects; polycrystalline structure; coefficient of kinetic friction; single crystal structure

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APA (6^th Edition):

Han Tsai, C. (2014). The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Web. 28 Feb 2021.

Vancouver:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

2. Wang , Jhao-Shun. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

► In the MEMS process, a thin film is likely to be coated on a substrate. Residual stress is established in the coating upon cooling to… (more)

▼ In the MEMS process, a thin film is likely to be coated on a substrate. Residual stress is established in the coating upon cooling to room temperature because thermal expansion coefficients of the thin film and the substrate are different. The residual stress in the coating not only causes bending but also affects the quality of coating. This thesis discusses the relationship of the residual stress and its distribution with the parameters of the process and the thickness of the ITO thin film that is coated on the Si-substrate. Four parameters of coating process - coating time, sputtering power, working pressure, and argon flow rate â are considered here. In the experiment, each parameter is set to one of three levels, consistent with the Taguchi Method, yielding nine combinations. For each of the nine combinations, three Si-substrates are used. Measurements are made at nine points on each Si-substrate. Two sets of the in-plane displacement of the coating from two different angles of the screen can be measured by using digital image correlation technique. The obtained sets of in-plane displacements can be used to calculate the out-of-plane displacement, the components of residual stress in the x-direction and the y-direction can be calculated using the modified Stoneyâs equation. The equivalent residual stress is calculated from these components of residual stresses, and the coefficient of variation is calculated from the average and standard deviation of the equivalent residual stress at the nine points on the Si-substrate. Finally, the distribution of residual stress in coating is discussed with reference to the experimentally obtained coefficient of variation. The experimental results indicate that the coating time and the sputtering power importantly affect the magnitude of residual stress, but the working pressure and the argon flow rate have very little effect. Additionally, the experimental results show that the residual stress distribution is affected by coating time, sputtering power, argon flow rate and working pressure, in order of declining strength of the effect. The coating time most strongly affects the coating process. As the coating thickness increases, the residual stress decreases and the variation among measurements made of three Si-substrates of same combination declines. Restated, the precision of the experimental measurements improves with the coating thickness, but the distribution of residual stress becomes less uniform. Advisors/Committee Members: T. N. Shiau (chair), Jung-Hung Sun (chair), Chung-Ting Wang (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: Digital Image Correlation Method; Indium Tin Oxide Film; Taguchi Method; Coating Residual Stress; Coating Distribution

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APA (6^th Edition):

Wang , J. (2016). Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Web. 28 Feb 2021.

Vancouver:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

3. Chu, Yu-tsung. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

► In traditional IC packaging, wire bonding is typically performed using gold. In recent years, increasing gold prices have motivated the packaging industry actively to develop… (more)

Subjects/Keywords: Cubic polynomial; Temperature effect; Thermal expansion coefficient; Palladium; Digital image correlation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chu, Y. (2014). DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Web. 28 Feb 2021.

Vancouver:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

4. Syue, Ming-Jyun. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

► As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out.… (more)

▼ As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out. The copper pillar bump bonding process has become the mean means of fabricating 2.5D IC structures. Recently, cold joint defects have been detected in copper pillar welding. Currently the industry believes that structural warping by heating is likely to be the main cause of the formation of defects. This work establishes a two-dimensional model of the 2.5D IC by using the finite element method to simulate the impact of bonding with warping on welding process, and determines the range of bonding forces when copper pillars debond and generate cracks, using the debonding setting in ANSYS. Finally, the impact of an IC on warping and the range of bonding forces is studied by changing the thickness of the die layer, the material structure of the copper pillars, and the reflow temperature. The results of the numerical simulation model that is used in this research, which does not consider the alignment show that when the bonding force exceeded 285MPa, no crack appeared. When the bonding was less than 50MPa, debonding occurred. Compared with 50um thickness of the die, when the thickness was changed to 100 and 150um, the critical bonding forces of crack were increased by 14 and 30%, respectively, and the warpages were increased 13.53 and 25.05%, respectively. Adding a nickel layer to the copper pillars directly reduced the overall warpage and increased critical bonding force. For example, the layer improved the critical bonding force of type 3 by 8.77%, reduced the warpage by 0.76%. Adding the gold layer reduced the stress concentration in the solder that was caused by the nickel layer, reducing the critical bonding force; the type 5 had a 4.84% lower bonding force that the type 3, which had no gold layer. Compared with 100 °C of reflow temperature, when the temperature was changed to 150, 200, and 240 °C, the critical bonding forces were increased by 31.71, 36.59 ,and 39.02%, respectively, and the warpages were increased approximately linearly with temperature by 46.47, 74.83 and 77.89%, respectively. Advisors/Committee Members: Chi-Hui Chien (committee member), Chung-Ting Wang (chair), Jung-Hung Sun (chair), T. N. Shiau (chair).

Subjects/Keywords: finite element method; cold joint; 2.5D integrated circuits; copper pillar bump; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Syue, M. (2014). The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Web. 28 Feb 2021.

Vancouver:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

5. Liu, Hsuan-Ting. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

► In this study, 3D FEM (finite element method) models of both single cell and dual-cell of PEMFC (proton exchange membrane fuel cell) had been established,… (more)

▼ In this study, 3D FEM (finite element method) models of both single cell and dual-cell of PEMFC (proton exchange membrane fuel cell) had been established, separately. The commercial software ANSYS15.0 was adopted in order to observe the effect of bolt pre-loading variation on the contact resistance and porosity of GDL (gas diffusion layer) in PEMFC. Then, the obtained values of contact resistance and porosity of GDL were substituted into the electro-chemistry simulation software Fluent 15.0 and the effect of bolt pre-loading variation on the efficiency of PEMFC was discussed. In stress-strain analysis, a 3D PEMFC model with the reactive area of 25cm2 had been established through 3D drawing software SolidWroks 2013. The model includes membrane, catalyst layer, gas diffusion layer, flow channel plate, current collector and body plate which all elements were fixed by 12 pairs of bolt and nut. In order to apply bolt pre-loading on each pair of bolt and nut, the nuts were assumed to be fixed and the ANSYS built-in function, bolt pretension, was adopted. According to the simulative results, both contact resistance and porosity of GDL are decreasing while the bolt pre-loading increasing. The decreasing of contact resistance can reduce the ohmic loss effectively, and increase the efficiency of PEMFC. However, the decreasing of porosity of GDL will cause the increasing of resistance of permeability and resulted in the decreasing of the efficiency of PEMFC. The results of electro-chemistry simulation show that by increasing bolt pre-loading from 5MPa to 16MPa will result in 75.7% improvement of maxima power density of PEMFC. In a dual-cell PEMFC, the average equivalent stress of the GDL is increased due to the increase in the total thickness of the flow channel plates, thus greatly reduce the contact resistance of GDL. The simulative results indicate that due to the contribution of the reduction of contact resistance of GDL, the maximum power density of the dual-cell module is increased by 37.8%. Keywords: Proton Exchange Membrane Fuel Cell, Contact Resistance, Porosity, Bolt Pre-loading, Power Density Advisors/Committee Members: T. N. Shiau (chair), Jung-Hung SUN (chair), Chung-Ting Wang (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: Proton Exchange Membrane Fuel Cell; Contact Resistance; Bolt Pre-loading; Power Density; Porosity

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Liu, H. (2017). The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Web. 28 Feb 2021.

Vancouver:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Internet] [Thesis]. NSYSU; 2017. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

6. Lo , Huan-Chun. Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724117-200159

► In recent years, due to the rapid development of computational science, hardware and software of computer, and the internet, the amount of information collected in… (more)

Subjects/Keywords: Big Data; Artificial Neural Network Algorithms; Genetic Algorithms; Optimization; Data Mining

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Lo , H. (2017). Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724117-200159

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Lo , Huan-Chun. “Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2017. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724117-200159.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Lo , Huan-Chun. “Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2017. Web. 28 Feb 2021.

Vancouver:

Lo H. Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms. [Internet] [Thesis]. NSYSU; 2017. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724117-200159.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lo H. Development of a software for obtaining optimized solution of engineering problems by using Artificial Neural Network Algorithms and Genetic Algorithms. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724117-200159

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

7. Lin, Chih-Wei. A Study on the Durability of Gasket Materials in the PEMFC.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2011, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0603111-170829

► Proton Exchange Membrane (PEM) fuel cell stack requires gaskets and seals in each cell to keep the hydrogen and air/oxygen within their respective regions. The… (more)

Subjects/Keywords: Chemical degradation; Durability; Elastomeric gaskets; DMA; PEMFC; Micro-indentation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Lin, C. (2011). A Study on the Durability of Gasket Materials in the PEMFC. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0603111-170829

Chicago Manual of Style (16^th Edition):

Lin, Chih-Wei. “A Study on the Durability of Gasket Materials in the PEMFC.” 2011. Doctoral Dissertation, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0603111-170829.

MLA Handbook (7^th Edition):

Lin, Chih-Wei. “A Study on the Durability of Gasket Materials in the PEMFC.” 2011. Web. 28 Feb 2021.

Vancouver:

Lin C. A Study on the Durability of Gasket Materials in the PEMFC. [Internet] [Doctoral dissertation]. NSYSU; 2011. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0603111-170829.

Council of Science Editors:

Lin C. A Study on the Durability of Gasket Materials in the PEMFC. [Doctoral Dissertation]. NSYSU; 2011. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0603111-170829

NSYSU

8. Chen, Chun-hung. Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2008, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1213108-230548

► In overwhelming majority of the petroleum or petrochemical plants, pressure vessels and process piping play important roles among the major elements of static equipments. So,… (more)

▼ In overwhelming majority of the petroleum or petrochemical plants, pressure vessels and process piping play important roles among the major elements of static equipments. So, based on the integrity of safety management for the petroleum or petrochemical plants and reduction of the operation risks, some objective schemes of the systematic failure evaluations and assessments should be established in order to optimize the resources of inspection and maintenance. However, performing the inspections based on the conventional methodologies, some uncontrolled factors which caused by the environments and inspection methods may exist and affect the assessment of the estimated corrosion rate. If the influences of the uncontrolled factors were not considered and compensated in the assessment of the estimated corrosion rate, some underestimate or unreasonable results would be obtained which lead potential risks may exist in the plants. Moreover, the measured data of some parameters, for example, operation pressure, corrosion condition, allowable stress, which were used to evaluate the estimated corrosion rate of the pressure components may exhibit a normal or non-normal distribution. Under such circumferences, if one used the nominal values of the measured parameters to assessment the safety conditions of the pressure components, potential risks may exist in the petroleum or petrochemical plants at the final stage of long-term operation. With an eye to obtain more conservative and objective assess results for pressure equipments in the long-term operation, three subjects will be differentiated between the evaluation of estimated corrosion rate, failure probability of pressure vessels and pressure safety valve (PSVs). First, based on the pressure boundaries suffered from general corrosion, a statistical methodology was proposed to modify the assessment of estimated corrosion rates for the pressure components in conventional methodology. Furthermore, the obtained results of the estimated corrosion rates will be used to assess the failure probability of pressure components based on the upper limited value. By adopting First Order Second Moment (FOSM) method, the failure probability was approached for the pressure components in long term operation. Moreover, for the sake of optimize the inspection and maintenance resources based on the acceptable risk of the plant owners, typical semi-quantitative risk based inspection (RBI) methodology to each pressure vessel are proposed in safety management based on the approached failure probability. Besides, the final protection for the pressure equipments when the pressure systems were upset - pressure safety valves (PSVs), are also play important roles to system evaluation and safety management for pressurized system. So, follow the semi-quantitative RBI methodology, the objective evaluation schemes together with the suggested inspection interval were conservatively established. Based on the conclusion of the studies, few pressure components with high failure probability will raise the… Advisors/Committee Members: T. N. Shiau (chair), C.H. Chien (committee member), J. H. Kuang (chair), S.K. Yang (chair), S.S.Hsieh (chair), M.J. Huang (chair), Y.F. Chen (chair), Jen, M. -H. R. (chair).

Subjects/Keywords: Failure probability assessment; PSVs inspection strategy; Inspection frequency; Corrosion rate assessment; Pressure vessels and piping inspection

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APA (6^th Edition):

Chen, C. (2008). Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1213108-230548

Chicago Manual of Style (16^th Edition):

Chen, Chun-hung. “Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process.” 2008. Doctoral Dissertation, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1213108-230548.

MLA Handbook (7^th Edition):

Chen, Chun-hung. “Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process.” 2008. Web. 28 Feb 2021.

Vancouver:

Chen C. Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process. [Internet] [Doctoral dissertation]. NSYSU; 2008. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1213108-230548.

Council of Science Editors:

Chen C. Application of Statistical Methodology on Monitoring the Failure Conditions of Static Equipments in the Petroleum Process. [Doctoral Dissertation]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1213108-230548

NSYSU

9. Cheng, Mao-Chuan. Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0122107-000442

► Over the past years, there are many studies discusses different modes of die cracking and improvement. Die cracking is one of the crucial issues that… (more)

Subjects/Keywords: FCBGA Test; ANSYS; Die Crack

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Cheng, M. (2007). Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0122107-000442

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Cheng, Mao-Chuan. “Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading.” 2007. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0122107-000442.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Cheng, Mao-Chuan. “Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading.” 2007. Web. 28 Feb 2021.

Vancouver:

Cheng M. Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading. [Internet] [Thesis]. NSYSU; 2007. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0122107-000442.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Cheng M. Stress Study of Silicon Die for Filp-Chip Package Under Different Types of Stress Loading. [Thesis]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0122107-000442

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

10. Wang, Chung-ting. Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1024107-135247

► Molecular dynamics (MD) simulations are applied to elucidate the anisotropic characteristics in the material responses for crystallographic nickel substrates with (100), (110) and (111) surface… (more)

▼ Molecular dynamics (MD) simulations are applied to elucidate the anisotropic characteristics in the material responses for crystallographic nickel substrates with (100), (110) and (111) surface orientations during nanoindentation. The strain energy of the substrate exerted by the tip is stored by the formation of the homogeneous nucleation, and is dissipated by the dislocation sliding of the {111} plane. The steep variations of the indentation curve from the local peak to the local minimums are affected by the numbers of slip angle of {111} sliding plane. The pile-up patterns of the three nickel substrates prove that the crystalline nickel materials demonstrate the pile-up phenomenon from nanoindentation on the nanoscale. The three crystallographic nickel substrates exhibit differing amounts of pile-up dislocation spreading at different crystallographic orientations. The effects of surface orientation in material properties of F.C.C. nickel material on the nanoscale are observable through the slip angle numbers of {111} sliding planes which influence hardness values, as well as the cohesive energy of different crystallographic surfaces that indicate Youngâs modulus. Furthermore, the multiscale simulations are performed on the (100) monocrystal nickel substrate by using nanoindentation, compensating for MD limitation of a large specimen simulation without significant increase in the size of the problem. This study examines the accuracy of the coupling method for the multiscale model by means of the indentation curve and the deformation profile. Nanoindentation-induced mechanical deformation in GaN thin films prepared by metal-organic chemical-vapor deposition (MOCVD) was investigated using the Berkovich diamond tip in combining with the cross-sectional transmission electron microscopy (XTEM). By using the focused ion beam (FIB) milling to accurately position the cross-section of the indented region, the XTEM results demonstrate that the major plastic deformation was taking place through the propagation of dislocations. The present observations are in support of attributing the pop-ins appeared in the load-displacement curves to the massive dislocation activities occurring underneath the indenter during loading cycle. The absence of indentation-induced new phases might have been due to the stress relaxation via substrate and is also consistent with the fact that no discontinuity was found upon unloading. Advisors/Committee Members: T. N. Shiau (chair), Hsieh, Shou-Shing (chair), Chien, Chi-Hui (committee member).

Subjects/Keywords: Material characteristics; Nanoindentation; Finite element method; Molecular dynamics; Metal thin films

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang, C. (2007). Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1024107-135247

Chicago Manual of Style (16^th Edition):

Wang, Chung-ting. “Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film.” 2007. Doctoral Dissertation, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1024107-135247.

MLA Handbook (7^th Edition):

Wang, Chung-ting. “Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film.” 2007. Web. 28 Feb 2021.

Vancouver:

Wang C. Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film. [Internet] [Doctoral dissertation]. NSYSU; 2007. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1024107-135247.

Council of Science Editors:

Wang C. Numerical Simulation and Experimental Test of Nanoindentation Analysis on Metal Thin Film. [Doctoral Dissertation]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1024107-135247

NSYSU

11. Shih, Yi-san. Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2006, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0816106-120138

► The efficiency of the fuel cell depends on both the kinetics of the electrochemical process and performance of the components. The main aim of this… (more)

Subjects/Keywords: Fuel cells; Interface Reliability; Micro-channels; Stress Intensity Factor

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Shih, Y. (2006). Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0816106-120138

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Shih, Yi-san. “Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC.” 2006. Thesis, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0816106-120138.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Shih, Yi-san. “Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC.” 2006. Web. 28 Feb 2021.

Vancouver:

Shih Y. Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC. [Internet] [Thesis]. NSYSU; 2006. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0816106-120138.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Shih Y. Reliability Analysis of the Cracked Ag-SU8 Interface on the Channel Wall in a Micro-PEMFC. [Thesis]. NSYSU; 2006. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0816106-120138

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

12. Wu, Yii-der. Characterizations of Biomechanical Properties of Bones in Mammals.

Degree: PhD, Mechanical and Electro-Mechanical Engineering, 2007, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0117107-154949

► Pigs, mice and human beings are all vertebrate mammals. More than 90% of genomes in pigs and mice are the same as human beings. Experiment… (more)

Subjects/Keywords: Radius; Bone; Cartilage; Cranial suture; Biomechanical properties; Cranium

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wu, Y. (2007). Characterizations of Biomechanical Properties of Bones in Mammals. (Doctoral Dissertation). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0117107-154949

Chicago Manual of Style (16^th Edition):

Wu, Yii-der. “Characterizations of Biomechanical Properties of Bones in Mammals.” 2007. Doctoral Dissertation, NSYSU. Accessed February 28, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0117107-154949.

MLA Handbook (7^th Edition):

Wu, Yii-der. “Characterizations of Biomechanical Properties of Bones in Mammals.” 2007. Web. 28 Feb 2021.

Vancouver:

Wu Y. Characterizations of Biomechanical Properties of Bones in Mammals. [Internet] [Doctoral dissertation]. NSYSU; 2007. [cited 2021 Feb 28]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0117107-154949.

Council of Science Editors:

Wu Y. Characterizations of Biomechanical Properties of Bones in Mammals. [Doctoral Dissertation]. NSYSU; 2007. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0117107-154949

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