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You searched for +publisher:"NSYSU" +contributor:("Chung-ting Wang"). Showing records 1 – 14 of 14 total matches.

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NSYSU

1. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

 Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous… (more)

Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 18 Apr 2021.

Vancouver:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

2. Han Tsai, Cing. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC,… (more)

Subjects/Keywords: molecular dynamics; temperature effects; polycrystalline structure; coefficient of kinetic friction; single crystal structure

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APA (6th Edition):

Han Tsai, C. (2014). The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Web. 18 Apr 2021.

Vancouver:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

3. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

 Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction… (more)

Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 18 Apr 2021.

Vancouver:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

4. Wang , Jhao-Shun. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

 In the MEMS process, a thin film is likely to be coated on a substrate. Residual stress is established in the coating upon cooling to… (more)

Subjects/Keywords: Digital Image Correlation Method; Indium Tin Oxide Film; Taguchi Method; Coating Residual Stress; Coating Distribution

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang , J. (2016). Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Web. 18 Apr 2021.

Vancouver:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

5. Chen , Yu-yen. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

 The characteristics of the intermetallic compound in an IC package are very important. When it is too thick or non-uniformly distributed, the reliability of the… (more)

Subjects/Keywords: first-principles method; Poissonâs ratio; Youngâs modulus; intermetallic compound; coefficient of thermal expansion

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APA (6th Edition):

Chen , Y. (2016). Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chen , Yu-yen. “Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.” 2016. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chen , Yu-yen. “Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.” 2016. Web. 18 Apr 2021.

Vancouver:

Chen Y. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen Y. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

6. Lee, Wei-Chi. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

 As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device… (more)

Subjects/Keywords: optical fiber transceiver device; heat dissipation; finite volume method; design rule; thermal conductivity coefficient

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Lee, W. (2016). The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Web. 18 Apr 2021.

Vancouver:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

7. Chu, Yu-tsung. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 In traditional IC packaging, wire bonding is typically performed using gold. In recent years, increasing gold prices have motivated the packaging industry actively to develop… (more)

Subjects/Keywords: Cubic polynomial; Temperature effect; Thermal expansion coefficient; Palladium; Digital image correlation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Chu, Y. (2014). DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Web. 18 Apr 2021.

Vancouver:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

8. Syue, Ming-Jyun. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out.… (more)

Subjects/Keywords: finite element method; cold joint; 2.5D integrated circuits; copper pillar bump; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Syue, M. (2014). The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Web. 18 Apr 2021.

Vancouver:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

9. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

 Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has… (more)

Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 18 Apr 2021.

Vancouver:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

10. Liu, Hsuan-Ting. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

 In this study, 3D FEM (finite element method) models of both single cell and dual-cell of PEMFC (proton exchange membrane fuel cell) had been established,… (more)

Subjects/Keywords: Proton Exchange Membrane Fuel Cell; Contact Resistance; Bolt Pre-loading; Power Density; Porosity

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Liu, H. (2017). The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Web. 18 Apr 2021.

Vancouver:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Internet] [Thesis]. NSYSU; 2017. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

11. Pan, Bo-Hong. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2018, NSYSU

 In recent years, due to the rapid development of computational science, software, and the internet, the popularity of storage device and high-capacity make the computational… (more)

Subjects/Keywords: Artificial Neural Network Algorithms; Genetic Algorithms; Multi-objective Optimization; Big Data; Data Mining Procedure

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APA (6th Edition):

Pan, B. (2018). Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pan, Bo-Hong. “Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2018. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pan, Bo-Hong. “Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2018. Web. 18 Apr 2021.

Vancouver:

Pan B. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. [Internet] [Thesis]. NSYSU; 2018. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pan B. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. [Thesis]. NSYSU; 2018. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

12. Hsu, Wei-Tsung. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2008, NSYSU

 Liquid crystal display (LCD) has been widely used as an important human interface with typical portable devices such as notebook-type computers, digital camera and cell… (more)

Subjects/Keywords: V-Cut; Dark region phenomenon; Edge structure; Backlight module; Light guide plate; Dot pattern

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hsu, W. (2008). A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hsu, Wei-Tsung. “A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.” 2008. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hsu, Wei-Tsung. “A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.” 2008. Web. 18 Apr 2021.

Vancouver:

Hsu W. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. [Internet] [Thesis]. NSYSU; 2008. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsu W. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. [Thesis]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

13. Wang, Hui-chi. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

 Nowadays, using the LED as backlight module's light source becomes generalization gradually, and the application of LED light source develops from the liquid crystal display… (more)

Subjects/Keywords: Uniformity; Reflection cup; LED; Backlight module

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, H. (2009). SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Web. 18 Apr 2021.

Vancouver:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Internet] [Thesis]. NSYSU; 2009. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


NSYSU

14. Wang, Ming-Han. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

 Polymer material tends to absorb moisture of environment to cause volume swelling among various materials of electronic package, such as underfill and substrate. The residual… (more)

Subjects/Keywords: Finite element; Glass transition temperature; Vapor pressure; Organic passivation; Moisture; 2.5D IC Package; 3D IC Package

Record DetailsSimilar RecordsGoogle PlusoneFacebookTwitterCiteULikeMendeleyreddit

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wang, M. (2014). Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Thesis, NSYSU. Accessed April 18, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Web. 18 Apr 2021.

Vancouver:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Apr 18]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

.