+publisher:"NSYSU" +contributor:("Chung-Ting Wang")

NSYSU

1. Li, Jun-jie. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2013, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

► Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous… (more)

▼ Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous stringent environmental conditions have been established for low-temperature processes. This has increased costs and created additional processing steps. Recently, researchers have proposed a couples-polishing activation-bonding (CAB) process. This process involves using ultrasonic vibration technology to induce interfacial friction, thereby increasing temperatures at the interface. Subsequently, atomic diffusion leaving copper contacts generate engagement. This process can be performed at room temperature. In this study, the finite-element method was used to establish a micro-copper block ultrasonic-vibration-bonding 3D simulation model. In addition, the effects of various ultrasonic-vibration frequencies on the stress, strain, and temperature fields of the interface were explored, and the effects of the coefficients of friction and amplitude on interface strain were analyzed. The simulation results showed that at 50 kHz, the bonding process was successful after 1500 Î¼s. The equivalent stress could be divided into stress upward, stress downward, and stress stabilization phases. Based on the results, it may be suggested that ultrasound-vibration frequencies affect energy transfer rates. The results obtained at 50 kHz showed that the outermost strain was less than 23% of the center strain. By increasing the frequency, a critical frequency was determined regarding the period necessary to obtain a steady stress rate. Finally, when the friction coefficient and amplitude were changed, at a fixed frequency, the coefficient of friction rose from 0.1 to 0.15, which was a larger increase in strain than 0.15 to 0.2. Regarding amplitude changes, when the frequency was low, the amplitude exhibited an increased effect on the maximum equivalent strain. Advisors/Committee Members: Rung-Hung Suen (chair), Chi-Hui Chien (committee member), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Ting-Lang Hsiao (chair).

Subjects/Keywords: couples-polishing activation bonding (CAB) process; 3D integrated circuits (ICs); copper-bonding process; ultrasonic vibration

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Li, J. (2013). Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Li, Jun-jie. “Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package.” 2013. Web. 24 Jan 2021.

Vancouver:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Internet] [Thesis]. NSYSU; 2013. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Li J. Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package. [Thesis]. NSYSU; 2013. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0805113-220336

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

2. Han Tsai, Cing. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

► The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC,… (more)

▼ The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC, Marc, and other packages, is available. Some of the software does not include enough material properties, and especially too few properties that are relate to temperature. Accordingly the results of simulations not close to the reality. The study uses the LAMMPS, which is software for simulating molecular dynamics, to simulate the experiments on the friction. The coefficient of the kinetic friction at high temperature is thus obtained. This work successfully developed a complete calculating package of coefficient of the kinetic friction. The user can change the metal and the temperature. Comparing experimental at room temperature in the literature with the results of the simulation yields a, single crystalline model error of 7.66% and a polycrystalline model error of 8.33%. This investigation discusses the effects of the frictional properties by copper on copper at various friction velocities, depth of ploughing and temperatures. In recent years, a few people have studied the polycrystalline model. In this work, not only a single crystalline model but also polycrystalline model is developed and utilized to describe the real structure of a material. The results obtained herein yield a depth of ploughing of 2.50 nm, a simulated temperature of 293.0 K and an increase in tip velocity from 100.0 m/s to 400.0 m/s. The coefficient of kinetic friction of the single crystalline structure decreased from 2.30 to 1.24 and that of the polycrystalline structure decreased from 1.86 to 1.44. When the tip velocity is 100 m/s, temperature is 293.0 K and the depth of ploughing increased from 1.00 nm to 2.50 nm. The coefficient of kinetic friction of the single crystal structure decreased from 4.30 to 2.30 and that of the polycrystalline structure is decreased from 2.25 to 1.86. Finally, when the tip velocity is 100 m/s, the depth of ploughing is 2.50 nm and temperature increased from 293.0 K to 1000.0 K. The single crystal structure decreased from 2.30 to 1.38 and that of the polycrystalline structure is maintained between 1.77 to 1.90. Advisors/Committee Members: CHChien (committee member), Jung-Hung Sun (chair), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), T. N. Shiau (chair).

Subjects/Keywords: molecular dynamics; temperature effects; polycrystalline structure; coefficient of kinetic friction; single crystal structure

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Han Tsai, C. (2014). The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Han Tsai, Cing. “The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation.” 2014. Web. 24 Jan 2021.

Vancouver:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Han Tsai C. The Temperature Effects of Friction Properties Analysis in Single Crystalline and Polycrystalline Metal by Molecular Dynamics Simulation. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0727114-154544

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

3. Chen , Jyun-Ye. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2015, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

► Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction… (more)

▼ Thermosonic copper wire bonding process technology is one of the main IC packing process technologies. During this process, there is heat generation produced by friction resulted from relative sliding between the contact surface of copper ball and pad and the interface temperature is increased. This will affect the formation of intermetallic compound and bonding strength. Therefore, in the study of copper wire bonding process, temperature effect is an important factor on wire bonding strength. However, most of the existed research articles for studying these issues by using numerical simulation method usually considered the frictional resistance only and ignored the effect of heat generation caused by friction. In this study, the finite element method is used and a three-dimensional simulation model is established for studying thermosonic copper wire bonding process and not only the frictional resistance effects but only the frictional thermal effects are considered. This study makes discussion and analysis on three parts. The first part discusses the effects of frictional heat generation on contact surface stress field, strain field and temperature field of copper wire bonding surface. The second part discusses the effects of variation of ultrasonic frequency and amplitude on stress field, strain field and temperature field of copper ball and aluminum pad during the process operating time. The third part analyzes the effect of variation of ultrasonic frequency and amplitude on thickness of intermetallic compounds due to intermetallic compound thickness generation formulation. The simulated results indicated that the maxima effective plastic strain of aluminum pad with considering frictional heat generation is 7.003 % lower than the values for which not considering frictional heat generation, the maxima temperature rises 20.47 %, and the maxima effective stress drops 41.53 %. The variation of ultrasonic frequency and amplitude on the temperature field is unobvious while the simulation time is 22 Î¼s. But if the simulation time reaches 955 Î¼s , the temperature will be raised 25.74 % to 34.45 %. Also, when simulation time is 22 Î¼s, ultrasonic amplitude is 1 Î¼m and the frequency varies from 60 kHz to 240 kHz, the thickness of intermetallic increases 37.58 %. If the frequency is 120 kHz and the amplitude varies from 0.5 Î¼m to 1.5 Î¼m, the intermetallic thickness increases 26.98 %. Advisors/Committee Members: Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Rung-Hung Suen (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: Intermetallic compound; Copper wire bonding process; Frictional heat generation; Finite element method

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chen , J. (2015). The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen , Jyun-Ye. “The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis.” 2015. Web. 24 Jan 2021.

Vancouver:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2015. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen J. The Interface Friction Effects on Copper Wire Bonding Process in IC Package by Finite Element Analysis. [Thesis]. NSYSU; 2015. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0020115-174047

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

4. Wang , Jhao-Shun. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

► In the MEMS process, a thin film is likely to be coated on a substrate. Residual stress is established in the coating upon cooling to… (more)

▼ In the MEMS process, a thin film is likely to be coated on a substrate. Residual stress is established in the coating upon cooling to room temperature because thermal expansion coefficients of the thin film and the substrate are different. The residual stress in the coating not only causes bending but also affects the quality of coating. This thesis discusses the relationship of the residual stress and its distribution with the parameters of the process and the thickness of the ITO thin film that is coated on the Si-substrate. Four parameters of coating process - coating time, sputtering power, working pressure, and argon flow rate â are considered here. In the experiment, each parameter is set to one of three levels, consistent with the Taguchi Method, yielding nine combinations. For each of the nine combinations, three Si-substrates are used. Measurements are made at nine points on each Si-substrate. Two sets of the in-plane displacement of the coating from two different angles of the screen can be measured by using digital image correlation technique. The obtained sets of in-plane displacements can be used to calculate the out-of-plane displacement, the components of residual stress in the x-direction and the y-direction can be calculated using the modified Stoneyâs equation. The equivalent residual stress is calculated from these components of residual stresses, and the coefficient of variation is calculated from the average and standard deviation of the equivalent residual stress at the nine points on the Si-substrate. Finally, the distribution of residual stress in coating is discussed with reference to the experimentally obtained coefficient of variation. The experimental results indicate that the coating time and the sputtering power importantly affect the magnitude of residual stress, but the working pressure and the argon flow rate have very little effect. Additionally, the experimental results show that the residual stress distribution is affected by coating time, sputtering power, argon flow rate and working pressure, in order of declining strength of the effect. The coating time most strongly affects the coating process. As the coating thickness increases, the residual stress decreases and the variation among measurements made of three Si-substrates of same combination declines. Restated, the precision of the experimental measurements improves with the coating thickness, but the distribution of residual stress becomes less uniform. Advisors/Committee Members: T. N. Shiau (chair), Jung-Hung Sun (chair), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: Digital Image Correlation Method; Indium Tin Oxide Film; Taguchi Method; Coating Residual Stress; Coating Distribution

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang , J. (2016). Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang , Jhao-Shun. “Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method.” 2016. Web. 24 Jan 2021.

Vancouver:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang J. Analysis of Residual Stress Distribution in ITO Thin Film Coated on Si-Substrate by Applying DIC Technique and Taguchi Method. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718116-153028

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

5. Chen , Yu-yen. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912

► The characteristics of the intermetallic compound in an IC package are very important. When it is too thick or non-uniformly distributed, the reliability of the… (more)

Subjects/Keywords: first-principles method; Poissonâs ratio; Youngâs modulus; intermetallic compound; coefficient of thermal expansion

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chen , Y. (2016). Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chen , Yu-yen. “Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.” 2016. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chen , Yu-yen. “Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion.” 2016. Web. 24 Jan 2021.

Vancouver:

Chen Y. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chen Y. Mechanical Properties Calculations for Metal IMC at Reflow Temperature â Youngâs Modulus, Poissonâs Ratio and Coefficient of Thermal Expansion. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722116-143912

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

6. Lee, Wei-Chi. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

► As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device… (more)

▼ As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device is important for communication through optical fiber networks. The temperature of the device affects its lifetime, the quality of communication and the coupling efficiency of the optical fiber. Since some of the components of the Optical Fiber Transceiver Device can be made of various materials, this work constructs a threeâdimensional Optical Fiber Transceiver Device model using the ANSYS 15.0/Fluent software for implementing the finite volume method, and to investigate the effects of the thermal conductivity coefficient of the materials on heat dissipation by the device. Among five components which have alternative materials â substrate, housing, coating, SMT substrate and solder ball ââ the results revealed the dissipation of heat by the device was dominated by the variations of substrate and SMT substrateâs thermal conductivity coefficient. These critical variables were fitted using equations in terms of the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling. The effect of the laser power on the fitting model was considered. Then, the design rule corresponding to the critical componentsâ thermal conductivity coefficient of the Optical Fiber Transceiver Device was obtained successfully. The errors between the simulated and the fitted results which were concluding the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling were less than 9%. At a heat dissipation by the laser of 210mW, when the thermal conductivity coefficients of the substrate and the SMT substrateâs material were 2W/mâ and 60W/mâ, the maximum temperature of the device and the difference between the inlet and outlet temperatures were less than 85â and 12â, respectively. Advisors/Committee Members: Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Jung-Hung Sun (chair), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair).

Subjects/Keywords: optical fiber transceiver device; heat dissipation; finite volume method; design rule; thermal conductivity coefficient

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Lee, W. (2016). The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Lee, Wei-Chi. “The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device.” 2016. Web. 24 Jan 2021.

Vancouver:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Internet] [Thesis]. NSYSU; 2016. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Lee W. The Effects of Variations of Materialâs Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729116-014200

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

7. Chu, Yu-tsung. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

► In traditional IC packaging, wire bonding is typically performed using gold. In recent years, increasing gold prices have motivated the packaging industry actively to develop… (more)

Subjects/Keywords: Cubic polynomial; Temperature effect; Thermal expansion coefficient; Palladium; Digital image correlation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Chu, Y. (2014). DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Chu, Yu-tsung. “DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels.” 2014. Web. 24 Jan 2021.

Vancouver:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Chu Y. DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731114-180308

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

8. Syue, Ming-Jyun. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

► As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out.… (more)

▼ As the semiconductor manufacturing industry continue to develop high-density integrated circuits ï¼ICï¼, many studies of 2.5D and 3D IC packaging technology are being carried out. The copper pillar bump bonding process has become the mean means of fabricating 2.5D IC structures. Recently, cold joint defects have been detected in copper pillar welding. Currently the industry believes that structural warping by heating is likely to be the main cause of the formation of defects. This work establishes a two-dimensional model of the 2.5D IC by using the finite element method to simulate the impact of bonding with warping on welding process, and determines the range of bonding forces when copper pillars debond and generate cracks, using the debonding setting in ANSYS. Finally, the impact of an IC on warping and the range of bonding forces is studied by changing the thickness of the die layer, the material structure of the copper pillars, and the reflow temperature. The results of the numerical simulation model that is used in this research, which does not consider the alignment show that when the bonding force exceeded 285MPa, no crack appeared. When the bonding was less than 50MPa, debonding occurred. Compared with 50um thickness of the die, when the thickness was changed to 100 and 150um, the critical bonding forces of crack were increased by 14 and 30%, respectively, and the warpages were increased 13.53 and 25.05%, respectively. Adding a nickel layer to the copper pillars directly reduced the overall warpage and increased critical bonding force. For example, the layer improved the critical bonding force of type 3 by 8.77%, reduced the warpage by 0.76%. Adding the gold layer reduced the stress concentration in the solder that was caused by the nickel layer, reducing the critical bonding force; the type 5 had a 4.84% lower bonding force that the type 3, which had no gold layer. Compared with 100 °C of reflow temperature, when the temperature was changed to 150, 200, and 240 °C, the critical bonding forces were increased by 31.71, 36.59 ,and 39.02%, respectively, and the warpages were increased approximately linearly with temperature by 46.47, 74.83 and 77.89%, respectively. Advisors/Committee Members: Chi-Hui Chien (committee member), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Jung-Hung Sun (chair), T. N. Shiau (chair).

Subjects/Keywords: finite element method; cold joint; 2.5D integrated circuits; copper pillar bump; warpage

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Syue, M. (2014). The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Syue, Ming-Jyun. “The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis.” 2014. Web. 24 Jan 2021.

Vancouver:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Syue M. The Bonding Effects of Reflow Warpage on 2.5D IC Copper Pillar Bump Process by Using Finite Element Analysis. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0729114-011633

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

9. Jhuang, Yun-Da. Effect of Coated Material on Cu Wire Bonding in IC Package.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2012, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

► Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has… (more)

Subjects/Keywords: Taguchi experiment method; Finite element method; Copper wire bonding; Coating

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Jhuang, Y. (2012). Effect of Coated Material on Cu Wire Bonding in IC Package. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Jhuang, Yun-Da. “Effect of Coated Material on Cu Wire Bonding in IC Package.” 2012. Web. 24 Jan 2021.

Vancouver:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Internet] [Thesis]. NSYSU; 2012. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Jhuang Y. Effect of Coated Material on Cu Wire Bonding in IC Package. [Thesis]. NSYSU; 2012. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0904112-020258

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

10. Liu, Hsuan-Ting. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2017, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

► In this study, 3D FEM (finite element method) models of both single cell and dual-cell of PEMFC (proton exchange membrane fuel cell) had been established,… (more)

▼ In this study, 3D FEM (finite element method) models of both single cell and dual-cell of PEMFC (proton exchange membrane fuel cell) had been established, separately. The commercial software ANSYS15.0 was adopted in order to observe the effect of bolt pre-loading variation on the contact resistance and porosity of GDL (gas diffusion layer) in PEMFC. Then, the obtained values of contact resistance and porosity of GDL were substituted into the electro-chemistry simulation software Fluent 15.0 and the effect of bolt pre-loading variation on the efficiency of PEMFC was discussed. In stress-strain analysis, a 3D PEMFC model with the reactive area of 25cm2 had been established through 3D drawing software SolidWroks 2013. The model includes membrane, catalyst layer, gas diffusion layer, flow channel plate, current collector and body plate which all elements were fixed by 12 pairs of bolt and nut. In order to apply bolt pre-loading on each pair of bolt and nut, the nuts were assumed to be fixed and the ANSYS built-in function, bolt pretension, was adopted. According to the simulative results, both contact resistance and porosity of GDL are decreasing while the bolt pre-loading increasing. The decreasing of contact resistance can reduce the ohmic loss effectively, and increase the efficiency of PEMFC. However, the decreasing of porosity of GDL will cause the increasing of resistance of permeability and resulted in the decreasing of the efficiency of PEMFC. The results of electro-chemistry simulation show that by increasing bolt pre-loading from 5MPa to 16MPa will result in 75.7% improvement of maxima power density of PEMFC. In a dual-cell PEMFC, the average equivalent stress of the GDL is increased due to the increase in the total thickness of the flow channel plates, thus greatly reduce the contact resistance of GDL. The simulative results indicate that due to the contribution of the reduction of contact resistance of GDL, the maximum power density of the dual-cell module is increased by 37.8%. Keywords: Proton Exchange Membrane Fuel Cell, Contact Resistance, Porosity, Bolt Pre-loading, Power Density Advisors/Committee Members: T. N. Shiau (chair), Jung-Hung SUN (chair), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Chi-Hui Chien (committee member).

Subjects/Keywords: Proton Exchange Membrane Fuel Cell; Contact Resistance; Bolt Pre-loading; Power Density; Porosity

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Liu, H. (2017). The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Liu, Hsuan-Ting. “The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL.” 2017. Web. 24 Jan 2021.

Vancouver:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Internet] [Thesis]. NSYSU; 2017. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Liu H. The Effect of Bolts Pre-loading on the Efficiency of PEMFC and Performance of GDL. [Thesis]. NSYSU; 2017. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0631117-023629

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

11. Pan, Bo-Hong. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2018, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733

► In recent years, due to the rapid development of computational science, software, and the internet, the popularity of storage device and high-capacity make the computational… (more)

▼ In recent years, due to the rapid development of computational science, software, and the internet, the popularity of storage device and high-capacity make the computational science rising greatly in various fields. Using computer to calculate, engineering experiment or information collecting from internet have increased greatly and conserved. The amount of information is so huge that the traditional data processing canât be handled. It needs a new type of data processing, so the development of data mining is very rapid. The purpose of this study is to develop a standard operating procedure of data mining, written by Python, which is highly expandable and easy to be compiled. Such that the predicting model corresponding to a massive amount of input engineering data can be obtained by using artificial neural network algorithms and optimized the engineering problem by using genetic algorithms. In this study, 130 sets of data collected from an existed literature, each set of data contains four input parameters and two output targets, were inputted into the proposed data mining procedure to establish the relevant predicting model. The predicted results showed that the mean square root of relative error of the two outputs target is 2.27% and 3.97%, respectively, which verifies the reliability of the predicting model established by the proposed data mining procedure. Furthermore, this study also uses Rastrigin function to verify the feasibility and correctness of the proposed data mining procedure in searching for the optimal combination of input parameters. This study also discusses the variations of the important control parameters of the two algorithms used in the proposed data mining procedure on the impact of the results. Finally, this study established a predicting model and optimizing the multi-objective target, using 64 sets of data simulated by ANSYS. The predicted results showed that the RMSE of the three outputs target are 1.72%ã2.42% and 4.51%, and verifies the reliability of the predicting model. By using genetic algorithms, we also got the results of multi-objective optimization which are 483.28ã359.33 and 176.39, all of those are lower than the minimum of the datasets we got. Verifying the multi-objective optimization we established again. Advisors/Committee Members: Ming-Hwa R. Jen (committee member), Cheng-Tang Pan (chair), ting%20Wang%22%29&pagesize-30">Chung-ting Wang (chair).

Subjects/Keywords: Artificial Neural Network Algorithms; Genetic Algorithms; Multi-objective Optimization; Big Data; Data Mining Procedure

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Pan, B. (2018). Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Pan, Bo-Hong. “Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2018. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Pan, Bo-Hong. “Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms.” 2018. Web. 24 Jan 2021.

Vancouver:

Pan B. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. [Internet] [Thesis]. NSYSU; 2018. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pan B. Reliability Analysis and Multi-objective Optimization for Electronic Packaging by using Artificial Neural Network Algorithms and Genetic Algorithms. [Thesis]. NSYSU; 2018. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0804118-162733

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

12. Hsu, Wei-Tsung. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2008, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353

► Liquid crystal display (LCD) has been widely used as an important human interface with typical portable devices such as notebook-type computers, digital camera and cell… (more)

▼ Liquid crystal display (LCD) has been widely used as an important human interface with typical portable devices such as notebook-type computers, digital camera and cell phones, etc. The LCD panel does not emit light spontaneously, and thus it needs a surface backlight source. The function of light guide plate (LGP) was to guide light from a light source and radiates it homogeneously from all over its output surface. In this thesis, the research object was focused on this optical component. This thesis mainly concludes two major parts. The first part focused on the design of cold fluorescent lamp (CCFL) light source LGP. If the bottom structure of the LGP in a backlight module was made up of V-Cut micro-structures, then conventionally, the shape and spacing between any two adjacent columns of micro-structure should be designed specifically in order to obtain a more uniform illuminance distribution. It was required to apply complicated mathematics and cost a lot of time to design. In this study, a simplified bottom structure of the LGP was proposed. The considered bottom structure of the LGP was proposed to be made up of same shape high energy V-Cut micro-structures, and the spacing between any two adjacent columns of the micro-structure was also the same. The design parameters were determined by using optimization technique. Also, the LCD design time could be reduced. In order to eliminate the dark region phenomenon caused by the proposed simplified bottom structure of the LGP, a simple new type of edge structure of the LGP was proposed also. The proposed simplified LGP design concepy has many merits, such as only three design parameters needed, manufacturing easily, the design time can be reduced, and can prevent the consumption of light source energy between the gaps of CCFL and LGP. The proposed design concept was applied on the design of 7 inches, 15 inches and 20 inches of backlight module (BLM). Through the numerical simulation by utilizing commercial software Light Tools, it can be shown that more than 80% of uniformity can be easily obtained. The second part focused on traditional dot pattern bottom structures. As the same concept mentioned in the first part, the proposed dot pattern was made up of same geometrival shape of dots, and the spacing between any two adjacent columns of the dots was also the same. The design parameters were determined by using optimization technique. The proposed design concept of the dot patten distribution can be applied on the design of LGP with either LED or CCFL light source. Also, the dark phenomenon did not occur, and so the corresponding edge structure did not need either. The proposed design concept was applied on the design of 7 inches, 15 inches and 20 inches of BLM with CCFL light source and on the design of 7 inches of BLM with LED light sources. The optical simulation results showed that about 90% of uniformity can be easily obtained. Advisors/Committee Members: Yii-Der Wu (chair), Ting-Lang Shiau (chair), Chih-Hui Chien (committee member), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Jung-Hsung Sun (chair).

Subjects/Keywords: V-Cut; Dark region phenomenon; Edge structure; Backlight module; Light guide plate; Dot pattern

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Hsu, W. (2008). A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Hsu, Wei-Tsung. “A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.” 2008. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Hsu, Wei-Tsung. “A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module.” 2008. Web. 24 Jan 2021.

Vancouver:

Hsu W. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. [Internet] [Thesis]. NSYSU; 2008. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsu W. A New Design of Light Guide Plate on the Elimination of Dark Region Phenomenon for Backlight Module. [Thesis]. NSYSU; 2008. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0722108-145353

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

13. Wang, Hui-chi. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2009, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

► Nowadays, using the LED as backlight module's light source becomes generalization gradually, and the application of LED light source develops from the liquid crystal display… (more)

▼ Nowadays, using the LED as backlight module's light source becomes generalization gradually, and the application of LED light source develops from the liquid crystal display to the liquid crystal TV. However, thermal dissipative problem of LED component is still an important issue to study presently, since it can affect the service lives of LED and LCD seriously. In order to increase the luminous energy of the LED component, one need to increase the supply of electric power and it will cause the increment of thermal dissipative problem of the LED component also. Therefore, by considering the LED components as the light source of the backlight module , the purpose of this study is to reduce number of the required LED components in order to decrease the thermal dissipative problem of LEDs, and maintain the luminous and uniformity of the backlight module simultaneously. A new packaging for LED, named SMD type metallic reflection cup LED component, was proposed in this study. The new LED package not only has a better thermal dissipative property, but also can control its radiation property by changing the angle of its reflection cup. So, the proposed LED package can be applied for different purposes. By applying the proposed LED components as the light source of a backlight module, under the condition of same illumination, it can be shown that the required number of LED components can be decreased tremendously and so the thermal dissipative problem can be decreased too. Also, the numerical simulated results showed that by choosing the suitable angle of the reflection cup, the uniformity of the backlight module can be improved. Besides, this study proposed a modified method for assessing the uniformity of a backlight module. The simulated results showed that the proposed method can assess the uniformity of a backlight module more suitable than the traditional nine points measurement method can do. Advisors/Committee Members: Ting-Nung Shiau (chair), Chi-Hui Chien (committee member), Ting%20Wang%22%29&pagesize-30">Chung-Ting Wang (chair), Chi-Chang Hsieh (chair), Jung-Hung Sun (chair).

Subjects/Keywords: Uniformity; Reflection cup; LED; Backlight module

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang, H. (2009). SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang, Hui-chi. “SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module.” 2009. Web. 24 Jan 2021.

Vancouver:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Internet] [Thesis]. NSYSU; 2009. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang H. SMD Type Metallic Reflection Cup LED Component on the Application of Backlight Module. [Thesis]. NSYSU; 2009. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0717109-114022

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

NSYSU

14. Wang, Ming-Han. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2014, NSYSU

URL: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

► Polymer material tends to absorb moisture of environment to cause volume swelling among various materials of electronic package, such as underfill and substrate. The residual… (more)

Subjects/Keywords: Finite element; Glass transition temperature; Vapor pressure; Organic passivation; Moisture; 2.5D IC Package; 3D IC Package

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^th Edition):

Wang, M. (2014). Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16^th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Thesis, NSYSU. Accessed January 24, 2021. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7^th Edition):

Wang, Ming-Han. “Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects.” 2014. Web. 24 Jan 2021.

Vancouver:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Internet] [Thesis]. NSYSU; 2014. [cited 2021 Jan 24]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Wang M. Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects. [Thesis]. NSYSU; 2014. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-1102114-144116

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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Open Access Theses and Dissertations