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You searched for +publisher:"NSYSU" +contributor:("C. L. Chiu"). One record found.

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NSYSU

1. Hsu, Ching-Hu. Study of laser cutting of Sapphire.

Degree: Master, Mechanical and Electro-Mechanical Engineering, 2016, NSYSU

In this thesis, we study laser machining of sapphire and related issues. In order to achieve the industryâs general standard so this study focuses on sapphire processing optimum process parameters. There are two main processing needed, laser scribing for splitting and laser dicing. Laser scribing for splitting needs a cut depth of 1/3 the thickness of sapphire, and the finished surface canât have chipping (< 30 μm), random crack or closet breaking. In addition, the processing time must be fast and stable. Therefore, this thesis proposes three different experimental dicing and processing parameters. First, experiment applies simple optical system (direct beam) with âoptical trepanâ and XY-stage with laser source of ultraviolet. The parameters of laser frequency at 25 kHz, laser power of 3 watt and once round rip cutting with speed 5 mm/s can achieve depth of 1/3 the thickness. Using optical improvements, installation âoptical trepanâ in optical path to make small circle around area circle can improve the speed of XY-stage. Then laser dicing can be achieved (the gap between the surface and back side is about 40 μm). Second experiment is using ultraviolet laser source. But in the optical system, we install âLaser Scannerâ (Galvo Head) with high cutting speed characteristic and high freedom of laser machining. Laser frequency of 25 kHz, laser power of 3 watt and 15 times round rip cutting with speed 100 mm/s can achieve depth of 1/3 the thickness. In high speed and high freedom of laser machining processing, âRepetition rate of machiningâ is more important. And the best repetition rate in scanner is 80%. Finally, to completely cut sapphire, we use a high power infrared fiber laser (150 watt) as a processing source. Installation laser cutter and coaxial blowing with different type cooling gas can improve the IR laser caused thermal effects. The best cooling gas is nitrogen (9 kgf/cm2), which can isolate sapphire and oxygen interacting. Thus the thermal affected region can be less than 20 μm. Advisors/Committee Members: C. L. Chiu (chair), Cheng-Tang Pan (committee member), Wang, Yu-Jen (chair).

Subjects/Keywords: laser cutter; trepan; laser scanner; fiber laser; laser maching; laser scribing; laser dicing; sapphire; infrared laser; ultraviolet laser

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hsu, C. (2016). Study of laser cutting of Sapphire. (Thesis). NSYSU. Retrieved from http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0028116-211556

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hsu, Ching-Hu. “Study of laser cutting of Sapphire.” 2016. Thesis, NSYSU. Accessed October 23, 2019. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0028116-211556.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hsu, Ching-Hu. “Study of laser cutting of Sapphire.” 2016. Web. 23 Oct 2019.

Vancouver:

Hsu C. Study of laser cutting of Sapphire. [Internet] [Thesis]. NSYSU; 2016. [cited 2019 Oct 23]. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0028116-211556.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hsu C. Study of laser cutting of Sapphire. [Thesis]. NSYSU; 2016. Available from: http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0028116-211556

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

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