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Indian Institute of Science

1. Ambasana, Nikita. Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems.

Degree: PhD, Faculty of Engineering, 2018, Indian Institute of Science

URL: http://etd.iisc.ac.in/handle/2005/3609

The Internet of Things (IoT) has ushered in an age where low-power sensors generate data which are communicated to a back-end cloud for massive data computation tasks. From the hardware perspective this implies co-existence of several power-efficient sub-systems working harmoniously at the sensor nodes capable of communication and high-speed processors in the cloud back-end. The package-board system-level design plays a crucial role in determining the performance of such low-power sensors and high-speed computing and communication systems. Although there exist several commercial solutions for electromagnetic and circuit analysis and verification, problem diagnosis and design tools are lacking leading to longer design cycles and non-optimal system designs. This work aims at developing methodologies for faster analysis, sensitivity based diagnosis and multi-objective design towards signal integrity and power integrity of such package-board system layouts.
The first part of this work aims at developing a methodology to enable faster and more exhaustive design space analysis. Electromagnetic analysis of packages and boards can be performed in time domain, resulting in metrics like eye-height/width and in frequency domain resulting in metrics like s-parameters and z-parameters. The generation of eye-height/width at higher bit error rates require longer bit sequences in time domain circuit simulation, which is compute-time intensive. This work explores learning based modelling techniques that rapidly map relevant frequency domain metrics like differential insertion-loss and cross-talk, to eye-height/width therefore facilitating a full-factorial design space sweep. Numerical results performed with artificial neural network as well as least square support vector machine on SATA 3.0 and PCIe Gen 3 interfaces generate less than 2% average error with order of magnitude speed-up in eye-height/width computation.
Accurate power distribution network design is crucial for low-power sensors as well as a cloud sever boards that require multiple power level supplies. Achieving target power-ground noise levels for low power complex power distribution networks require several design and analysis cycles. Although various classes of analysis tools, 2.5D and 3D, are commercially available, the presence of design tools is limited. In the second part of the thesis, a frequency domain mesh-based sensitivity formulation for DC and AC impedance (z-parameters) is proposed. This formulation enables diagnosis of layout for maximum impact in achieving target specifications. This sensitivity information is also used for linear approximation of impedance profile updates for small mesh variations, enabling faster analysis.
To enable designing of power delivery networks for achieving target impedance, a mesh-based decoupling capacitor sensitivity formulation is presented. Such an analytical gradient is used in gradient based optimization techniques to achieve an optimal set of decoupling capacitors with appropriate values and placement information in…
*Advisors/Committee Members: Gope, Dipanjan (advisor).*

Subjects/Keywords: Power Integrity; Chip Package System; Package-bond System Level Design; Least Square Support Vector Machines (LS-SVM); S-Parameters; Learning Based Models; Power Integrity Design; Chip-Package-Systems; Electrical Communication

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^{th} Edition):

Ambasana, N. (2018). Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems. (Doctoral Dissertation). Indian Institute of Science. Retrieved from http://etd.iisc.ac.in/handle/2005/3609

Chicago Manual of Style (16^{th} Edition):

Ambasana, Nikita. “Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems.” 2018. Doctoral Dissertation, Indian Institute of Science. Accessed April 17, 2021. http://etd.iisc.ac.in/handle/2005/3609.

MLA Handbook (7^{th} Edition):

Ambasana, Nikita. “Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems.” 2018. Web. 17 Apr 2021.

Vancouver:

Ambasana N. Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems. [Internet] [Doctoral dissertation]. Indian Institute of Science; 2018. [cited 2021 Apr 17]. Available from: http://etd.iisc.ac.in/handle/2005/3609.

Council of Science Editors:

Ambasana N. Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems. [Doctoral Dissertation]. Indian Institute of Science; 2018. Available from: http://etd.iisc.ac.in/handle/2005/3609

Indian Institute of Science

2. Das, Arkaprovo. Fast Solvers for Integtral-Equation based Electromagnetic Simulations.

Degree: PhD, Faculty of Engineering, 2018, Indian Institute of Science

URL: http://etd.iisc.ac.in/handle/2005/2998

With the rapid increase in available compute power and memory, and bolstered by the advent of efficient formulations and algorithms, the role of 3D full-wave computational methods for accurate modelling of complex electromagnetic (EM) structures has gained in significance. The range of problems includes Radar Cross Section (RCS) computation, analysis and design of antennas and passive microwave circuits, bio-medical non-invasive detection and therapeutics, energy harvesting etc. Further, with the rapid advances in technology trends like System-in-Package (SiP) and System-on-Chip (SoC), the fidelity of chip-to-chip communication and package-board electrical performance parameters like signal integrity (SI), power integrity (PI), electromagnetic interference (EMI) are becoming increasingly critical. Rising pin-counts to satisfy functionality requirements and decreasing layer-counts to maintain cost-effectiveness necessitates 3D full wave electromagnetic solution for accurate system modelling.
Method of Moments (MoM) is one such widely used computational technique to solve a 3D electromagnetic problem with full-wave accuracy. Due to lesser number of mesh elements or discretization on the geometry, MoM has an advantage of a smaller matrix size. However, due to Green's Function interactions, the MoM matrix is dense and its solution presents a time and memory challenge. The thesis focuses on formulation and development of novel techniques that aid in fast MoM based electromagnetic solutions.
With the recent paradigm shift in computer hardware architectures transitioning from single-core microprocessors to multi-core systems, it is of prime importance to parallelize the serial electromagnetic formulations in order to leverage maximum computational benefits. Therefore, the thesis explores the possibilities to expedite an electromagnetic simulation by scalable parallelization of near-linear complexity algorithms like Fast Multipole Method (FMM) on a multi-core platform.
Secondly, with the best of parallelization strategies in place and near-linear complexity algorithms in use, the solution time of a complex EM problem can still be exceedingly large due to over-meshing of the geometry to achieve a desired level of accuracy. Hence, the thesis focuses on judicious placement of mesh elements on the geometry to capture the physics of the problem without compromising on accuracy- a technique called Adaptive Mesh Refinement. This facilitates a reduction in the number of solution variables or degrees of freedom in the system and hence the solution time.
For multi-scale structures as encountered in chip-package-board systems, the MoM formulation breaks down for parts of the geometry having dimensions much smaller as compared to the operating wavelength. This phenomenon is popularly known as low-frequency breakdown or low-frequency instability. It results in an ill-conditioned MoM system matrix, and hence higher iteration count to converge when solved using an iterative solver framework. This consequently increases the solution time…
*Advisors/Committee Members: Gope, Dipanjan (advisor).*

Subjects/Keywords: Electromagnetic Solvers; Method of Moments (MOM); Electromagnetic Simulations; Computational Electromagnetics; Electromagnetics; Fast Multiple Method; Adaptive Mesh Refinement; Integral Equation Electromagnetic Solvers; Electromagnetic Refinement Indicators; Electric Field Integral Equation; Electrical Communication Engineering

Record Details Similar Records

❌

APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6^{th} Edition):

Das, A. (2018). Fast Solvers for Integtral-Equation based Electromagnetic Simulations. (Doctoral Dissertation). Indian Institute of Science. Retrieved from http://etd.iisc.ac.in/handle/2005/2998

Chicago Manual of Style (16^{th} Edition):

Das, Arkaprovo. “Fast Solvers for Integtral-Equation based Electromagnetic Simulations.” 2018. Doctoral Dissertation, Indian Institute of Science. Accessed April 17, 2021. http://etd.iisc.ac.in/handle/2005/2998.

MLA Handbook (7^{th} Edition):

Das, Arkaprovo. “Fast Solvers for Integtral-Equation based Electromagnetic Simulations.” 2018. Web. 17 Apr 2021.

Vancouver:

Das A. Fast Solvers for Integtral-Equation based Electromagnetic Simulations. [Internet] [Doctoral dissertation]. Indian Institute of Science; 2018. [cited 2021 Apr 17]. Available from: http://etd.iisc.ac.in/handle/2005/2998.

Council of Science Editors:

Das A. Fast Solvers for Integtral-Equation based Electromagnetic Simulations. [Doctoral Dissertation]. Indian Institute of Science; 2018. Available from: http://etd.iisc.ac.in/handle/2005/2998