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You searched for +publisher:"Georgia Tech" +contributor:("May, Gary"). Showing records 1 – 20 of 20 total matches.

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1. Fairley, Jacqueline Antoinette. Statistical modeling of the human sleep process via physiological recordings.

Degree: PhD, Electrical and Computer Engineering, 2009, Georgia Tech

 The main objective of this work was the development of a computer-based Expert Sleep Analysis Methodology (ESAM) to aid sleep care physicians in the diagnosis… (more)

Subjects/Keywords: Evolutionary computer algorithms; Biosignal processing; Quantitative-based human sleep analysis; Human sleep pathology; Sleep; Polysomnography; Parkinson's disease; Computer simulation; Automatic classification

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APA (6th Edition):

Fairley, J. A. (2009). Statistical modeling of the human sleep process via physiological recordings. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/33912

Chicago Manual of Style (16th Edition):

Fairley, Jacqueline Antoinette. “Statistical modeling of the human sleep process via physiological recordings.” 2009. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/33912.

MLA Handbook (7th Edition):

Fairley, Jacqueline Antoinette. “Statistical modeling of the human sleep process via physiological recordings.” 2009. Web. 30 Mar 2020.

Vancouver:

Fairley JA. Statistical modeling of the human sleep process via physiological recordings. [Internet] [Doctoral dissertation]. Georgia Tech; 2009. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/33912.

Council of Science Editors:

Fairley JA. Statistical modeling of the human sleep process via physiological recordings. [Doctoral Dissertation]. Georgia Tech; 2009. Available from: http://hdl.handle.net/1853/33912

2. Mevawalla, Zubin. Process modeling and optimization using industrial semiconductor fabrication data.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 Manufacturers address the distinct operational objectives of product innovation and manufacturing efficiency by having separate fabrication facilities (“fabs”) for development and manufacturing. Additionally, the industrial… (more)

Subjects/Keywords:

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APA (6th Edition):

Mevawalla, Z. (2015). Process modeling and optimization using industrial semiconductor fabrication data. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53382

Chicago Manual of Style (16th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/53382.

MLA Handbook (7th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Web. 30 Mar 2020.

Vancouver:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/53382.

Council of Science Editors:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53382

3. King, Calvin R., Jr. Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling.

Degree: PhD, Electrical and Computer Engineering, 2012, Georgia Tech

 Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can… (more)

Subjects/Keywords: Packaging; Microelectronics; Liquid cooling; 3D integration; Thermal management; Microelectronics Cooling; Heat Convection; Liquids Thermal properties; Microelectronics packaging

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APA (6th Edition):

King, Calvin R., J. (2012). Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/44759

Chicago Manual of Style (16th Edition):

King, Calvin R., Jr. “Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling.” 2012. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/44759.

MLA Handbook (7th Edition):

King, Calvin R., Jr. “Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling.” 2012. Web. 30 Mar 2020.

Vancouver:

King, Calvin R. J. Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling. [Internet] [Doctoral dissertation]. Georgia Tech; 2012. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/44759.

Council of Science Editors:

King, Calvin R. J. Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling. [Doctoral Dissertation]. Georgia Tech; 2012. Available from: http://hdl.handle.net/1853/44759

4. Patterson, Chad E. Exploration of liquid crystal polymer packaging techniques for rf wireless systems.

Degree: PhD, Electrical and Computer Engineering, 2012, Georgia Tech

 In the past decade, there has been an increased interest in low-cost, low-power, high data rate wireless systems for both commercial and defense applications. Some… (more)

Subjects/Keywords: Wire bond; Microstrip; BAW; Active antenna; Phased array; Microwave; Millimeter wave; GaAs; CMOS; SiGe; Flip-chip; Liquid crystal polymer; System on package; Polymer liquid crystals; Wireless communication systems; Microelectronic packaging

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APA (6th Edition):

Patterson, C. E. (2012). Exploration of liquid crystal polymer packaging techniques for rf wireless systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/44800

Chicago Manual of Style (16th Edition):

Patterson, Chad E. “Exploration of liquid crystal polymer packaging techniques for rf wireless systems.” 2012. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/44800.

MLA Handbook (7th Edition):

Patterson, Chad E. “Exploration of liquid crystal polymer packaging techniques for rf wireless systems.” 2012. Web. 30 Mar 2020.

Vancouver:

Patterson CE. Exploration of liquid crystal polymer packaging techniques for rf wireless systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2012. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/44800.

Council of Science Editors:

Patterson CE. Exploration of liquid crystal polymer packaging techniques for rf wireless systems. [Doctoral Dissertation]. Georgia Tech; 2012. Available from: http://hdl.handle.net/1853/44800

5. Zhang, Xuchen. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Signal integrity and thermal management are the two major challenges in heterogeneous integration technologies. In this research, the impact of through silicon vias (TSVs) on… (more)

Subjects/Keywords: Heterogeneous integration; 3D IC; 2.5D IC; HIST; Microfluidic cooling; Signal integrity; TSV; Compliance interconnects

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APA (6th Edition):

Zhang, X. (2017). 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58647

Chicago Manual of Style (16th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/58647.

MLA Handbook (7th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Web. 30 Mar 2020.

Vancouver:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/58647.

Council of Science Editors:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58647

6. Oh, Hanju. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Microfluidic cooling technology is a promising thermal solution for high-performance three-dimensional (3-D) microsystems. However, the integration of microfluidic cooling into 3-D microsystems inevitably impacts tier-to-tier… (more)

Subjects/Keywords: 3D microsystem; Microfluidic cooling; Silicon interposer; Through-silicon via

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APA (6th Edition):

Oh, H. (2017). Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58139

Chicago Manual of Style (16th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/58139.

MLA Handbook (7th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Web. 30 Mar 2020.

Vancouver:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/58139.

Council of Science Editors:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58139


Georgia Tech

7. Shin, Jaemin. Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates.

Degree: PhD, Electrical and Computer Engineering, 2005, Georgia Tech

 In this dissertation, a predictive (scalable) measurement-based PEEC modeling method for high-frequency interconnects on low-cost FR4 substrates is proposed and demonstrated. The interconnects are modeled… (more)

Subjects/Keywords: Modeling; High frequency; Interconnect; Measurement; Predictive; FR4

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APA (6th Edition):

Shin, J. (2005). Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/7108

Chicago Manual of Style (16th Edition):

Shin, Jaemin. “Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates.” 2005. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/7108.

MLA Handbook (7th Edition):

Shin, Jaemin. “Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates.” 2005. Web. 30 Mar 2020.

Vancouver:

Shin J. Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates. [Internet] [Doctoral dissertation]. Georgia Tech; 2005. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/7108.

Council of Science Editors:

Shin J. Rapid, Predictive Modeling for High Frequency Interconnect on Low Cost Substrates. [Doctoral Dissertation]. Georgia Tech; 2005. Available from: http://hdl.handle.net/1853/7108


Georgia Tech

8. Morris, Bryan George Oneal. In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor.

Degree: PhD, Electrical and Computer Engineering, 2009, Georgia Tech

 This research explores a novel in-situ technique for monitoring film thickness in the reactive etching process that incorporates a micromachined sensor. The sensor correlates film… (more)

Subjects/Keywords: Capacitive interface circuit; Sacrificial layer technique; Integrated MEMS sensor; RIE process control; Etch rate monitoring; Resonant MEMS sensor; RIE; Reactive ion etching; Plasma etching; Semiconductor industry

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APA (6th Edition):

Morris, B. G. O. (2009). In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/31688

Chicago Manual of Style (16th Edition):

Morris, Bryan George Oneal. “In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor.” 2009. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/31688.

MLA Handbook (7th Edition):

Morris, Bryan George Oneal. “In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor.” 2009. Web. 30 Mar 2020.

Vancouver:

Morris BGO. In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor. [Internet] [Doctoral dissertation]. Georgia Tech; 2009. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/31688.

Council of Science Editors:

Morris BGO. In situ monitoring of reactive ion etching using a surface micromachined integrated resonant sensor. [Doctoral Dissertation]. Georgia Tech; 2009. Available from: http://hdl.handle.net/1853/31688


Georgia Tech

9. Xuan, Xiangdong. Analysis and design of reliable mixed-signal CMOS circuits.

Degree: PhD, Electrical and Computer Engineering, 2004, Georgia Tech

 Facing the constantly increasing reliability challenges under technology scaling, the topics in IC reliability technique have been receiving serious attention during recent years. In this… (more)

Subjects/Keywords: Reliability simulation; Design-for-reliability; IC reliability; Metal oxide semiconductors, Complementary Reliability Computer simulation; Integrated circuits Reliability Computer simulation

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APA (6th Edition):

Xuan, X. (2004). Analysis and design of reliable mixed-signal CMOS circuits. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/4776

Chicago Manual of Style (16th Edition):

Xuan, Xiangdong. “Analysis and design of reliable mixed-signal CMOS circuits.” 2004. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/4776.

MLA Handbook (7th Edition):

Xuan, Xiangdong. “Analysis and design of reliable mixed-signal CMOS circuits.” 2004. Web. 30 Mar 2020.

Vancouver:

Xuan X. Analysis and design of reliable mixed-signal CMOS circuits. [Internet] [Doctoral dissertation]. Georgia Tech; 2004. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/4776.

Council of Science Editors:

Xuan X. Analysis and design of reliable mixed-signal CMOS circuits. [Doctoral Dissertation]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/4776


Georgia Tech

10. Reid, Pamela Patrice. Variable Frequency Microwave Reflow of Lead-Free Solder Paste.

Degree: MS, Chemical Engineering, 2004, Georgia Tech

 As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of… (more)

Subjects/Keywords: Variable frequency microwave; Microelectronics; Lead-free solder; Microelectronics Research; Microwaves Industrial applications; Solder paste

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APA (6th Edition):

Reid, P. P. (2004). Variable Frequency Microwave Reflow of Lead-Free Solder Paste. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5011

Chicago Manual of Style (16th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Masters Thesis, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/5011.

MLA Handbook (7th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Web. 30 Mar 2020.

Vancouver:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Internet] [Masters thesis]. Georgia Tech; 2004. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/5011.

Council of Science Editors:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Masters Thesis]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/5011


Georgia Tech

11. Williams, Frances R. Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques.

Degree: PhD, Electrical and Computer Engineering, 2003, Georgia Tech

 Since semiconductor fabrication processes require numerous steps, cost and yield are critical concerns. In-situ monitoring is therefore vital for process control. However, this goal is… (more)

Subjects/Keywords: Acoustic sensor; Semiconductor manufacturing; Electroplating; MEMS; Semiconductors Design and construction; Electroplating; Microelectromechanical systems Design and construction; Semiconductors Acoustic properties

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APA (6th Edition):

Williams, F. R. (2003). Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5278

Chicago Manual of Style (16th Edition):

Williams, Frances R. “Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques.” 2003. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/5278.

MLA Handbook (7th Edition):

Williams, Frances R. “Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques.” 2003. Web. 30 Mar 2020.

Vancouver:

Williams FR. Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques. [Internet] [Doctoral dissertation]. Georgia Tech; 2003. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/5278.

Council of Science Editors:

Williams FR. Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques. [Doctoral Dissertation]. Georgia Tech; 2003. Available from: http://hdl.handle.net/1853/5278


Georgia Tech

12. Thacker, Hiren Dilipkumar. Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects.

Degree: PhD, Electrical and Computer Engineering, 2006, Georgia Tech

 The use of optical input/output (I/O) interconnects, in addition to electrical I/Os, is a promising approach for achieving high-bandwidth, chip-to-board communications required for future high-performance… (more)

Subjects/Keywords: Optoelectronic testing; Optical testing; MEMS; Waveguide; MOEMS; Compliant leads; Optical interconnects; Packaging; Interconnects; Through-wafer interconnects; Optical loopback; Probe; Probes (Electronic instruments) Testing; Optoelectronic devices; Optical interconnects; Microelectromechanical systems; Interconnects (Integrated circuit technology); High performance computing Research

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APA (6th Edition):

Thacker, H. D. (2006). Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/11597

Chicago Manual of Style (16th Edition):

Thacker, Hiren Dilipkumar. “Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects.” 2006. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/11597.

MLA Handbook (7th Edition):

Thacker, Hiren Dilipkumar. “Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects.” 2006. Web. 30 Mar 2020.

Vancouver:

Thacker HD. Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects. [Internet] [Doctoral dissertation]. Georgia Tech; 2006. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/11597.

Council of Science Editors:

Thacker HD. Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects. [Doctoral Dissertation]. Georgia Tech; 2006. Available from: http://hdl.handle.net/1853/11597


Georgia Tech

13. Sutton, Akil Khamisi. Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits.

Degree: PhD, Electrical and Computer Engineering, 2009, Georgia Tech

 Hydrocarbon exploration, global navigation satellite systems, computed tomography, and aircraft avionics are just a few examples of applications that require system operation at an ambient… (more)

Subjects/Keywords: Bit error rate testing; Displacement damage; Heterojunction bipolar transistor; Radiation effects; Radiation hardening by design; Silicon germanium; Single event upset; Ionization; Heterojunctions; Bipolar transistors; Logic circuits; Radiation hardening; Hardness; Germanium compounds; Silicon compounds; Extreme environments

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APA (6th Edition):

Sutton, A. K. (2009). Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/29778

Chicago Manual of Style (16th Edition):

Sutton, Akil Khamisi. “Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits.” 2009. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/29778.

MLA Handbook (7th Edition):

Sutton, Akil Khamisi. “Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits.” 2009. Web. 30 Mar 2020.

Vancouver:

Sutton AK. Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits. [Internet] [Doctoral dissertation]. Georgia Tech; 2009. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/29778.

Council of Science Editors:

Sutton AK. Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits. [Doctoral Dissertation]. Georgia Tech; 2009. Available from: http://hdl.handle.net/1853/29778


Georgia Tech

14. Brown, Terence D. Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy.

Degree: PhD, Electrical and Computer Engineering, 2003, Georgia Tech

 The objective of this research was to investigate the microscopic processes occurring at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy… (more)

Subjects/Keywords: Anion exchange; Segregation; Diffusion

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APA (6th Edition):

Brown, T. D. (2003). Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5279

Chicago Manual of Style (16th Edition):

Brown, Terence D. “Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy.” 2003. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/5279.

MLA Handbook (7th Edition):

Brown, Terence D. “Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy.” 2003. Web. 30 Mar 2020.

Vancouver:

Brown TD. Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy. [Internet] [Doctoral dissertation]. Georgia Tech; 2003. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/5279.

Council of Science Editors:

Brown TD. Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy. [Doctoral Dissertation]. Georgia Tech; 2003. Available from: http://hdl.handle.net/1853/5279


Georgia Tech

15. Buford, Clarence Marcelle. Thermodynamic Analysis of Hydrogen Generation.

Degree: PhD, Physics, 2003, Georgia Tech

 Hydrogen is an energy carrier that can be used to create electricity via an electrochemical device called a fuel cell. Thus, many American scientists and… (more)

Subjects/Keywords: Thermodynamic; Hydrogen

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APA (6th Edition):

Buford, C. M. (2003). Thermodynamic Analysis of Hydrogen Generation. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5295

Chicago Manual of Style (16th Edition):

Buford, Clarence Marcelle. “Thermodynamic Analysis of Hydrogen Generation.” 2003. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/5295.

MLA Handbook (7th Edition):

Buford, Clarence Marcelle. “Thermodynamic Analysis of Hydrogen Generation.” 2003. Web. 30 Mar 2020.

Vancouver:

Buford CM. Thermodynamic Analysis of Hydrogen Generation. [Internet] [Doctoral dissertation]. Georgia Tech; 2003. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/5295.

Council of Science Editors:

Buford CM. Thermodynamic Analysis of Hydrogen Generation. [Doctoral Dissertation]. Georgia Tech; 2003. Available from: http://hdl.handle.net/1853/5295


Georgia Tech

16. Averett, Rodney Dewayne. Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions.

Degree: PhD, Polymer, Textile and Fiber Engineering, 2008, Georgia Tech

 The objective of the current research was to contribute to the area of mechanics of composite polymeric materials. This objective was reached by establishing a… (more)

Subjects/Keywords: Fibers; Neural networks; Polymers; Fatigue; Nanocomposites; Nanostructured materials Fatigue; Composite materials Fatigue; Fracture mechanics; Deformations (Mechanics)

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APA (6th Edition):

Averett, R. D. (2008). Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/24807

Chicago Manual of Style (16th Edition):

Averett, Rodney Dewayne. “Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions.” 2008. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/24807.

MLA Handbook (7th Edition):

Averett, Rodney Dewayne. “Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions.” 2008. Web. 30 Mar 2020.

Vancouver:

Averett RD. Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/24807.

Council of Science Editors:

Averett RD. Experimental aspects and mechanical modeling paradigms for the prediction of degradation and failure in nanocomposite materials subjected to fatigue loading conditions. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/24807


Georgia Tech

17. Eason, Kwaku. Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements.

Degree: PhD, Mechanical Engineering, 2008, Georgia Tech

 There is strong interest in the use of small low-cost highly sensitive magnetic field sensors for applications (such as small memory and biomedical devices) requiring… (more)

Subjects/Keywords: Meshless methods; Micromagnetics; Magneto-impedance; Magnetoresistance; Detectors; Electromagnetic devices

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APA (6th Edition):

Eason, K. (2008). Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/26589

Chicago Manual of Style (16th Edition):

Eason, Kwaku. “Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements.” 2008. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/26589.

MLA Handbook (7th Edition):

Eason, Kwaku. “Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements.” 2008. Web. 30 Mar 2020.

Vancouver:

Eason K. Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/26589.

Council of Science Editors:

Eason K. Numerical investigation of micro-macro coupling in magneto-impedance sensors for weak field measurements. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/26589


Georgia Tech

18. Wornyo, Edem. Fabrication and characterization of shape memory polymers at small scales.

Degree: PhD, Electrical and Computer Engineering, 2008, Georgia Tech

 The objective of this research is to thoroughly investigate the shape memory effect in polymers, characterize, and optimize these polymers for applications in information storage… (more)

Subjects/Keywords: Information storage; Nanotechnology; Atomic force microscopy; Nanoindentation; Shape memory polymers; Dynamic mechanical analysis; Genetic algorithms; Designed experiments; Shape memory alloys; Smart materials; Polymers; Shape memory effect; Information storage and retrieval systems

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Wornyo, E. (2008). Fabrication and characterization of shape memory polymers at small scales. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/26714

Chicago Manual of Style (16th Edition):

Wornyo, Edem. “Fabrication and characterization of shape memory polymers at small scales.” 2008. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/26714.

MLA Handbook (7th Edition):

Wornyo, Edem. “Fabrication and characterization of shape memory polymers at small scales.” 2008. Web. 30 Mar 2020.

Vancouver:

Wornyo E. Fabrication and characterization of shape memory polymers at small scales. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/26714.

Council of Science Editors:

Wornyo E. Fabrication and characterization of shape memory polymers at small scales. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/26714


Georgia Tech

19. Setia, Ronald. Modeling and Diagnosis of Excimer Laser Ablation.

Degree: PhD, Electrical and Computer Engineering, 2005, Georgia Tech

 Recent advances in the miniaturization, functionality, and integration of integrated circuits and packages, such as the system-on-package (SOP) methodology, require increasing use of microvias that… (more)

Subjects/Keywords: Neural networks; Microvia; Microsystem packaging; Neuro-fuzzy networks; Statistical experimental design; Excimer laser ablation; Failure detection and diagnosis; Genetic algorithms; Dempster-Shafer theory; Neural networks (Computer science); Microelectronics; Microelectromechanical systems; Excimer lasers

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APA (6th Edition):

Setia, R. (2005). Modeling and Diagnosis of Excimer Laser Ablation. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/7634

Chicago Manual of Style (16th Edition):

Setia, Ronald. “Modeling and Diagnosis of Excimer Laser Ablation.” 2005. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/7634.

MLA Handbook (7th Edition):

Setia, Ronald. “Modeling and Diagnosis of Excimer Laser Ablation.” 2005. Web. 30 Mar 2020.

Vancouver:

Setia R. Modeling and Diagnosis of Excimer Laser Ablation. [Internet] [Doctoral dissertation]. Georgia Tech; 2005. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/7634.

Council of Science Editors:

Setia R. Modeling and Diagnosis of Excimer Laser Ablation. [Doctoral Dissertation]. Georgia Tech; 2005. Available from: http://hdl.handle.net/1853/7634


Georgia Tech

20. Dang, Bing. Integrated Input/Output Interconnection and Packaging for GSI.

Degree: PhD, Electrical and Computer Engineering, 2006, Georgia Tech

 In this research, a set of integrated I/O interconnection and packaging technologies are investigated. MEMS-based sea-of-leads (SoL) compliant interconnects are demonstrated to be promising to… (more)

Subjects/Keywords: I/O packaging; GSI

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Dang, B. (2006). Integrated Input/Output Interconnection and Packaging for GSI. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/14001

Chicago Manual of Style (16th Edition):

Dang, Bing. “Integrated Input/Output Interconnection and Packaging for GSI.” 2006. Doctoral Dissertation, Georgia Tech. Accessed March 30, 2020. http://hdl.handle.net/1853/14001.

MLA Handbook (7th Edition):

Dang, Bing. “Integrated Input/Output Interconnection and Packaging for GSI.” 2006. Web. 30 Mar 2020.

Vancouver:

Dang B. Integrated Input/Output Interconnection and Packaging for GSI. [Internet] [Doctoral dissertation]. Georgia Tech; 2006. [cited 2020 Mar 30]. Available from: http://hdl.handle.net/1853/14001.

Council of Science Editors:

Dang B. Integrated Input/Output Interconnection and Packaging for GSI. [Doctoral Dissertation]. Georgia Tech; 2006. Available from: http://hdl.handle.net/1853/14001

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