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Georgia Tech
1.
Xu, Jianwen.
Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards.
Degree: PhD, Materials Science and Engineering, 2006, Georgia Tech
URL: http://hdl.handle.net/1853/11525 
► Conventionally discrete passive components like capacitors, resistors, and inductors are surface-mounted on top of the printed circuit boards (PCBs). To match the ever increasing demands…
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▼ Conventionally discrete passive components like capacitors, resistors, and inductors are surface-mounted on top of the printed circuit boards (PCBs). To match the ever increasing demands of miniaturization, cost reduction, and high performance in microelectronic industry, a promising approach is to integrate passive components into the board during PCB manufacture. Because they are embedded inside multilayer PCBs, such components are called embedded passives.
This work focuses on the materials design, development and processing of polymer-based dielectric nanocomposites for embedded capacitor applications. The methodology of this approach is to combine the advantages of the polymer and the filler to satisfy the electric, dielectric, mechanical, fabrication, and reliability requirements for embedded capacitors. Restrained by poor adhesion and poor thermal stress reliability at high filler loadings, currently polymer-ceramic composites can only achieve a dielectric constant of less than 50. In order to increase the dielectric constant to above 50, effects of high-k polymer matrix, bimodal fillers, and dispersing agent are systematically investigated. Surface functionalization of nanofiller particles and modification of epoxy matrix with a secondary rubberized epoxy to form sea-island structure are proposed to enhance the dielectric constant, adhesion and high-temperature thermal stress reliability of high-k composites. To obtain photodefinable high-k composites, fundamental understanding of the photopolymerization of the novel epoxy-ceramic composite photoresist is addressed. While the properties of high-k composites largely depend on the polymer matrix, the fillers can also drastically affect the material properties. Carbon black- and carbon nanotubes-filled ultrahigh-k polymer composites are investigated as the candidate materials for embedded capacitors. Dielectric composites based on percolation typically show a high dielectric constant, and a high dielectric loss which is not desirable for high frequency applications. To achieve a reproducible low-loss percolative composite, a novel low-cost core-shell particle filled high-k percolative composite is developed. The nanoscale insulating shells allow the electrons in the metallic core to tunnel through it, and thereby the composites exhibit a high dielectric constant as a percolation system; on the other hand, the insulating oxide layer restricts the electron transfer between filler particles, thus leading to a low loss as in a polymer-ceramic system.
Advisors/Committee Members: Dr. C.P. Wong (Committee Chair), Dr. Christopher Summers (Committee Member), Dr. Dennis W. Hess (Committee Member), Dr. Meilin Liu (Committee Member), Dr. Rosario A. Gerhardt (Committee Member).
Subjects/Keywords: Embedded passives; Polymer composite; Nanocomposites; Dielectric properties; Photoresists; Embedded capacitors; Nanostructured materials; Polymeric composites; Composite materials; Dielectrics
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APA (6th Edition):
Xu, J. (2006). Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/11525
Chicago Manual of Style (16th Edition):
Xu, Jianwen. “Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards.” 2006. Doctoral Dissertation, Georgia Tech. Accessed January 20, 2021.
http://hdl.handle.net/1853/11525.
MLA Handbook (7th Edition):
Xu, Jianwen. “Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards.” 2006. Web. 20 Jan 2021.
Vancouver:
Xu J. Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards. [Internet] [Doctoral dissertation]. Georgia Tech; 2006. [cited 2021 Jan 20].
Available from: http://hdl.handle.net/1853/11525.
Council of Science Editors:
Xu J. Dielectric Nanocomposites for High Performance Embedded Capacitors in Organic Printed Circuit Boards. [Doctoral Dissertation]. Georgia Tech; 2006. Available from: http://hdl.handle.net/1853/11525
Georgia Tech
2.
Zhu, Qunzhi.
Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces.
Degree: PhD, Mechanical Engineering, 2004, Georgia Tech
URL: http://hdl.handle.net/1853/5062
► Bidirectional reflectance is a fundamental radiative property of rough surfaces. Knowledge of the bidirectional reflectance is crucial to the emissivity modeling and heat transfer analysis.…
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▼ Bidirectional reflectance is a fundamental radiative property of rough surfaces. Knowledge of the bidirectional reflectance is crucial to the emissivity modeling and heat transfer analysis. This thesis concentrates on the modeling and measurements of the bidirectional reflectance for microrough silicon surfaces and on the validity of a hybrid method in the modeling of the bidirectional reflectance for thin-film coated rough surfaces.
The surface topography and the bidirectional reflectance distribution function (BRDF) of the rough side of several silicon wafers have been extensively characterized using an atomic force microscope and a laser scatterometer, respectively. The slope distribution calculated from the surface topographic data deviates from the Gaussian distribution. Both nearly isotropic and strongly anisotropic features are observed in the two-dimensional (2-D) slope distributions and in the measured BRDF for more than one sample. The 2-D slope distribution is used in a geometric-optics based model to predict the BRDF, which agrees reasonably well with the measured values. The side peaks in the slope distribution and the subsidiary peaks in the BRDF for two anisotropic samples are attributed to the formation of {311} planes during chemical etching. The correlation between the 2-D slope distribution and the BRDF has been developed.
A boundary integral method is applied to simulate the bidirectional reflectance of thin-film coatings on rough substrates. The roughness of the substrate is one dimensional for simplification. The result is compared to that from a hybrid method which uses the geometric optics approximation to model the roughness effect and the thin-film optics to consider the interference due to the coating. The effects of the film thickness and the substrate roughness on the validity of the hybrid method have been investigated. The validity regime of the hybrid method is established for silicon dioxide films on silicon substrates in the visible wavelength range.
The proposed method to characterize the microfacet orientation and to predict the BRDF may be applied to other anisotropic or non-Gaussian rough surfaces. The measured BRDF may be used to model the apparent emissivity of silicon wafers to improve the temperature measurement accuracy in semiconductor manufacturing processes. The developed validity regime for the hybrid method can be beneficial to future research related to the modeling for thin-film coated rough surfaces.
Advisors/Committee Members: Dr. Zhuomin Zhang (Committee Chair), Dr. Andrei G. Fedorov (Committee Member), Dr. Andrew F. Peterson (Committee Member), Dr. Dennis W. Hess (Committee Member), Dr. J. Robert Mahan (Committee Member).
Subjects/Keywords: Light Scattering; Slope distribution; Thin-film coating; Rough surface; AFM; BRDF; Thin films Testing; Silicon Testing; Reflectance; Light Scattering
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APA (6th Edition):
Zhu, Q. (2004). Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5062
Chicago Manual of Style (16th Edition):
Zhu, Qunzhi. “Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces.” 2004. Doctoral Dissertation, Georgia Tech. Accessed January 20, 2021.
http://hdl.handle.net/1853/5062.
MLA Handbook (7th Edition):
Zhu, Qunzhi. “Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces.” 2004. Web. 20 Jan 2021.
Vancouver:
Zhu Q. Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces. [Internet] [Doctoral dissertation]. Georgia Tech; 2004. [cited 2021 Jan 20].
Available from: http://hdl.handle.net/1853/5062.
Council of Science Editors:
Zhu Q. Modeling and Measurements of the Bidirectional Reflectance of Microrough Silicon Surfaces. [Doctoral Dissertation]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/5062
Georgia Tech
3.
Ford, Jackson Walker.
Designing for sustainability with CO2-tunable solvents.
Degree: PhD, Chemical Engineering, 2007, Georgia Tech
URL: http://hdl.handle.net/1853/19866
► Developing greener, more efficient, and less energy-intensive processes will lead the chemical industry into a more sustainable future. Gas-expanded liquids (GXLs) form a unique class…
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▼ Developing greener, more efficient, and less energy-intensive processes will lead the chemical industry into a more sustainable future. Gas-expanded liquids (GXLs) form a unique class of environmentally benign and tunable solvents that can be used in a variety of applications. Through the series of studies presented in this thesis, we have investigated both the properties and applications of GXLs. We have developed a more complete understanding of the interactions between the gas, the organic liquid, and solutes at the molecular level through kinetic and solvatochromic experiments. We have examined a Diels-Alder reaction and an SN2 reaction and have described the kinetic results in terms of intermolecular interactions and local composition enhancement. We have also demonstrated the use of Organic-Aqueous Tunable Solvents, a special case of GXLs, to recycle homogeneous hydroformylation catalysts. The results of this research can be used to guide future applications of GXLs as green reaction solvents.
Advisors/Committee Members: Dr. Charles A. Eckert (Committee Chair), Dr. Charles L. Liotta (Committee Co-Chair), Dr. Amyn Teja (Committee Member), Dr. Dennis W. Hess (Committee Member), Dr. Victor Breedveld (Committee Member).
Subjects/Keywords: Gas-expanded liquids; Alternative solvents; Carbon dioxide; Solvatochromism; Local structure; Carbon dioxide; Solvents; Sustainable engineering; Green products
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APA (6th Edition):
Ford, J. W. (2007). Designing for sustainability with CO2-tunable solvents. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/19866
Chicago Manual of Style (16th Edition):
Ford, Jackson Walker. “Designing for sustainability with CO2-tunable solvents.” 2007. Doctoral Dissertation, Georgia Tech. Accessed January 20, 2021.
http://hdl.handle.net/1853/19866.
MLA Handbook (7th Edition):
Ford, Jackson Walker. “Designing for sustainability with CO2-tunable solvents.” 2007. Web. 20 Jan 2021.
Vancouver:
Ford JW. Designing for sustainability with CO2-tunable solvents. [Internet] [Doctoral dissertation]. Georgia Tech; 2007. [cited 2021 Jan 20].
Available from: http://hdl.handle.net/1853/19866.
Council of Science Editors:
Ford JW. Designing for sustainability with CO2-tunable solvents. [Doctoral Dissertation]. Georgia Tech; 2007. Available from: http://hdl.handle.net/1853/19866
Georgia Tech
4.
Myneni, Satyanarayana.
Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids.
Degree: PhD, Chemical Engineering, 2004, Georgia Tech
URL: http://hdl.handle.net/1853/7605
► As feature sizes in semiconductor devices become smaller and newer materials are incorporated, current methods for photoresist and post plasma etch residue removal face several…
(more)
▼ As feature sizes in semiconductor devices become smaller and newer materials are incorporated, current methods for photoresist and post plasma etch residue removal face several challenges. A cleaning process should be environmentally benign, compatible with dielectric materials and copper, and provide residue removal from narrow and high aspect ratio features. In this work, sub-critical CO2 based mixtures have been developed to remove the etch residues; these mixtures satisfy the above requirements and can potentially replace the two step residue removal process currently used in the integrated circuit (IC) industry.
Based on the chemical nature of the residue being removed, additives or co-solvents to CO2 have been identified that can remove the residues without damaging the dielectric layers. Using the phase behavior of these additives as a guide, the composition of the co-solvent was altered to achieve a single liquid phase at moderate pressures without compromising cleaning ability. The extent of residue removal has been analyzed primarily by x-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Various techniques such as attenuated total reflection - Fourier transform infrared (ATR-FTIR) spectroscopy, angle-resolved XPS (ARXPS), and interferometry were used to probe the interaction of cleaning fluids with residues. Model films of photoresists and plasma deposited residues were used to assist in understanding the mechanism of residue removal. From these studies, it was concluded that residue removal takes place primarily by attack of the interface between the residue and the substrate; a solvent rinse then lifts these residues from the wafer. It has been shown that transport of the additives to the interface is enhanced in the presence of CO2. From positronium annihilation lifetime spectroscopy (PALS) studies on a porous dielectric film, it has been shown that these high pressure fluids do not cause significant changes to the pore sizes or the bonding structure of the film. Hence, this method can be used to remove post etch residues from low-k dielectric films.
Advisors/Committee Members: Dr. Dennis W. Hess (Committee Chair), Dr. Amyn S. Teja (Committee Member), Dr. Charles A. Eckert (Committee Member), Dr. Charles L. Liotta (Committee Member), Dr. J. Carson Meredith (Committee Member).
Subjects/Keywords: Low-K; Angle resolved XPS; Surface cleaning; Supercritical carbon dioxide; ATR-FTIR; Fluorocarbon residue; Etch residue; Semiconductors Cleaning; Plasma etching; Liquid carbon dioxide Industrial applications
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APA (6th Edition):
Myneni, S. (2004). Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/7605
Chicago Manual of Style (16th Edition):
Myneni, Satyanarayana. “Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids.” 2004. Doctoral Dissertation, Georgia Tech. Accessed January 20, 2021.
http://hdl.handle.net/1853/7605.
MLA Handbook (7th Edition):
Myneni, Satyanarayana. “Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids.” 2004. Web. 20 Jan 2021.
Vancouver:
Myneni S. Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids. [Internet] [Doctoral dissertation]. Georgia Tech; 2004. [cited 2021 Jan 20].
Available from: http://hdl.handle.net/1853/7605.
Council of Science Editors:
Myneni S. Post Plasma Etch Residue Removal Using Carbon Dioxide Based Fluids. [Doctoral Dissertation]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/7605
Georgia Tech
5.
Pathak, Shantanu Chaturvedi.
Characterization of plasma-polymerized polyethylene glycol-like films.
Degree: PhD, Chemical Engineering, 2008, Georgia Tech
URL: http://hdl.handle.net/1853/31789
► A parallel-plate capacitively-coupled plasma deposition system was designed and built for the growth of polyethylene glycol-like films. Deposition rate, bonding structure and dissolution and swelling…
(more)
▼ A parallel-plate capacitively-coupled plasma deposition system was designed and built for the growth of polyethylene glycol-like films. Deposition rate, bonding structure and dissolution and swelling behavior was characterized as a function of input RF power, reactor pressure and substrate temperature to provide information on the relationship between input plasma parameters and film properties. For the conditions studied in this thesis, deposition rates increased at increasing input powers and operating pressures and decreasing substrate temperatures. The PEG-like coatings resembled higher molecular weight solution-polymerized PEG films with a higher crosslinked structure. Manipulation of plasma deposition conditions allowed control of film crosslink density and resulted in tunable dissolution and swelling properties of the PEG-like polymer. At higher applied powers, lower operating pressures, and higher substrate temperatures, films had a higher crosslink density, thus leading to slower dissolution rates and smaller extents of swelling. Void space openings of swelled-state, PEG-like films were determined using electrophoretic drift and diffusion-controlled transport of fluorophore-tagged PAMAM dendrimers into the bulk of the coating. PAMAM dendrimers were used because of their well-defined sizes and negatively-charged succinamic acid surface groups as a means to probe pore sizes of the plasma films. It was estimated that the upper bound of pore size diameters in the plasma polymer was approximately equal to ~5.5-6.0 nm. Positron annihilation lifetime spectroscopy was used to determine average pore sizes and was estimated to equal ~0.60-0.65 nm.
Advisors/Committee Members: Dr. Dennis W. Hess (Committee Chair), Dr. Clifford L. Henderson (Committee Member), Dr. J. Carson Meredith (Committee Member), Dr. L. Andrew Lyon (Committee Member), Dr. Mark R. Prausnitz (Committee Member).
Subjects/Keywords: Barrier film; Plasma polymerization; Stent; Biomedical materials Research; Medical instruments and apparatus; Thin films
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APA ·
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APA (6th Edition):
Pathak, S. C. (2008). Characterization of plasma-polymerized polyethylene glycol-like films. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/31789
Chicago Manual of Style (16th Edition):
Pathak, Shantanu Chaturvedi. “Characterization of plasma-polymerized polyethylene glycol-like films.” 2008. Doctoral Dissertation, Georgia Tech. Accessed January 20, 2021.
http://hdl.handle.net/1853/31789.
MLA Handbook (7th Edition):
Pathak, Shantanu Chaturvedi. “Characterization of plasma-polymerized polyethylene glycol-like films.” 2008. Web. 20 Jan 2021.
Vancouver:
Pathak SC. Characterization of plasma-polymerized polyethylene glycol-like films. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2021 Jan 20].
Available from: http://hdl.handle.net/1853/31789.
Council of Science Editors:
Pathak SC. Characterization of plasma-polymerized polyethylene glycol-like films. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/31789
. 
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