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You searched for +publisher:"Georgia Tech" +contributor:("Bidstrup Allen, Sue Ann"). Showing records 1 – 11 of 11 total matches.

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Georgia Tech

1. McCune, Mallarie DeShea. Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications.

Degree: PhD, Chemical Engineering, 2012, Georgia Tech

 Because of its excellent and unique physical properties, ZnO nanowires have been widely used in numerous scientific fields such as sensors, solar cells, nanogenerators, etc.… (more)

Subjects/Keywords: Three-dimensional nanostructure; Power conversion efficiency; Zinc oxide nanowires; Dye-sensitized solar cells; Nanostructures; Nanotechnology; Zinc oxide

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APA (6th Edition):

McCune, M. D. (2012). Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/44725

Chicago Manual of Style (16th Edition):

McCune, Mallarie DeShea. “Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications.” 2012. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/44725.

MLA Handbook (7th Edition):

McCune, Mallarie DeShea. “Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications.” 2012. Web. 17 Jan 2020.

Vancouver:

McCune MD. Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2012. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/44725.

Council of Science Editors:

McCune MD. Fundamental study of the fabrication of zinc oxide nanowires and its dye-sensitized solar cell applications. [Doctoral Dissertation]. Georgia Tech; 2012. Available from: http://hdl.handle.net/1853/44725

2. Hayden, Harley T. Enhanced Adhesion Between Electroless Copper and Advanced Substrates.

Degree: PhD, Chemical and Biomolecular Engineering, 2008, Georgia Tech

 In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due… (more)

Subjects/Keywords: Electroless copper; Dielectric; Plasma; Adhesion; Electroless plating; Copper plating; Adhesion; Chemical bonds

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APA (6th Edition):

Hayden, H. T. (2008). Enhanced Adhesion Between Electroless Copper and Advanced Substrates. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/22615

Chicago Manual of Style (16th Edition):

Hayden, Harley T. “Enhanced Adhesion Between Electroless Copper and Advanced Substrates.” 2008. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/22615.

MLA Handbook (7th Edition):

Hayden, Harley T. “Enhanced Adhesion Between Electroless Copper and Advanced Substrates.” 2008. Web. 17 Jan 2020.

Vancouver:

Hayden HT. Enhanced Adhesion Between Electroless Copper and Advanced Substrates. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/22615.

Council of Science Editors:

Hayden HT. Enhanced Adhesion Between Electroless Copper and Advanced Substrates. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/22615

3. Fritz, Nathan Tyler. Materials, design and processing of air encapsulated MEMS packaging.

Degree: PhD, Chemical Engineering, 2011, Georgia Tech

 Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS). In this work, an overcoat material is used to cover a sacrificial polymer,… (more)

Subjects/Keywords: Air cavity; POSS; MEMS packaging; Microelectromechanical systems; Microelectronic packaging; Dielectrics

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APA (6th Edition):

Fritz, N. T. (2011). Materials, design and processing of air encapsulated MEMS packaging. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/43751

Chicago Manual of Style (16th Edition):

Fritz, Nathan Tyler. “Materials, design and processing of air encapsulated MEMS packaging.” 2011. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/43751.

MLA Handbook (7th Edition):

Fritz, Nathan Tyler. “Materials, design and processing of air encapsulated MEMS packaging.” 2011. Web. 17 Jan 2020.

Vancouver:

Fritz NT. Materials, design and processing of air encapsulated MEMS packaging. [Internet] [Doctoral dissertation]. Georgia Tech; 2011. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/43751.

Council of Science Editors:

Fritz NT. Materials, design and processing of air encapsulated MEMS packaging. [Doctoral Dissertation]. Georgia Tech; 2011. Available from: http://hdl.handle.net/1853/43751

4. Osborn, Tyler Nathaniel. All-copper chip-to-substrate interconnects for high performance integrated circuit devices.

Degree: PhD, Chemical Engineering, 2009, Georgia Tech

 In this work, all-copper connections between silicon microchips and substrates are developed. The semiconductor industry advances the transistor density on a microchip based on the… (more)

Subjects/Keywords: Microelectronic packaging; Interconnects; Electroless copper; Plating; Electrodeposition; Interconnects (Integrated circuit technology); Copper

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APA (6th Edition):

Osborn, T. N. (2009). All-copper chip-to-substrate interconnects for high performance integrated circuit devices. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/28211

Chicago Manual of Style (16th Edition):

Osborn, Tyler Nathaniel. “All-copper chip-to-substrate interconnects for high performance integrated circuit devices.” 2009. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/28211.

MLA Handbook (7th Edition):

Osborn, Tyler Nathaniel. “All-copper chip-to-substrate interconnects for high performance integrated circuit devices.” 2009. Web. 17 Jan 2020.

Vancouver:

Osborn TN. All-copper chip-to-substrate interconnects for high performance integrated circuit devices. [Internet] [Doctoral dissertation]. Georgia Tech; 2009. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/28211.

Council of Science Editors:

Osborn TN. All-copper chip-to-substrate interconnects for high performance integrated circuit devices. [Doctoral Dissertation]. Georgia Tech; 2009. Available from: http://hdl.handle.net/1853/28211


Georgia Tech

5. Reid, Pamela Patrice. Variable Frequency Microwave Reflow of Lead-Free Solder Paste.

Degree: MS, Chemical Engineering, 2004, Georgia Tech

 As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of… (more)

Subjects/Keywords: Variable frequency microwave; Microelectronics; Lead-free solder; Microelectronics Research; Microwaves Industrial applications; Solder paste

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APA (6th Edition):

Reid, P. P. (2004). Variable Frequency Microwave Reflow of Lead-Free Solder Paste. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5011

Chicago Manual of Style (16th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Masters Thesis, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/5011.

MLA Handbook (7th Edition):

Reid, Pamela Patrice. “Variable Frequency Microwave Reflow of Lead-Free Solder Paste.” 2004. Web. 17 Jan 2020.

Vancouver:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Internet] [Masters thesis]. Georgia Tech; 2004. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/5011.

Council of Science Editors:

Reid PP. Variable Frequency Microwave Reflow of Lead-Free Solder Paste. [Masters Thesis]. Georgia Tech; 2004. Available from: http://hdl.handle.net/1853/5011


Georgia Tech

6. Rajarathinam, Venmathy. Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging.

Degree: PhD, Chemical Engineering, 2010, Georgia Tech

 To enable fast and reliable processors, advances must be made in the interconnections on the printed circuit board and in the interconnections from the chip… (more)

Subjects/Keywords: Nano-indentation; Microelectronics packaging; Interconnects; Polynorbornenes; Imprint lithography; Dielectric; Photosensitive polyimides; Photopolymers; Photopolymerization; Microelectronics; Electrodiffusion

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APA (6th Edition):

Rajarathinam, V. (2010). Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/34722

Chicago Manual of Style (16th Edition):

Rajarathinam, Venmathy. “Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging.” 2010. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/34722.

MLA Handbook (7th Edition):

Rajarathinam, Venmathy. “Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging.” 2010. Web. 17 Jan 2020.

Vancouver:

Rajarathinam V. Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging. [Internet] [Doctoral dissertation]. Georgia Tech; 2010. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/34722.

Council of Science Editors:

Rajarathinam V. Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging. [Doctoral Dissertation]. Georgia Tech; 2010. Available from: http://hdl.handle.net/1853/34722


Georgia Tech

7. Spencer, Todd Joseph. Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections.

Degree: PhD, Chemical Engineering, 2010, Georgia Tech

 Low-loss off-chip interconnects are required for energy-efficient communication in dense microprocessors. To meet these needs, air cavity parallel plate and microstrip lines with copper conductors… (more)

Subjects/Keywords: Dielectric; Interconnect; Chip-to-chip; Air gap; Microelectromechanical systems; Microprocessors; Polymers – Deterioration; Polymers Electric properties

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APA (6th Edition):

Spencer, T. J. (2010). Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/34754

Chicago Manual of Style (16th Edition):

Spencer, Todd Joseph. “Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections.” 2010. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/34754.

MLA Handbook (7th Edition):

Spencer, Todd Joseph. “Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections.” 2010. Web. 17 Jan 2020.

Vancouver:

Spencer TJ. Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections. [Internet] [Doctoral dissertation]. Georgia Tech; 2010. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/34754.

Council of Science Editors:

Spencer TJ. Air-gap transmission lines on printed circuit boards for chip-to-chip interconnections. [Doctoral Dissertation]. Georgia Tech; 2010. Available from: http://hdl.handle.net/1853/34754


Georgia Tech

8. Li, Shuo. A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management.

Degree: PhD, Mechanical Engineering, 2005, Georgia Tech

 A numerical study of axisymmetric synthetic jet flow was conducted. The synthetic jet cavity was modeled as a rigid chamber with a piston-like moving diaphragm… (more)

Subjects/Keywords: Synthetic jets; CFD; Thermal management; Control volume modeling; Turbulence Computer simulation; Jets Fluid dynamics; Heat Transmission

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APA (6th Edition):

Li, S. (2005). A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/7539

Chicago Manual of Style (16th Edition):

Li, Shuo. “A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management.” 2005. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/7539.

MLA Handbook (7th Edition):

Li, Shuo. “A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management.” 2005. Web. 17 Jan 2020.

Vancouver:

Li S. A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management. [Internet] [Doctoral dissertation]. Georgia Tech; 2005. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/7539.

Council of Science Editors:

Li S. A Numerical Study of Micro Synthetic Jet and Its Applications in Thermal Management. [Doctoral Dissertation]. Georgia Tech; 2005. Available from: http://hdl.handle.net/1853/7539


Georgia Tech

9. Vaswani, Sudeep. Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors.

Degree: PhD, Chemical Engineering, 2005, Georgia Tech

 Paper and cellulosic materials hold a good promise of being candidates for flexible packaging materials provided suitable barrier properties such as water repellence and grease… (more)

Subjects/Keywords: Lipophobic or Grease Barrier; Water vapor diffusivity; Barrier films; Hydrophobic; Surface modification; Plasma deposition; Fluorocarbon films; Water barrier; Plasma chemistry; Diffusion; Packaging Materials

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APA (6th Edition):

Vaswani, S. (2005). Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/10582

Chicago Manual of Style (16th Edition):

Vaswani, Sudeep. “Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors.” 2005. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/10582.

MLA Handbook (7th Edition):

Vaswani, Sudeep. “Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors.” 2005. Web. 17 Jan 2020.

Vancouver:

Vaswani S. Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors. [Internet] [Doctoral dissertation]. Georgia Tech; 2005. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/10582.

Council of Science Editors:

Vaswani S. Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors. [Doctoral Dissertation]. Georgia Tech; 2005. Available from: http://hdl.handle.net/1853/10582


Georgia Tech

10. He, Ate. Fabrication of High Performance Chip-to-Substrate Interconnections.

Degree: PhD, Chemical Engineering, 2007, Georgia Tech

 Novel fabrication technologies for high performance electrical and optical chip-to-substrate input/output (I/O) interconnections were developed. This research is driven by the long term performance and… (more)

Subjects/Keywords: Electroless plating; Assembly; Fabrication; Chip-to-substrate; Interconnect; Copper pillar

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APA (6th Edition):

He, A. (2007). Fabrication of High Performance Chip-to-Substrate Interconnections. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/14483

Chicago Manual of Style (16th Edition):

He, Ate. “Fabrication of High Performance Chip-to-Substrate Interconnections.” 2007. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/14483.

MLA Handbook (7th Edition):

He, Ate. “Fabrication of High Performance Chip-to-Substrate Interconnections.” 2007. Web. 17 Jan 2020.

Vancouver:

He A. Fabrication of High Performance Chip-to-Substrate Interconnections. [Internet] [Doctoral dissertation]. Georgia Tech; 2007. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/14483.

Council of Science Editors:

He A. Fabrication of High Performance Chip-to-Substrate Interconnections. [Doctoral Dissertation]. Georgia Tech; 2007. Available from: http://hdl.handle.net/1853/14483


Georgia Tech

11. White, Celesta E. Advanced Methods, Materials, and Devices for Microfluidics.

Degree: PhD, Chemical Engineering, 2003, Georgia Tech

 Advanced Methods, Materials, and Devices for Microfluidics Celesta E. White 217 Pages Directed by Dr. Clifford L. Henderson Microfluidics is a rapidly growing research area… (more)

Subjects/Keywords: Polycarbonates; Sacrificial materials; Microfluidics; Poly(propylene carbonate); Photosensitive polycarbonates; Microelectromechanical systems; Polycarbonates; Photosensitive polyimides; Microelectromechanical systems

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APA (6th Edition):

White, C. E. (2003). Advanced Methods, Materials, and Devices for Microfluidics. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/5287

Chicago Manual of Style (16th Edition):

White, Celesta E. “Advanced Methods, Materials, and Devices for Microfluidics.” 2003. Doctoral Dissertation, Georgia Tech. Accessed January 17, 2020. http://hdl.handle.net/1853/5287.

MLA Handbook (7th Edition):

White, Celesta E. “Advanced Methods, Materials, and Devices for Microfluidics.” 2003. Web. 17 Jan 2020.

Vancouver:

White CE. Advanced Methods, Materials, and Devices for Microfluidics. [Internet] [Doctoral dissertation]. Georgia Tech; 2003. [cited 2020 Jan 17]. Available from: http://hdl.handle.net/1853/5287.

Council of Science Editors:

White CE. Advanced Methods, Materials, and Devices for Microfluidics. [Doctoral Dissertation]. Georgia Tech; 2003. Available from: http://hdl.handle.net/1853/5287

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