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You searched for +publisher:"Georgia Tech" +contributor:("Bakir, Muhannad S."). Showing records 1 – 30 of 33 total matches.

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1. Liang, Jiaxing. Microfabricated thin silicon vapor chambers for low profile thermal management.

Degree: MS, Mechanical Engineering, 2017, Georgia Tech

 Portable electronics, such as smartphones, tablets, and ultrabooks are innovating rapidly. They are becoming as powerful as desktop computers, and incorporating multiple functionalities enabled through… (more)

Subjects/Keywords: Vapor chamber; Heat pipe; Wick; Low profile thermal management; Portable electronics; Interposer; Vapor chamber charging

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APA (6th Edition):

Liang, J. (2017). Microfabricated thin silicon vapor chambers for low profile thermal management. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60114

Chicago Manual of Style (16th Edition):

Liang, Jiaxing. “Microfabricated thin silicon vapor chambers for low profile thermal management.” 2017. Masters Thesis, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/60114.

MLA Handbook (7th Edition):

Liang, Jiaxing. “Microfabricated thin silicon vapor chambers for low profile thermal management.” 2017. Web. 20 Sep 2020.

Vancouver:

Liang J. Microfabricated thin silicon vapor chambers for low profile thermal management. [Internet] [Masters thesis]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/60114.

Council of Science Editors:

Liang J. Microfabricated thin silicon vapor chambers for low profile thermal management. [Masters Thesis]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/60114


Georgia Tech

2. Puckett, Waylon Tanner. Novel substrates for improved cooling of power electronics.

Degree: MS, Mechanical Engineering, 2017, Georgia Tech

 The thermal management of power electronics is critical to the long term reliability of these devices. In this work, three concepts which allow the placement… (more)

Subjects/Keywords: Power electronics; Integrated cooling; IGBT; HEMT; Substrate; DBC; Evaporation; Bonding; Copper particles; AlN; AlSiC; RF amplifier; Heat spreader; Eutectic bond; Thermal management; Two-phase cooling

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APA (6th Edition):

Puckett, W. T. (2017). Novel substrates for improved cooling of power electronics. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60187

Chicago Manual of Style (16th Edition):

Puckett, Waylon Tanner. “Novel substrates for improved cooling of power electronics.” 2017. Masters Thesis, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/60187.

MLA Handbook (7th Edition):

Puckett, Waylon Tanner. “Novel substrates for improved cooling of power electronics.” 2017. Web. 20 Sep 2020.

Vancouver:

Puckett WT. Novel substrates for improved cooling of power electronics. [Internet] [Masters thesis]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/60187.

Council of Science Editors:

Puckett WT. Novel substrates for improved cooling of power electronics. [Masters Thesis]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/60187

3. Zheng, Li. Power distribution network modeling and microfluidic cooling for high-performance computing systems.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 A silicon interposer platform with microfluidic cooling is proposed for high-performance computing systems. The key components and technologies for the proposed platform, including electrical and… (more)

Subjects/Keywords: Power distribution network; Power supply noise; Numerical modeling; Silicon interposer; Microfluidic cooling

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APA (6th Edition):

Zheng, L. (2015). Power distribution network modeling and microfluidic cooling for high-performance computing systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54449

Chicago Manual of Style (16th Edition):

Zheng, Li. “Power distribution network modeling and microfluidic cooling for high-performance computing systems.” 2015. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/54449.

MLA Handbook (7th Edition):

Zheng, Li. “Power distribution network modeling and microfluidic cooling for high-performance computing systems.” 2015. Web. 20 Sep 2020.

Vancouver:

Zheng L. Power distribution network modeling and microfluidic cooling for high-performance computing systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/54449.

Council of Science Editors:

Zheng L. Power distribution network modeling and microfluidic cooling for high-performance computing systems. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/54449


Georgia Tech

4. Jo, Paul K. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.

Degree: PhD, Electrical and Computer Engineering, 2019, Georgia Tech

 This research proposes and demonstrate 1) a new compliant interconnect that can provide cost-effective and simple fabrication process and allow high-degree of freedom in design… (more)

Subjects/Keywords: Compliant interconnect; Heterogeneous integration; Package; 2.5D; 3D; System-level integration; System-in-package

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APA (6th Edition):

Jo, P. K. (2019). Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62301

Chicago Manual of Style (16th Edition):

Jo, Paul K. “Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.” 2019. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/62301.

MLA Handbook (7th Edition):

Jo, Paul K. “Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects.” 2019. Web. 20 Sep 2020.

Vancouver:

Jo PK. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/62301.

Council of Science Editors:

Jo PK. Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62301


Georgia Tech

5. Pirouz, Amirabbas. Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography.

Degree: PhD, Electrical and Computer Engineering, 2019, Georgia Tech

 The objective of this research is to develop capacitive micromachined ultrasonic transducer (CMUT) arrays with novel geometry for intracardiac echocardiography (ICE) imaging along with a… (more)

Subjects/Keywords: CMUT coupling coefficient; CMUT efficiency; CMUT large signal operation; CMUT low temperature fabrication; Oxide lift-off; CMUT parasitic capacitance; Reliable CMUT; CMUT array design; CMUT noise; CMUT on CMOS; CMUT integration; CMUT pulse optimization; Intracardiac echocardiography; CMUT ICE; CMUT 2D array

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APA (6th Edition):

Pirouz, A. (2019). Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62656

Chicago Manual of Style (16th Edition):

Pirouz, Amirabbas. “Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography.” 2019. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/62656.

MLA Handbook (7th Edition):

Pirouz, Amirabbas. “Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography.” 2019. Web. 20 Sep 2020.

Vancouver:

Pirouz A. Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/62656.

Council of Science Editors:

Pirouz A. Capacitive micromachined ultrasound transducer (CMUT) design and fabrication for intracardiac echocardiography. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62656


Georgia Tech

6. Abbaspour, Reza. Three-dimensional microfabrication technologies for electronic and lab-on-chip applications.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The density of heterogeneous three-dimensional integrated circuits (3D-ICs) is significantly limited by through-silicon-via (TSV) density and cooling challenges. To enable fine-grain 3D-ICs, high aspect-ratio sub-micron… (more)

Subjects/Keywords: 3D integrated circuits; Through-silicon-via; Microfluidics; Power dissipation; Bosh process; Lab on chip; Soft lithography; Copper 3D printing; Red blood cells

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APA (6th Edition):

Abbaspour, R. (2018). Three-dimensional microfabrication technologies for electronic and lab-on-chip applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62230

Chicago Manual of Style (16th Edition):

Abbaspour, Reza. “Three-dimensional microfabrication technologies for electronic and lab-on-chip applications.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/62230.

MLA Handbook (7th Edition):

Abbaspour, Reza. “Three-dimensional microfabrication technologies for electronic and lab-on-chip applications.” 2018. Web. 20 Sep 2020.

Vancouver:

Abbaspour R. Three-dimensional microfabrication technologies for electronic and lab-on-chip applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/62230.

Council of Science Editors:

Abbaspour R. Three-dimensional microfabrication technologies for electronic and lab-on-chip applications. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/62230


Georgia Tech

7. Asrar, Pouya. Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins.

Degree: PhD, Mechanical Engineering, 2018, Georgia Tech

 Dielectric fluids, including refrigerants, are electrically inert and are a good candidate as working fluid in two-phase microsystem cooling applications. In this study, R245fa is… (more)

Subjects/Keywords: Flow boiling; Heat transfer; Microgap; Two-phase heat transfer coefficient

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APA (6th Edition):

Asrar, P. (2018). Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62234

Chicago Manual of Style (16th Edition):

Asrar, Pouya. “Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/62234.

MLA Handbook (7th Edition):

Asrar, Pouya. “Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins.” 2018. Web. 20 Sep 2020.

Vancouver:

Asrar P. Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/62234.

Council of Science Editors:

Asrar P. Flow boiling of r245fa in microgaps with staggered circular and hydrofoil pin fins. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/62234


Georgia Tech

8. Kao, Tsung-Ting. Development and characterization of III-Nitride bipolar devices.

Degree: PhD, Electrical and Computer Engineering, 2016, Georgia Tech

 III-nitride (III-N) materials have been widely used in optical devices such as blue light-emitting diodes today. On the other hand, III-N power electronics are also… (more)

Subjects/Keywords: III-N devices; Compound semiconductor

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APA (6th Edition):

Kao, T. (2016). Development and characterization of III-Nitride bipolar devices. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59114

Chicago Manual of Style (16th Edition):

Kao, Tsung-Ting. “Development and characterization of III-Nitride bipolar devices.” 2016. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/59114.

MLA Handbook (7th Edition):

Kao, Tsung-Ting. “Development and characterization of III-Nitride bipolar devices.” 2016. Web. 20 Sep 2020.

Vancouver:

Kao T. Development and characterization of III-Nitride bipolar devices. [Internet] [Doctoral dissertation]. Georgia Tech; 2016. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/59114.

Council of Science Editors:

Kao T. Development and characterization of III-Nitride bipolar devices. [Doctoral Dissertation]. Georgia Tech; 2016. Available from: http://hdl.handle.net/1853/59114


Georgia Tech

9. Hossen, Md Obaidul. Power delivery and thermal considerations for 2.5-D and 3-D integration technologies.

Degree: PhD, Electrical and Computer Engineering, 2019, Georgia Tech

 Owing to advanced technologies, the total power density in a high-performance computing system is expected to increase beyond 100 W/cm2; power delivery becomes a critical… (more)

Subjects/Keywords: Power delivery network; Heterogeneous Integration

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APA (6th Edition):

Hossen, M. O. (2019). Power delivery and thermal considerations for 2.5-D and 3-D integration technologies. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/62346

Chicago Manual of Style (16th Edition):

Hossen, Md Obaidul. “Power delivery and thermal considerations for 2.5-D and 3-D integration technologies.” 2019. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/62346.

MLA Handbook (7th Edition):

Hossen, Md Obaidul. “Power delivery and thermal considerations for 2.5-D and 3-D integration technologies.” 2019. Web. 20 Sep 2020.

Vancouver:

Hossen MO. Power delivery and thermal considerations for 2.5-D and 3-D integration technologies. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/62346.

Council of Science Editors:

Hossen MO. Power delivery and thermal considerations for 2.5-D and 3-D integration technologies. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/62346


Georgia Tech

10. Kumar, Vachan. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 Modeling approaches are developed to optimize emerging on-chip and off-chip electrical interconnect technologies and benchmark them against conventional technologies. While transistor scaling results in an… (more)

Subjects/Keywords: Interconnect modeling; Graphene nanoribbons; Through silicon via, airgap interconnects

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APA (6th Edition):

Kumar, V. (2014). Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54280

Chicago Manual of Style (16th Edition):

Kumar, Vachan. “Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/54280.

MLA Handbook (7th Edition):

Kumar, Vachan. “Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.” 2014. Web. 20 Sep 2020.

Vancouver:

Kumar V. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/54280.

Council of Science Editors:

Kumar V. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54280


Georgia Tech

11. Cao, Ningyuan. Circuit and Algorithm Design to Enable Edge Intelligence.

Degree: PhD, Electrical and Computer Engineering, 2020, Georgia Tech

 “Edge Intelligence” (EI) is a promising alternative to a centralized could-IoT paradigm that has inherent advantages with communication cost, processing latency, data security, network robustness,… (more)

Subjects/Keywords: Edge intelligence; edge computation; internet-of-things; system-on-chip; ASIC; low-power circuit; machine learning; artificial intelligence; micro-robotics

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APA (6th Edition):

Cao, N. (2020). Circuit and Algorithm Design to Enable Edge Intelligence. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/63653

Chicago Manual of Style (16th Edition):

Cao, Ningyuan. “Circuit and Algorithm Design to Enable Edge Intelligence.” 2020. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/63653.

MLA Handbook (7th Edition):

Cao, Ningyuan. “Circuit and Algorithm Design to Enable Edge Intelligence.” 2020. Web. 20 Sep 2020.

Vancouver:

Cao N. Circuit and Algorithm Design to Enable Edge Intelligence. [Internet] [Doctoral dissertation]. Georgia Tech; 2020. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/63653.

Council of Science Editors:

Cao N. Circuit and Algorithm Design to Enable Edge Intelligence. [Doctoral Dissertation]. Georgia Tech; 2020. Available from: http://hdl.handle.net/1853/63653


Georgia Tech

12. Ju, Inchan. A study on design methodologies of power amplifiers using SiGe BiCMOS technologies.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The goal of the proposed research is to develop multiple design methodologies of power amplifiers (PAs) using silicon germanium (SiGe) heterojunction bipolar junction transistor (HBT)… (more)

Subjects/Keywords: Power amplifier; HBT; SiGe

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APA (6th Edition):

Ju, I. (2018). A study on design methodologies of power amplifiers using SiGe BiCMOS technologies. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/61180

Chicago Manual of Style (16th Edition):

Ju, Inchan. “A study on design methodologies of power amplifiers using SiGe BiCMOS technologies.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/61180.

MLA Handbook (7th Edition):

Ju, Inchan. “A study on design methodologies of power amplifiers using SiGe BiCMOS technologies.” 2018. Web. 20 Sep 2020.

Vancouver:

Ju I. A study on design methodologies of power amplifiers using SiGe BiCMOS technologies. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/61180.

Council of Science Editors:

Ju I. A study on design methodologies of power amplifiers using SiGe BiCMOS technologies. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/61180

13. Mevawalla, Zubin. Process modeling and optimization using industrial semiconductor fabrication data.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 Manufacturers address the distinct operational objectives of product innovation and manufacturing efficiency by having separate fabrication facilities (“fabs”) for development and manufacturing. Additionally, the industrial… (more)

Subjects/Keywords:

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APA (6th Edition):

Mevawalla, Z. (2015). Process modeling and optimization using industrial semiconductor fabrication data. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53382

Chicago Manual of Style (16th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/53382.

MLA Handbook (7th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Web. 20 Sep 2020.

Vancouver:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/53382.

Council of Science Editors:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53382

14. Song, Chao. Micromachined flow sensors for velocity and pressure measurement.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 This research focuses on developing sensors for properties of aerodynamic interest (i.e., flow and pressure) based on low-cost polymeric materials and simple fabrication processes. Such… (more)

Subjects/Keywords: Flow sensor; Pressure sensor; Sensor interface circuit; Vibration amplitude measurement; All-polymer air flow sensor; Flow-induced vibration; Drift reduction; Flex-PCB; Polymer-based pressure sensor; Polymer-based flow sensor; Pt piezoresistive flow sensor

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APA (6th Edition):

Song, C. (2014). Micromachined flow sensors for velocity and pressure measurement. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52304

Chicago Manual of Style (16th Edition):

Song, Chao. “Micromachined flow sensors for velocity and pressure measurement.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/52304.

MLA Handbook (7th Edition):

Song, Chao. “Micromachined flow sensors for velocity and pressure measurement.” 2014. Web. 20 Sep 2020.

Vancouver:

Song C. Micromachined flow sensors for velocity and pressure measurement. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/52304.

Council of Science Editors:

Song C. Micromachined flow sensors for velocity and pressure measurement. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/52304

15. Okereke, Raphael Ifeanyi. Electroplated multi-path compliant copper interconnects for flip-chip packages.

Degree: PhD, Mechanical Engineering, 2014, Georgia Tech

 The international technology roadmap for semiconductors (ITRS) 2012 report foresees the use of porous dielectric materials with a low dielectric constant in conjunction with copper… (more)

Subjects/Keywords: Compliant interconnects; Flip-chip technology; Delta interconnects; Copper/Low-k compatible technology; Low die stress; White bump solution; MEMS; CMOS compatible; Interconnects (Integrated circuit technology); Copper

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APA (6th Edition):

Okereke, R. I. (2014). Electroplated multi-path compliant copper interconnects for flip-chip packages. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/51800

Chicago Manual of Style (16th Edition):

Okereke, Raphael Ifeanyi. “Electroplated multi-path compliant copper interconnects for flip-chip packages.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/51800.

MLA Handbook (7th Edition):

Okereke, Raphael Ifeanyi. “Electroplated multi-path compliant copper interconnects for flip-chip packages.” 2014. Web. 20 Sep 2020.

Vancouver:

Okereke RI. Electroplated multi-path compliant copper interconnects for flip-chip packages. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/51800.

Council of Science Editors:

Okereke RI. Electroplated multi-path compliant copper interconnects for flip-chip packages. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/51800

16. Yang, Hyung Suk. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 A novel large-scale silicon system platform with 9.6cm² of active silicon interposer area is demonstrated. The platform contains three interposer tiles and two silicon bridges,… (more)

Subjects/Keywords: Silicon interposers; Interconnects; Alignment; Flip-chip

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APA (6th Edition):

Yang, H. S. (2014). Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52983

Chicago Manual of Style (16th Edition):

Yang, Hyung Suk. “Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/52983.

MLA Handbook (7th Edition):

Yang, Hyung Suk. “Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.” 2014. Web. 20 Sep 2020.

Vancouver:

Yang HS. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/52983.

Council of Science Editors:

Yang HS. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/52983

17. Wang, Po-Chun. Fabrication, packaging, and application of micromachined hollow polymer needle arrays.

Degree: PhD, Electrical and Computer Engineering, 2013, Georgia Tech

 Micromachined needles have been shown to successfully transport biological molecules into the body with minimal invasiveness and pain, following the insertion of needles into the… (more)

Subjects/Keywords: Microneedle; Microfabrication; Mechanical characterization; Drug delivery systems; Microlithography; Micromachining

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APA (6th Edition):

Wang, P. (2013). Fabrication, packaging, and application of micromachined hollow polymer needle arrays. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/50283

Chicago Manual of Style (16th Edition):

Wang, Po-Chun. “Fabrication, packaging, and application of micromachined hollow polymer needle arrays.” 2013. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/50283.

MLA Handbook (7th Edition):

Wang, Po-Chun. “Fabrication, packaging, and application of micromachined hollow polymer needle arrays.” 2013. Web. 20 Sep 2020.

Vancouver:

Wang P. Fabrication, packaging, and application of micromachined hollow polymer needle arrays. [Internet] [Doctoral dissertation]. Georgia Tech; 2013. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/50283.

Council of Science Editors:

Wang P. Fabrication, packaging, and application of micromachined hollow polymer needle arrays. [Doctoral Dissertation]. Georgia Tech; 2013. Available from: http://hdl.handle.net/1853/50283

18. Yu, Xuehong. Silicon-embedded magnetic components for on-chip integrated power applications.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 The objective of the proposed research is to design, fabricate, characterize and test silicon-embedded magnetic components for on-chip integrated power applications. Driven by the trend… (more)

Subjects/Keywords: Silicon embedding; Toroidal inductors; Power supply on chip; MEMS

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APA (6th Edition):

Yu, X. (2014). Silicon-embedded magnetic components for on-chip integrated power applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54243

Chicago Manual of Style (16th Edition):

Yu, Xuehong. “Silicon-embedded magnetic components for on-chip integrated power applications.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/54243.

MLA Handbook (7th Edition):

Yu, Xuehong. “Silicon-embedded magnetic components for on-chip integrated power applications.” 2014. Web. 20 Sep 2020.

Vancouver:

Yu X. Silicon-embedded magnetic components for on-chip integrated power applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/54243.

Council of Science Editors:

Yu X. Silicon-embedded magnetic components for on-chip integrated power applications. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54243

19. Zhang, Chaoqi. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 In this research, wafer-level flexible input/output interconnection technologies, Mechanically Flexible Interconnects (MFIs), have been developed. First, Au-NiW MFIs with 65 µm vertical elastic range of… (more)

Subjects/Keywords: Advanced packaging; Heterogeneous system; Flexible interconnects; Rematable assembly; CMOS/MEMS integration; Spray-coating; Interposer

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APA (6th Edition):

Zhang, C. (2015). Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53637

Chicago Manual of Style (16th Edition):

Zhang, Chaoqi. “Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.” 2015. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/53637.

MLA Handbook (7th Edition):

Zhang, Chaoqi. “Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.” 2015. Web. 20 Sep 2020.

Vancouver:

Zhang C. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/53637.

Council of Science Editors:

Zhang C. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53637

20. Oh, Hanju. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Microfluidic cooling technology is a promising thermal solution for high-performance three-dimensional (3-D) microsystems. However, the integration of microfluidic cooling into 3-D microsystems inevitably impacts tier-to-tier… (more)

Subjects/Keywords: 3D microsystem; Microfluidic cooling; Silicon interposer; Through-silicon via

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APA (6th Edition):

Oh, H. (2017). Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58139

Chicago Manual of Style (16th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/58139.

MLA Handbook (7th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Web. 20 Sep 2020.

Vancouver:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/58139.

Council of Science Editors:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58139

21. Han, Xuefei. Flow boiling of water in pin-fin enhanced microgap.

Degree: PhD, Mechanical Engineering, 2017, Georgia Tech

 This study experimentally investigated flow boiling of water in a closed flow loop system at reduced pressure with a wide range of heat fluxes, mass… (more)

Subjects/Keywords: Flow boiling; Reduced pressure; Microgap; Pin fin

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APA (6th Edition):

Han, X. (2017). Flow boiling of water in pin-fin enhanced microgap. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58217

Chicago Manual of Style (16th Edition):

Han, Xuefei. “Flow boiling of water in pin-fin enhanced microgap.” 2017. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/58217.

MLA Handbook (7th Edition):

Han, Xuefei. “Flow boiling of water in pin-fin enhanced microgap.” 2017. Web. 20 Sep 2020.

Vancouver:

Han X. Flow boiling of water in pin-fin enhanced microgap. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/58217.

Council of Science Editors:

Han X. Flow boiling of water in pin-fin enhanced microgap. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58217

22. Sarvey, Thomas Eric. Microfluidic cooling for densely integrated microelectronic systems.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The challenge of dissipating heat is a major barrier to continuing improvement in integrated circuit performance. Additionally, the bottleneck for computational performance and energy has… (more)

Subjects/Keywords: Microfluidic cooling; Micropin-fin; Microelectronics

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APA (6th Edition):

Sarvey, T. E. (2018). Microfluidic cooling for densely integrated microelectronic systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60759

Chicago Manual of Style (16th Edition):

Sarvey, Thomas Eric. “Microfluidic cooling for densely integrated microelectronic systems.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/60759.

MLA Handbook (7th Edition):

Sarvey, Thomas Eric. “Microfluidic cooling for densely integrated microelectronic systems.” 2018. Web. 20 Sep 2020.

Vancouver:

Sarvey TE. Microfluidic cooling for densely integrated microelectronic systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/60759.

Council of Science Editors:

Sarvey TE. Microfluidic cooling for densely integrated microelectronic systems. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/60759

23. Zia, Muneeb. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The demand for continuous increase in computing performance has put an overburdening demand on I/O interface and novel heterogeneous integration to allow performance benefits at… (more)

Subjects/Keywords: 3D integration; 2.5D integration; Heterogeneous integration; Flexible interconnects; In vitro biosensing; In vivo biosensing; EMG; Songbird; Flexible multi-electrode array

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APA (6th Edition):

Zia, M. (2018). 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60795

Chicago Manual of Style (16th Edition):

Zia, Muneeb. “3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/60795.

MLA Handbook (7th Edition):

Zia, Muneeb. “3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.” 2018. Web. 20 Sep 2020.

Vancouver:

Zia M. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/60795.

Council of Science Editors:

Zia M. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/60795

24. Cha, Soonyoung. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 The objective of this research is to extract NBTI and GOBD model parameters to enable the estimation of the degradation and the remaining life of… (more)

Subjects/Keywords: Design for reliability and yield enhancement; Device-level and system-level reliability modeling

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APA (6th Edition):

Cha, S. (2017). Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59748

Chicago Manual of Style (16th Edition):

Cha, Soonyoung. “Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.” 2017. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/59748.

MLA Handbook (7th Edition):

Cha, Soonyoung. “Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.” 2017. Web. 20 Sep 2020.

Vancouver:

Cha S. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/59748.

Council of Science Editors:

Cha S. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/59748

25. Zhang, Yang. Thermal and power delivery network modeling for emerging microelectronic integration platforms.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 In this dissertation, thermal management and power delivery challenges in 2.5-D and 3-D integration are presented. To address the thermal coupling issues in heterogeneous 3-D… (more)

Subjects/Keywords: 3D-IC, 2.5-D IC, Thermal, Power delivery, Signaling; 2.5-D IC; Thermal; Power delivery; Signaling

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APA (6th Edition):

Zhang, Y. (2017). Thermal and power delivery network modeling for emerging microelectronic integration platforms. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59199

Chicago Manual of Style (16th Edition):

Zhang, Yang. “Thermal and power delivery network modeling for emerging microelectronic integration platforms.” 2017. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/59199.

MLA Handbook (7th Edition):

Zhang, Yang. “Thermal and power delivery network modeling for emerging microelectronic integration platforms.” 2017. Web. 20 Sep 2020.

Vancouver:

Zhang Y. Thermal and power delivery network modeling for emerging microelectronic integration platforms. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/59199.

Council of Science Editors:

Zhang Y. Thermal and power delivery network modeling for emerging microelectronic integration platforms. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/59199

26. Zhang, Xuchen. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Signal integrity and thermal management are the two major challenges in heterogeneous integration technologies. In this research, the impact of through silicon vias (TSVs) on… (more)

Subjects/Keywords: Heterogeneous integration; 3D IC; 2.5D IC; HIST; Microfluidic cooling; Signal integrity; TSV; Compliance interconnects

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APA (6th Edition):

Zhang, X. (2017). 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58647

Chicago Manual of Style (16th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/58647.

MLA Handbook (7th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Web. 20 Sep 2020.

Vancouver:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/58647.

Council of Science Editors:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58647

27. Madapusi Srinivas Prasad, Divya. A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The objective of this research is to present a holistic study of the on-chip copper interconnect technology, from interconnect modeling to their manifestation in modern… (more)

Subjects/Keywords: On-chip interconnect; Design-technology-co-optimization; Physical design; Rent's rule; System-level modeling; Performance model

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APA (6th Edition):

Madapusi Srinivas Prasad, D. (2018). A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/61606

Chicago Manual of Style (16th Edition):

Madapusi Srinivas Prasad, Divya. “A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/61606.

MLA Handbook (7th Edition):

Madapusi Srinivas Prasad, Divya. “A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs.” 2018. Web. 20 Sep 2020.

Vancouver:

Madapusi Srinivas Prasad D. A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/61606.

Council of Science Editors:

Madapusi Srinivas Prasad D. A holistic study of on-chip interconnect technology: From modeling theory to physical design of semiconductor ICs. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/61606


Georgia Tech

28. Fleetwood, Zachary Evan. Qualifying silicon-germanium electronics for harsh radiation environments.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The objective of this thesis is to investigate the robustness of Silicon-Germanium Heterojunction Bipolar Transistors (SiGe HBTs) to radiation-induced damage. The work described in this… (more)

Subjects/Keywords: SiGe HBT; TID; SEE; Radiation; Superjunction; DD; Profile modifications

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APA (6th Edition):

Fleetwood, Z. E. (2018). Qualifying silicon-germanium electronics for harsh radiation environments. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59891

Chicago Manual of Style (16th Edition):

Fleetwood, Zachary Evan. “Qualifying silicon-germanium electronics for harsh radiation environments.” 2018. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/59891.

MLA Handbook (7th Edition):

Fleetwood, Zachary Evan. “Qualifying silicon-germanium electronics for harsh radiation environments.” 2018. Web. 20 Sep 2020.

Vancouver:

Fleetwood ZE. Qualifying silicon-germanium electronics for harsh radiation environments. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/59891.

Council of Science Editors:

Fleetwood ZE. Qualifying silicon-germanium electronics for harsh radiation environments. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/59891


Georgia Tech

29. Wan, Congshan. Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics.

Degree: PhD, Electrical and Computer Engineering, 2019, Georgia Tech

 The objective of the dissertation is to theoretically design and experimentally demonstrate optical couplers for 2.5D/3D heterogeneous integrated electronics. In the first part, a new… (more)

Subjects/Keywords: Integrated photonics; Optical coupler; Diffraction grating; Grating theory; Optical interconnect

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APA (6th Edition):

Wan, C. (2019). Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/61260

Chicago Manual of Style (16th Edition):

Wan, Congshan. “Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics.” 2019. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/61260.

MLA Handbook (7th Edition):

Wan, Congshan. “Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics.” 2019. Web. 20 Sep 2020.

Vancouver:

Wan C. Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics. [Internet] [Doctoral dissertation]. Georgia Tech; 2019. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/61260.

Council of Science Editors:

Wan C. Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics. [Doctoral Dissertation]. Georgia Tech; 2019. Available from: http://hdl.handle.net/1853/61260


Georgia Tech

30. Serrano, Diego Emilio. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 This dissertation discusses the design, simulation and characterization of process-compatible accelerometers and gyroscopes for the implementation of multi-degree-of-freedom (multi-DOF) systems. All components presented herein were… (more)

Subjects/Keywords: Micromechanical sensors; MEMS; Gyroscopes; Accelerometers; Inertial sensors; Inertial navigation; Silicon resonators; Bulk acoustic wave; Anchor loss

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APA (6th Edition):

Serrano, D. E. (2014). Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54283

Chicago Manual of Style (16th Edition):

Serrano, Diego Emilio. “Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.” 2014. Doctoral Dissertation, Georgia Tech. Accessed September 20, 2020. http://hdl.handle.net/1853/54283.

MLA Handbook (7th Edition):

Serrano, Diego Emilio. “Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.” 2014. Web. 20 Sep 2020.

Vancouver:

Serrano DE. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2020 Sep 20]. Available from: http://hdl.handle.net/1853/54283.

Council of Science Editors:

Serrano DE. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54283

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