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You searched for +publisher:"Georgia Tech" +contributor:("Bakir, Muhannad S."). Showing records 1 – 23 of 23 total matches.

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Georgia Tech

1. Liang, Jiaxing. Microfabricated thin silicon vapor chambers for low profile thermal management.

Degree: MS, Mechanical Engineering, 2017, Georgia Tech

 Portable electronics, such as smartphones, tablets, and ultrabooks are innovating rapidly. They are becoming as powerful as desktop computers, and incorporating multiple functionalities enabled through… (more)

Subjects/Keywords: Vapor chamber; Heat pipe; Wick; Low profile thermal management; Portable electronics; Interposer; Vapor chamber charging

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APA (6th Edition):

Liang, J. (2017). Microfabricated thin silicon vapor chambers for low profile thermal management. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60114

Chicago Manual of Style (16th Edition):

Liang, Jiaxing. “Microfabricated thin silicon vapor chambers for low profile thermal management.” 2017. Masters Thesis, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/60114.

MLA Handbook (7th Edition):

Liang, Jiaxing. “Microfabricated thin silicon vapor chambers for low profile thermal management.” 2017. Web. 18 Feb 2019.

Vancouver:

Liang J. Microfabricated thin silicon vapor chambers for low profile thermal management. [Internet] [Masters thesis]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/60114.

Council of Science Editors:

Liang J. Microfabricated thin silicon vapor chambers for low profile thermal management. [Masters Thesis]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/60114


Georgia Tech

2. Puckett, Waylon Tanner. Novel substrates for improved cooling of power electronics.

Degree: MS, Mechanical Engineering, 2017, Georgia Tech

 The thermal management of power electronics is critical to the long term reliability of these devices. In this work, three concepts which allow the placement… (more)

Subjects/Keywords: Power electronics; Integrated cooling; IGBT; HEMT; Substrate; DBC; Evaporation; Bonding; Copper particles; AlN; AlSiC; RF amplifier; Heat spreader; Eutectic bond; Thermal management; Two-phase cooling

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APA (6th Edition):

Puckett, W. T. (2017). Novel substrates for improved cooling of power electronics. (Masters Thesis). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60187

Chicago Manual of Style (16th Edition):

Puckett, Waylon Tanner. “Novel substrates for improved cooling of power electronics.” 2017. Masters Thesis, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/60187.

MLA Handbook (7th Edition):

Puckett, Waylon Tanner. “Novel substrates for improved cooling of power electronics.” 2017. Web. 18 Feb 2019.

Vancouver:

Puckett WT. Novel substrates for improved cooling of power electronics. [Internet] [Masters thesis]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/60187.

Council of Science Editors:

Puckett WT. Novel substrates for improved cooling of power electronics. [Masters Thesis]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/60187

3. Zheng, Li. Power distribution network modeling and microfluidic cooling for high-performance computing systems.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 A silicon interposer platform with microfluidic cooling is proposed for high-performance computing systems. The key components and technologies for the proposed platform, including electrical and… (more)

Subjects/Keywords: Power distribution network; Power supply noise; Numerical modeling; Silicon interposer; Microfluidic cooling

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APA (6th Edition):

Zheng, L. (2015). Power distribution network modeling and microfluidic cooling for high-performance computing systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54449

Chicago Manual of Style (16th Edition):

Zheng, Li. “Power distribution network modeling and microfluidic cooling for high-performance computing systems.” 2015. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/54449.

MLA Handbook (7th Edition):

Zheng, Li. “Power distribution network modeling and microfluidic cooling for high-performance computing systems.” 2015. Web. 18 Feb 2019.

Vancouver:

Zheng L. Power distribution network modeling and microfluidic cooling for high-performance computing systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/54449.

Council of Science Editors:

Zheng L. Power distribution network modeling and microfluidic cooling for high-performance computing systems. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/54449


Georgia Tech

4. Kumar, Vachan. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 Modeling approaches are developed to optimize emerging on-chip and off-chip electrical interconnect technologies and benchmark them against conventional technologies. While transistor scaling results in an… (more)

Subjects/Keywords: Interconnect modeling; Graphene nanoribbons; Through silicon via, airgap interconnects

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APA (6th Edition):

Kumar, V. (2014). Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54280

Chicago Manual of Style (16th Edition):

Kumar, Vachan. “Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/54280.

MLA Handbook (7th Edition):

Kumar, Vachan. “Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies.” 2014. Web. 18 Feb 2019.

Vancouver:

Kumar V. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/54280.

Council of Science Editors:

Kumar V. Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54280


Georgia Tech

5. Zhang, Yang. Thermal and power delivery network modeling for emerging microelectronic integration platforms.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 In this dissertation, thermal management and power delivery challenges in 2.5-D and 3-D integration are presented. To address the thermal coupling issues in heterogeneous 3-D… (more)

Subjects/Keywords: 3D-IC, 2.5-D IC, Thermal, Power delivery, Signaling; 2.5-D IC; Thermal; Power delivery; Signaling

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APA (6th Edition):

Zhang, Y. (2017). Thermal and power delivery network modeling for emerging microelectronic integration platforms. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59199

Chicago Manual of Style (16th Edition):

Zhang, Yang. “Thermal and power delivery network modeling for emerging microelectronic integration platforms.” 2017. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/59199.

MLA Handbook (7th Edition):

Zhang, Yang. “Thermal and power delivery network modeling for emerging microelectronic integration platforms.” 2017. Web. 18 Feb 2019.

Vancouver:

Zhang Y. Thermal and power delivery network modeling for emerging microelectronic integration platforms. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/59199.

Council of Science Editors:

Zhang Y. Thermal and power delivery network modeling for emerging microelectronic integration platforms. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/59199


Georgia Tech

6. Kao, Tsung-Ting. Development and characterization of III-Nitride bipolar devices.

Degree: PhD, Electrical and Computer Engineering, 2016, Georgia Tech

 III-nitride (III-N) materials have been widely used in optical devices such as blue light-emitting diodes today. On the other hand, III-N power electronics are also… (more)

Subjects/Keywords: III-N devices; Compound semiconductor

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APA (6th Edition):

Kao, T. (2016). Development and characterization of III-Nitride bipolar devices. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59114

Chicago Manual of Style (16th Edition):

Kao, Tsung-Ting. “Development and characterization of III-Nitride bipolar devices.” 2016. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/59114.

MLA Handbook (7th Edition):

Kao, Tsung-Ting. “Development and characterization of III-Nitride bipolar devices.” 2016. Web. 18 Feb 2019.

Vancouver:

Kao T. Development and characterization of III-Nitride bipolar devices. [Internet] [Doctoral dissertation]. Georgia Tech; 2016. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/59114.

Council of Science Editors:

Kao T. Development and characterization of III-Nitride bipolar devices. [Doctoral Dissertation]. Georgia Tech; 2016. Available from: http://hdl.handle.net/1853/59114


Georgia Tech

7. Cha, Soonyoung. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 The objective of this research is to extract NBTI and GOBD model parameters to enable the estimation of the degradation and the remaining life of… (more)

Subjects/Keywords: Design for reliability and yield enhancement; Device-level and system-level reliability modeling

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APA (6th Edition):

Cha, S. (2017). Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59748

Chicago Manual of Style (16th Edition):

Cha, Soonyoung. “Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.” 2017. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/59748.

MLA Handbook (7th Edition):

Cha, Soonyoung. “Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system.” 2017. Web. 18 Feb 2019.

Vancouver:

Cha S. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/59748.

Council of Science Editors:

Cha S. Frontend reliability analysis and modeling from device to integrated circuits for reliability and yield enhancement system. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/59748

8. Zhang, Chaoqi. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 In this research, wafer-level flexible input/output interconnection technologies, Mechanically Flexible Interconnects (MFIs), have been developed. First, Au-NiW MFIs with 65 µm vertical elastic range of… (more)

Subjects/Keywords: Advanced packaging; Heterogeneous system; Flexible interconnects; Rematable assembly; CMOS/MEMS integration; Spray-coating; Interposer

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APA (6th Edition):

Zhang, C. (2015). Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53637

Chicago Manual of Style (16th Edition):

Zhang, Chaoqi. “Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.” 2015. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/53637.

MLA Handbook (7th Edition):

Zhang, Chaoqi. “Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration.” 2015. Web. 18 Feb 2019.

Vancouver:

Zhang C. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/53637.

Council of Science Editors:

Zhang C. Mechanically flexible interconnects (MFIs) for large scale heterogeneous system integration. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53637

9. Yu, Xuehong. Silicon-embedded magnetic components for on-chip integrated power applications.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 The objective of the proposed research is to design, fabricate, characterize and test silicon-embedded magnetic components for on-chip integrated power applications. Driven by the trend… (more)

Subjects/Keywords: Silicon embedding; Toroidal inductors; Power supply on chip; MEMS

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APA (6th Edition):

Yu, X. (2014). Silicon-embedded magnetic components for on-chip integrated power applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54243

Chicago Manual of Style (16th Edition):

Yu, Xuehong. “Silicon-embedded magnetic components for on-chip integrated power applications.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/54243.

MLA Handbook (7th Edition):

Yu, Xuehong. “Silicon-embedded magnetic components for on-chip integrated power applications.” 2014. Web. 18 Feb 2019.

Vancouver:

Yu X. Silicon-embedded magnetic components for on-chip integrated power applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/54243.

Council of Science Editors:

Yu X. Silicon-embedded magnetic components for on-chip integrated power applications. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54243

10. Song, Chao. Micromachined flow sensors for velocity and pressure measurement.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 This research focuses on developing sensors for properties of aerodynamic interest (i.e., flow and pressure) based on low-cost polymeric materials and simple fabrication processes. Such… (more)

Subjects/Keywords: Flow sensor; Pressure sensor; Sensor interface circuit; Vibration amplitude measurement; All-polymer air flow sensor; Flow-induced vibration; Drift reduction; Flex-PCB; Polymer-based pressure sensor; Polymer-based flow sensor; Pt piezoresistive flow sensor

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APA (6th Edition):

Song, C. (2014). Micromachined flow sensors for velocity and pressure measurement. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52304

Chicago Manual of Style (16th Edition):

Song, Chao. “Micromachined flow sensors for velocity and pressure measurement.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/52304.

MLA Handbook (7th Edition):

Song, Chao. “Micromachined flow sensors for velocity and pressure measurement.” 2014. Web. 18 Feb 2019.

Vancouver:

Song C. Micromachined flow sensors for velocity and pressure measurement. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/52304.

Council of Science Editors:

Song C. Micromachined flow sensors for velocity and pressure measurement. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/52304

11. Yang, Hyung Suk. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 A novel large-scale silicon system platform with 9.6cm² of active silicon interposer area is demonstrated. The platform contains three interposer tiles and two silicon bridges,… (more)

Subjects/Keywords: Silicon interposers; Interconnects; Alignment; Flip-chip

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APA (6th Edition):

Yang, H. S. (2014). Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/52983

Chicago Manual of Style (16th Edition):

Yang, Hyung Suk. “Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/52983.

MLA Handbook (7th Edition):

Yang, Hyung Suk. “Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures.” 2014. Web. 18 Feb 2019.

Vancouver:

Yang HS. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/52983.

Council of Science Editors:

Yang HS. Large-scale silicon system technologies: through-silicon vias, mechanically flexible interconnects, and positive self-alignment structures. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/52983

12. Okereke, Raphael Ifeanyi. Electroplated multi-path compliant copper interconnects for flip-chip packages.

Degree: PhD, Mechanical Engineering, 2014, Georgia Tech

 The international technology roadmap for semiconductors (ITRS) 2012 report foresees the use of porous dielectric materials with a low dielectric constant in conjunction with copper… (more)

Subjects/Keywords: Compliant interconnects; Flip-chip technology; Delta interconnects; Copper/Low-k compatible technology; Low die stress; White bump solution; MEMS; CMOS compatible; Interconnects (Integrated circuit technology); Copper

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APA (6th Edition):

Okereke, R. I. (2014). Electroplated multi-path compliant copper interconnects for flip-chip packages. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/51800

Chicago Manual of Style (16th Edition):

Okereke, Raphael Ifeanyi. “Electroplated multi-path compliant copper interconnects for flip-chip packages.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/51800.

MLA Handbook (7th Edition):

Okereke, Raphael Ifeanyi. “Electroplated multi-path compliant copper interconnects for flip-chip packages.” 2014. Web. 18 Feb 2019.

Vancouver:

Okereke RI. Electroplated multi-path compliant copper interconnects for flip-chip packages. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/51800.

Council of Science Editors:

Okereke RI. Electroplated multi-path compliant copper interconnects for flip-chip packages. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/51800

13. Mevawalla, Zubin. Process modeling and optimization using industrial semiconductor fabrication data.

Degree: PhD, Electrical and Computer Engineering, 2015, Georgia Tech

 Manufacturers address the distinct operational objectives of product innovation and manufacturing efficiency by having separate fabrication facilities (“fabs”) for development and manufacturing. Additionally, the industrial… (more)

Subjects/Keywords:

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APA (6th Edition):

Mevawalla, Z. (2015). Process modeling and optimization using industrial semiconductor fabrication data. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53382

Chicago Manual of Style (16th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/53382.

MLA Handbook (7th Edition):

Mevawalla, Zubin. “Process modeling and optimization using industrial semiconductor fabrication data.” 2015. Web. 18 Feb 2019.

Vancouver:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/53382.

Council of Science Editors:

Mevawalla Z. Process modeling and optimization using industrial semiconductor fabrication data. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53382

14. Wang, Po-Chun. Fabrication, packaging, and application of micromachined hollow polymer needle arrays.

Degree: PhD, Electrical and Computer Engineering, 2013, Georgia Tech

 Micromachined needles have been shown to successfully transport biological molecules into the body with minimal invasiveness and pain, following the insertion of needles into the… (more)

Subjects/Keywords: Microneedle; Microfabrication; Mechanical characterization; Drug delivery systems; Microlithography; Micromachining

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APA (6th Edition):

Wang, P. (2013). Fabrication, packaging, and application of micromachined hollow polymer needle arrays. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/50283

Chicago Manual of Style (16th Edition):

Wang, Po-Chun. “Fabrication, packaging, and application of micromachined hollow polymer needle arrays.” 2013. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/50283.

MLA Handbook (7th Edition):

Wang, Po-Chun. “Fabrication, packaging, and application of micromachined hollow polymer needle arrays.” 2013. Web. 18 Feb 2019.

Vancouver:

Wang P. Fabrication, packaging, and application of micromachined hollow polymer needle arrays. [Internet] [Doctoral dissertation]. Georgia Tech; 2013. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/50283.

Council of Science Editors:

Wang P. Fabrication, packaging, and application of micromachined hollow polymer needle arrays. [Doctoral Dissertation]. Georgia Tech; 2013. Available from: http://hdl.handle.net/1853/50283

15. Zhang, Xuchen. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Signal integrity and thermal management are the two major challenges in heterogeneous integration technologies. In this research, the impact of through silicon vias (TSVs) on… (more)

Subjects/Keywords: Heterogeneous integration; 3D IC; 2.5D IC; HIST; Microfluidic cooling; Signal integrity; TSV; Compliance interconnects

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APA (6th Edition):

Zhang, X. (2017). 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58647

Chicago Manual of Style (16th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/58647.

MLA Handbook (7th Edition):

Zhang, Xuchen. “3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling.” 2017. Web. 18 Feb 2019.

Vancouver:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/58647.

Council of Science Editors:

Zhang X. 3D and 2.5D heterogeneous integration platforms with interconnect stitching and microfluidic cooling. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58647

16. Oh, Hanju. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.

Degree: PhD, Electrical and Computer Engineering, 2017, Georgia Tech

 Microfluidic cooling technology is a promising thermal solution for high-performance three-dimensional (3-D) microsystems. However, the integration of microfluidic cooling into 3-D microsystems inevitably impacts tier-to-tier… (more)

Subjects/Keywords: 3D microsystem; Microfluidic cooling; Silicon interposer; Through-silicon via

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APA (6th Edition):

Oh, H. (2017). Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58139

Chicago Manual of Style (16th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/58139.

MLA Handbook (7th Edition):

Oh, Hanju. “Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias.” 2017. Web. 18 Feb 2019.

Vancouver:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/58139.

Council of Science Editors:

Oh H. Silicon microsystem platform with integrated microfluidic cooling and low-loss through-silicon vias. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58139

17. Han, Xuefei. Flow boiling of water in pin-fin enhanced microgap.

Degree: PhD, Mechanical Engineering, 2017, Georgia Tech

 This study experimentally investigated flow boiling of water in a closed flow loop system at reduced pressure with a wide range of heat fluxes, mass… (more)

Subjects/Keywords: Flow boiling; Reduced pressure; Microgap; Pin fin

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APA (6th Edition):

Han, X. (2017). Flow boiling of water in pin-fin enhanced microgap. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/58217

Chicago Manual of Style (16th Edition):

Han, Xuefei. “Flow boiling of water in pin-fin enhanced microgap.” 2017. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/58217.

MLA Handbook (7th Edition):

Han, Xuefei. “Flow boiling of water in pin-fin enhanced microgap.” 2017. Web. 18 Feb 2019.

Vancouver:

Han X. Flow boiling of water in pin-fin enhanced microgap. [Internet] [Doctoral dissertation]. Georgia Tech; 2017. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/58217.

Council of Science Editors:

Han X. Flow boiling of water in pin-fin enhanced microgap. [Doctoral Dissertation]. Georgia Tech; 2017. Available from: http://hdl.handle.net/1853/58217

18. Sarvey, Thomas Eric. Microfluidic Cooling for Densely Integrated Microelectronic Systems.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The challenge of dissipating heat is a major barrier to continuing improvement in integrated circuit performance. Additionally, the bottleneck for computational performance and energy has… (more)

Subjects/Keywords: microfluidic cooling; micropin-fin; microelectronics

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APA (6th Edition):

Sarvey, T. E. (2018). Microfluidic Cooling for Densely Integrated Microelectronic Systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60759

Chicago Manual of Style (16th Edition):

Sarvey, Thomas Eric. “Microfluidic Cooling for Densely Integrated Microelectronic Systems.” 2018. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/60759.

MLA Handbook (7th Edition):

Sarvey, Thomas Eric. “Microfluidic Cooling for Densely Integrated Microelectronic Systems.” 2018. Web. 18 Feb 2019.

Vancouver:

Sarvey TE. Microfluidic Cooling for Densely Integrated Microelectronic Systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/60759.

Council of Science Editors:

Sarvey TE. Microfluidic Cooling for Densely Integrated Microelectronic Systems. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/60759

19. Zia, Muneeb. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The demand for continuous increase in computing performance has put an overburdening demand on I/O interface and novel heterogeneous integration to allow performance benefits at… (more)

Subjects/Keywords: 3D integration; 2.5D integration; Heterogeneous integration; Flexible interconnects; In vitro biosensing; In vivo biosensing; EMG; Songbird; Flexible multi-electrode array

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APA (6th Edition):

Zia, M. (2018). 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/60795

Chicago Manual of Style (16th Edition):

Zia, Muneeb. “3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.” 2018. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/60795.

MLA Handbook (7th Edition):

Zia, Muneeb. “3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications.” 2018. Web. 18 Feb 2019.

Vancouver:

Zia M. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/60795.

Council of Science Editors:

Zia M. 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/60795


Georgia Tech

20. Serrano, Diego Emilio. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.

Degree: PhD, Electrical and Computer Engineering, 2014, Georgia Tech

 This dissertation discusses the design, simulation and characterization of process-compatible accelerometers and gyroscopes for the implementation of multi-degree-of-freedom (multi-DOF) systems. All components presented herein were… (more)

Subjects/Keywords: Micromechanical sensors; MEMS; Gyroscopes; Accelerometers; Inertial sensors; Inertial navigation; Silicon resonators; Bulk acoustic wave; Anchor loss

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APA (6th Edition):

Serrano, D. E. (2014). Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/54283

Chicago Manual of Style (16th Edition):

Serrano, Diego Emilio. “Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.” 2014. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/54283.

MLA Handbook (7th Edition):

Serrano, Diego Emilio. “Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes.” 2014. Web. 18 Feb 2019.

Vancouver:

Serrano DE. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. [Internet] [Doctoral dissertation]. Georgia Tech; 2014. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/54283.

Council of Science Editors:

Serrano DE. Integrated inertial measurement units using silicon bulk-acoustic wave gyroscopes. [Doctoral Dissertation]. Georgia Tech; 2014. Available from: http://hdl.handle.net/1853/54283


Georgia Tech

21. Fleetwood, Zachary Evan. Qualifying silicon-germanium electronics for harsh radiation environments.

Degree: PhD, Electrical and Computer Engineering, 2018, Georgia Tech

 The objective of this thesis is to investigate the robustness of Silicon-Germanium Heterojunction Bipolar Transistors (SiGe HBTs) to radiation-induced damage. The work described in this… (more)

Subjects/Keywords: SiGe HBT; TID; SEE; Radiation; Superjunction; DD; Profile modifications

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APA (6th Edition):

Fleetwood, Z. E. (2018). Qualifying silicon-germanium electronics for harsh radiation environments. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/59891

Chicago Manual of Style (16th Edition):

Fleetwood, Zachary Evan. “Qualifying silicon-germanium electronics for harsh radiation environments.” 2018. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/59891.

MLA Handbook (7th Edition):

Fleetwood, Zachary Evan. “Qualifying silicon-germanium electronics for harsh radiation environments.” 2018. Web. 18 Feb 2019.

Vancouver:

Fleetwood ZE. Qualifying silicon-germanium electronics for harsh radiation environments. [Internet] [Doctoral dissertation]. Georgia Tech; 2018. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/59891.

Council of Science Editors:

Fleetwood ZE. Qualifying silicon-germanium electronics for harsh radiation environments. [Doctoral Dissertation]. Georgia Tech; 2018. Available from: http://hdl.handle.net/1853/59891

22. Mueller, Brennen. Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties.

Degree: PhD, Chemical and Biomolecular Engineering, 2015, Georgia Tech

 Permanent dielectric materials are integral to the fabrication of microelectronic devices and packaging. Dielectrics are used throughout devices to electrically and mechanically isolate conductive components.… (more)

Subjects/Keywords: DNQ; Dielectric; Photosensitive; Positive tone; Chemically amplified; Polynorbornene; Low-k

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APA (6th Edition):

Mueller, B. (2015). Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/53494

Chicago Manual of Style (16th Edition):

Mueller, Brennen. “Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties.” 2015. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/53494.

MLA Handbook (7th Edition):

Mueller, Brennen. “Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties.” 2015. Web. 18 Feb 2019.

Vancouver:

Mueller B. Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties. [Internet] [Doctoral dissertation]. Georgia Tech; 2015. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/53494.

Council of Science Editors:

Mueller B. Photo-definable dielectrics with improved lithographic, mechanical, and electrical properties. [Doctoral Dissertation]. Georgia Tech; 2015. Available from: http://hdl.handle.net/1853/53494


Georgia Tech

23. Huang, Gang. Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems.

Degree: PhD, Electrical and Computer Engineering, 2008, Georgia Tech

 The objective of this dissertation is to derive a set of compact physical models addressing power integrity issues in high performance gigascale integration (GSI) systems… (more)

Subjects/Keywords: Gigascale integration (GSI); Three-dimensional integraton (3-D integration); Compact physical model; Power delivery; Chip/package co-design; Power supply noise; Current noise (Electricity); Microprocessors

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APA (6th Edition):

Huang, G. (2008). Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems. (Doctoral Dissertation). Georgia Tech. Retrieved from http://hdl.handle.net/1853/26619

Chicago Manual of Style (16th Edition):

Huang, Gang. “Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems.” 2008. Doctoral Dissertation, Georgia Tech. Accessed February 18, 2019. http://hdl.handle.net/1853/26619.

MLA Handbook (7th Edition):

Huang, Gang. “Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems.” 2008. Web. 18 Feb 2019.

Vancouver:

Huang G. Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems. [Internet] [Doctoral dissertation]. Georgia Tech; 2008. [cited 2019 Feb 18]. Available from: http://hdl.handle.net/1853/26619.

Council of Science Editors:

Huang G. Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems. [Doctoral Dissertation]. Georgia Tech; 2008. Available from: http://hdl.handle.net/1853/26619

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