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You searched for +publisher:"Brno University of Technology" +contributor:("Szendiuch, Ivan"). Showing records 1 – 30 of 60 total matches.

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Brno University of Technology

1. Kristek, Michal. Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules.

Degree: 2019, Brno University of Technology

 This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper… (more)

Subjects/Keywords: Pouzdření; fluidizace; fluidizační zařízení; zalévání; zastříkávání; lisování; hermetická pouzdra; nehermetická pouzdra; Packaging; fluidization; fluidization bed; glop topping; underfilling; transfer molding; compression molding; hermetic package; non-hermetic package

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APA (6th Edition):

Kristek, M. (2019). Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/66714

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Kristek, Michal. “Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/66714.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Kristek, Michal. “Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules.” 2019. Web. 28 May 2020.

Vancouver:

Kristek M. Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/66714.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Kristek M. Ekonomické způsoby pouzdření integrovaných obvodů a modulů: Economic encapsulation for integrated circuits and modules. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/66714

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

2. Němec, Tomáš. Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components.

Degree: 2018, Brno University of Technology

 The master thesis deals with multilayer structures and thick film technology. The main goal of this work is measure basic electric features of structures realized… (more)

Subjects/Keywords: Tlustovrstvová technologie; tlustovrstvá technologie; tlusté vrstvy; sítotisk; elektrické vlastnosti; vícevrstvé obvody; diplomová práce.; Thick film technology; thick film; screen-printing; electrical characteristics; multilayer circuits; master's thesis.

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APA (6th Edition):

Němec, T. (2018). Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1314

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Němec, Tomáš. “Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/1314.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Němec, Tomáš. “Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components.” 2018. Web. 28 May 2020.

Vancouver:

Němec T. Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/1314.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Němec T. Návrh a realizace struktur s vnořenými komponenty: Design and Realization of Structures with Embeded Components. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/1314

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

3. Somer, Jakub. Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics.

Degree: 2018, Brno University of Technology

 This diploma thesis deals with thick film technology and its potential to use for non-conventional applications. First part of this project is focused on research… (more)

Subjects/Keywords: tlustovrstvová technologie; LTCC; frekvenční filtr; senzor tlaku; Fabry-Perotův rezonátor; Thick Film Technology; LTCC; Frequency Filter; Pressure Sensor; Fabry-Perot Resonator

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APA (6th Edition):

Somer, J. (2018). Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/26997

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Somer, Jakub. “Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/26997.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Somer, Jakub. “Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics.” 2018. Web. 28 May 2020.

Vancouver:

Somer J. Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/26997.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Somer J. Využití tlustých vrstev v moderní elektronice: Application of Thick Films in the Modern Electronics. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/26997

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

4. Gančev, Jan. Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity.

Degree: 2018, Brno University of Technology

 This work deals with the issue of emissivity and its impact on the heat dissipation.The first part describes the basics of thermal management, the issue… (more)

Subjects/Keywords: Tepelný management; emisivita; LED; dural; povrchová úprava; termokamera; termočlánek; spektrometr; simulace; ANSYS Icepak; chladič.; Thermal management; emissivity; LED; duralumin; surface finish; thermal camera; thermocouple; spectrometer; simulation; ANSYS Icepak; heatsink.

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APA (6th Edition):

Gančev, J. (2018). Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/59035

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Gančev, Jan. “Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/59035.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Gančev, Jan. “Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity.” 2018. Web. 28 May 2020.

Vancouver:

Gančev J. Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/59035.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gančev J. Emisivita a její vliv na odvod tepla: Emisivity and its Impact on the Heat Conductivity. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/59035

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

5. Nešpor, Dušan. Moderní způsoby připojování čipů: Modern methods for Chip Attach.

Degree: 2019, Brno University of Technology

 The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different… (more)

Subjects/Keywords: Pouzdření; připojování čipů; mechanické pnutí; termodynamické namáhání; ANSYS; spolehlivost.; Packaging; die attach; mechanical stress; thermodynamic stress; ANSYS; reliability.

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APA (6th Edition):

Nešpor, D. (2019). Moderní způsoby připojování čipů: Modern methods for Chip Attach. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1304

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Nešpor, Dušan. “Moderní způsoby připojování čipů: Modern methods for Chip Attach.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/1304.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Nešpor, Dušan. “Moderní způsoby připojování čipů: Modern methods for Chip Attach.” 2019. Web. 28 May 2020.

Vancouver:

Nešpor D. Moderní způsoby připojování čipů: Modern methods for Chip Attach. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/1304.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Nešpor D. Moderní způsoby připojování čipů: Modern methods for Chip Attach. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1304

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

6. Frantík, Ondřej. Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production.

Degree: 2019, Brno University of Technology

This report occupy by technology RTA (RTP) - Rapid Thermal Annealing (Rapid Thermal Processing) and its use in practical application to oven type SHS1000 . Our attention is fixate to production solar cells of monocrystalline silicon. Advisors/Committee Members: Szendiuch, Ivan (advisor), SOLARTEC, Radim Bařinka, (referee).

Subjects/Keywords: Rychlé teplotní procesy; rychlé teplotní žíhání; rychlá teplotní difúze; rychlá teplotní oxidace.; Rapid Thermal Process; Rapid Themal Annealing; Rapid Thermal Diffusion; Rapid Thermal Oxydation.

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APA (6th Edition):

Frantík, O. (2019). Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1329

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Frantík, Ondřej. “Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/1329.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Frantík, Ondřej. “Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production.” 2019. Web. 28 May 2020.

Vancouver:

Frantík O. Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/1329.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Frantík O. Optimalizace teplotních procesů při výrobě fotovoltaických článků: Optimizing of Temperature Processes by Photovoltaic Solar Cells production. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1329

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

7. Psota, Boleslav. Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system.

Degree: 2019, Brno University of Technology

 This work deals with behavior of the temperature dependent element that makes a part of thermodynamics system. The analyzed element makes a base for modern… (more)

Subjects/Keywords: senzor; elementární model; interakce; sensor; elementar model; interaction

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Psota, B. (2019). Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1335

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Psota, Boleslav. “Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/1335.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Psota, Boleslav. “Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system.” 2019. Web. 28 May 2020.

Vancouver:

Psota B. Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/1335.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Psota B. Modelování teplotního prvku jako součásti elektronického systému: Modeling of elementar part as component of electronics system. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1335

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

8. Řezníček, Michal. Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip.

Degree: 2019, Brno University of Technology

This work deal with taking advatage of ballance thermodynamic sensors as the replacement of commercial temperature sensors. Advisors/Committee Members: Szendiuch, Ivan (advisor), Jankovský, Jaroslav (referee).

Subjects/Keywords: termodynamický senzor; teplotní senzor; měření teploty; teplota okolí termodynamické soustavy; teplota jako stavová veličina; ztrátové teplo; šíření tepla; ustálený stav; přechodný děj; bilanční rovnováha; rovnovážné monitorování; simulace; thermodynamic sensor; temerature sensor; temperature measuring; ambient temperature thermodynamic systems; temperature as the state value; heat dissipation; heat diffusion; steady state; transient process; thermo ballance; ballance monitoring; simulation

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Řezníček, M. (2019). Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/788

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Řezníček, Michal. “Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/788.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Řezníček, Michal. “Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip.” 2019. Web. 28 May 2020.

Vancouver:

Řezníček M. Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/788.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Řezníček M. Optimalizovaný termodynamický senzor na bilančním principu: Optimized Thermo-dynamic Senzor with Balance P¨rincip. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/788

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

9. Hřešil, Tomáš. Nové směry v pouzdření: New ways in Packaging.

Degree: 2019, Brno University of Technology

 This project deals with the creating a base of manual for modern electronic packages, which are more and more used in today's electronic circuits and… (more)

Subjects/Keywords: Pouzdření v elektronice; DIL; QFP; BGA; PGA; CSP; Flip chip; SiP; návrhová pravidla pro montáž; Packaging in electronics; DIL; QFP; BGA; PGA; CSP; Flip chip; SiP; design rules (guidelines)

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Hřešil, T. (2019). Nové směry v pouzdření: New ways in Packaging. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/1904

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hřešil, Tomáš. “Nové směry v pouzdření: New ways in Packaging.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/1904.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hřešil, Tomáš. “Nové směry v pouzdření: New ways in Packaging.” 2019. Web. 28 May 2020.

Vancouver:

Hřešil T. Nové směry v pouzdření: New ways in Packaging. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/1904.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hřešil T. Nové směry v pouzdření: New ways in Packaging. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/1904

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

10. Grund, Pavel. Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s.

Degree: 2019, Brno University of Technology

 Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid… (more)

Subjects/Keywords: hybridní integrovaný obvod; tlustovrstvová technologie; technologie povrchové montáže; kapacitní sonda; nekonvenční aplikace; hybrid integrated circuit; thick film technology; surface mount technology; capacitive probe; non conventional applications

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Grund, P. (2019). Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17906

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Grund, Pavel. “Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/17906.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Grund, Pavel. “Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s.” 2019. Web. 28 May 2020.

Vancouver:

Grund P. Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/17906.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Grund P. Nekonvenční aplikace hybridních integrovaných obvodů: Non conventional applications of HIC´s. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/17906

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

11. Částka, Michal. Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space.

Degree: 2019, Brno University of Technology

 When measuring the effectiveness of air coolers on standard PC processors, there is considerable errors. Ambient air in which energy is transferred from the cooler… (more)

Subjects/Keywords: Chladič; teplo; energie; procesory; tepelné trubice; účinnost; řízený tunel; Cooler; heat; energy; processors; heatpipes; efficiency; aerodynamic space

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Částka, M. (2019). Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/8289

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Částka, Michal. “Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/8289.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Částka, Michal. “Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space.” 2019. Web. 28 May 2020.

Vancouver:

Částka M. Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/8289.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Částka M. Měření účinnosti chladičů CPU a návrh tunelu s řízeným prouděním: Measurement of Cooler Efficiency and design of aerodynamic space. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/8289

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

12. Zlámal, Jiří. Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology.

Degree: 2019, Brno University of Technology

This bachelor's thesis sums up gained knowledge of current trends in packaging. First part focuses on various types of electrical packages and their functions while second part describes the process of designing an electrical package. Advisors/Committee Members: Szendiuch, Ivan (advisor), Kuchta, Radek (referee).

Subjects/Keywords: Polovodičové čipy; integrovaný obvod; přenos signálu; pouzdra a pouzdření; 3D pouzdra; Semiconductor chips; integrated circuit; signal transmission; package and packaging; 3D package

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Zlámal, J. (2019). Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/12494

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Zlámal, Jiří. “Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/12494.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Zlámal, Jiří. “Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology.” 2019. Web. 28 May 2020.

Vancouver:

Zlámal J. Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/12494.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Zlámal J. Aplikace moderních pouzdřících technologií v elektronice: Application of Advanced Electronic Packaging Technology. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/12494

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

13. Toufar, Michal. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.

Degree: 2019, Brno University of Technology

 It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the… (more)

Subjects/Keywords: bezolovnatá pájka; pájení přetavením; dusík; kvalita pájeného spoje; povrchová úprava; lead – free solder reflow; nitrogen; quality of solder joint; surface finish

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APA (6th Edition):

Toufar, M. (2019). Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/34465

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Toufar, Michal. “Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/34465.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Toufar, Michal. “Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints.” 2019. Web. 28 May 2020.

Vancouver:

Toufar M. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/34465.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Toufar M. Zjišťování spolehlivosti pájených spojů v ochranné atmosféře: Investigation of Reliability for Solder Joints. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/34465

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

14. Gančev, Jan. Perspektivní materiály pro pouzdření: Perspective materials for packaging.

Degree: 2019, Brno University of Technology

 The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the… (more)

Subjects/Keywords: ANSYS® Workbench™; tepelný management; tepelná vodivost; teplotní simulace; termoplasty; pouzdření; ANSYS® Workbench™; thermal management; thermal conductivity; thermal simulation; thermoplastics; packaging

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APA (6th Edition):

Gančev, J. (2019). Perspektivní materiály pro pouzdření: Perspective materials for packaging. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/34475

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Gančev, Jan. “Perspektivní materiály pro pouzdření: Perspective materials for packaging.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/34475.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Gančev, Jan. “Perspektivní materiály pro pouzdření: Perspective materials for packaging.” 2019. Web. 28 May 2020.

Vancouver:

Gančev J. Perspektivní materiály pro pouzdření: Perspective materials for packaging. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/34475.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Gančev J. Perspektivní materiály pro pouzdření: Perspective materials for packaging. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/34475

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

15. Krejčí, Pavel. Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology.

Degree: 2019, Brno University of Technology

 This work deals with issues of application of the thick film technology in the non-conventional field. It includes the essential core of this technology, the… (more)

Subjects/Keywords: Tlustovrstvová technologie; nekonvenční aplikace; využití tlustých vrstev; planární induktor; planární vícevrstevný induktor; Greenhouse formula; Thick film technologie; non-conventional application; application of thick film; planar inductor; multilayer planar inductor; Greenhouse formula

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APA (6th Edition):

Krejčí, P. (2019). Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/61672

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Krejčí, Pavel. “Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/61672.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Krejčí, Pavel. “Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology.” 2019. Web. 28 May 2020.

Vancouver:

Krejčí P. Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/61672.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Krejčí P. Nekonvenční aplikace tlustých vrstev: Non-conventional Applications in Thick Film Technology. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/61672

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

16. Bařinka, David. Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia.

Degree: 2019, Brno University of Technology

 This dissertation is the study about the future of solar power stations in the Czech Republic, describing the history, composition, principle of solar power stations… (more)

Subjects/Keywords: fotovoltaika; recyklace; ekologie; závady; průzkum; photovoltaic; recycling; ecology; defects; survey

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Bařinka, D. (2019). Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/65799

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bařinka, David. “Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/65799.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bařinka, David. “Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia.” 2019. Web. 28 May 2020.

Vancouver:

Bařinka D. Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/65799.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bařinka D. Studie fotovoltaických elektráren na jižní Moravě: Study of Free-Field Photovoltaic Plants in South Moravia. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/65799

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

17. Bolcek, Martin. Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly.

Degree: 2019, Brno University of Technology

 This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive… (more)

Subjects/Keywords: Elektricky vodivá lepidla; tepelně vodivá lepidla; pevnost ve střihu; vlhkostní komora; mikrovýbrus; spolehlivost; Electicall conductive adhesive; thermal conductiv adhesive; die shear strenght; humidity chambre; micro cut; reliability

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Bolcek, M. (2019). Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/69408

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bolcek, Martin. “Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/69408.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bolcek, Martin. “Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly.” 2019. Web. 28 May 2020.

Vancouver:

Bolcek M. Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/69408.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bolcek M. Aplikace lepidel v mikroelektronických sestavách: Applications of Adhesives in Microelectronics Assembly. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/69408

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

18. Hladík, Jiří. Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells.

Degree: 2019, Brno University of Technology

 The submitted work deals with the methods for manufacturing and analysis of contacts on crystalline silicon solar cells. It is focused on selective processes for… (more)

Subjects/Keywords: selektivní procesy; fotovoltaický článek; přední metalizace; laserové procesy; chemický nikl; analýza kontaktů; vodivé lepidlo; měděný drátek; selective processes; solar cell; front side metallization; laser processes; electro-less nickel; analysis of contacts; conductive adhesive; copper wire

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APA (6th Edition):

Hladík, J. (2019). Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/21044

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Hladík, Jiří. “Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/21044.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Hladík, Jiří. “Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells.” 2019. Web. 28 May 2020.

Vancouver:

Hladík J. Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/21044.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Hladík J. Analýza a optimalizace selektivních technologických procesů pro kontakty krystalických křemíkových solárních článků: The Analysis and Optimization of Selective Technological Processes for Contacts on Crystalline Silicon Solar Cells. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/21044

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

19. Řezníček, Michal. Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium.

Degree: 2019, Brno University of Technology

 This paper deals with the problem of monitoring the occurrence of the minority events in thermodynamic systems by using thermodynamic sensors based on the principle… (more)

Subjects/Keywords: Termodynamická soustava; teplota; energie; měření aktivity; minoritní aktivita; majoritní aktivita; senzor; simulace; bilanční rovnováha.; Thermodynamic system; temperature; energy; activity measurement; minor activity; major activity; sensor; simulation; balance equilibrium.

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APA (6th Edition):

Řezníček, M. (2019). Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/36213

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Řezníček, Michal. “Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/36213.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Řezníček, Michal. “Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium.” 2019. Web. 28 May 2020.

Vancouver:

Řezníček M. Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/36213.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Řezníček M. Termodynamické senzory na principu bilanční rovnováhy: Thermodynamic Sensors Based on the Principle of Balance Equilibrium. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/36213

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

20. Psota, Boleslav. Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems.

Degree: 2019, Brno University of Technology

 This paper deals with the behavior of electronic assemblies, which are loaded by the vibrations, especially in the context of computer simulations use. The main… (more)

Subjects/Keywords: Vibrace; mechanické vlastnosti; počítačové simulace; ANSYS Workbench; Vibration; mechanical properties; computer simulations; ANSYS Workbench

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APA (6th Edition):

Psota, B. (2019). Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/51791

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Psota, Boleslav. “Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/51791.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Psota, Boleslav. “Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems.” 2019. Web. 28 May 2020.

Vancouver:

Psota B. Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/51791.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Psota B. Mechanické vlastnosti mikroelektronických systémů: Mechanical Properties of the Microelectronic Systems. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/51791

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

21. Pulec, Jiří. Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band.

Degree: 2019, Brno University of Technology

 The present paper deals with the problematics of the design and technology of planar microelectronic structures for the hign frequency band. These structures were realised… (more)

Subjects/Keywords: Kmitočtový filtr; cívka; kondenzátor; interdigitální; FEM; ANSYS; Ansoft Designer; Frequency filter; coil; capacitor; interdigital; FEM; ANSYS; Ansoft Designer

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Pulec, J. (2019). Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/63318

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pulec, Jiří. “Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/63318.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pulec, Jiří. “Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band.” 2019. Web. 28 May 2020.

Vancouver:

Pulec J. Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/63318.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pulec J. Planární struktury pro vysoké kmitočty: Planar Structures for High Frequency Band. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/63318

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

22. Skácel, Josef. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.

Degree: 2018, Brno University of Technology

 This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution.… (more)

Subjects/Keywords: Pouzdření v elektronice; ANSYS Workbench; teplotní simulace; pouzdřící materiály; koeficient teplotní roztažnosti; TKR; Packaging in electronics; ANSYS Workbench; thermal simulation; packaging materials; coefficient of thermal expansion; CTE

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Skácel, J. (2018). Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/40254

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Skácel, Josef. “Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/40254.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Skácel, Josef. “Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties.” 2018. Web. 28 May 2020.

Vancouver:

Skácel J. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/40254.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Skácel J. Studie srovnání vlastností pouzder QFN a BGA: Study of BGA and QFN package properties. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/40254

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

23. Shishkin, Alexey. Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components.

Degree: 2018, Brno University of Technology

 Purpose of our experiment to receive mathematical model for RC-RP elemets with different structure. As a objektive factor of mathematical model we will decide temperature… (more)

Subjects/Keywords: Matematicky model; prvky z rozloženými parametry; optimalní režim výroby; tlustovrstvá technologie; RC-RP prvek.; Mathematical model; elements with distibuted parametrs; optimal conditions of production; thic-film technology; RC-RP element.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Shishkin, A. (2018). Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/14472

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Shishkin, Alexey. “Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/14472.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Shishkin, Alexey. “Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components.” 2018. Web. 28 May 2020.

Vancouver:

Shishkin A. Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/14472.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Shishkin A. Vlastnosti 3D prvků realizovaných tlustovrstvovou technologií: Properties of Thick Film Multilayer Components. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/14472

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

24. Bobek, Josef. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.

Degree: 2018, Brno University of Technology

 This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture… (more)

Subjects/Keywords: Pájecí kuličky; inovace; pouzdra BGA; postupy pájení; FRITSCH; Solder balls; innovation; BGA packages; solder processes; FRITSCH

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APA (6th Edition):

Bobek, J. (2018). Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/21766

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Bobek, Josef. “Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/21766.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Bobek, Josef. “Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device.” 2018. Web. 28 May 2020.

Vancouver:

Bobek J. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/21766.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Bobek J. Návrh a zhotovení zařízení pro osazování pájecích kuliček: Design and realisation of solder-ball mounting device. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/21766

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

25. Frantík, Ondřej. Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production.

Degree: 2018, Brno University of Technology

 The thesis is focused on high temperature processes in crystalline solar cells production. Main topic is diffusion of traditional dopants phosphorus and boron. Diffusion processes… (more)

Subjects/Keywords: solární články; difúze; fosfor; bor; příměs; emitor; pasivační vrstvy; vrstvový odpor; doba života minoritních nosičů; MWPCD; elipsometrie; ECV; solar cells; diffusion; phosphorus; boron; dopant; emitter; passivation layers; sheet resistance; minority carrier lifetime; MWPCD; Ellipsometry; ECV

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APA (6th Edition):

Frantík, O. (2018). Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/36204

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Frantík, Ondřej. “Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/36204.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Frantík, Ondřej. “Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production.” 2018. Web. 28 May 2020.

Vancouver:

Frantík O. Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/36204.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Frantík O. Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků: High Temperature Processes in Silicon Solar Cells Production. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/36204

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

26. Pavlas, Ondřej. Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages.

Degree: 2018, Brno University of Technology

 This bachelor thesis „Optimalization of fabrication technology for ceramics packals“ tackles the issues of ceramic packaging technology for microelectronics applications. This thesis deals with experimental… (more)

Subjects/Keywords: Pouzdro; oxidová keramika; čip; pouzdření; integrovaný obvod; tlustá vrstva; dispensní tisk; Package; oxide ceramics; chip; packaging; integrated circuit; thick-film technology; dispensing

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Pavlas, O. (2018). Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/81627

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Pavlas, Ondřej. “Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/81627.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Pavlas, Ondřej. “Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages.” 2018. Web. 28 May 2020.

Vancouver:

Pavlas O. Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/81627.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Pavlas O. Optimalizace technologie pro vytváření keramických pouzder: Optimization of fabrication technology for ceramics packages. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/81627

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

27. Otáhal, Alexandr. Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400.

Degree: 2018, Brno University of Technology

 This project deals with innovation of IR-400 equipment which is based on design and installation of temperature regulation, in both top and bottom side. This… (more)

Subjects/Keywords: infračervené pájení přetavením; bezolovnaté pájky; pájecí profil; opravy součástek; infrared reflow soldering; lead-free solder; solder profile; rework and repair of components

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Otáhal, A. (2018). Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/17936

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Otáhal, Alexandr. “Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400.” 2018. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/17936.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Otáhal, Alexandr. “Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400.” 2018. Web. 28 May 2020.

Vancouver:

Otáhal A. Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400. [Internet] [Thesis]. Brno University of Technology; 2018. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/17936.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Otáhal A. Optimalizace procesu pájení na zařízení IR-400: Optimalization of soldering process on IR-400. [Thesis]. Brno University of Technology; 2018. Available from: http://hdl.handle.net/11012/17936

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

28. Klíma, Martin. Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics.

Degree: 2019, Brno University of Technology

 The doctoral thesis is aimed at research of application possibilities of low-temperature co-fired ceramics, especially its non-conventional usage. It deals with particular topics ensue from… (more)

Subjects/Keywords: LTCC; tlustovrstvová technologie; pouzdření; 3D rezistor; kontaktování; hermetičnost; optoelektronický senzor.; LTCC; thick film technology; packaging; 3D resistor; wire bonding; hermeticity; optoelectronic sensor.

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APA · Chicago · MLA · Vancouver · CSE | Export to Zotero / EndNote / Reference Manager

APA (6th Edition):

Klíma, M. (2019). Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/51792

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Klíma, Martin. “Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/51792.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Klíma, Martin. “Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics.” 2019. Web. 28 May 2020.

Vancouver:

Klíma M. Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/51792.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Klíma M. Nekonvenční aplikace keramiky s nízkou teplotou výpalu: Non-Conventional Applications of Low-Temperature Co-Fired Ceramics. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/51792

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

29. Buršík, Martin. Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology.

Degree: 2019, Brno University of Technology

 Doctoral thesis deals with the deposition of special thixotropic materials for microelectronic technology. The aim of the work is the development of the new method… (more)

Subjects/Keywords: Ultrazvuk; nanášení; reologie; optimalizace; tisk; tlustovrstvová technologie; Ultrasonic; deposition; rheology; optimizing; print; thick film technology.

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APA (6th Edition):

Buršík, M. (2019). Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/36214

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Buršík, Martin. “Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/36214.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Buršík, Martin. “Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology.” 2019. Web. 28 May 2020.

Vancouver:

Buršík M. Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/36214.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Buršík M. Nové oblasti aplikace ultrazvuku v mikroelektronických technologiích: New Areas of the Ultrasonic Application in Microelectronics Technology. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/36214

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation


Brno University of Technology

30. Genčanský, David. Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system.

Degree: 2019, Brno University of Technology

 The importance of vibration and vibration tests is increasingly relevant given th growing number of mobile electronic devices. This thesis descibes the design of control… (more)

Subjects/Keywords: Vibrácie; vibračné skúšky; riadenie; labview; vibračná stolica; Vibrations; vibrations test; control; labview; shaker table

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APA (6th Edition):

Genčanský, D. (2019). Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system. (Thesis). Brno University of Technology. Retrieved from http://hdl.handle.net/11012/32170

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Chicago Manual of Style (16th Edition):

Genčanský, David. “Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system.” 2019. Thesis, Brno University of Technology. Accessed May 28, 2020. http://hdl.handle.net/11012/32170.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

MLA Handbook (7th Edition):

Genčanský, David. “Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system.” 2019. Web. 28 May 2020.

Vancouver:

Genčanský D. Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system. [Internet] [Thesis]. Brno University of Technology; 2019. [cited 2020 May 28]. Available from: http://hdl.handle.net/11012/32170.

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

Council of Science Editors:

Genčanský D. Řízení vibrační stolice pomocí embedded systému: Vibration system control through embedded system. [Thesis]. Brno University of Technology; 2019. Available from: http://hdl.handle.net/11012/32170

Note: this citation may be lacking information needed for this citation format:
Not specified: Masters Thesis or Doctoral Dissertation

[1] [2]

.